200830145 九、發明說明 【發明所屬之技術領域】 本發明是有關具備：執行所定處理的機器本體、及將 該機器本體收納於内部的框體之電子機器的製造方法及該 電子機器。 【先前技術】 以往，具備 CPU ( Central Processing Unit)等的積體 電路之資訊處理裝置爲人所知。就如此的資訊處理裝置而 言，例如有執行所定的運算處理的個人電腦（Personal Computer，PC )、或將記錄或記憶於 C D ( C o m p a c t D i s c )、DVD ( Digital V e r s at i 1 e D i s c )及 B D ( B 1 u - r ay D i s c :註冊商標）等的光碟記錄媒體、及半導體記憶卡或HDD (Hard Disk Drive)等的記憶媒體的圖像及音聲資訊予以 再生的碟片再生裝置爲人所知。 就如此的碟片再生裝置而言，例如有讀出記錄於光碟 的遊戲程式，按照來自使用者所操作的控制器的指示，執 行該遊戲程式的娛樂裝置爲人所知（例如參照文獻1 :曰 本特開2001-320181號公報）。 記載於此文獻1的娛樂裝置是具備：具有電子零件等 的裝置本體、及收容該裝置本體的框體。其中，裝置本體 是具備：安裝有CPU等的電路基板、及被覆該電路基板 的表背面的一對遮蔽板、及被載置於一方遮蔽板的上面側 的碟片裝置。並且，框體是具備：具有用以收納裝置本體 -4- 200830145 的開口的下盒（lower case )、及閉塞該開口的上盒（ uppercase) 〇 此娛樂裝置的組裝程序，是經由開口在下盒的内部分 別積層配置一方的遮蔽板、電路基板、另一方的遮蔽板及 碟片裝置，且以能夠閉塞下盒的開口之方式來使上盒卡合 。在此，於下盒的底面形成有突起，以該突起能夠插通一 方的遮蔽板、電路基板及另一方的遮蔽板之方式，將該等 配置於下盒内。然後，使該等反轉，將下盒的底面向上之 後，在形成於該下盒的揷入孔插入固定螺絲，而使該固定 螺絲螺合於上盒所形成的雌螺絲孔。如此一來，上盒與下 盒可被組合，此時，形成於下盒的板狀肋材或突起會按壓 電路基板及一對的遮蔽板的同時，該板狀肋材的側面會與 遮蔽板抵接。藉此，即使進行框體的反轉動作，照樣可以 抑止内部的構成構件在框體内部移動。 然而，記載於文獻1的娛樂裝置，因爲是針對下盒來 定位一對的遮蔽板及電路基板，所以有可能在電路基板與 一對的遮蔽構件之間產生位移。 在此，在電路基板上，除了前述的CPU以外，大多 的情況是安裝有多數個晶片組等的積體電路，一旦如此的 電路基板與以能夠夾著該電路基板的方式配置的遮蔽板發 生位移，則有可能遮蔽板撞擊到該等積體電路。因此，必 須在積體電路與遮蔽構件之間設置緩衝構件等’所以會有 構成複雜化的問題。因此，期望有可防止電路基板與夾著 該電路基板的構件之位移的方式。 -5- 200830145 【發明內容】 本發明的主要目的是在於提供一種可防止電路基板與 夾著該電路基板的構件之位移發生之電子機器的製造方法 及電子機器。 爲了達成上述目的，本發明之電子機器的製造方法， 係具備：執行信號處理的機器本體、及將該機器本體收納 於内部的框體之電子機器的製造方法，其特徵爲： 上述機器本體具備： 執行上述信號處理的電路基板；及 夾著上述電路基板而覆蓋的第1框架及第2框架， 上述框體係具備： 具有收納上述機器本體的開口之第1框體；及 閉塞上述開口的第2框體， 上述第1框架係具有第1銷及第2銷， 上述第2框架及上述電路基板係具有插通上述第1銷 的孔部， 上述第1框體係具有嵌合上述第2銷的嵌合穴， 該電子機器的製造方法係具有： 基板定位工程，其係使上述第1銷插通於上述電路基 板的上述孔部，藉此將該電路基板定位於上述第1框架； 第2框架定位工程，其係使上述第1銷插通於上述第 2框架的上述孔部，藉此將該第2框架定位於上述第1框 架； -6- 200830145 第1框架定位工程，其係使上述第2 合穴，藉此將上述第1框架定位於上述第 第2框體安裝工程，其係於上述第1 2框體。 右利用本發明’則首先在基板定位工 定位於第1框架。此時，以電路基板的孔 框架的第1銷之方式來定位，藉此可防止 基板的位移。然後，在第2框架定位工程 孔部能夠揷通第1銷的方式，使該第2框 位。藉此，可防止第1框架及電路基板與 。其次，在第1框架定位工程，使第1框 於第1框體的嵌合穴，將該第1框架定位 此，可防止第1框架與第1框體的位移， 路基板及第2框架與第1框體的位移。然 安裝工程，將第2框體安裝於第1框體， 機器。 藉此，由於是在對第1框體定位的第 基板及第2框架，因此可防止電路基板及 框架的位移。 並且，在如此對第1框架定位電路基 後，將該第1框架定位於第1框體，藉此 電路基板及第2框架定位於框體内的適當 防止在框體内之各構件的位移，進而能夠 擾。 銷嵌合於上述嵌 1框體；及 框體安裝上述第 程，將電路基板 部能夠揷通第1 第1框架與電路 ，以第2框架的 架對第1框架定 第2框架的位移 架的第2銷嵌合 於第1框體。藉 進而能夠防止電 後，在第2框體 而得以製造電子 1框架定位電路 第2框架對第1 板及第2框架之 可將第1框架、 位置。因此，可 防止各構件的干 200830145 就本發明而言，最好上述第1框架係於該第1框架的 端部具備抵接於上述電路基板及上述第2框架的各個端部 之抵接部， 上述第1銷係形成於與上述抵接部呈相反側的端部， 在上述基板定位工程，使上述電路基板的端部抵接於 上述抵接部之後，以該端部爲軸來使上述電路基板轉動， 藉此將該電路基板定位於上述第1框架， 在上述第2框架定位工程，使上述第2框架的端部抵 接於上述抵接部之後，以該端部爲軸來使上述第2框架轉 動，藉此將該第2框架定位於上述第1框架。 若利用本發明，則由於是藉由位於第1框架的一方端 部的抵接部、及位於另一方的端部的第1銷，來使電路基 板及第2框架對第1框架定位，因此可確實防止該等電路 基板及第2框架的位移。又，由於電路基板及第2框架是 以抵接於第1框架的抵接部的端部爲軸來使轉動，以能夠 覆蓋該第1框架的方式來定位，因此可簡易進行該等電路 基板及第2框架的定位工程。所以，可使電路基板及第2 框架的定位工程簡略化，且可確實防止該等的位移。 就本發明而言，最好上述第1框架係具備立起部，其 係於上述抵接部與上述第1銷之間，往對向於上述電路基 板的側立起，且引導上述電路基板及上述第2框架的其中 至少任一的定位。 若利用本發明’則可使電路基板及第2框架抵接於第 1框架的抵接部，以能使轉動的方式來定位第1框架時， -8- 200830145 藉由第1框架的立起部來引導該電路基板及第2框架的至 少其中之一的轉動。因此，可使對第1框架之電路基板及 第2框架的至少其中之一的定位工程更簡略化。 就本發明而言，最好上述立起部係分別形成於與從上 述抵接部往上述第1銷的方向正交的方向之上述第1框架 的兩端， 上述電路基板及上述第2框架的至少其中之一的構件 係於對應於上述各立起部的位置具有缺口， 上述缺口係於上述構件定位於上述第1框架時，藉由 上述各立起部所夾著。 若利用本發明，則由於是藉由位於第1框架的兩端之 立起部來夾著缺口，因此可使電路基板及第2框架的至少 其中之一，且具有缺口的構件確實地定位於第1框架上的 適當位置。又，由於在定位該電路基板及第2框架時，缺 口爲立起部所夾著，藉此可抑止在第1框架上的搖動，因 此可更確實地防止該構件對第1框架的位移。所以，可謀 求電路基板及第2框架的定位工程的簡略化的同時，可更 確實地防止該構件的位移。 就本發明而言，最好上述第1銷係設置複數個，上述 電路基板及上述第2框架係具有對應於上述第1銷的複數 個上述孔部。 若利用本發明，則第1框架具有複數個第1銷，對應 於該第1銷，電路基板及第2框架具有複數個孔部。藉此 ，可將電路基板及第2框架定位於第1框架上的複數處， -9- 200830145 可更抑止在第1框架上之電路基板及第2框架的搖動。因 此，可更確實地防止電路基板及第2框架與第1框架的位 移。 就本發明而言，最好上述第2銷係與上述第1銷，突 出方向爲相反， 在上述第2框架定位工程，以上述第2框架的上述孔 部能夠從上方來揷通於上述第1銷之方式，對上述第1框 架定位上述第2框架， 上述第1框架定位工程係具有： 第1框架反轉程序，其係以上述第2銷的突出方向能 夠朝向上方之方式，使上述第1框架反轉；及 第1框體被覆程序，其係以使反轉後的上述第1框架 的上述第2銷能夠嵌合於上述嵌合穴之方式，使上述第1 框體覆蓋於該第1框架。 若利用本發明，則在第1框架反轉程序，使定位電路 基板及第2框架的第1框架反轉，藉此在第1框體被覆程 序將第1框架定位於第1框體時，可使突出於和第1銷呈 相反方向的第2銷容易嵌合於第1框體的嵌合穴。因此， 可使第1框架定位工程簡略化。 就本發明而言，最好上述機器本體係具備冷卻手段， 其係經由形成於上述第1框架的其他開口來抵接於上述電 路基板，且冷卻由該電路基板所傳導的熱， 上述冷卻手段及上述第1框架的其中任一方係於對向 於另一方的側具有複數的定位銷，另一方係具有插入上述 -10- 200830145 定位銷的銷揷入口， 該電子機器的製造方法係具有冷卻手段定位工程’其 係使上述定位銷插通於上述銷揷入口 ’藉此定位上述冷卻 手段及上述第1框架。 在此，當CPU等的積體電路設於電路基板時，積體 電路一般是在發熱體的一方，對熱較弱’因此必須有效 率地冷卻該積體電路。 相對的，本發明是機器本體具備：在電路基板所發生 的熱會被傳導，且冷卻該熱之冷卻手段，藉此可適當地冷 卻電路基板，進而能夠謀求電路基板的處理安定化。 又，由於冷卻手段及第1框架的其中之一方具有定位 銷，另一方具有銷揷入口，因此除了可容易進行冷卻手段 定位工程之冷卻手段與第1框架的定位以外，還可防止該 冷卻手段與第1框架的位移。 就本發明而言，最好上述機器本體係具備： 彈壓板，其係對上述電路基板設置於與上述冷卻手段 呈相反的側，且將上述冷卻手段按壓於經由上述其他的開 口而露出的上述電路基板；及 安裝構件，其係將上述彈壓板安裝於上述冷卻手段， 上述第1框架、上述電路基板及上述第2框架係分別 具有插通上述安裝構件的其他孔部， 上述冷卻手段係具有卡止上述安裝構件的卡止部， 該電子機器的製造方法係具有冷卻手段安裝工程，其 係於上述冷卻手段定位工程及上述第2框架定位工程之後 -11 - 200830145 ，經由上述彈壓板、上述第2框架、上述電路基板及上述 第1框架來使上述安裝構件卡止於上述卡止部，藉此以上 述冷卻手段及上述彈壓板能夠挾持上述電路基板及上述第 2框架的方式，在上述電路基板安裝上述冷卻手段。 就如此的安裝構件而言，例如可舉螺絲、螺栓等的固 定具。 若利用本發明，則安裝構件會經由彈壓板、第2框架 、電路基板及第1框架來卡止於卡止部，藉此可將該等第 1框架、電路基板及第2框架與冷卻手段一體構成。藉此 ，可容易處理機器本體，所以可使前述的第1框架定位工 程等之電子機器的製造工程簡略化。 又，由於藉由彈壓板來將電路基板按壓於冷卻手段， 因此可使在電路基板所產生的熱之往冷卻手段的傳導效率 提升。藉此，可有效率地進行電路基板的冷卻。 又，第1框架、電路基板及第2框架是藉由彈壓板及 冷卻手段所挾持。藉此，在第1框架、電路基板及第2框 架的其中之一固定冷卻手段時，可防止因冷卻手段的荷重 造成固定該冷卻手段的構件發生彎曲等的變位，且可將冷 卻手段適當地按壓於電路基板。因此，可安定維持一體化 的機器本體的同時，可使利用冷卻手段之電路基板的冷卻 效率更爲提升。 就本發明而言，最好上述第1框架及上述第2框架係 具有凹部，其係沒入於與對向於上述電路基板的側呈相反 的側，上述第1框架及上述第2框架係以對應於上述電路 -12- 200830145 基板的尺寸所形成，上述凹部的端緣係抵接於上述電路基 板。 若利用本發明，則可在藉由第1框架及第2框架的各 凹部所形成的空間内配置電路基板，藉此除了可確實防止 安裝於該電路基板的積體電路等直接抵接於第1框架及第 2框架以外，還可謀求第1框架及第2框架的薄型化。因 此，可謀求機器本體的小型化。 又，電路基板是抵接於第1框架及第2框架的端緣， 藉此可使隨著流動於該電路基板的電流所產生的輻射雜訊 導通至第1框架及第2框架。因此可可實施電子機器的 EMI ( Electro Magnetic Interference、電磁干渉）對策。 又，本發明的電子機器，係具備執行信號處理的機器 本體、及將該機器本體收納於内部的框體之電子機器，其 特徵爲： 上述框體係具備： 具有收納上述機器本體的開口之第1框體；及 閉塞上述開口的第2框體， 上述機器本體係具備： 執行上述信號處理的電路基板；及 夾著上述電路基板而覆蓋的第1框架及第2框架， 上述第1框架係在一方的端部具備抵接於上述電路基 板及上述第2框架的各個端部的抵接部，在另一方的端部 具有第1銷及第2銷， 上述第1框架係於與從上述抵接部往上述第1銷的方 -13- 200830145 向正交的方向的端部具備往對向於上述電路基板的側立起 的立起部， 上述電路基板及上述第2框架係具有：插通上述第1 銷的孔部、及卡合於上述抵接部的卡合部， 上述第1框體係具有嵌合上述第2銷的嵌合穴。 若利用本發明，則可發揮與前述電子機器的製造方法 同樣的效果。 亦即，以第1框架的抵接部與卡合於該抵接部的電路 基板及第2框架的卡合部的接點爲軸，以能夠覆蓋第1框 架的方式來使電路基板及第2框架轉動，使第1銷揷通於 該電路基板的孔部，藉此將電路基板定位於第1框架。此 時，藉由第1框架的立起部，在電路基板及第2框架的轉 動時，該電路基板及第2框架的端部會被對齊，因此不僅 電路基板及第2框架會被引導至對第1框架的適當位置， 而且在該第1框架上之電路基板及第2框架的搖動會被抑 止。 藉此，可藉由第1框架的抵接部、第1銷及立起部來 夾著電路基板及第2框架，因此不僅可在對該第1框架的 適當位置定位電路基板及第2框架以外，而且還可以第1 框架爲基準抑止電路基板及第2框架的各位移。 又，如此定位電路基板及第2框架的第1框架的第2 銷會嵌合於第1框體的嵌合穴，藉此可將第1框架定位第 1框體。因此，可抑止構成電子機器的各構件之彼此的位 移。 -14 - 200830145 【實施方式】 以下，根據圖面來說明本發明之一實施形態 (1 )資訊處理裝置1的構成 圖1是由正面側來看本實施形態的資訊處理; 立體圖，圖2是由正面側來看開放蓋構件2 3的 訊處理裝置1的立體圖。 本實施形態的資訊處理裝置1是按照來自使 作的控制器（圖示略）之指示，或自動取得CD、 BD等光碟的記錄媒體、或各種半導體記億卡；S Hard Disk Drive)等記憶媒體中所記錄或記憶的 及由連接的網路來取得資訊，除了再生該取得資 的圖像資訊及音聲資訊以外，還執行該取得資訊 程式之電子機器。並且，此資訊處理裝置1除了 使用的光碟種類來對該光碟進行資訊的記錄以外 所裝著的半導體記憶卡及HDD等的記憶媒體進 記錄。如此的資訊處理裝置1雖省略圖示，但實 視受像機等的圖像顯示裝置電性連接，藉由使用 制器，來進行對應於使用者的操作之所定的處理 理結果輸出圖像信號及音聲信號至該圖像顯示裝穩 此資訊處理裝置1是具備：外裝框體2 (圖1 、及收納於該外裝框體2内的裝置本體3 (圖7〜 裝置1的 狀態之資 用者所操 DVD及 ：HDD ( 資訊、以 訊中所含 中所含的 可依據所 ，還可對 行資訊的 際是與電 者操作控 ，由該處 L ° 〜圖6 ) 圖9 )。 -15- 200830145 (2)外裝框體2的構成 外裝框體2’如圖1及圖2所示，全體具有大略楕圓 柱狀。如此的外裝框體2是由安裝有罩殼24的上部框體 21及下部框體22所構成。 (2-1 )上部框體21的構成 上部框體21是相當於本發明的第2框體，形成具有 圓弧狀的彎曲部份的箱型形狀，與下部框體22組合後螺 絲固定。在此上部框體21形成有正面部21 1 (圖1、圖2 及圖4)、上面部212(圖3及圖4)及側面部213(圖1 、圖2及圖4) ，214(圖3)。 正面部2 1 1是在圖1及圖2中則面側的面’在該正面 部2 1 1的大略中央及左端設有突出於面外方向的突出部 2111，2112。夾於該等突出部2111，2112的區域中形成 有卡槽部2113，在該卡槽部2113中，如圖2所示，形成 有可插拔各種半導體記憶卡（以下有時簡稱「記憶卡」） 的3個開口 2 1 1 3 1。經由該等開口 2 1 1 3 1，設於外裝框體2 内的後述讀卡機3 5 1之對應於各種記憶卡的揷入部會露出 〇 在形成有該等突出部2111，2112及卡槽部2113的區 域中，覆蓋該突出部2111，2112及卡槽部2113的蓋構件 23會被設成可轉動自如。此蓋構件23是具有沿著正面部 2 1 1的長邊方向之轉動軸，以該轉動軸爲中心來轉動至上 方，藉此開放卡槽部2113，藉由轉動至下方來閉塞卡槽部 -16- 200830145 2113° 在正面部21 1的右側，對應於直徑12cm的光碟之碟 片揷入口 2114會沿著正面部211的長邊方向來形成。插 入該碟片揷入口 2114的光碟是被插入構成後述的裝置本 體3的碟片單元3 3。 更在圖1及圖2的右側的側面部2 1 3形成有複數的吸 氣口 2 1 3 1，其係從該外裝框體2外吸入用以冷卻收納於外 裝框體2内的裝置本體3之冷卻空氣。 圖3是由背面側來看移開罩殼24後的狀態之資訊處 理裝置1的立體圖，圖4是由正面側來看卸下罩殼24後 的狀態之資訊處理裝置1的立體圖。 在上部框體21的上面部212，如圖3所示，覆蓋該上 面部2 1 2的罩殼24會可滑動自如地安裝。此罩殼24是形 成沿著上面部2 1 2的彎曲形狀，使沿著該上面部2 1 2的長 邊方向而滑動，藉此來安裝上面部212。 若卸下如此的罩殻24，則如圖4所示，形成於上面部 2 1 2的一對溝部2 1 2 1、複數的卡合部2 1 22及複數的螺絲 揷入口 2123會露出。 其中，溝部2121是在上面部212的短邊方向的兩端 ，沿著該上面部212的長邊方向而形成，引導罩殼24之 沿著上面部2 1 2的滑動。卡合部2 1 2 2是突設於罩殻2 4的 背面（與上面部212對向的面），且與具有大略鉤狀的卡 止部（圖示省略）卡合，而來防止罩殼24從上面部212 脫離。在螺絲揷入口 2 1 2 3插入用以固定上部框體2 1與裝 -17 - 200830145 置本體3的螺絲。 並且，在側面部214的長邊方向兩端，如圖3所示， 設有藉由橡膠等所形成的脚部2 1 4 1。 (2-2 )下部框體22的構成 下部框體22是相當於本發明的第1框體，如圖1及 圖2所示，具有組合長方體與半圓柱的形狀，以使半圓柱 狀部份能夠相向的方式來與前述的上部框體2 1組合。 此下部框體22是在與上部框體2 1對向的側具有用以 收納後述的裝置本體3之開口 22A (圖6 )，在該下部框 體22形成有正面部221 (圖1及圖2)、側面部222 (圖 1及圖2) ，223(圖3)、背面部224(圖3)、底面部 225(圖5)及内面部226(圖6)。另外，開口 22A是藉 由前述的上部框體2 1所閉塞。 在正面部221 (圖1及圖2的前面側部份）的左側形 成有4個大略矩形狀的開口 2211。經由該等開口 2211， 設置於構成裝置本體3的控制基板5 (圖1 8及圖19 )且 可連接準照USB ( Universal Serial Bus )規格的A端子之 端子會分別露出。並且，在正面部221的開口 221 1的右 側形成有大略矩形的複數個吸氣口 22 1 2，經由該吸氣口 22 12來導入外裝框體2外的空氣至内部。 更，在正面部221的延出部份的下面，形成有導入外 裝框體2外的空氣之吸氣口 2213 (圖5 )。 並且，在圖1及圖2的右側的側面部222、亦即對應 -18- 200830145 於上部框體21的側面部213之側面部222形成有階差， 其係上方側比後述的第1階差部225 1 (圖5 )更突出，下 方側没入，且在該階差之沿著側面部2 1 3的形成方向的面 形成有排氣口 222 1，2222，其係排出冷卻裝置本體3後的 冷卻空氣。詳而言之，在上方側的突出部份的側面形成有 排氣口 222 1，在下方側的没入部份的側面形成有排氣口 2222 ° 因此，在藉由外裝框體2的側面部2 1 3，2 2 2所形成 的面2A，吸氣口 2131及排氣口 2221，2222會形成於同 一面。 在側面部22 3的兩端，如圖3所示，設有藉由橡膠等 所形成的脚部223 1。以使形成於該側面部223的脚部 223 1、及形成於上部框體2 1的側面部2 1 4的脚部2 1 4 1能 夠抵接於設置面的方式來配置，而使資訊處理裝置1能夠 縱置。 並且，在側面部2 2 3的大略中央形成有大略矩形狀的 開口 2232，經由該開口 2232來安裝未圖示的HDD (Hard Disk Drive)單元。此開口 223 2是藉由具有對應於該開口 2232的形狀之蓋構件25來閉塞。 而且，在開口 2232的下方，沿著側面部223的長邊 方向而形成有複數的吸氣口 223 3。 在背面部224，如圖3所示，在收納於外裝框體2内 部的控制基板5所設置的各種端子5 9 (圖1 9 )會露出的 開口 2241〜2244是沿著該背面部224的長邊方向來形成 -19- 200830145 具體而言，在開口 224 1中，可連接HDMI ( High-Definition Multimedia Interface)端子的端子會露出，在 開口 2242 中，準照 IEEE8 02.3 i，可連接 10Base-T 及 100Base-TX 等的 LAN (Local Area Network)纜線的端子 會露出。並且，在開口 2243中，可連接準照USB規格的 B端子之端子會露出，在開口 2244中，可連接一端側設 有影像用的1個端子及音聲用的2個端子之同軸纜線的他 端側的端子會露出。 更在背面部224的右端設有開啓/關閉主電源的電源 開關2245，在該電源開關2245的下方形成有連接電源纜 線（圖示省略）的插入口連接器（inlet connector ) 2247 會露出的開口 2246。 並且，在背面部224的開口 224 1〜2244，2246所被 形成的部份、及設有電源開關2245的部份以外的區域， 形成有將冷卻外裝框體2内的裝置本體3後的冷卻空氣排 出至外部的排氣口 2248。 另外，此背面部224是被安裝於後述的冷卻單元32， 形成於該背面部224的排氣口 2248與冷卻單元32的吐出 口 328 (圖22)是藉由設於該吐出口 328的海綿3281來 連接。因此，從吐出口 3 28吐出的空氣不會洩漏而排出至 外裝框體2外。 圖5是由下方來看資訊處理裝置1的立體圖。 下部框體22的底面部225是對應於下部框體22之與 -20 - 200830145 上部框體2 1呈相反側的長方體部份的底面之部份。在此 底面部225中，如圖5所示，形成有突出至下方的2段的 第1階差部225 1及第2階差部2252。 詳而言之，第1階差部225 1是在底面部225中，以 正面部221及側面部222側會偏移於内側，且側面部223 及背面部224 (圖3 )側會成面一致的方式來形成。並且 ，第2階差部2252是在該第1階差部225 1的内側，以正 面部221及側面部222側會偏移於内側，側面部223及背 面部224側會成面一致的方式來形成。該等之中，在第1 階差部225 1的正面側形成有前述的開口 2211及吸氣口 2212，在該第1階差部225 1的側面形成有前述的排氣口 2222 ° 在第2階差部2252的底面的四個角落，設有藉由橡 膠所形成的複數個脚部2252 1。以使該等脚部2252 1能夠 抵接於設置面的方式來配置資訊處理裝置1，藉此可橫置 該資訊處理裝置1。 並且，在第2階差部225 2，接近側面部223的側，與 吸氣口 223 3 (圖3)同樣的吸氣口 22522會沿著該底面部 2 2 5的短邊方向（沿著側面部2 2 3的方向）來形成。 圖6是表示下部框體22的内面部226的平面圖。 在下部框體22的内面部226，如前述，形成有用以收 納裝置本體3的開口 22A，且雖省略詳細的圖示，但實際 沿著該下部框體22的外周而形成有複數的螺絲孔。在該 等螺絲孔中，將裝置本體3及上部框體22固定於下部框 -21 - 200830145 體22的螺絲會螺合。 並且，在下部框體22的正面部221側的兩端形 嵌合穴2261，2262。在該等嵌合穴2261，2262中嵌 置於構成裝置本體3的控制單元31之後述的主框架 銷48(48R，48L)(圖14)，藉此控制單元31會被 於下部框體22。另外，形成於接近側面部222的側之 穴226 1是形成平面視大略長圓形狀，形成於接近側 223的側之嵌合穴2262是形成大略圓形狀。因此，即 48R，48L與嵌合穴2261，2262的位置因製造誤差等 稍微的偏差時，還是可以將銷48R，48L嵌合於該嵌 2261，2262。另外，在嵌合穴2261中是嵌合銷48R 嵌合穴2262中是嵌合銷48L。 而且，在内面部226中，於正面部221側，沿著 面部221的形成方向（長邊方向）設有海綿2263。更 言之，海綿2263是配置於形成有吸氣口 2213的正 221之延出部份的基端側。此海綿2263是在後述的控 元31被收容於下部框體22内時，抵接於該控制單j 的主框架4的下面。此海綿2 2 6 3是在於防止經由吸 22 1 3而從外裝框體2的外部導入的冷卻空氣直接流入 於控制單元3 1的下方之冷卻單元3 2。 並且，在内面部226中，於背面部224側，在對 該背面部224所形成的排氣口 2248之位置，沿著背 2 24的形成方向（長邊方向）設有海綿2264。此海綿 是抵接於後述的冷卻單元32的吐出口 3 28 (圖22 ) 成有 合設 4的 定位 嵌合 面部 使銷 而有 合穴 ，在 該正 詳而 面部 制單 C 3 1 氣口 配置 應於 面部 2264 的周 -22- 200830145 圍，提高該吐出口 3 2 8與排氣口 2248的密着度。因此 從吐出口 3 2 8吐出的冷卻空氣不會從排氣口 2248洩漏 排出至外裝框體2外。 另外，在内面部226中，對應於底面部225所形成 第2階差部2 2 5 2 (圖5 )，於接近側面部2 2 2的區域， 成有設於後述的冷卻單元32的吐出口 327的周圍之海 3 27 1 (圖22 )會抵接的抵接部2265。藉由在此抵接 2 265抵接該海綿327 1，從冷卻單元32的吐出口 3 27所 出的冷卻空氣不會從形成於側面部222的排氣口 2222 ( 1 )洩漏而排出。 (3 )裝置本體3的構成 圖7是由正面側來看移開上部框體21後的狀態之 訊處理裝置1的立體圖。並且，圖8是由正面側來看裝 本體3的立體圖，圖9是表示裝置本體3的分解立體圖 裝置本體3是相當於本發明的機器本體，如圖7所 ，被收納於外裝框體2内。此裝置本體3是如圖7〜圖 所示，具備：控制單元3 1 (圖7〜圖9 )、冷卻單元32 圖8及圖9)、碟片單元33(圖7〜圖9)、電源單元 (圖7〜圖9)、讀卡機單元35(圖7〜圖9)及板彈 36(圖9)。而且，裝置本體3是該等各單元31〜35及 彈簧3 6會互相藉由螺絲等來固定，一體組合。 其中，碟片單元3 3是在後述的控制單元31之控制 ，讀出被記錄於所揷入的前述各種光碟的圖像、影像及 而 的 形 綿 部 吐 圖 資 置 〇 示 9 ( 34 簧 板 下 程 -23- 200830145 式等的資訊，且將該資訊輸出至構成控制單 基板5。並且，碟片單元3 3是對所揷入的光 樣的資訊記錄。 此碟片單元3 3省略了詳細的圖示，其 3 3 1、及將該單元本體3 3 1收納於内部的金層 其中，在框體332的正面形成有用以插拔直 碟之開口 3 32 1。 電源單元3 4是對裝置本體3供給驅動 而言，電源單元34是將輸入至設於外裝框1 連接器2247 (圖3 )之商用交流電流予以直 及減壓至對應於構成裝置本體3的各電子零 供應給該各電子零件。此電源單元34是與 單元3 1的後述控制基板5的電源銷5 7 1 ( | 經由該控制基板5來供給驅動電力至各電子: 讀卡機單元3 5是在後述的控制基板5 經由形成於前述上部框體2 1的卡槽部 2 2 1 1 3 1而揷入的各種記憶卡執行資訊的讀出 卡機單元3 5是具備插拔記憶卡的讀卡機3 5 1 卡機351的動作之基板3 52。