200831227 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種雷射切割設備，尤其涉及一種可用於 對脆性材料基板進行切割之雷射切割設備。 【先前技術】 隨著顯示技術之不斷發展，薄膜電晶體液晶顯示器 (Thin Film Transistor Liquid Crystal Display，TFT-LCD)等液 φ晶顯示裝置已廣泛應用於消費領域，其有望取代傳統陰極 射線管（Cathode Ray Tube，CRT)顯示裝置。TFT-LCD 等液 晶顯示裝置通常由上下兩塊玻璃板，收容於該兩塊玻璃板 間之液晶及複數電路組成。所述液晶可以於電場作用下改 變排列方式來實現顯示功能。為了形成不同尺寸之液晶顯 示面板，通常需要對較大尺寸之玻璃基板進行切割。 雷射切割設備通常包括承載盤，刀輪，雷射器，以及 冷卻器。採用該種雷射切割設備切割玻璃基板時，通常是 錢|先將待切割之玻璃基板固持於承載盤上，然後用刀輪於玻 璃基板表面形成預切割線，隨後利用雷射器發射雷射光束 沿該預切割線加熱所述玻璃基板，再經由冷卻器噴射冷卻 流體冷卻玻璃基板表面。該玻璃基板會因急劇産生之溫度 差而産生應力變化，該應力變化使先前由刀輪於玻璃基板 表面形成之預切割線位置産生向下成長之裂紋，進而使整 個玻璃基板開裂。而此種雷射切割設備基本上只能經由上 述切割製程來執行對單一或少數幾種不同材料或厚度之基 板進行切割。 200831227 【發明内容】 有鑒於此，有必要提供一種可執行多種切割製程之雷 射切割設備，以滿足不同厚度及材質之脆性材料基板之切 割需求。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser cutting apparatus, and more particularly to a laser cutting apparatus which can be used for cutting a substrate of a brittle material. [Prior Art] With the continuous development of display technology, liquid crystal display devices such as Thin Film Transistor Liquid Crystal Display (TFT-LCD) have been widely used in the consumer field, and it is expected to replace the conventional cathode ray tube ( Cathode Ray Tube, CRT) display device. A liquid crystal display device such as a TFT-LCD usually consists of two upper and lower glass plates, and is housed in a liquid crystal and a plurality of circuits between the two glass plates. The liquid crystal can be changed in arrangement by an electric field to realize a display function. In order to form liquid crystal display panels of different sizes, it is usually necessary to cut a glass substrate of a larger size. Laser cutting equipment typically includes a carrier disk, a cutter wheel, a laser, and a cooler. When the glass substrate is cut by the laser cutting device, it is usually money to hold the glass substrate to be cut on the carrier, and then use a cutter wheel to form a pre-cut line on the surface of the glass substrate, and then use the laser to emit the laser. The light beam heats the glass substrate along the pre-cut line, and then sprays a cooling fluid through the cooler to cool the surface of the glass substrate. The glass substrate undergoes a stress change due to a sharp temperature difference, which causes a downwardly growing crack in the position of the pre-cut line previously formed by the cutter wheel on the surface of the glass substrate, thereby cracking the entire glass substrate. Such a laser cutting apparatus can basically perform cutting of a single or a small number of substrates of different materials or thicknesses via the above-described cutting process. 200831227 SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a laser cutting apparatus that can perform a variety of cutting processes to meet the cutting requirements of brittle material substrates of different thicknesses and materials.
一種雷射切割設備，其包括一具有一承載面之承載裝 置，一相對所述承載裝置設置並位於該承載裝置之承載面 一侧之雷射切割裝置，以及分別設於所述雷射切割裝置之 相對兩側之預切割裝置及冷卻裝置，其中，所述預切割裝 置包括複數可切換使用之預切割單元。 相較於先前技術，所述雷射切割設備之預切割裝置包 括複數可切換使用之預切割單元，經由切換使用不同之預 切割單元，可執行多種不同之雷射切割製程，以滿足不同 厚度及材質之脆性材料基板之切割需求。 【實施方式】 下面將結合附圖對本發明實施例作進一步詳細說明。 請參見圖1，本發明實施例所提供之一種雷射切割設 備100，其包括一承載裝置110，一雷射切割裝置120，一 預切割裝置130，以及一冷卻裝置140。 所述承載裝置110具有一承載面112，用於承載待切 割之脆性材料基板200。該脆性材料基板200之材質可為陶 瓷、玻璃或石英等脆性材料。通常，該承載裝置110可沿 垂直於其承載面112之Z轴方向移動，還可在平行於該承 載面112之X-Y平面内平動或/及轉動。 所述雷射切割裝置120相對該承載裝置110設置，並 200831227 且位於該承載裝置110之承載面112 —侧。該雷射切割裝 置120包括一雷射源122及一聚光裝置124。該雷射源122 可為一個二氧化碳雷射器，用於産生一雷射光束照射並加 熱所述脆性材料基板200。所述聚光裝置124用於將所述雷 射源122發射出之雷射光束聚集至所述脆性材料基板 200,以提高加熱效率。通常，所述雷射源122發射出之雷 射光束經由該聚光裝置124聚集後以非聚焦方式照射並加 熱所述脆性材料基板200。