其中，在基板 基板5來輸入控制信號，使對應於該控制信 於讀卡機3 5 1。如此的讀卡機單元3 5是被支 後述的控制單元3 1之副框架6上。 (4 )控制單元3 1的構成 元 3 1的控制 碟進行前述那 具備單元本體 i製框體3 3 2。 徑 1 2 c m的光 電力者。具體 體2的插入口 流變換，昇壓 件之電壓，而 設於構成控制 圖1 8 )連接’ 零件。 之控制下，對 1 1 3的各開口 及記憶。此讀 、及控制該讀 3 5 2是由控制 號的動作執行 持固定於構成 -24- 200830145 圖10及圖11是由上方及下方來看控制單元31的立 體圖。並且，圖12是表示控制單元31及冷卻單元32的 分解立體圖。 控制單元3 1是控制裝置本體3、進而資訊處理裝置1 的驅動之單元。此控制單元3 1，如圖1 0〜圖1 2所示，具 備主框架4、控制基板5及副框架6，控制基板5及副框 架6是對主框架4定位。 (4-1)主框架4的構成 圖13及圖14是由上方及下方來看主框架4的立體圖 〇 主框架4是與後述的副框架6 —起挾持控制基板5， 連接至後述的冷卻單元3 2的框架構件，相當於本發明的 第1框架。此主框架4是形成具有平面視大略長方形狀的 平板狀，基於放熱及 EMI ( Electro Magnetic Interference 、電磁干渉）的考量，而由鋁等的金屬所形成。並且，在 主框架4的中央，如圖1 3所示，形成有凹部40，其係陷 入下面側、亦即與對向於控制基板5的側呈相反的側。在 藉由此凹部40及後述的副框架6的凹部60所形成的空間 内收納配置有控制基板5，主框架4是以設置於該主框架 4所安裝的控制基板5上的各種晶片不會被按壓的方式來 形成。更在主框架4中形成有複數個大略圓形狀的孔，該 孔是使主框架4輕量化的同時，使冷卻空氣通風於該主框 架4與副框架6所挾持的控制基板5。 -25- 200830145 在形成有此凹部4 0的區域的背面側（圖1 3及圖1 4 的上方側）、及右側（圖13的右側，圖14的左側，接近 外裝框體2的側面部21 3，222的側）分別形成有2個’ 合計4個的銷揷入口 4 0 1。更詳而言之’形成於主框架4 的背面側之2個的銷揷入口 4 0 1是分別沿著主框架4的長 邊方向來形成，且形成於右側的2個銷揷入口 40 1是分別 沿著主框架4的短邊方向來形成。在該等銷揷入口 401中 ，是在將主框架4定位於後述的冷卻單元3 2上時，插通 該冷卻單元32所形成的定位銷329 ° 在主框架4，大槪中央，平面視大略矩形狀的開口 41 (圖13的左側），42 (圖13的右側）會並列形成。該等 開口 4 1，4 2是形成在對應於後述的控制基板5所配設的 CPU ( Central Processing Unit ) 51 及 GPU ( Graphics[Technical Field] The present invention relates to a method of manufacturing an electronic device including a machine body that performs a predetermined process and a casing in which the machine body is housed, and the electronic device. [Prior Art] Conventionally, an information processing device including an integrated circuit such as a CPU (Central Processing Unit) has been known. For such an information processing apparatus, for example, a personal computer (PC) that performs a predetermined arithmetic processing, or a recording or memory on a CD (C ompact D isc ), a DVD (Digital V ers at i 1 e D) A disc recording medium such as isc) and BD (B 1 u - r ay D isc : registered trademark), and a disc for reproducing the image and sound information of a memory medium such as a semiconductor memory card or HDD (Hard Disk Drive) Regeneration devices are known. In such a disc reproducing apparatus, for example, a game program recorded on a disc is read, and an entertainment apparatus that executes the game program is known in accordance with an instruction from a controller operated by the user (for example, refer to Document 1:曰本特开开2001-320181 bulletin). The entertainment device disclosed in Patent Document 1 includes an apparatus main body having an electronic component or the like, and a housing that houses the main body of the apparatus. The device main body includes a circuit board on which a CPU or the like is mounted, a pair of shielding plates covering the front and back surfaces of the circuit board, and a disk device placed on the upper surface side of one of the shielding plates. Further, the housing is provided with a lower case having an opening for accommodating the apparatus body -4-200830145, and an upper case for occluding the opening, and an assembly procedure of the entertainment device is through the opening in the lower case One of the shielding plates, the circuit board, the other shielding plate, and the disc device are stacked in the interior, and the upper case is engaged so that the opening of the lower case can be closed. Here, a projection is formed on the bottom surface of the lower case, and the projection can be inserted into one of the shielding plate, the circuit board, and the other shielding plate, and the same can be disposed in the lower case. Then, the inversion is reversed, and the bottom surface of the lower case is upwardly inserted, and a fixing screw is inserted into the insertion hole formed in the lower case, and the fixing screw is screwed to the female screw hole formed by the upper case. In this way, the upper case and the lower case can be combined. At this time, the plate-like ribs or protrusions formed on the lower case press the circuit board and the pair of shielding plates, and the side faces of the plate-shaped ribs are shielded. The board is abutted. Thereby, even if the reverse movement of the casing is performed, it is possible to prevent the internal constituent members from moving inside the casing. However, in the entertainment apparatus described in Document 1, since the pair of shielding plates and the circuit board are positioned for the lower case, displacement between the circuit board and the pair of shielding members may occur. Here, in addition to the aforementioned CPU, in many cases, an integrated circuit such as a plurality of wafer sets is mounted on the circuit board, and such a circuit board and a shield plate disposed so as to be able to sandwich the circuit board occur. Displacement, it is possible that the shield plate hits the integrated circuit. Therefore, it is necessary to provide a cushioning member or the like between the integrated circuit and the shielding member, so that the configuration is complicated. Therefore, it is desirable to prevent the displacement of the circuit board and the member sandwiching the circuit board. -5-200830145 SUMMARY OF THE INVENTION A main object of the present invention is to provide a method and an electronic device for manufacturing an electronic device which can prevent displacement of a circuit board and a member sandwiching the circuit board. In order to achieve the above object, a method of manufacturing an electronic device according to the present invention includes: a device body that performs signal processing; and a method of manufacturing an electronic device that houses the device body in the inside of the device body, wherein the device body includes a circuit board that performs the signal processing; and a first frame and a second frame that are covered by the circuit board; the frame system includes: a first housing having an opening for housing the main body; and a second housing that closes the opening In the second frame, the first frame has a first pin and a second pin, and the second frame and the circuit board have a hole through which the first pin is inserted, and the first frame system has the second pin The manufacturing method of the electronic device includes: a substrate positioning process for inserting the first pin into the hole portion of the circuit board, thereby positioning the circuit board on the first frame; a frame positioning project for inserting the first pin into the hole portion of the second frame to position the second frame in the first frame; -6- 200830145 1 The frame positioning project is configured to position the first frame in the second frame mounting process by the second hole, and the first frame is attached to the first frame. Right using the present invention, the first positioning of the substrate is located in the first frame. At this time, the first pin of the hole frame of the circuit board is positioned so that the displacement of the substrate can be prevented. Then, in the second frame positioning project hole portion, the first pin can be opened to make the second frame. Thereby, the first frame and the circuit board can be prevented. Next, in the first frame positioning project, the first frame is placed in the fitting hole of the first frame, and the first frame is positioned to prevent displacement of the first frame and the first frame, and the substrate and the second frame are prevented. The displacement with the first frame. In the installation work, the second frame is attached to the first frame and the machine. Thereby, since the first substrate and the second frame which are positioned in the first frame are formed, displacement of the circuit board and the frame can be prevented. Then, after positioning the circuit substrate in the first frame, the first frame is positioned in the first frame, and the circuit board and the second frame are positioned in the casing to appropriately prevent displacement of each member in the casing. And can be disturbed. a pin is fitted to the frame 1; and the frame is attached to the first step, the circuit board portion is capable of opening the first frame and the circuit, and the frame of the second frame is positioned to the first frame. The second pin is fitted to the first frame. Further, it is possible to prevent the electric frame from being manufactured in the second casing. The first frame and the second frame can be placed on the first frame and the second frame. Therefore, in the present invention, it is preferable that the first frame has an abutting portion that abuts against each end portion of the circuit board and the second frame at an end portion of the first frame. The first pin is formed on an end portion opposite to the abutting portion, and the end portion of the circuit board is brought into contact with the abutting portion after the substrate positioning process, and the end portion is used as an axis. The circuit board is rotated to position the circuit board in the first frame, and in the second frame positioning process, the end of the second frame is brought into contact with the abutting portion, and the end portion is used as an axis. The second frame is rotated to position the second frame in the first frame. According to the present invention, since the circuit board and the second frame are positioned to the first frame by the abutting portion located at one end portion of the first frame and the first pin located at the other end portion, the circuit board and the second frame are positioned to the first frame. The displacement of the circuit board and the second frame can be reliably prevented. In addition, since the circuit board and the second frame are rotated by the end portion of the contact portion that abuts on the first frame as an axis, and can be positioned so as to cover the first frame, the circuit board can be easily formed. And the positioning project of the second frame. Therefore, the positioning process of the circuit board and the second frame can be simplified, and the displacement can be surely prevented. In the above aspect of the invention, it is preferable that the first frame includes a rising portion that is raised between the abutting portion and the first pin and that faces the side of the circuit board, and guides the circuit board And positioning of at least one of the above second frames. According to the present invention, when the circuit board and the second frame are brought into contact with the abutting portion of the first frame, and the first frame can be positioned in a rotatable manner, -8-200830145 is raised by the first frame. The portion guides rotation of at least one of the circuit board and the second frame. Therefore, the positioning work of at least one of the circuit board of the first frame and the second frame can be simplified. In the present invention, it is preferable that the rising portions are formed at both ends of the first frame in a direction orthogonal to a direction from the abutting portion to the first pin, and the circuit board and the second frame are At least one of the members has a notch at a position corresponding to each of the rising portions, and the notch is sandwiched by the rising portions when the member is positioned at the first frame. According to the present invention, since the notches are sandwiched by the rising portions located at both ends of the first frame, at least one of the circuit board and the second frame and the member having the notch can be reliably positioned. The appropriate position on the first frame. Further, when the circuit board and the second frame are positioned, the notch is sandwiched by the rising portion, whereby the rocking on the first frame can be suppressed, so that the displacement of the member to the first frame can be more reliably prevented. Therefore, the positioning of the circuit board and the second frame can be simplified, and the displacement of the member can be more reliably prevented. In the present invention, it is preferable that the plurality of first pins are provided, and the circuit board and the second frame have a plurality of the holes corresponding to the first pins. According to the invention, the first frame has a plurality of first pins, and the circuit board and the second frame have a plurality of holes corresponding to the first pins. Thereby, the circuit board and the second frame can be positioned at a plurality of places on the first frame, and -9-200830145 can further suppress the shaking of the circuit board and the second frame on the first frame. Therefore, the displacement of the circuit board and the second frame and the first frame can be more reliably prevented. In the present invention, it is preferable that the second pin system and the first pin have opposite protruding directions, and in the second frame positioning work, the hole portion of the second frame can be passed through from the upper side. In the first frame, the first frame positioning system has a first frame reversal program, and the first frame reversal program is configured such that the protruding direction of the second pin can be upward. The first frame is reversed; and the first frame covering program is configured such that the second frame of the first frame that is reversed can be fitted to the fitting hole, and the first frame is covered with The first frame. According to the first aspect of the present invention, when the first frame is reversed, the first frame of the positioning circuit board and the second frame is reversed, and when the first frame is positioned by the first frame, the first frame is positioned in the first frame. The second pin protruding in the opposite direction to the first pin can be easily fitted into the fitting hole of the first frame. Therefore, the first frame positioning project can be simplified. In the above aspect of the invention, it is preferable that the device system includes a cooling means for abutting on the circuit board via another opening formed in the first frame, and cooling the heat conducted by the circuit board, and the cooling means And one of the first frames is provided with a plurality of locating pins on the other side, and the other has a pin 揷 inlet inserted into the -10-200830145 locating pin, and the electronic device is manufactured by cooling. The means positioning project "inserts the positioning pin through the pin inlet" to position the cooling means and the first frame. Here, when an integrated circuit such as a CPU is provided on a circuit board, the integrated circuit is generally one of the heat generating bodies and is weak to heat. Therefore, it is necessary to effectively cool the integrated circuit. In contrast, in the present invention, the apparatus body is provided with a cooling means for conducting heat generated on the circuit board and cooling the heat, whereby the circuit board can be appropriately cooled, and the processing of the circuit board can be stabilized. Further, since one of the cooling means and the first frame has a positioning pin and the other has a pin-inlet, the cooling means can be easily prevented from being positioned by the cooling means and the positioning of the first frame. The displacement with the 1st frame. In the above aspect of the invention, it is preferable that the device system includes: an elastic plate that is disposed on a side opposite to the cooling means on the circuit board, and that presses the cooling means to be exposed through the other opening a circuit board; and a mounting member, wherein the elastic plate is attached to the cooling means, wherein the first frame, the circuit board, and the second frame each have another hole through which the mounting member is inserted, and the cooling means has The locking portion of the mounting member is locked, and the manufacturing method of the electronic device includes a cooling means mounting process, which is performed after the cooling means positioning project and the second frame positioning project -11 - 200830145, via the elastic plate, In the second frame, the circuit board, and the first frame, the mounting member is locked to the locking portion, and the cooling device and the elastic plate can hold the circuit board and the second frame. The above cooling means is mounted on the circuit board. As such a mounting member, for example, a fixing tool such as a screw or a bolt can be mentioned. According to the present invention, the mounting member is locked to the locking portion via the elastic plate, the second frame, the circuit board, and the first frame, whereby the first frame, the circuit board, the second frame, and the cooling means can be used. One body. As a result, the machine body can be easily handled, so that the manufacturing process of the electronic device such as the first frame positioning process described above can be simplified. Further, since the circuit board is pressed against the cooling means by the elastic pressing plate, the conduction efficiency of the heat to the cooling means generated on the circuit board can be improved. Thereby, the cooling of the circuit board can be performed efficiently. Further, the first frame, the circuit board, and the second frame are held by the elastic plate and the cooling means. Therefore, when the cooling means is fixed to one of the first frame, the circuit board, and the second frame, it is possible to prevent the member fixing the cooling means from being displaced due to the load of the cooling means, and the cooling means can be appropriately adjusted. Pressed on the circuit board. Therefore, while maintaining the integrated machine body, the cooling efficiency of the circuit board using the cooling means can be further improved. In the present invention, it is preferable that the first frame and the second frame have recesses that are immersed on a side opposite to a side opposite to the circuit board, and the first frame and the second frame are The edge of the recess is abutted against the circuit board by a size corresponding to the substrate of the above circuit -12-200830145. According to the present invention, the circuit board can be placed in the space formed by the recesses of the first frame and the second frame, and the integrated circuit mounted on the circuit board can be reliably prevented from directly contacting the first circuit. In addition to the 1 frame and the second frame, it is also possible to reduce the thickness of the first frame and the second frame. Therefore, it is possible to reduce the size of the machine body. Further, the circuit board is in contact with the end edges of the first frame and the second frame, whereby the radiation noise generated by the current flowing through the circuit board can be conducted to the first frame and the second frame. Therefore, Cocoa can implement EMI (Electromagnetic Interference) countermeasures for electronic equipment. Moreover, the electronic device of the present invention includes an apparatus main body that performs signal processing and an electronic device that houses the main body of the main body, wherein the frame system includes an opening that accommodates the main body of the main body. a first frame that closes the opening, and the device system includes: a circuit board that performs the signal processing; and a first frame and a second frame that are covered by the circuit board, wherein the first frame is One end portion is provided with an abutting portion that abuts against each end portion of the circuit board and the second frame, and the other end portion has a first pin and a second pin, and the first frame is attached to The abutting portion has a rising portion that rises toward the side facing the circuit board to the end portion in the orthogonal direction to the first pin 13-200830145, and the circuit board and the second frame have: The hole portion through which the first pin is inserted and the engagement portion that is engaged with the abutting portion, the first frame system has a fitting hole into which the second pin is fitted. According to the present invention, the same effects as those of the above-described electronic device manufacturing method can be obtained. In other words, the contact portion of the first frame and the contact portion of the circuit board and the second frame that are engaged with the contact portion are pivoted so as to cover the first frame so as to cover the first frame. The frame rotates so that the first pin is passed through the hole of the circuit board, whereby the circuit board is positioned in the first frame. At this time, when the circuit board and the second frame are rotated by the rising portion of the first frame, the end portions of the circuit board and the second frame are aligned, so that not only the circuit board and the second frame are guided to The appropriate position of the first frame and the shaking of the circuit board and the second frame on the first frame are suppressed. With this configuration, the circuit board and the second frame can be sandwiched by the abutting portion, the first pin, and the rising portion of the first frame. Therefore, the circuit board and the second frame can be positioned not only at an appropriate position on the first frame. In addition to the first frame, the displacement of the circuit board and the second frame can be suppressed. Further, the second pin of the first frame in which the circuit board and the second frame are positioned is fitted to the fitting hole of the first frame, whereby the first frame can be positioned by the first frame. Therefore, the displacement of each of the members constituting the electronic machine can be suppressed. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. (1) Configuration of Information Processing Apparatus 1 FIG. 1 is an information processing of the present embodiment viewed from the front side; FIG. 2 is a perspective view A perspective view of the processing device 1 that opens the cover member 23 is viewed from the front side. The information processing device 1 of the present embodiment is a recording medium such as an instruction from a controller (not shown) or automatically acquiring a disc such as a CD or a BD, or a memory such as a semiconductor chip (S Hard Disk Drive). The information recorded or memorized in the media and acquired by the connected network, in addition to reproducing the acquired image information and sound information, the electronic device that acquires the information program is also executed. Further, the information processing device 1 records a semiconductor memory card and a memory medium such as an HDD which are mounted on the optical disk in addition to the type of the optical disk used. Although the information processing device 1 is not shown in the drawings, the image display device such as a virtual receiver is electrically connected, and the image signal is outputted in accordance with a predetermined processing result corresponding to the user's operation. And the audio signal is applied to the image display device. The information processing device 1 includes an exterior casing 2 (FIG. 1 and the device body 3 housed in the exterior casing 2 (FIG. 7 to the state of the device 1) The DVDs of the users and the HDD (information, according to the information contained in the news, can also be based on the information, and the operation of the operator is controlled by the L ° ~ Figure 6) 9) -15- 200830145 (2) Configuration of the exterior casing 2 As shown in Fig. 1 and Fig. 2, the exterior casing 2' has a substantially cylindrical shape. The exterior casing 2 is mounted with The upper casing 21 and the lower casing 22 of the casing 24 are configured. (2-1) The upper casing 21 of the upper casing 21 is a second casing corresponding to the present invention, and has a curved portion having an arc shape. The box shape is combined with the lower frame 22 and screwed. The upper frame 21 is formed with a front portion 21 1 (Fig. 1, Fig. 2). 