優選的，該雷射切割裝置120 ®還包括一光束偏轉器126,用於調整所述雷射源122發射出 之雷射光束之方向，以減小該雷射切割裝置120之體積， 使所述雷射切割設備100之整體結構緊湊。該光束偏轉器 126可為一反射鏡或棱鏡。更優選的，該雷射切割裝置120 還包括一光遮斷器128,該光遮斷器128可作為一光開關， 用於阻斷所述雷射源122發射出之雷射光束照射至所述待 切割之脆性材料基板200,使得於工作過程中無需直接開啓 _或關閉所述雷射源122,以避免該雷射源122關閉後重新開 啓時，因需預熱而影響生産效率。 所述預切割裝置130位於該雷射切割裝置120之一 側，用於在所述脆性材料基板200上沿一預定方向A形成 一預切割線220。該預切割裝置130包括可切換使用之雷射 預切割單元132及刀輪預切割單元134。 所述雷射預切割單元132包括一雷射源1322及一聚光 裝置1324。該雷射源1322可為一紫外雷射器，用於産生一 紫外光束照射並沿所述預定方向.A預切割所述脆性材料基 10 200831227 板200。所述聚光裝置1324位於所述承載裝置110之承載 面112 —侧，用於將所述雷射源1322發射出之雷射光束聚 集至所述脆性材料基板200,以提高預切割效率。所述雷射 源1322發射出之雷射光束經由該聚光裝置1324聚集後， 一般以聚焦方式照射並沿所述預定方向A對所述脆性材料 基板200進行預切割。該聚光裝置1324可沿垂直於所述承 載裝置110之承載面112之Z軸方向移動，從而可調節所 述雷射光束之會聚點之位置或照射至該脆性材料基板200 着上之光斑大小。通常，該雷射預切割單元132還包括一導 引元件1326，如滑執、滑桿或螺桿等；該導引元件1326 沿垂直於所述承載面112之Z軸方向延伸。所述聚光裝置 1324與該導引元件1326活動連接，即，該聚光裝置1324 可於該導引元件1326上移動。優選的，該雷射預切割單元 132還包括一光束偏轉器1321，用於調整所述雷射源1322 所産生之雷射光束之方向，以減小該雷射預切割單元132 _之體積，使所述雷射切割設備100之整體結構更加緊湊。 該光束偏轉器1121可為一反射鏡或棱鏡。更優選的，該雷 射預切割單元132還包括一光遮斷器1323，該光遮斷器 1323可作為一光開關，用於阻斷所述雷射源1322發射出之 雷射光束照射至所述待切割之脆性材料基板200,使得於工 作過程中無需直接開啓或關閉所述雷射源1322，以避免該 雷射源1322關閉後重新開啓時，因需預熱而影響生産效率。 所述刀輪預切割單元134位於所述承載裝置110之承 載面112 —側，其包括一刀輪1342及一支撐座1344。該刀 11 200831227 輪1342可為鑽石刀輪或鎢鋼刀輪，其裝載於所述支撐座 1344上。該支撐座1344可帶著刀輪1342沿平行於所述承 載裝置110之承載面112之X軸方向移動。通常，該刀輪 預切割單元134也包括一導引元件1346，如滑執、滑桿^ 螺桿等，該導引元件1346沿平行於所述承載面112之χ軸 方向延伸。所述支撐座1344與該導引元件1346活動連接， 即，該支撐座1344可帶著所述刀輪1342於該導引元件1346 上移動。所述導引元件1346之一端靠近所述雷射預切割單 兀132之導引元件1326設置，以使得所述刀輪1342對脆 性材料基板200進行預切割之初始切割位置可與採用所述 雷射預切割單元132對脆性材料基板200進行預切割之初 始切割位置大致處於同一位置。 當然，可以理解的是，該預切割裝置130還可包括其 他預切割單元，以適用於其他不同厚度或材質之脆性材料 基板之預切割。 ^ 所述冷卻裝置140位於所述雷射切割裝置120之與所 述預切割裝置130相對之另一侧，用於提供冷卻流體以冷 卻被該雷射切割裝置120所加熱之脆性材料基板200,以使 該脆性材料基板200沿所述預切割線220産生裂紋成長並 開裂。該冷卻裝置140包括一第一流道I42，一第二流道 144,以及一與該第一流道142及第二流道I44均連通之喷 嘴146。該喷嘴146位於所述承載裝置I10之承載面η2 一侧。該第一流道142及第二流道144砰分別提供一第一 冷卻流體及一第二冷卻流體。該第一冷卻流體可為冷卻液 12 200831227 體，如冷卻水、液態氮或液態氦等。該第二冷卻流體可為 低溫（通常為〇°c以下）之無塵乾燥空氣、氣態氮、氣態氦或 其混合物等氣體。通常’該冷卻裝置140還包括一第^一闊 門141及一第二闕門1C ’其分別設置於所述第一流道142 及第二流道144上，分別用於切換該第一流道142及弟一 流道144之導通與關閉狀態。當然’可以理解的是，使用 過程中可同時開通第/閥門141及第二閥門143,亦< 只開 通其中之一個閥門。優選的，該冷卻裝置140之喷嘴146 _與雷射切割裝置1知射至所述跪性材料基板200之雷射 光束與刀輪1342，以及雷射預切割單元132照射至該跪性 材料基板200之雷射光束大致位於同一平面内，即X-Z平 面内。 當然，可以理解的是，該冷卻裝置140還可包括更多 流道，從而可提供更多不同之冷卻流體及冷卻流體組合’ 以滿足更多種不同雷射切割製程之需求。 ^ 使用該雷射切割設備100切割所述脆性材料基板200 時’通常先根據該脆性材料基板200之材質及厚度等選擇 所要採用之預切割單元，例如，若該脆性材料基板2〇〇為 一般厚度之玻璃或陶究等材料，則可採用雷射預切割單元 進订預切副，若該脆性材料基板200為較厚之陶瓷或石 英等材料，則可採用刀輪預切割單元進行預切割。 具體地右採用雷射預切割單元132進行預切割，則 可由所述承餘置11G將該脆性材料基板移至靠近所 述預切割裝置130之一側，且使該脆性材料基板2〇〇與所 13 200831227 述刀輪預切割單元134沿Z軸方向保留一定間距。當然， 可以理解的是，應使該刀輪預切割單元134之支撐座1344 於其導引元件1346上移動至遠離所述雷射預切割單元134 之導引元件1326之位置，以免該刀輪預切割單元134影響 切割過程。之後，將雷射預切割單元132之雷射源1322及 光遮斷器1323均開啓，使該雷射源1322發射出之雷射光 束經所述光束偏轉器1321偏轉後射入所述聚光裝置 1324,並沿所述導引元件1326移動該聚光裝置1324，以使 ®雷射光束經由該聚光裝置1324聚焦至所述脆性材料基板 200之一側部邊緣，然後由所述承載裝置110帶著該脆性材 料基板200沿所述預定方向A相反之方向移動，隨後啓動 雷射切割裝置120及冷卻裝置140進行切割。 請一併參見圖2，若採用刀輪預切割單元134進行預 切割，所述雷射切割設備100之工作流程與上述採用雷射 預切割單元134進行預切割時基本相同，不同之處在於： _需將雷射預切割單元132之光遮斷器1323關閉，並使其聚 光裝置1324於所述導引元件1326上移至遠離所述承載裝 置110之承載面112之位置，而使刀輪預切割單元134之 支撐座1344帶著刀輪1342於所述導引元件1346上移動至 靠近所述雷射預切割單元134之導引元件1326之位置，之 後由所述承載裝置110將所述脆性材料基板200之一侧部 邊緣移至與所述刀輪1342相接觸，然後可按照與採用雷射 預切割單元132進行預切割時相同之切割步驟進行切割。 當然，可以理解的是，若所述脆性材料基板200為超 14 200831227 薄玻璃等材料時，可無需使用雷射切割裝置120，即，可關 閉該雷射切割裝置120之光遮斷器128以阻斷所述雷射源 122發射出之雷射光束照射至所述待切割之脆性材料基板 200，而直接採用雷射預切割單元132完成切割。 本發明實施例所提供之雷射切割設備100可經由切換 使用不同之預切割單元來執行多種不同之雷射切割製程， 以滿足不同厚度及材質之脆性材料基板之切割需求。並 且，所述雷射預切割單元132之聚光裝置1324及刀輪預切 鑄割單元134之支撐座1344均採用可移動式設置，可使該雷 射切割設備100之整體結構更加緊湊。 綜上所述，本發明確已符合發明專利要件，爰依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施例， 舉凡熟悉本案技藝之人士，於援依本案發明精神所作之等 效修飾或變化，皆應包含於以下之申請專利範圍之内。 【圖式簡單說明】 _ 圖1係本發明實施例所提供之雷射切割設備採用雷射 預切割單元進行預切割之工作狀態示意圖。 