4), upper surface portion 212 (Figs. 3 and 4) and side surface portion 213 (Figs. 1, 2 and 4), 214 (Fig. 3). Front portion 2 1 1 is in Fig. 1 and Fig. 2 The side surface ' is provided with protrusions 2111, 2112 protruding in the out-of-plane direction at the center and the left end of the front portion 2 1 1 . A card groove portion 2113 is formed in a region sandwiched between the protrusion portions 2111, 2112. As shown in FIG. 2, the card slot portion 2113 has three openings 2 1 1 3 1 into which various semiconductor memory cards (hereinafter sometimes simply referred to as "memory cards" are inserted and inserted. Through the openings 2 1 1 3 1. The insertion portion of the card reader 353, which will be described later, in the exterior housing 2, corresponding to the various memory cards, is exposed in the region in which the projections 2111, 2112 and the card slot portion 2113 are formed, covering The protrusions 2111, 2112 and the cover member 23 of the card slot portion 2113 are rotatably provided. The cover member 23 has a rotation axis along the longitudinal direction of the front portion 2 1 1 , centered on the rotation axis Rotate to the upper side, thereby opening the card slot portion 2113, and closing the card slot portion by rotating to the lower side - 16-200830145 2113° on the right side of the front portion 21 1 corresponding to the straight The disc opening 2 2114 of the 12 cm disc is formed along the longitudinal direction of the front portion 211. The disc inserted into the disc 揷 entrance 2114 is inserted into the disc unit 3 3 constituting the apparatus main body 3 to be described later. 1 and the side surface portion 2 1 3 on the right side of FIG. 2 are formed with a plurality of intake ports 2 1 3 1 that are sucked from the outside of the exterior casing 2 to cool the apparatus body 3 housed in the exterior casing 2 Cooling air. Fig. 3 is a perspective view of the information processing device 1 in a state in which the cover 24 is removed from the back side, and Fig. 4 is a perspective view of the information processing device 1 in a state in which the cover 24 is removed from the front side. In the upper surface portion 212 of the upper casing 21, as shown in Fig. 3, the casing 24 covering the upper surface portion 21 is slidably attached. The casing 24 is formed in a curved shape along the upper surface portion 2 1 2 so as to slide along the longitudinal direction of the upper surface portion 2 1 2, whereby the upper surface portion 212 is attached. When such a casing 24 is removed, as shown in Fig. 4, a pair of groove portions 2 1 2 1 formed in the upper surface portion 2 1 2, a plurality of engaging portions 2 1 22, and a plurality of screw 揷 inlets 2123 are exposed. The groove portion 2121 is formed at both ends in the short-side direction of the upper surface portion 212 along the longitudinal direction of the upper surface portion 212, and guides the sliding of the casing 24 along the upper surface portion 2 1 2 . The engaging portion 2 1 2 2 is protruded from the back surface of the cover 24 (the surface facing the upper surface portion 212), and is engaged with a locking portion (not shown) having a substantially hook shape to prevent the cover. The shell 24 is detached from the upper face portion 212. Insert the screws for fixing the upper frame 2 1 and the -17 - 200830145 body 3 at the screw 揷 inlet 2 1 2 3 . Further, at both ends in the longitudinal direction of the side surface portion 214, as shown in Fig. 3, a leg portion 2 1 4 1 formed of rubber or the like is provided. (2-2) Configuration of Lower Frame 22 The lower frame 22 corresponds to the first frame of the present invention, and as shown in Figs. 1 and 2, has a rectangular parallelepiped shape and a semi-cylindrical shape so that the semi-cylindrical portion The parts can be combined with the aforementioned upper frame 21 in a manner that can face each other. The lower casing 22 has an opening 22A (FIG. 6) for accommodating a device main body 3 to be described later on a side facing the upper casing 21, and a front portion 221 is formed in the lower casing 22 (FIG. 1 and FIG. 2) side surface portions 222 (Figs. 1 and 2), 223 (Fig. 3), back surface portion 224 (Fig. 3), bottom surface portion 225 (Fig. 5), and inner surface portion 226 (Fig. 6). Further, the opening 22A is closed by the above-described upper housing 21. On the left side of the front portion 221 (the front side portion of Figs. 1 and 2), four openings 2211 having a substantially rectangular shape are formed. Through the openings 2211, the terminals of the A terminal which can be connected to the control board 5 (Fig. 18 and Fig. 19) constituting the apparatus main body 3 and can be connected to the USB (Universal Serial Bus) standard are exposed. Further, a plurality of substantially rectangular intake ports 22 1 2 are formed on the right side of the opening 221 1 of the front portion 221, and the air outside the exterior casing 2 is introduced into the inside through the intake port 22 12 . Further, on the lower surface of the extended portion of the front portion 221, an air inlet 2213 (Fig. 5) for introducing air outside the outer casing 2 is formed. Further, a side step is formed on the side surface portion 222 on the right side of FIGS. 1 and 2, that is, the side surface portion 222 of the side surface portion 213 of the upper casing 21 corresponding to -18-200830145, and the upper side is higher than the first step described later. The difference portion 225 1 (Fig. 5) is more prominent, and the lower side is immersed, and an exhaust port 222 1, 2222 is formed on the surface of the step along the direction in which the side surface portion 2 1 3 is formed, which discharges the cooling device body 3 After the cooling air. Specifically, the exhaust port 222 is formed on the side surface of the protruding portion on the upper side, and the exhaust port 2222 is formed on the side of the lower portion of the lower side. Therefore, the side of the exterior casing 2 is formed. The surface 2A formed by the portion 2 1 3, 2 2 2, the intake port 2131, and the exhaust ports 2221, 2222 are formed on the same surface. At both ends of the side surface portion 22 3, as shown in Fig. 3, a leg portion 223 1 formed of rubber or the like is provided. The leg portion 223 1 formed on the side surface portion 223 and the leg portion 2 1 4 1 formed on the side surface portion 2 1 4 of the upper frame body 21 can be placed in contact with the installation surface, thereby enabling information processing. The device 1 can be placed vertically. Further, a substantially rectangular opening 2232 is formed in the center of the side surface portion 2 2 3, and an HDD (Hard Disk Drive) unit (not shown) is attached via the opening 2232. This opening 223 2 is closed by a cover member 25 having a shape corresponding to the opening 2232. Further, below the opening 2232, a plurality of intake ports 223 3 are formed along the longitudinal direction of the side surface portion 223. In the back surface portion 224, as shown in FIG. 3, the openings 2241 to 2244 which are exposed by the various terminals 5 9 (FIG. 19) provided in the control board 5 housed inside the exterior casing 2 are along the back surface portion 224. The long side direction is formed to form -19-200830145. Specifically, in the opening 224 1 , the terminal to which the HDMI (High-Definition Multimedia Interface) terminal can be connected is exposed, and in the opening 2242, the IEEE 8 02 is permitted. 3 i, the terminals of the LAN (Local Area Network) cable that can be connected to 10Base-T and 100Base-TX are exposed. Further, in the opening 2243, the terminal of the B terminal to which the USB standard can be connected is exposed, and in the opening 2244, a coaxial cable having one terminal for video and two terminals for sound can be connected to one end side. The terminal on his side will be exposed. Further, a power switch 2245 for turning on/off the main power source is provided at the right end of the rear surface portion 224, and an inlet connector 2247 for connecting a power cable (not shown) is formed under the power switch 2245. Opening 2246. Further, in a portion other than the portion where the openings 224 1 to 2244 and 2246 of the back surface portion 224 are formed and the portion where the power switch 2245 is provided, the apparatus main body 3 in the outer casing 2 is cooled. The cooling air is exhausted to an external exhaust port 2248. Further, the back surface portion 224 is attached to a cooling unit 32 to be described later, and the exhaust port 2248 formed in the back surface portion 224 and the discharge port 328 (FIG. 22) of the cooling unit 32 are sponges provided in the discharge port 328. 3281 to connect. Therefore, the air discharged from the discharge port 3 28 is discharged to the outside of the exterior casing 2 without leaking. FIG. 5 is a perspective view of the information processing apparatus 1 as seen from below. The bottom surface portion 225 of the lower casing 22 is a portion corresponding to the bottom surface of the rectangular parallelepiped portion of the lower casing 22 which is opposite to the upper casing 2 1 of -20 - 200830145. In the bottom surface portion 225, as shown in Fig. 5, a first step portion 225 1 and a second step portion 2252 which protrude to the lower two stages are formed. Specifically, in the bottom surface portion 225, the first step portion 225 1 is offset from the inside on the front portion 221 and the side surface portion 222 side, and the side surface portion 223 and the back surface portion 224 (Fig. 3) are surfaced. A consistent way to form. Further, the second step portion 2252 is inside the first step portion 2251, and the front portion 221 and the side surface portion 222 side are shifted to the inner side, and the side surface portion 223 and the back surface portion 224 side face each other. To form. In the above, the opening 2211 and the intake port 2212 are formed on the front side of the first step portion 225 1 , and the exhaust port 2222 ° is formed on the side surface of the first step portion 225 1 . The four corners of the bottom surface of the second step portion 2252 are provided with a plurality of leg portions 2252 1 formed of rubber. The information processing device 1 is disposed such that the leg portions 2252 1 can abut against the installation surface, whereby the information processing device 1 can be placed horizontally. Further, in the second step portion 2252, on the side close to the side surface portion 223, the same intake port 22522 as the intake port 223 3 (FIG. 3) is along the short side direction of the bottom surface portion 2 25 (along The side portion 2 2 3 is formed in the direction). FIG. 6 is a plan view showing the inner surface portion 226 of the lower casing 22. As described above, the opening 22A for accommodating the apparatus main body 3 is formed in the inner surface portion 226 of the lower casing 22, and although detailed illustration is omitted, a plurality of screw holes are actually formed along the outer circumference of the lower casing 22. . In the screw holes, the device body 3 and the upper frame 22 are fixed to the lower frame -21 - 200830145. The screws of the body 22 are screwed. Further, the holes 2261 and 2262 are fitted to both ends of the lower casing 22 on the side of the front portion 221 side. Main frame pins 48 (48R, 48L) (FIG. 14), which will be described later, which are formed in the control unit 31 constituting the apparatus body 3, are embedded in the fitting holes 2261, 2262, whereby the control unit 31 is applied to the lower frame 22 . Further, the hole 226 1 formed on the side close to the side surface portion 222 is formed into a substantially oblong shape in plan view, and the fitting hole 2262 formed on the side close to the side 223 is formed into a substantially circular shape. Therefore, even when the positions of the 48R, 48L and the fitting holes 2261, 2262 are slightly different due to manufacturing errors or the like, the pins 48R, 48L can be fitted to the fittings 2261, 2262. Further, in the fitting hole 2261, the fitting pin 48R is a fitting pin 482 in the fitting hole 2262. Further, in the inner surface portion 226, a sponge 2263 is provided on the front surface portion 221 side along the direction in which the surface portion 221 is formed (longitudinal direction). More specifically, the sponge 2263 is disposed on the proximal end side of the extended portion of the positive 221 where the suction port 2213 is formed. This sponge 2263 abuts against the lower surface of the main frame 4 of the control sheet j when the control unit 31 to be described later is housed in the lower casing 22. This sponge 2 2 6 3 is a cooling unit 32 that prevents the cooling air introduced from the outside of the exterior casing 2 via the suction 22 1 directly from flowing into the lower side of the control unit 31. Further, in the inner surface portion 226, on the side of the back surface portion 224, a sponge 2264 is provided along the direction in which the back surface 24 is formed (longitudinal direction) at the position of the exhaust port 2248 formed in the back surface portion 224. This sponge is abutting on the discharge port 3 28 (FIG. 22) of the cooling unit 32 which will be described later, and the positioning fitting surface portion of the joint 4 is provided with a pin to form a hole, and the face portion C 3 1 port is disposed in this manner. The degree of adhesion between the discharge port 3 28 and the exhaust port 2248 should be increased around the circumference -22-200830145 of the face 2264. Therefore, the cooling air discharged from the discharge port 3 2 8 does not leak from the exhaust port 2248 and is discharged to the outside of the exterior casing 2 . Further, in the inner surface portion 226, the second step portion 2 2 5 2 ( FIG. 5 ) formed in the bottom surface portion 225 is formed in the region close to the side surface portion 2 2 2 and is provided in the cooling unit 32 to be described later. The abutting portion 2265 at which the sea 3 27 1 (Fig. 22) around the exit 327 abuts. The abutment 2 265 abuts against the sponge 327 1, and the cooling air discharged from the discharge port 3 27 of the cooling unit 32 is not leaked from the exhaust port 2222 (1) formed in the side surface portion 222. (3) Configuration of the apparatus main body 3 Fig. 7 is a perspective view of the information processing apparatus 1 in a state in which the upper housing 21 is removed from the front side. 8 is a perspective view showing the main body 3 from the front side, and FIG. 9 is an exploded perspective view showing the main body 3 of the apparatus. The apparatus main body 3 is a machine main body corresponding to the present invention, and is housed in the outer casing as shown in FIG. 2 inside. As shown in FIG. 7 to FIG. 7, the apparatus main body 3 includes a control unit 31 (FIG. 7 to FIG. 9), a cooling unit 32 (FIG. 8 and FIG. 9), a disc unit 33 (FIG. 7 to FIG. 9), and a power supply. Unit (Fig. 7 to Fig. 9), card reader unit 35 (Figs. 7 to 9) and plate bomb 36 (Fig. 9). Further, the apparatus main body 3 is such that the units 31 to 35 and the springs 36 are fixed to each other by screws or the like, and are integrally combined. The disc unit 33 is controlled by the control unit 31, which will be described later, and reads the image and video recorded on the various optical discs that have been inserted. The information of the board is -23-200830145, and the information is output to constitute the control unit substrate 5. And the disc unit 3 3 is an information record of the light sample that has been inserted. This disc unit 3 3 is omitted. In the detailed illustration, the 313 and the unit body 3 3 1 are housed in the inner gold layer, and an opening 3 32 1 for inserting and removing the straight disk is formed on the front surface of the frame 332. The power supply unit 3 4 When the apparatus main body 3 is driven, the power supply unit 34 directly and decompresses the commercial alternating current input to the outer frame 1 connector 2247 (FIG. 3) to correspond to the respective electronic zeros constituting the apparatus main body 3. The power supply unit 34 is a power supply pin 517 of the control board 5, which will be described later, of the unit 31. (The power is supplied to each electronic via the control board 5: the card reader unit 35 is in The control board 5 to be described later is formed through the upper housing 21 The card reader unit 35 of the various card execution information that is inserted into the card slot unit 2 2 1 1 3 1 is a substrate 3 52 having an operation of the card reader 35 1 card machine 351 for inserting and removing a memory card. A control signal is input to the substrate substrate 5 so as to correspond to the control signal to the card reader 35. The card reader unit 35 is attached to the sub-frame 6 of the control unit 31 to be described later. The control disk of the component element 31 of the control unit 31 is provided with the light body of the frame body 3 3 2 having a diameter of 12 cm. The insertion port of the specific body 2 is converted, and the voltage of the booster is And under the control of the control figure 18) connected to the 'parts', the openings and memories of the 1 1 3 are read. This read and control the read 3 5 2 is fixed by the action of the control number. - Figure 10 and Fig. 11 are perspective views of the control unit 31 as seen from above and below. Fig. 12 is an exploded perspective view showing the control unit 31 and the cooling unit 32. The control unit 31 is the control device body 3, and further information processing The unit of the drive of the device 1. This control unit 3 1, as shown in Fig. 10~1 The main frame 4, the control board 5, and the sub-frame 6 are provided, and the control board 5 and the sub-frame 6 are positioned on the main frame 4. (4-1) Configuration of the main frame 4 FIGS. 13 and 14 are from above and below. The main frame 4 of the main frame 4 is a frame member that is held by a sub-frame 6 to be described later, and is connected to a cooling unit 32 to be described later, and corresponds to the first frame of the present invention. A flat plate having a substantially rectangular shape in plan view is formed, and is formed of a metal such as aluminum based on heat radiation and EMI (electromagnetic interference). Further, in the center of the main frame 4, as shown in Fig. 13, a concave portion 40 is formed which is recessed on the lower side, that is, on the side opposite to the side opposite to the control substrate 5. The control board 5 is housed in a space formed by the recessed portion 40 and the recessed portion 60 of the sub-frame 6 to be described later, and the main frame 4 is not provided with various chips provided on the control board 5 on which the main frame 4 is mounted. It is formed by the way it is pressed. Further, a plurality of substantially circular circular holes are formed in the main frame 4, and the cooling holes are ventilated to the control substrate 5 held by the main frame 4 and the sub-frame 6 while reducing the weight of the main frame 4. -25- 200830145 On the back side (upper side of FIGS. 13 and 14) and the right side of the region where the recess 40 is formed, the right side (the right side of FIG. 13 and the left side of FIG. 14 are close to the side of the exterior casing 2) The sides of the portions 21 3, 222 are respectively formed with two 'four totals of pin ports 4 0 1 '. More specifically, the two pin inlets 40 formed on the back side of the main frame 4 are formed along the longitudinal direction of the main frame 4, respectively, and the two pin inlets 40 1 formed on the right side. They are formed along the short side direction of the main frame 4, respectively. In the pin inlets 401, when the main frame 4 is positioned on the cooling unit 32, which will be described later, the positioning pins 329° formed by the cooling unit 32 are inserted in the main frame 4, in the center of the main frame, in plan view. A roughly rectangular opening 41 (left side of Fig. 13), 42 (right side of Fig. 13) is formed in parallel. The openings 4 1, 4 2 are formed in a CPU (Central Processing Unit) 51 and a GPU (graphics) corresponding to the control substrate 5 to be described later.
Processing Unit) 52 之位置，該 CPU51 及 GPU52 是經由 開口 4 1，4 2來露出於主框架4的下面側。在該開口 41， 42之對向的兩邊形成有延伸出至下方的延出部41 1，421 ，在該延出部4 1 1，42 1中分別設有挾持冷卻單元32的後 述受熱區塊3 2 5的挾持片4A，該冷卻單元32是抵接於分 別從開口 41，42露出的CPU51及GPU52。 圖1 5及圖1 6是由正面側及背面側來看挾持片4 A的 立體圖。又，圖17是表示主框架4的開口 41周邊的立體 圖。 挾持片4 A是如圖1 5及圖16所示，具有剖面視大略 U字狀的金屬性構件，如前述，分別安裝於主框架4的延 -26- 200830145 出部4 1 1，42 1。此挾持片4A是在控制單元3 1 的冷卻單元3 2時，挾持對應於主框架4的開口 冷卻單元32的位置所設置的受熱區塊325 (圖 體而言，分別設置於開口 4 1的端緣所形成的一 4 1 1的各挾持片4 A是由側方來挾持配置於該開匚 受熱區塊3 2 5 C，分別設置於開口 4 2的端緣所形 延出部4 1 1的各挾持片4 A是由側方來挾持配置 42内的受熱區塊325 G。 在該挾持片4A形成有抵接於受熱區塊325 4A1、及抵接於延出部411 ’ 421的背面部4A2。 在正面部4A1形成有往離開背面部4A2的 成剖面大略V字狀的突出部4A11。並且，在正 形成有分割突出部4A1 1的複數個缺口 4A12。其 部4 A 1 1具有可撓性，在抵接於受熱區塊3 2 5時 該受熱區塊3 2 5的方向賦予彈壓力。 在背面部4A2形成有2個大略圓形狀的開匚 在該等開口 4A21中，如圖17所示，嵌合突起 1 7中只圖示形成於延出部4 1 1的突起部4 1 1 1 ) 部是形成於主框架4的延出部41 1，421，且以 4A2 1大略相同的形狀及尺寸所形成。藉此，防 4A從延出部41 1，421脫離。 藉由將如此的挾持片4A設置於延出部4 1 1 了可將冷卻單元32的受熱區塊325適當地配置;! ，42内以外，還可維持該受熱區塊3 25的配置狀 安裝後述 41 ， 42 之 23)。具 對延出部 ]41内的 成的一對 於該開口 的正面部 方向突出 面部4 A 1 中，突出 ，對按壓 ：]4A2 1。 部（在圖 ，該突起 和該開口 止挟持片 ，421 ，除 令開口 4 1 態。並且 -27- 200830145 ，在主框架4安裝控制基板5，CPU51及GPU52抵接於後 述的冷卻單元32的受熱區塊325C，325G (圖23)時，可 經由該受熱區塊 3 2 5 C，3 25 G及挾持片 4A來電性連接 CPU51及GPU52與主框架4，使CPU51及GPU52與主框 架 4 導通，因此可防止 EMI ( Electro Magnetic Interference、電磁干渉）。 回到圖1 3及圖14，在開口 4 1，42附近分別形成有各 2個的孔部4 1 2，422。具體而言，2個的孔部4 1 2是形成 於大略矩形的開口 4 1之一方的對角線上，且2個的孔部 422是形成於大略矩形的開口 42之一方的對角線上。在該 等孔部4 1 2，422中，將冷卻單元3 2安裝於控制單元3 1 的螺絲3 7 (圖1 2 )會插通。 並且，在主框架4的正面側（圖1 3及圖14的前面側 )，大略矩形的開口 43會2個並列形成。在該等開口 43 中，在將控制基板5載置於主框架4時，設置於該控制基 板5的2個端子連接部53 (圖1 8 )會揷通。 在主框架4的背面側（圖1 3的上方側）形成有從該 主框架4的端緣立起成剖面大略L字狀的側面部44，45 〇 其中，在形成於圖1 3的左側之側面部44形成有尺寸 相異的4個開口 441〜444。在該等開口 441中，設置於控 制基板5且從形成於下部框體22的開口 224 1〜2244露出 的各端子59 (圖19 )會插通。並且，在側面部44，於該 開口 44 1，443，444的上側形成有細長略矩形的開口 445 -28- 200830145 〜447。而且，在形成於圖13的右側之側面部45形成有 和開口 445〜447同樣的開口 451。在該等開口 445〜447 ，45 1中，形成於後述的副框架6的立起部65會卡合，藉 此於主框架4安裝副框架6。亦即，側面部44，45是相當 於本發明的抵接部。 在主框架4的上面之正面側的長邊方向兩端部，如圖 1 3所示，分別設有突出於面外方向的銷46 (主框架4的 右側的銷爲46R，左側的銷爲46L)。該等銷46是在主框 架4載置控制基板5及副框架6時，予以定位的定位銷， 相當於本發明的第1銷。 並且，在主框架4的上面之沿著短邊方向的端緣的大 略中央分別形成有從該端緣立起之剖面大略L字狀的立起 部47 (主框架4的右側的立起部爲47R，左側的立起部爲 47L )。該等立起部47是在將控制基板5及副框架6定位 於主框架4時，使能夠夾著沿著該控制基板5及副框架6 的短邊方向的端緣的大略中央來引導該定位。 在對應於主框架4的下面的銷46之位置，如圖丨4所 示，分別設有同樣突出於面外方向的銷4 8 (主框架4的右 側的銷爲48R，左側的銷爲48L)。該等銷48是相當於本 發明的第2銷，該各銷48R，48L是被嵌合於下部框體22 所形成的嵌合穴226 1，2262 (圖6 )，將主框架4定位於 下部框體22。 並且，在主框架4的左側（圖1 3的左側，接近下部 框體22的側面部223的側），且背面側，形成有大略矩 -29- 200830145 形狀的開口 402。在形成有此開口 402的部份的下面側（ 圖14的右側）設有安裝未圖示的HDD單元之HDD安裝 部49。此HDD安裝部49是具有全體大略長方體形狀，在 表面形成有冷卻空氣導入用的複數個孔。並且，在該HDD 安裝部49的左側（接近下部框體22的側面部223 (圖3 )的側，圖14的右側）形成有大略矩形狀的開口 491 1， 經由該開口 491 1及形成於下部框體22的側面部223的開 口 2232來將HDD單元收納於HDD安裝部49内。然後， 一旦經由開口 402而露出於HDD安裝部49内的連接器58 (圖1 1 )與HDD單元的端子被連接，則可在控制基板5 的控制下對HDD單元進行資訊的讀出及記錄。 (4-2)控制基板5的構成 圖18及圖19是由上方及下方來看控制基板5的立體 圖。 控制基板5是在於控制裝置本體3，進而資訊處理裝 置1全體者，除了分別配置於大略中央的積體電路之 CPU51 (圖19的右側）及GPU52 (圖19的左側）以外， 雖省略了詳細的圖示，但實爲構成安裝有RAM ( Random Access Memory) 、ROM ( Read Only Memory)、及晶片 組寺的各種IC (Integrated Circuit)晶片等的電路基板。 而且，控制基板5是配置成使安裝有含CPU51及GPU52 的各種1C晶片的面、亦即各1C晶片的外殼（casing )所 被配置的下面對向於主框架4，且使電阻等元件的端子露 -30- 200830145 出的上面對向於副框架6。另外，CPU51及GPU52的端子 是設置於控制基板5的下面側，且被安裝於與CPU5 1及 GPU52的端子連接的插座511，521 (圖27)。該等插座 5 1 1，521，由平面來看，具有比CPU51及GPU52稍微大 的尺寸。 在控制基板 5的大略中央、具體而言，CPU5 1及 GPU52的一方的對角線上，如圖18及圖19所示，形成有 4個的孔部54，其係固定控制單元3 1與後述的冷卻單元 32的螺絲37 (圖12 )會揷通。該等4個的孔部54是被形 成在對應於主框架4的開口 4 1，42附近所形成的孔部4 1 2 ，4 2 2之位置。 並且，在控制基板5的正面側的長邊方向兩端部分別 形成有孔部5 5 (控制基板5的右側的孔部爲5 5R，左側的 孔部爲55L )。在該等孔部55R，55L中分別插通主框架4 所形成的銷46R，46L，藉此控制基板5會被定位於主框 架4 〇 而且，在沿著控制基板5的短邊方向之端緣的大略中 央、亦即在控制基板5中對應於主框架4的立起部4 7的 位置，形成有往中央没入的缺口 5 6 (控制基板5的右側的 缺口爲5 6 R，左側的缺口爲5 6 L )。該等缺口 5 6是在控制 基板5對主框架4定位時，以能夠位於該主框架4的立起 部4 7R，47L的内側之方式來配置，藉此，在主框架4上 規制控制基板5的搖動。 