圖2係本發明實施例所提供之雷射切割設備採用刀輪 預切割單元進行預切割之工作狀態示意圖。 【主要元件符號說明】 雷射切割設備 100 承載面 112 雷射源 122、1322 光束偏轉器 126、1321 承載裝置 110 雷射切割裝置 120 聚光裝置 124、1324 光遮斷器 128、1323 15 200831227 預切割裝置 130 雷射預切割單元 132 導引元件 1326、 1346 刀輪預切割單元 134 刀輪 1342 支撐座 1344 冷卻裝置 140 第一閥門 141 第一流道 142 第二閥門 143 第二流道 144 喷嘴 146 脆性材料基板 200 預切割線 220 傷 16A laser cutting device comprising: a carrying device having a bearing surface, a laser cutting device disposed on the side of the carrying surface of the carrying device, and respectively disposed on the laser cutting device Pre-cutting device and cooling device on opposite sides, wherein the pre-cutting device comprises a plurality of pre-cutting units switchable. Compared with the prior art, the pre-cutting device of the laser cutting device comprises a plurality of pre-cutting units that can be switched, and a plurality of different laser cutting processes can be performed by switching different pre-cutting units to meet different thicknesses and Cutting requirements for materials of brittle material substrates. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. Referring to FIG. 1, a laser cutting apparatus 100 according to an embodiment of the present invention includes a carrying device 110, a laser cutting device 120, a pre-cutting device 130, and a cooling device 140. The carrying device 110 has a bearing surface 112 for carrying the brittle material substrate 200 to be cut. The material of the brittle material substrate 200 may be a brittle material such as ceramic, glass or quartz. Typically, the carrier 110 can be moved in a Z-axis direction perpendicular to its bearing surface 112 and can also be translated or/and rotated in an X-Y plane parallel to the carrier surface 112. The laser cutting device 120 is disposed relative to the carrier device 110 and is located at the side of the bearing surface 112 of the carrier device 110. The laser cutting device 120 includes a laser source 122 and a concentrating device 124. The laser source 122 can be a carbon dioxide laser for generating a laser beam to illuminate and heat the brittle material substrate 200. The concentrating device 124 is configured to collect the laser beam emitted from the laser source 122 to the brittle material substrate 200 to improve heating efficiency. Typically, the laser beam emitted by the laser source 122 is concentrated by the concentrating device 124 to illuminate and heat the brittle material substrate 200 in an unfocused manner. Preferably, the laser cutting device 120 ® further includes a beam deflector 126 for adjusting the direction of the laser beam emitted by the laser source 122 to reduce the volume of the laser cutting device 120. The overall structure of the laser cutting apparatus 100 is compact. The beam deflector 126 can be a mirror or prism. More preferably, the laser cutting device 120 further includes a photointerrupter 128, which can serve as an optical switch for blocking the laser beam emitted from the laser source 122 to be irradiated to the laser beam. The cut brittle material substrate 200 is described so that it is not necessary to directly turn on or turn off the laser source 122 during operation to avoid the re-heating of the laser source 122 when it is turned off, which affects the production efficiency due to the need for preheating. The pre-cutting device 130 is located on one side of the laser cutting device 120 for forming a pre-cut line 220 along the predetermined direction A on the brittle material substrate 200. The pre-cutting device 130 includes a laser pre-cutting unit 132 and a cutter wheel