並且，在控制基板5的左側（圖1 8的左側）形成有 - 31 - 200830145 大略矩形的開口 5 0，在該開口 5 0中，電源連接端子5 7會 從下方被嵌合。此電源連接端子57是具備：插入電源單 元3 4的一對電源銷5 7 1 (圖1 8 )、及將該電源銷5 7 1安 裝於控制基板5的框體5 72 (圖1 9 )’該電源連接端子5 7 是以電源銷5 7 1能夠突出於控制基板5的上面側之方式， 從該控制基板5的下面側來安裝。 其中，一對的電源銷5 7 1雖省略了詳細的圖示，但實 際分別具有大略S字狀，一方的端部爲形成圓筒狀，該圓 筒狀部份會突出至框體外。因此，一對的電源銷5 7 1是構 成可搖動於框體5 72内。藉此，即使在電源單元3 4的製 造時發生尺寸等的誤差，照樣電源銷5 7 1可適當地揷入副 框架6上所配置的電源單元3 4。 並且，在框體572的長邊方向兩端部形成有露出於控 制基板5的上面之突出部5 7 2 1，藉由對控制基板5錫焊該 突出部5 72 1，電源連接端子5 7會被安裝於控制基板5。 在此突出部572 1露出的控制基板5的上面，因爲是電阻 等的各元件的端子露出的面，所以可在與其他元件的安裝 相同的面進行電源連接端子5 7的安裝。因此，可容易進 行電源連接端子5 7對控制基板5的安裝，可使資訊處理 裝置1的製造工程簡略化。更在框體5 72，如圖1 8所示， 形成有卡止爪5722，其係抵接於開口 50端緣，防止該框 體572往下方、亦即與框體572的安裝方向呈相反的方向 脫離。 在控制基板5的下面之正面側（圖1 8及圖1 9的前面 -32- 200830145 側），如圖19所示，設有2個USB端子531的端子連接 部5 3會並列設置2個。該等端子連接部5 3是在控制基板 5安裝於主框架4時，插通該主框架4的開口 43。然後， 該等端子連接部53的各USB端子531會從下部框體22 的開口 221 1露出。該等USB端子53 1是構成可插入準照 USB規格的連接器的A端子。 在控制基板5的下面側（對向於主框架4的側）設有 連接器58，其係經由開口 402 (圖13 )來露出於HDD安 裝部49(圖14)内，且連接HDD單元（圖示省略）。 連接器58是具備：與設於HDD單元的端子連接的連 接部5 8 1、及支持該連接部5 8 1的框體5 82。 其中，連接部5 8 1是形成側面視大略L字狀，一方的 端部會從框體5 8 2沿著控制基板5的下面而突出，經由該 突出方向的前端部份所形成的開口（圖示省略）來連接設 於連接部581内部的端子（圖示省略）與HDD單元的端 子。此連接部581是構成對框體582而言可搖動於與該突 出方向相反的方向、及與該突出方向大略正交的方向。因 此，對連接部581而言即使HDD單元的端子偏離，還是 可藉由連接部5 8 1的搖動’在該連接部5 8 1適當地插入端 子。 更在控制基板5的下面的背面側設有從下部框體2 2 的背面部224所形成的開口 2241〜2244露出的各種端子 59 ( 59 1〜5 93 )(從開口 4 4 4及開口 2 2 4 4露出的端子圖 示省略）。該等各端子5 9是被插入主框架4的側面部44 -33- 200830145 所形成的開口 441〜444，該開口 441〜444與端子59的卡 合部位是形成控制基板5對主框架4的轉動軸。然後，以 該轉動軸作爲中心來使控制基板5轉動於接近主框架4的 方向，藉此將控制基板5安裝於主框架4。亦即，該等端 子5 9是相當於控制基板5之本發明的卡合部。 (4-3 )副框架6的構成 圖20及圖21是由上方及下方來看副框架6的立體圖 〇 副框架6是與主框架4 一起支持控制基板5，且支持 前述的碟片單元33、電源單元34及讀卡機單元35的框架 構件，相當於本發明的第2框架。此副框架6是與主框架 4 同樣，基於放熱及 EMI( Electro Magnetic Interference 、電磁干渉）的考慮，而藉由鋁等的金屬所形成。此副框 架6，如圖2 0及圖2 1所示，形成平面視大略長方形狀的 平板狀，在大略中央部份形成有凹部6 0，其係於與控制基 板5對向的側呈相反的側没入。而且，如前述，在藉由凹 部6 0及主框架4的凹部4 0所形成的空間内収納配置前述 的控制基板5。 在此副框架6的大略中央形成有大略長圓形狀的開口 61 (圖20的左側）’ 62 (圖20的右側）。形成有該等開 口 6 1 ’ 6 2的位置是藉由該副框架6及主框架4來對應於 挾持控制基板5時的CPU51及GPU52。並且，該等開口 6 1，6 2是形成對應於將後述的冷卻單元3 2安裝於控制單 -34- 200830145 元3 1之後述的板彈簧3 6的形狀。 並且，在該等開口 61，62的内側，對應於CPU51及 GPU52的尺寸之平面視大略正方形狀的板狀體63，64會 分別被設置。該等板狀體63，64是藉由具有剛性的鐵等 金屬所形成，藉由螺合於開口 6 1，62附近所形成的螺絲 孔（圖示省略）之螺絲61 1，621，以能夠阻塞開口 61， 62的大略中央之方式，來安裝於副框架6的下面側。該等 板狀體63，64是以副框架6能夠覆蓋控制基板5的方式 來安裝於主框架4時，設在對應於CPU5 1及GPU52的位 置。At the position of the processing unit 52, the CPU 51 and the GPU 52 are exposed on the lower surface side of the main frame 4 via the openings 4 1, 4 2 . On the opposite sides of the openings 41, 42 are formed extension portions 41 1, 421 extending downward, and in the extension portions 4 1 1, 42 1 respectively, a heating block to be described later holding the cooling unit 32 is provided The holding piece 4A of the 3 2 5 is abutting on the CPU 51 and the GPU 52 which are exposed from the openings 41 and 42, respectively. Fig. 15 and Fig. 16 are perspective views of the holding piece 4A as seen from the front side and the back side. Further, Fig. 17 is a perspective view showing the periphery of the opening 41 of the main frame 4. As shown in FIGS. 15 and 16, the holding piece 4A has a metal member having a U-shaped cross section, and is attached to the main frame 4, as described above, in the extension -26-200830145, the outer portion 4 1 1, 42 1 . The holding piece 4A is a heating block 325 which is disposed at a position corresponding to the position of the opening cooling unit 32 of the main frame 4 when the cooling unit 32 of the control unit 3 1 is mounted (in the figure, the opening is respectively provided in the opening 4 1 Each of the holding pieces 4 A formed by the end edge is disposed on the side of the opening heat receiving block 3 2 5 C by the side, and is respectively disposed at the end edge of the opening 4 2 to form the extending portion 4 1 Each of the holding pieces 4 A of the first holding member 4A holds the heat receiving block 325 G in the arrangement 42. The holding piece 4A is formed to abut against the heated block 325 4A1 and abuts against the extended portion 411 '421. The front surface portion 4A2 is formed with a protruding portion 4A11 having a substantially V-shaped cross section that faces away from the back surface portion 4A2, and a plurality of notches 4A12 in which the divided protruding portion 4A1 1 is formed. The portion 4 A 1 1 Having flexibility, the spring pressure is given in the direction of the heated block 3 25 when abutting against the heated block 3 2 5 . Two roughly circular openings are formed in the back portion 4A2 in the openings 4A21, As shown in FIG. 17, only the projection 4 1 1 1 formed in the extending portion 4 1 1 is formed in the fitting projection 17 as being formed in the main frame. The extensions 41 1 421 of the frame 4 are formed in substantially the same shape and size as 4A2 1 . Thereby, the prevention 4A is detached from the extension portion 41 1,421. By arranging such a holding piece 4A in the extending portion 4 1 1 , the heat receiving block 325 of the cooling unit 32 can be appropriately disposed; in addition to the inside of the 42, the configuration of the heated block 3 25 can be maintained. Later, 41, 42 of 23). A pair of protrusions in the extension portion 41 protrudes from the front surface portion of the opening in the face portion 4 A 1 , and protrudes and presses :] 4A2 1 . In the figure, the protrusion and the opening stop holding piece 421 are in the state of the opening 4 1 and -27-200830145, the control board 5 is mounted on the main frame 4, and the CPU 51 and the GPU 52 are in contact with the cooling unit 32 to be described later. In the heating block 325C, 325G (Fig. 23), the CPU 51 and the GPU 52 and the main frame 4 can be electrically connected via the heated block 3 2 5 C, 3 25 G and the holding piece 4A, so that the CPU 51 and the GPU 52 are electrically connected to the main frame 4. Therefore, EMI (Electromagnetic Magnetic Interference) can be prevented. Returning to Fig. 13 and Fig. 14, two hole portions 4 1 2 and 422 are formed in the vicinity of the openings 4 1, 42. Specifically, 2 The hole portions 4 1 2 are formed on a diagonal line of one of the openings 4 1 of the substantially rectangular shape, and the two hole portions 422 are formed on a diagonal line of one of the openings 42 of the substantially rectangular shape. In 4 1 2, 422, the screw 3 7 (Fig. 12) that mounts the cooling unit 3 2 to the control unit 3 1 is inserted. Also, on the front side of the main frame 4 (the front side of Fig. 13 and Fig. 14) ), the roughly rectangular opening 43 is formed in parallel. In the openings 43, the control substrate 5 is placed In the main frame 4, the two terminal connecting portions 53 (Fig. 18) provided in the control board 5 are turned on. On the back side of the main frame 4 (upper side in Fig. 13), the main frame 4 is formed. The end edge rises into a side portion 44 having a substantially L-shaped cross section, and 45 sides thereof are formed with four openings 441 to 444 having different sizes in the side surface portion 44 formed on the left side of FIG. The terminals 59 (FIG. 19) which are provided on the control substrate 5 and are exposed from the openings 224 1 to 2244 formed in the lower casing 22 are inserted, and the side portions 44 are at the openings 44 1, 443, 444. An elongated rectangular opening 445-28-200830145-447 is formed on the upper side. Further, an opening 451 similar to the openings 445 to 447 is formed in the side surface portion 45 formed on the right side of Fig. 13. In the openings 445 to 447, 45 In the first embodiment, the rising portion 65 formed in the sub-frame 6 to be described later is engaged, whereby the sub-frame 6 is attached to the main frame 4. That is, the side portions 44, 45 are the abutting portions corresponding to the present invention. Both ends of the front side of the upper surface of the frame 4 in the longitudinal direction are respectively provided as shown in FIG. The pin 46 (the pin on the right side of the main frame 4 is 46R and the pin on the left side is 46L). These pins 46 are positioning pins that are positioned when the control frame 5 and the sub-frame 6 are placed on the main frame 4, and correspond to the present invention. In addition, a rising portion 47 having a substantially L-shaped cross section rising from the end edge is formed in the center of the edge of the upper surface of the main frame 4 in the short-side direction (the main frame 4 is formed). The rising portion on the right side is 47R, and the rising portion on the left side is 47L). When the control board 5 and the sub-frame 6 are positioned on the main frame 4, the rising portion 47 guides the center of the edge of the control board 5 and the sub-frame 6 in the short-side direction. Positioning. At positions corresponding to the lower pins 46 of the main frame 4, as shown in Fig. 4, pins 4 8 are also provided which are also protruded in the out-of-plane direction (the pin on the right side of the main frame 4 is 48R, and the pin on the left side is 48L). ). These pins 48 are second pins corresponding to the present invention, and the pins 48R, 48L are fitted to the fitting holes 226 1, 2262 (FIG. 6) formed by the lower casing 22, and the main frame 4 is positioned. Lower frame 22. Further, on the left side of the main frame 4 (on the left side of Fig. 13, close to the side of the side surface portion 223 of the lower frame 22), and on the back side, an opening 402 having a shape of a large moment -29 - 200830145 is formed. An HDD mounting portion 49 to which an HDD unit (not shown) is mounted is provided on the lower surface side (the right side in Fig. 14) of the portion where the opening 402 is formed. The HDD mounting portion 49 has a substantially rectangular parallelepiped shape, and a plurality of holes for introducing cooling air are formed on the surface. Further, on the left side of the HDD mounting portion 49 (on the side closer to the side surface portion 223 (FIG. 3) of the lower casing 22, on the right side in FIG. 14), a substantially rectangular opening 491 1 is formed through the opening 491 1 and The opening 2232 of the side surface portion 223 of the lower casing 22 houses the HDD unit in the HDD mounting portion 49. Then, once the connector 58 (FIG. 11) exposed in the HDD mounting portion 49 via the opening 402 is connected to the terminal of the HDD unit, information reading and recording can be performed on the HDD unit under the control of the control substrate 5. . (4-2) Configuration of Control Substrate 5 Figs. 18 and 19 are perspective views of the control substrate 5 as viewed from above and below. The control board 5 is the control unit main body 3, and further, the information processing apparatus 1 is omitted except for the CPU 51 (the right side in FIG. 19) and the GPU 52 (the left side in FIG. 19) of the integrated circuit which are disposed substantially at the center. In addition, it is a circuit board which comprises various IC (Integrated Circuit) wafers, such as a random access memory (RAM), a ROM (Read Only Memory), and a chip group temple. Further, the control board 5 is disposed so that the lower surface of each of the 1C wafers on which the CPU 51 and the GPU 52 are mounted, that is, the casing of each 1C wafer, is disposed opposite to the main frame 4, and components such as resistors are placed. The top of the terminal dew-30-200830145 is opposite to the sub-frame 6. Further, the terminals of the CPU 51 and the GPU 52 are provided on the lower surface side of the control board 5, and are mounted on the sockets 511, 521 (Fig. 27) connected to the terminals of the CPU 51 and the GPU 52. These sockets 5 1 1,521 have a slightly larger size than the CPU 51 and the GPU 52 in plan view. As shown in FIG. 18 and FIG. 19, in the approximate center of the control board 5, specifically, on one diagonal line of the CPU 51 and the GPU 52, four hole portions 54 are formed, which are fixed to the control unit 31 and described later. The screw 37 (Fig. 12) of the cooling unit 32 is smashed. The four hole portions 54 are formed at positions corresponding to the hole portions 4 1 2 and 4 2 2 formed in the vicinity of the openings 41, 42 of the main frame 4. Further, hole portions 55 are formed at both end portions in the longitudinal direction of the front surface side of the control substrate 5 (the hole portion on the right side of the control substrate 5 is 5 5R, and the hole portion on the left side is 55 L). Pins 46R, 46L formed by the main frame 4 are respectively inserted into the holes 55R, 55L, whereby the control substrate 5 is positioned at the main frame 4 and at the end along the short side of the control substrate 5. The center of the edge, that is, the position of the control substrate 5 corresponding to the rising portion 47 of the main frame 4, is formed with a notch 56 that is immersed in the center (the gap on the right side of the control substrate 5 is 5 6 R, left side The gap is 5 6 L ). When the control substrate 5 is positioned on the main frame 4, the notches 56 are disposed so as to be located inside the rising portions 47R, 47L of the main frame 4, whereby the control substrate is regulated on the main frame 4. 