pre-cutting unit 134 that are switchable. The laser pre-cutting unit 132 includes a laser source 1322 and a concentrating device 1324. The laser source 1322 can be an ultraviolet laser for generating an ultraviolet beam illumination and pre-cutting the brittle material substrate 10 200831227 plate 200 in the predetermined direction. The concentrating device 1324 is located on the side of the bearing surface 112 of the carrying device 110 for collecting the laser beam emitted from the laser source 1322 to the brittle material substrate 200 to improve the pre-cut efficiency. After the laser beam emitted from the laser source 1322 is collected by the concentrating device 1324, it is generally irradiated in a focused manner and pre-cuts the brittle material substrate 200 along the predetermined direction A. The concentrating device 1324 is movable along a Z-axis direction perpendicular to the bearing surface 112 of the carrier device 110, so that the position of the convergence point of the laser beam or the spot size irradiated onto the brittle material substrate 200 can be adjusted. . Typically, the laser pre-cutting unit 132 further includes a guiding member 1326, such as a slide, slide or screw, etc.; the guiding member 1326 extends in a Z-axis direction perpendicular to the bearing surface 112. The concentrating device 1324 is movably coupled to the guiding member 1326, that is, the concentrating device 1324 is movable on the guiding member 1326. Preferably, the laser pre-cutting unit 132 further includes a beam deflector 1321 for adjusting the direction of the laser beam generated by the laser source 1322 to reduce the volume of the laser pre-cutting unit 132_. The overall structure of the laser cutting apparatus 100 is made more compact. The beam deflector 1121 can be a mirror or prism. More preferably, the laser pre-cutting unit 132 further includes a photointerrupter 1323, which can serve as an optical switch for blocking the laser beam emitted from the laser source 1322 to be irradiated to The brittle material substrate 200 to be cut is such that the laser source 1322 does not need to be directly turned on or off during operation to avoid the re-heating of the laser source 1322, and the production efficiency is affected by preheating. The cutter wheel pre-cutting unit 134 is located on the side of the bearing surface 112 of the carrying device 110, and includes a cutter wheel 1342 and a support seat 1344. The knife 11 200831227 wheel 1342 can be a diamond or tungsten steel cutter wheel that is loaded onto the support base 1344. The support seat 1344 is movable with the cutter wheel 1342 in an X-axis direction parallel to the bearing surface 112 of the carrier device 110. Typically, the cutter wheel pre-cutting unit 134 also includes a guiding member 1346, such as a slide, a slider, or the like, which extends in a direction parallel to the axis of the bearing surface 112. The support seat 1344 is movably coupled to the guiding member 1346, that is, the support seat 1344 can be moved over the guiding member 1346 with the cutter wheel 1342. One end of the guiding element 1346 is disposed adjacent to the guiding element 1326 of the laser pre-cutting unit 132, such that the initial cutting position of the cutting wheel 1342 to pre-cut the brittle material substrate 200 can be used with the The initial cutting position at which the pre-cutting unit 132 pre-cuts the brittle material substrate 200 is substantially at the same position. Of course, it will be appreciated that the pre-cutting device 130 may also include other pre-cutting units for pre-cutting of other brittle material substrates of different thicknesses or materials. The cooling device 140 is located on the opposite side of the laser cutting device 120 from the pre-cutting device 130 for providing a cooling fluid to cool the brittle material substrate 200 heated by the laser cutting device 120, The brittle material substrate 200 is cracked and cracked along the pre-cut line 220. The cooling device 140 includes a first flow path I42, a second flow path 144, and a nozzle 146 that communicates with the first flow path 142 and the second flow path I44. The nozzle 146 is located on the side of the bearing surface η2 of the carrier device I10. The first flow channel 142 and the second flow channel 144 are respectively provided with a first cooling fluid and a second cooling fluid. The first cooling fluid may be a coolant 12 200831227 body such as cooling water, liquid nitrogen or liquid helium. The second cooling fluid may be a low temperature (typically below 〇 °c) dust-free dry air, gaseous nitrogen, gaseous helium or a mixture thereof. Generally, the cooling device 140 further includes a first wide gate 141 and a second gate 1C respectively disposed on the first flow passage 142 and the second flow passage 144 for respectively switching the first flow passage 142. And the first-class road 144 is turned on and off. Of course, it can be understood that the valve 141 and the second valve 143 can be simultaneously opened during use, and only one of the valves is opened. Preferably, the nozzle 146 of the cooling device 140 and the laser cutting device 1 are irradiated to the laser beam and the cutter wheel 1342 of the inert material substrate 200, and the laser pre-cutting unit 132 is irradiated to the substrate of the inert material. The 200 laser beams are located approximately in the same plane, ie in the XZ plane. Of course, it will be appreciated that the cooling device 140 may also include more flow passages to provide more different combinations of cooling fluid and cooling fluids to meet the needs of a variety of different laser cutting processes. ^ When the brittle material substrate 200 is cut by the laser cutting device 100, the pre-cutting unit to be used is usually selected according to the material and thickness of the brittle material substrate 200, for example, if the brittle material substrate 2 is For materials such as glass or ceramics of thickness, the pre-cutting unit may be used by the laser pre-cutting unit. If the brittle material substrate 200 is thick ceramic or quartz, the pre-cutting unit may be used for pre-cutting. . Specifically, the pre-cutting is performed by the laser pre-cutting unit 132, and the brittle material substrate can be moved to the side of the pre-cutting device 130 by the rest bearing 11G, and the brittle material substrate 2 is 13 200831227 The cutter wheel pre-cutting unit 134 retains a certain distance along the Z-axis direction. Of course, it should be understood that the support seat 1344 of the cutter wheel pre-cutting unit 134 should be moved on its guiding element 1346 to a position away from the guiding element 1326 of the laser pre-cutting unit 134 to avoid the cutter wheel. The pre-cutting unit 134 affects the cutting process. Thereafter, the laser source 1322 and the photointerrupter 1323 of the laser pre-cutting unit 132 are both turned on, and the laser beam emitted from the laser source 1322 is deflected by the beam deflector 1321 and then injected into the spotlight. The device 1324 moves