5 shaking. Further, on the left side (the left side of Fig. 18) of the control board 5, an opening 50 of a substantially rectangular shape of -31 - 200830145 is formed, and in the opening 50, the power connection terminal 57 is fitted from below. The power connection terminal 57 includes a pair of power pins 5 7 1 (FIG. 18) inserted into the power supply unit 34, and a casing 5 72 for attaching the power pin 517 to the control board 5 (FIG. 19). The power connection terminal 5 7 is attached from the lower surface side of the control board 5 so that the power pin 517 can protrude from the upper surface side of the control board 5. Here, although the pair of power supply pins 517 are omitted from the detailed drawings, they are substantially S-shaped, and one end portion is formed in a cylindrical shape, and the cylindrical portion protrudes outside the frame. Therefore, a pair of power pins 517 are configured to be rockable within the frame 572. Thereby, even if an error such as size occurs during the manufacture of the power supply unit 34, the power supply pin 517 can be appropriately inserted into the power supply unit 34 disposed on the sub-frame 6. Further, at both end portions in the longitudinal direction of the casing 572, a protruding portion 57.2 which is exposed on the upper surface of the control substrate 5 is formed, and the protruding portion 572 is soldered to the control substrate 5, and the power connection terminal 57 is connected. It will be mounted on the control substrate 5. Since the upper surface of the control board 5 on which the protruding portion 572 1 is exposed is a surface on which the terminals of the respective elements such as the resistor are exposed, the power source connection terminal 57 can be mounted on the same surface as the other elements. Therefore, the mounting of the power supply connection terminal 57 to the control board 5 can be easily performed, and the manufacturing process of the information processing apparatus 1 can be simplified. Further, in the frame 5 72, as shown in FIG. 18, a locking claw 5722 is formed which abuts against the end edge of the opening 50 to prevent the frame 572 from going downward, that is, opposite to the mounting direction of the frame 572. The direction is gone. On the front side of the lower surface of the control board 5 (the front side of FIG. 18 and FIG. 19 - the side of -32 - 200830145), as shown in FIG. 19, the terminal connection part 5 3 provided with two USB terminals 531 is provided in parallel. . The terminal connecting portion 53 is an opening 43 through which the main frame 4 is inserted when the control board 5 is attached to the main frame 4. Then, the USB terminals 531 of the terminal connecting portions 53 are exposed from the opening 221 1 of the lower casing 22. The USB terminals 53 1 are A terminals constituting a connector that can be inserted into the USB standard. On the lower surface side of the control substrate 5 (the side opposite to the main frame 4), a connector 58 is provided which is exposed through the opening 402 (FIG. 13) in the HDD mounting portion 49 (FIG. 14) and is connected to the HDD unit ( The illustration is omitted). The connector 58 includes a connecting portion 581 connected to a terminal provided in the HDD unit, and a housing 582 supporting the connecting portion 581. The connecting portion 581 is formed in a substantially L-shaped side view, and one end portion protrudes from the frame body 528 along the lower surface of the control board 5, and an opening formed through the front end portion of the protruding direction ( The terminals (not shown) provided inside the connection portion 581 and the terminals of the HDD unit are connected to each other. The connecting portion 581 is configured to be rotatable in a direction opposite to the protruding direction of the frame 582 and a direction substantially orthogonal to the protruding direction. Therefore, even if the terminal of the HDD unit is deviated from the connecting portion 581, the terminal can be appropriately inserted by the rocking of the connecting portion 581. Further, various terminals 59 (59 1 to 5 93 ) exposed from the openings 2241 to 2244 formed in the back surface portion 224 of the lower casing 2 2 are provided on the back surface side of the lower surface of the control substrate 5 (from the opening 4 4 4 and the opening 2) 2 4 4 The exposed terminal illustration is omitted). Each of the terminals 59 is an opening 441 to 444 formed by the side surface portions 44-33 to 200830145 of the main frame 4, and the engagement portions of the openings 441 to 444 and the terminal 59 form the control substrate 5 to the main frame 4. Rotate the shaft. Then, the control substrate 5 is rotated in the direction approaching the main frame 4 with the rotation axis as a center, whereby the control substrate 5 is attached to the main frame 4. That is, the terminals 59 are the engaging portions of the present invention corresponding to the control board 5. (4-3) Configuration of Sub-Frame 6 FIGS. 20 and 21 are perspective views of the sub-frame 6 viewed from above and below. The sub-frame 6 supports the control board 5 together with the main frame 4, and supports the aforementioned disc unit 33. The frame members of the power supply unit 34 and the card reader unit 35 correspond to the second frame of the present invention. Similarly to the main frame 4, the sub-frame 6 is formed of a metal such as aluminum based on heat radiation and EMI (electromagnetic interference). As shown in Fig. 20 and Fig. 21, the sub-frame 6 is formed in a flat shape having a substantially rectangular shape in plan view, and a concave portion 60 is formed in a substantially central portion, which is opposite to the side opposite to the control substrate 5. The side is immersed. Further, as described above, the above-described control substrate 5 is housed in the space formed by the concave portion 60 and the concave portion 40 of the main frame 4. In the approximate center of the sub-frame 6, an opening 61 (left side in Fig. 20) '62 (on the right side of Fig. 20) having a substantially elliptical shape is formed. The position at which the openings 6 1 ' 6 2 are formed corresponds to the CPU 51 and the GPU 52 when the sub-frame 6 and the main frame 4 are held by the control substrate 5. Further, the openings 6 1, 6 2 are formed in a shape corresponding to a leaf spring 36 which will be described later, in which the cooling unit 3 2 described later is attached to the control sheet -34 - 200830145. Further, on the inner side of the openings 61, 62, the substantially square-shaped plate-like members 63, 64 corresponding to the dimensions of the CPU 51 and the GPU 52 are provided. The plate-like members 63 and 64 are formed of a metal such as iron having rigidity, and are screwed to the screw 61, 621 of a screw hole (not shown) formed in the vicinity of the opening 61, 62. The lower ends of the sub-frames 6 are attached so as to block the centers of the openings 61, 62. The plate-like members 63, 64 are provided at positions corresponding to the CPU 5 1 and the GPU 52 when the sub-frame 6 is attached to the main frame 4 so that the sub-frame 6 can cover the control board 5.
在板狀體63，64的四個角落，大略圓筒狀的突起部 63 1，641會以能夠分別貫通板狀體63，64的方式來設置 ，如圖2 1所示，一部份會突出於下面（對向於控制基板5 側的面，圖21所示的面）側。該等突起部6 3 1，641是抵 接於控制基板5的CPU51及GPU52所被安裝的面的相反 側的面，且與與該CPU51及GPU52所被設置的位置呈反 對側的位置。該等突起部63 1，64 1是例如藉由乙縮醛樹 脂等具有絶緣性的合成樹脂所形成，在副框架6覆蓋控制 基板5時，防止流動於該控制基板5的電流經由板狀體6 3 ，64來傳導至板彈簧36。並且，藉由該突起部631，641 設於板狀體63，64下面的四個角落，可使利用板彈簧36 之冷卻單元32的後述受熱區塊325C，325G (圖23)對 CPU51 A 的按壓力會g夠均等地傳達至該CPU51 A GPU52 。 -35- 200830145 在副框架6的背面側的端緣，如圖2 0及圖2 1所示， 形成有朝上方立起的複數個立起部65。該等立起部65是 分別形成在對應於主框架4的側面部4 4，4 5所形成的開 口 445〜44 7，451 (圖13)之位置。而且，該等立起部65 是分別被插入該開口 445〜447，45 1，藉此將副框架6安 裝於主框架4。亦即，立起部6 5是相當於副框架6之本發 明的卡合部。 在副框架6的正面側的長邊方向兩端，形成有在將副 框架6安裝於主框架4時，設於該主框架4的銷46 (圖 1 3 )會揷通的孔部66 (副框架6的右側的孔部爲66R，左 側的孔部爲66L )。 並且’在沿著副框架6的短邊方向的端緣的大略中央 ’形成有與控制基板5所形成的缺口 5 6 (圖1 8 )同樣的 缺口 67 (副框架6的右側的缺口爲67R，左側的缺口爲 6 7 L )。該等缺口 6 7是對主框架4定位控制基板5後，在 該主框架4定位副框架6時，嵌入形成於主框架4的立起 部47。藉此，引導副框架6定位至主框架4。另外，在從 形成有缺口 67L的位置靠副框架6的中央的位置，形成有 大略矩形的開口 60 1，其係插通設於控制基板5的電源連 接端子5 7的電源銷5 7 1 (圖1 8 )。 而且’在副框架6的上面之正面左側，如圖20所示 ’設有支持固定讀卡機單元3 5 (圖9)的台座構件6 8。此 台座構件6 8是由：配置於左側的左側台座6 8丨、及配置於 右側的右側台座6 8 2所構成。在該等台座6 8 1，6 8 2形成 -36- 200830145 有：與副框架6的上面大略平行形成之延出部6811，6821 、及與該上面大略平行形成，且形成於比延出部6 8 1 1， 6821更離開副框架6的上面的位置之延出部6812，6822 。其中，延出部 6811，6821是支持基板 352，延出部 6812，6822是支持讀卡機351。 更在副框架6的上面之背面左側，設有沿著該背面的 端緣來支持電源單元34的支持部69。此支持部69是形成 平面視大略長方形狀，沿著長邊方向的端緣的兩端會對副 框架6的上面垂直立起，其前端部份會大略平行延伸出於 該上面。在此大略平行延伸出的延出部691載置有電源單 元3 4 (圖9)，該電源單元3 4是藉由未圖示的螺絲來固 定於支持部69。 (5 )冷卻單元3 2的構成 圖22是由下方來看組合於控制單元3 1的冷卻單元3 2 的立體圖。並且，圖23是由上方來看冷卻單元32的立體 圖。 冷卻單元32，如前述，是藉由板彈簧36來與控制單 元3 1形成一體，除了冷卻構成該控制單元31的控制基板 5以外，在從外裝框體2外部導入冷卻空氣的過程中，爲 冷卻位於該冷卻空氣的流路上的電源單元3 4等之冷卻手 段。此冷卻單元3 2，如圖2 2所示，是以一部份能夠覆蓋 主框架4的HDD安裝部49之方式來配置。 冷卻單元32是具備： -37- 200830145 送風部3 2 1，其係於旋轉軸具有形成放射狀的葉片構 件3 2 1 1，具備使該旋轉軸及葉片構件3 2 1 1旋轉的馬達（ 圖示省略）；及 框體322，其係將該等構件收納於内部的框體322。 送風部3 2 1是藉由隨馬達的旋轉而旋轉的葉片構件 321 1來從形成於框體3 22的後述吸氣口 3 23 1，3244吸引 框體3 2 2外的空氣，且從吐出口 3 2 7，3 2 8吐出吸引後的 空氣。藉由該等馬達及葉片構件3 2 1 1的旋轉所送風的冷 卻空氣是在於冷卻經由設於框體322的後述受熱區塊325 來傳導至放熱鰭3245，3246的熱。 框體3 22是形成全體大略長方體形狀，爲了提高放熱 性及強度，而藉由鋁等的金屬來形成。 在此框體322的下面部3 23、亦即與下部框體22對向 的下面部3 23，如圖22所示，形成有平面視大略圓形狀的 吸氣口 3 23 1。在此吸氣口 3 23 1，經由形成於下部框體22 的正面部221的吸氣口 2212來導入外裝框體2内部的冷 卻空氣會被引入。 冷卻單元32的上面部3 24、亦即對向於控制單元31 的上面部324，如圖23所示，是由2個板構件324 1， 3242所形成。該等板構件324 1，3 242是藉由複數的安裝 構件3243來可若干的上下作動地安裝於框體3 22。 在上面部3 24的大略中央，以能夠跨越該等2個板構 件3 24 1，3242的方式來形成平面視大略圓形狀的吸氣口 3 244。在此吸氣口 3244，隨著送風部 321的葉片構件 -38- 200830145 3 2 1 1的旋轉來將冷卻裝置本體3後的冷卻空氣導入冷卻單 元32内。 在框體322的内部設有放熱鰭3245，3246，其係分別 連接至板構件324 1，3242，將傳導至該板構件324 1， 3 242的熱予以放熱。更詳而言之，在板構件324 1連接放 熱鰭3246，在板構件3242連接放熱鰭3 245。該等放熱鰭 3 24 5，3 246是具有藉由複數的金屬製薄板所形成，互相連 接的階層構造。而且，在該等放熱鰭3245，3246，是藉由 葉片構件32 11的旋轉來使吸引至框體322内的空氣送風 ，冷卻該放熱鰭3245，3246。又，由於此時是藉由該放熱 鰭3 245，3 246來使冷卻空氣流通於各薄板間，因此可謀 求冷卻空氣的整流。另外，放熱鰭3245與放熱鰭3246是 各分離，獨立設置。 並且，在上面部3 24設有2個的受熱區塊325(3250 ，325G)。該等受熱區塊325是相當於本發明的受熱部， 爲熱傳導性高的金屬性構件，分別形成對應於主框架4所 形成的開口 4 1，42的形狀。在該等受熱區塊3 2 5的大略 中央形成有平面視大略矩形狀的平坦部3 2 5 1，在兩端，比 平坦部3 2 5 1低的階差部3 2 5 2會形成夾著該平坦部3 2 5 1。 在該等受熱區塊3 25的階差部3252分別形成有螺絲 孔3 25 2 1，在該螺絲孔32 5 2 1中，插通後述的板彈簧36的 孔部3 63 2 (圖24 )、控制基板5的孔部54 (圖18 )及主 框架4的孔部412，422之螺絲37 (圖12 )會螺合。藉此 ，將冷卻單元3 2安裝於控制單元3 1。亦即，螺絲孔 -39- 200830145 3 2 5 2 1是相當於卡止安裝構件的螺絲3 7之卡止部。 該等受熱區塊325中，受熱區塊325C (圖23的左側 )是設置於覆蓋吸氣口 3 244的一部份之位置，且對應於 控制基板5的CPU51之位置。而且，在冷卻單元32安裝 於控制單元31時，該受熱區塊3 2 5 C的平坦部325 1會抵 接於CPU51，在該受熱區塊325C傳導CPU51所產生的熱 〇 又，受熱區塊3 25G (圖23的右側）是設置於覆蓋吸 氣口 3244及板構件3242的各一部份之位置，且對應於控 制基板5的GPU52之位置。而且，同樣的，在冷卻單元 32安裝於控制單元31時，該受熱區塊3 2 5 G的平坦部 3 2 5 1會抵接於GPU52，在該受熱區塊325 G傳導GPU52 所產生的熱。 在該等受熱區塊325C，325G的平坦部3251之對向於 CPU51及GPU52且抵接於該CPU51及GPU52的面，塗佈 用以減少熱電阻的潤滑油（grease )。藉由該潤滑油， CPU5 1及GPU5 2的熱會形成容易傳導至受熱區塊325°另 外，亦可取代潤滑油而貼附熱傳導薄板（sheet )，但爲了 維持受熱區塊3 2 5 C，3 25 G的各個高度，最好是使用潤滑 油。 在此，於冷卻單元32中，配置有受熱區塊3 25 C， 3 25G的高度是分別不同。具體而言，抵接於CPU51的受 熱區塊3 2 5 C是配置於比抵接於GPU52的受熱區塊3 2 5 G 高的位置。