the concentrating device 1324 along the guiding member 1326 such that the laser beam is focused to the side edge of one of the brittle material substrates 200 via the concentrating device 1324, and then the carrier device The substrate 110 is moved in the opposite direction of the predetermined direction A with the brittle material substrate 200, and then the laser cutting device 120 and the cooling device 140 are activated for cutting. Referring to FIG. 2 together, if the pre-cutting is performed by the cutter wheel pre-cutting unit 134, the workflow of the laser cutting apparatus 100 is basically the same as that of the pre-cutting by the laser pre-cutting unit 134 described above, except that: The photo-interrupter 1323 of the laser pre-cutting unit 132 is closed, and the concentrating device 1324 is moved on the guiding element 1326 to a position away from the bearing surface 112 of the carrying device 110, so that the knife is The support seat 1344 of the wheel pre-cutting unit 134 is moved by the cutter wheel 1342 to the guiding element 1346 to a position close to the guiding element 1326 of the laser pre-cutting unit 134, and then the carrier device 110 One of the side edges of the brittle material substrate 200 is moved into contact with the cutter wheel 1342, and then the cutting can be performed in the same cutting step as when the laser pre-cutting unit 132 performs pre-cutting. Of course, it can be understood that if the brittle material substrate 200 is a material such as ultra-light 2008 14721227 thin glass, the laser cutting device 120 can be eliminated, that is, the photo-interrupter 128 of the laser cutting device 120 can be turned off. The laser beam emitted from the laser source 122 is blocked from being irradiated onto the brittle material substrate 200 to be cut, and the cutting is directly performed by the laser pre-cutting unit 132. The laser cutting apparatus 100 provided by the embodiments of the present invention can perform a plurality of different laser cutting processes by switching different pre-cutting units to meet the cutting requirements of the brittle material substrates of different thicknesses and materials. Moreover, the concentrating device 1324 of the laser pre-cutting unit 132 and the supporting seat 1344 of the cutter wheel pre-cutting and cutting unit 134 are all movably arranged, so that the overall structure of the laser cutting apparatus 100 can be more compact. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and those skilled in the art will be able to incorporate the modifications and variations of the invention in the spirit of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing the working state of a laser cutting device according to an embodiment of the present invention using a laser pre-cutting unit for pre-cutting. 2 is a schematic view showing the working state of the laser cutting device provided by the embodiment of the present invention using a cutter wheel pre-cutting unit for pre-cutting. [Main component symbol description] Laser cutting device 100 bearing surface 112 laser source 122, 1322 beam deflector 126, 1321 carrier device 110 laser cutting device 120 concentrating device 124, 1324 light interrupter 128, 1323 15 200831227 Cutting device 130 laser pre-cutting unit 132 guiding element 1326, 1346 cutter wheel pre-cutting unit 134 cutter wheel 1342 support seat 1344 cooling device 140 first valve 141 first flow channel 142 second valve 143 second flow channel 144 nozzle 146 brittleness Material substrate 200 pre-cut line 220 injury 16