這是因爲CPU51的外殻比GPU52小，所以使 -40- 200830145 抵接於該CPU51的受熱區塊3 25 C的位置比受熱區塊 325G更提高。藉此，可在大致相同的壓力下將各個的受 熱區塊325C，325G按壓於CPU51及GPU52。又，如前述 ，連接該等受熱區塊325C，325G的板構件3241，3242中 ，載置受熱區塊3 25 G的板構件3242是構成可上下作動。 因此，可調整受熱區塊325G對該受熱區塊325C的高度。 所以，可使受熱區塊325C，325G確實地抵接於CPU51及 GPU52 。 在該等受熱區塊3 2 5中設有複數的熱管（heat pipe) 326(326C，326G)，其係連接至該受熱區塊325，且沿 著上面部324而延伸。 其中，3根的熱管326C是連接受熱區塊325C及板構 件3241，將傳導至該受熱區塊325C之CPU51的熱予以吸 熱，使傳導至板構件324 1。並且，2根的熱管326G是連 接受熱區塊325G及板構件3242，將傳導至該受熱區塊 3 25 G之GPU52的熱予以吸熱，使傳導至板構件3242。 然後，被傳導至板構件 3 24 1，3242之 CPU51及 GPU52的熱會分別傳導至放熱鰭3246，3 245，該熱會藉 由隨著構成送風部3 2 1的馬達及葉片構件3 2 1 1的旋轉而 流通的冷卻空氣來冷卻。 在如此的受熱區塊3 25與主框架4之間，是在冷卻單 元32安裝於控制單元31時，介裝挾持片4A (圖15〜圖 1 7 )，其係設於該主框架4的開口 41，42的端緣所形成 的延出部41 1，421。而且，在受熱區塊3 2 5的側面，挾持 -41 - 200830145 片4A的突出部4A11 (圖15及圖17)會抵接，藉由該挾 持片4A，受熱區塊325位於開口 41，42内。 在除了框體322的下面部323及上面部324以外的4 個側面中，在隣接的2個側面，如圖22及圖23所示，形 成有吐出口 327，328，其係將吸至框體322内的空氣予以 吐出。 該等吐出口 327，328中，吐出口 327是連接至下部 框體2 2的側面部2 2 2所形成的排氣口 2 2 2 1，2 2 2 2，經由 該排氣口 222 1，2222來排出冷卻放熱鰭3245的空氣。在 此吐出口 3 27的周圍，具體而言是形成該吐出口 3 27的框 體3 22的下面及側面設有海綿327 1，其係抵接於下部框體 22的内面部226所形成的抵接部2265。藉由此海綿327 1 ，吐出口 3 27與形成於下部框體22的排氣口 2222 (圖1 )會被連接，冷卻外裝框體2内的裝置本體3且從吐出口 3 27吐出的冷卻空氣不會洩漏而從排氣口 222 1，2222排出 〇 又，吐出口 328會被連接至下部框體22的背面部224 所形成的排氣口 2248，經由該排氣口 2248來使冷卻放熱 鰭3 246後的空氣排氣。在此吐出口 3 28的周圍、具體而 言是形成該吐出口 328的框體322的上面（圖23所圖示 的面）及側面設有海綿3 2 8 1。藉由此海綿3 2 8 1、及設於 下部框體22的内面部226的海綿2264 (圖6 )，吐出口 328與形成於下部框體22的背面部224的排氣口 2248 ( 圖3 )會被連接，可使從該吐出口 3 2 8吐出的冷卻空氣不 -42- 200830145 會自排氣口 2248洩漏而排出至外裝框體2外部。 而且，冷卻單元3 2是在橫置資訊處理裝置1時，將 冷卻内部後的冷卻空氣排出至側方（面2A (圖1 )側）及 背面側，在縱置時，是排出至上方及背面側。 並且，在上面部3 24設有合計4個從該上面部324往 面外方向突出的定位銷329。該等定位銷329中，2個是 突設於板構件324 1的吐出口 327附近，2個是突設於板構 件3 242的吐出口 3 2 8附近。該等定位銷329是以能夠使 冷卻單元32的上面部324與控制單元31的主框架4的下 面對向之方式，在冷卻單元3 2定位主框架4時，分別插 通形成於該主框架4的銷揷入口 40 1。 (6 )板彈簧3 6的構成 其次，說明有關板彈簧3 6的構成。 圖24是由上方來看板彈簧36的立體圖。又，圖25 是表示板彈簧3 6的剖面圖。 如前述，2個的板彈簧36是在控制單元31安裝冷卻 單元32的構件，相當於本發明的彈壓板。此板彈簧36， 如圖2 4所示，形成大略點對稱的平面視大略長圓形狀。 具體而言，板彈簧3 6是具有對應於副框架6的開口 61， 62之形狀，分別嵌合於副框架6的開口 61，62。 在板彈簧36的大略中央，如圖24及圖25所示，形 成有細長的平坦部3 6 1，在該平坦部3 6 1的大略中央形成 有1個突出部3 6 1 1 ’其係突出於副框架6側，且抵接於該 -43- 200830145 副框架6的板狀體63，64的上面大略中央。並且，在板 彈簧3 6形成有一對的傾斜部3 62，其係以能夠夾著該平坦 部3 6 1的方式來往上方傾斜。並且，以能夠夾著該等一對 的傾斜部3 6 2之方式來形成大略平行於平坦部3 6丨的平坦 部 3 63。 在各平坦部3 6 3中分別形成有2個的孔部3 6 3 1，3 6 3 2 〇 其中’比孔部3 632更形成於内側的孔部3 63 1是在板 彈簧3 6抵接於板狀體63，64時，設置在對應於該板狀體 6 3，6 4的上面側所露出的突起部6 3 1，6 4 1之位置。 並且，形成於板彈簧36的兩端之孔部3 63 2是螺合於 冷卻單元3 2的受熱區塊3 2 5所形成的螺絲孔3 2 5 2 1 (圖 2 3 )之螺絲3 7 (圖1 2 )會揷通。 然後，在該等孔部3 632中插入螺絲37，一旦該螺絲 3 7螺合於冷卻單元3 2的螺絲孔3 2 5 2 1，則板彈簧3 6的各 個平坦部3 6 3會被按下於下側（副框架6側）。在此，對 平坦部3 6 3而言，位於該平坦部3 6 3的内側之一對的傾斜 部3 62是分別傾斜著，因此夾在該一對的傾斜部3 62之平 坦部3 6 1是被按下於下方。此時，形成於平坦部3 6 1的下 面側之突出部361 1會抵接於副框架6的板狀體63，64， 對該板狀體63，64而言，在1點施加荷重。利用藉此板 彈簧3 6而施加的荷重，經由副框架6的板狀體63，64來 將控制基板5的CPU51及GPU52分別按壓於冷卻單元32 的受熱區塊325C，325G，且冷卻單元32會拉至接近控制 -44- 200830145 單元3 1的方向。因此，可使CPU51及GPU52確實地按壓 於受熱區塊325C，325G，可提高從該CPU51及GPU52往 受熱區塊325C，325G的傳熱效率。 (7 )資訊處理裝置1的製造工程 在此，說明有關本實施形態的資訊處理裝置1的製造 工程。 圖26是表示資訊處理裝置1的製造工程的流程圖。 資訊處理裝置1，如圖26所示，是經由冷卻單元定位 工程S01、控制基板定位工程S02、副框架定位工程S03 、冷卻單元安裝工程S04、單元反轉工程S05、下部框體 被覆工程S06、下部框體反轉工程S07、碟片單元安裝工 程S08、電源單元安裝工程S09、基板安裝工程S10、讀 卡機安裝工程S11、上部框體安裝工程S12及罩殼安裝工 程S 1 3來製造。以下，具體說明有關各工程S 0 1〜S 1 3。 冷卻單元定位工程S0 1是相當於本發明的冷卻手段定 位工程，在該工程S01中，是將冷卻單元32定位於控制 單元3 1的主框架4。在此工程S 0 1中，是以突設於冷卻 單元32的上面部324的各定位銷329能夠插通主框架4 所形成的銷揷入口 4 0 1之方式，將該冷卻單元3 2定位於 主框架4。 控制基板定位工程S 02是相當於本發明的基板定位工 程，在該工程S02中，是針對定位於冷卻單元32上的主 框架4來定位電路基板亦即控制基板5。 -45- 200830145 具體而言，在形成於主框架4之作爲抵接部的側 44的開口 441〜444 (圖13 )中插入設置於控制基板 背面側之作爲卡合部的各端子59 (圖1 9 )，以該端= 與開口 441〜444的卡合部位作爲軸，使轉動成能以 基板5覆蓋主框架4，將該控制基板5載置於主框架 此時，以控制基板5的缺口 5 6R，5 6L (圖1 8 )能夠 於主框架4所形成的立起部47R，47L (圖13 )的内 方式，且以控制基板5的孔部5 5 R，5 5 L (圖1 8 )能 設於主框架4的銷4 6 R，4 6 L (圖1 3 )揷通之方式， 制基板5定位於主框架4。此時，控制基板5與主框 是在凹部4 0的端緣、亦即主框架4的端緣互相接觸 框架4的端緣與控制基板5的端緣會被對齊。 藉此，被安裝於控制基板5的CPU5 1及GPU52 別插通主框架4的開口 41，42，該CPU51及GPU52 向於位在主框架4的下方之冷卻單元32的受熱區塊 ，32 5 G。因此，可針對主框架4，將控制基板5定位 當的位置。 副框架定位工程S 03是相當於本發明的第2框架 工程，在該工程S03中，是針對載置有控制基板5的 架4來定位副框架6。此時，針對形成於主框架4之 抵接部的側面部4 4的開口 4 4 5〜4 4 7 (圖1 3 )、及形 作爲抵接部的側面部4 5的開口 4 5 1 (圖1 3 )來插入 於副框架6的背面側的端部之作爲卡合部的立起部6 5 2〇)，且以該立起部65與開口 445〜447，451的卡 面部 5的 f 59 控制 4 〇 配置 側之 夠被 將控 架4 ，主 會分 會對 3 2 5 C 於適 定位 主框 作爲 成於 形成 (圖 合部 -46- 200830145 位爲軸，以能夠覆蓋主框架4及控制基板5的方式來 框架6轉動而配置。 此時，與控制基板5的情況同樣，以形成於副框 的缺口 67R，67L (圖20)能夠配置於主框架4的立 4 7R，47L (圖13 )的内側之方式，且以形成於副框 的孔部6 6 R，6 6 L (圖2 0 )能夠被設於主框架4的銷 ，4 6 L (圖1 3 )揷通之方式，將副框架6定位於主框 。並且，此時，副框架6與控制基板5是在凹部6 0 緣、亦即副框架6的端緣互相接觸，主框架4的端緣 框架6的端緣會被對齊。 藉此，板狀體6 3，6 4會位在對應於控制基板 CPU51及GPU52的位置，可針對該控制基板5及主框 ，將副框架6定位於適當的位置。 之後’以能夠插通形成於主框架4及副框架6的 之未圖示的孔部之方式來進行螺絲固定，藉此組裝控 元3 1。 圖27是表示構成控制單元3 1的各構件4〜6及 單兀32的剖面圖。圖28是表不在控制單元31安裝 單元3 2的狀態之該控制單元31及冷卻單元3 2的剖 。另外，圖28是對應於控制基板5的CPU51之位置 面圖，有關同樣的構成之GPU52的各構件是賦予括號 冷卻單元安裝工程S04是相當於本發明的冷卻手 裝工程，在該工程S 04中，是藉由板彈簧36及冷卻 3 2 ’使能夠夾著控制單元3 1，在該控制單元3 1安裝 使副 架6 起部 架6 46R 架4 的端 與副 5的 架4 外周 制單 冷卻 冷卻 面圖 的剖 〇 段安 單元 冷卻 -47- 200830145 單元32。 具體而言，在工程S〇4中，首先，如上述般 相定位的控制單元31中，如圖2 7及圖2 8所示 對準該控制單元3 1的副框架6所形成的開口 6 i 式，來分別配置板彈簧3 6。此時，各板彈簧3 6 央所形成的平坦部3 6 1的突出部3 6 1 1會抵接於 塞開口 6 1 ’ 62的大略中央之方式而設置的板狀！ (在圖2 8中是僅圖示板狀體6 3 )，且以從該平 的兩端延伸出的傾斜部3 62的延出方向能夠形成 架6的方向之方式來配置各板彈簧3 6。 之後，使螺絲3 7插通於板彈簧3 6的平坦部 成的孔部3 6 3 2 (圖2 7 )、副框架6的開口 6 1， 基板5所形成的孔部5 4、及、主框架4的孔部 。然後，使螺絲3 7螺合於冷卻單元3 2的受熱E ，3 2 5 G所形成的螺絲孔3 2 5 2 1，將板彈簧3 6予 冷卻單元3 2。此時，藉由對螺絲孔3 2 5 2 1之螺翻 合，板彈簧3 6的傾斜部3 6 2及平坦部3 6 3會彎 於控制基板5，藉此該平坦部3 6 3會經由螺絲3 7 冷卻單元3 2拉至控制單元3 1側的方式來彈壓的 坦部361的突出部361 1會經由板狀體63，64來 板5的CPU51及GPU52按壓於冷卻單元32的 3 25C，325 G。 在此，板彈簧36與板狀體63，64是在該丰j 的平坦部3 6 1所形成的突出部3 6 1 1的一點抵接 ，在被互 ，以能夠 ，62之方 的大略中 以能夠阻 豊 63 ， 64 坦部3 6 1 離開副框 3 63所形 62、控制 412 ， 422 【塊 325C 以螺固於 ί 3 7的螺 曲成接近 以能夠將 同時，平 將控制基 受熱區塊 乏彈簧3 6 ，板彈簧 -48- 200830145 36是在該突出部361 1對板狀體63，64以能夠施加10kg 的荷重之方式被固定。因此，施加於板狀體63，64的 10kg的荷重是由設於該板狀體63的四個角落的突起部 6 3 1，6 4 1來均等地施加於控制基板5 ° 並且，該等板狀體63 ’ 64是以和控制基板5的 CPU5 1及GPU52大略相同的尺寸所形成，且配置在對應 於該CPU5 1及GPU52的位置。因此，從設於板狀體63， 64的四個角落的突起部 631，641所施加的荷重是使 CPU51及GPU52的四個角落分別均等地壓著於受熱區塊 325C，325G。所以，可抑止設於CPU51及GPU52，插入 控制基板5所設置的插座5 1 1，5 2 1之端子的變形等的變 位，且可使該CPU5 1及GPU52確實且適當地壓著於受熱 區塊 325C， 325G。 在此，針對螺絲3 7來加以説明，如圖27所示，螺絲 3 7是相當於本發明的安裝構件，形成揷入方向前端側細， 揷入方向基端側粗。 更詳而言之，在螺絲3 7形成有：具有平面視大略圓 形狀的螺絲頭3 7 1、及從該螺絲頭3 7 1往面外方向突出的 圓筒部3 72、及更從該圓筒部3 72的前端部份突出，比圓 筒部3 72的外徑尺寸小之大略圓筒狀的螺合部3 73。 其中，螺絲頭3 7 1的外徑尺寸是比板彈簧3 6的孔部 3 63 2的内徑尺寸更大，且圓筒部372的外徑尺寸是比板彈 簧36、控制基板5及主框架4所形成的各孔部3 63 2，54 ，412，422稍微小。又，螺合部3 73的外徑尺寸是形成比 -49- 200830145 受熱區塊3 2 5所形成的螺絲孔3 2 5 2 1的内徑尺寸 在該螺合部3 73的外周形成有螺絲溝。 當如此的螺絲3 7螺合於受熱區塊3 2 5的螺 時，該螺絲37對螺絲孔3252 1的鎖緊力不會傳 架6、控制基板5及主框架4。而且，CPU5 1及 受熱區塊325C，325G的壓著是藉由板彈簧36的 生之冷卻單元32的牽引、及經由板狀體63，64 CPU51及GPU52往受熱區塊3 25的按壓來進行 可抑止螺絲37對受熱區塊3 25的安裝造成控制 彎曲等的變位。 圖29是表示藉由安裝於延出部411的挾持戶 挾持的受熱區塊3 2 5的立體圖。 如此，在控制基板5的CPU5 1及GPU52與 32的受熱區塊325C，325G壓著時，如圖29所 安裝於主框架4的開口 4 1，42的端緣的延出部 (在圖29中僅圖示延出部411)之一對的挾持片 持受熱區塊 325C，325G (在圖 29中僅圖示 325C)。因此，可在開口 41，42内位置受熱區| 325G，使該受熱區塊325C，325G適當地抵接於 ，42露出於冷卻單元32側的CPU51及GPU52。 挾持片4A是藉由熱傳導性的金屬所形成，因此 至受熱區塊325的熱更傳導至主框架4而放熱。 述般，經由受熱區塊325C，325G及挾持片4A 接 CPU51及 GPU52與主框架 4，因此可防_ 稍微小， I 孔 3 2 5 2 1 達至副框 GPU52 與 變形所產 而傳達之 。因此， 基板5的 r 4 a所被 冷卻單元 示，藉由 41 1，421 ‘ 4A來挾 受熱區塊 鬼 325C ， 從開口 4 1 又，由於 可將傳導 又，如前 來電性連 t EMI ( -50- 200830145At the four corners of the plate-like bodies 63, 64, the substantially cylindrical projections 63, 641 are provided so as to penetrate the plate-like bodies 63, 64, respectively, as shown in Fig. 21, and a part will be The side is protruded from the side (the surface facing the control substrate 5 side, the surface shown in FIG. 21). The projections 633, 641 are abutting on the opposite side of the surface on which the CPU 51 and the GPU 52 of the control board 5 are mounted, and are opposite to the positions on which the CPU 51 and the GPU 52 are disposed. The projections 63 1, 64 1 are formed of, for example, an insulating synthetic resin such as acetal resin, and when the sub-frame 6 covers the control substrate 5 , the current flowing through the control substrate 5 is prevented from passing through the plate-like body. 6 3 , 64 to conduct to the leaf spring 36. Further, by providing the projections 631, 641 at the four corners below the plate-like members 63, 64, the heat-receiving blocks 325C, 325G (Fig. 23) of the cooling unit 32 of the leaf spring 36 can be used for the CPU 51A. The pressing force will be equally transmitted to the CPU 51 A GPU 52 . -35- 200830145 On the edge of the back side of the sub-frame 6, as shown in Figs. 20 and 21, a plurality of rising portions 65 rising upward are formed. The rising portions 65 are formed at positions corresponding to the openings 445 to 44, 451 (Fig. 13) formed by the side portions 44, 45 of the main frame 4. Further, the rising portions 65 are inserted into the openings 445 to 447, 45 1, respectively, whereby the sub-frame 6 is mounted to the main frame 4. That is, the rising portion 65 is an engaging portion of the present invention corresponding to the sub-frame 6. At both ends in the longitudinal direction of the front surface side of the sub-frame 6, when the sub-frame 6 is attached to the main frame 4, the hole portion 66 (FIG. 13) which is provided in the main frame 4 is formed (the hole portion 66) The hole portion on the right side of the sub-frame 6 is 66R, and the hole portion on the left side is 66L). Further, a notch 67 similar to the notch 56 (Fig. 18) formed by the control substrate 5 is formed in the center of the end edge in the short side direction of the sub-frame 6 (the notch on the right side of the sub-frame 6 is 67R) The gap on the left side is 6 7 L ). These notches VII are used to position the control substrate 5 on the main frame 4, and when the sub-frame 6 is positioned in the main frame 4, the rising portion 47 formed in the main frame 4 is fitted. Thereby, the guide sub-frame 6 is positioned to the main frame 4. Further, a substantially rectangular opening 601 is formed at a position from the center of the sub-frame 6 at a position where the notch 67L is formed, and is inserted into the power pin 5 7 1 of the power connection terminal 57 of the control board 5 ( Figure 1 8). Further, on the front left side of the upper surface of the sub-frame 6, as shown in Fig. 20, a pedestal member 680 supporting the fixed card reader unit 35 (Fig. 9) is provided. The pedestal member 680 is composed of a left pedestal 6 8 配置 disposed on the left side and a right pedestal 862 disposed on the right side. The pedestal 6 8 1,6 8 2 is formed as -36- 200830145. The extending portion 6811, 6821 which is formed substantially parallel to the upper surface of the sub-frame 6 and which is formed substantially parallel to the upper surface and formed in the ratio extending portion 6 8 1 1, 6821 is further extended from the upper position of the sub-frame 6 by the portions 6812, 6822. The extensions 6811 and 6821 are support substrates 352, and the extensions 6812 and 6822 are supported by the card reader 351. Further, on the left side of the back surface of the upper surface of the sub-frame 6, a support portion 69 for supporting the power source unit 34 along the end edge of the back surface is provided. The support portion 69 is formed in a substantially rectangular shape in plan view, and both ends of the end edge along the longitudinal direction are vertically erected on the upper surface of the sub-frame 6, and the front end portions thereof extend substantially parallel to the upper surface. The power supply unit 3 4 (Fig. 9) is placed on the extension portion 691 which extends substantially in parallel, and the power supply unit 34 is fixed to the support portion 69 by a screw (not shown). (5) Configuration of Cooling Unit 3 2 Fig. 22 is a perspective view of the cooling unit 3 2 combined with the control unit 31 as seen from the lower side. Further, Fig. 23 is a perspective view of the cooling unit 32 as seen from above. As described above, the cooling unit 32 is integrally formed with the control unit 31 by the leaf spring 36, and in addition to cooling the control substrate 5 constituting the control unit 31, in the process of introducing the cooling air from the outside of the exterior casing 2, A cooling means for cooling the power supply unit 34 or the like located on the flow path of the cooling air. The cooling unit 32, as shown in Fig. 22, is arranged in such a manner as to cover the HDD mounting portion 49 of the main frame 4. The cooling unit 32 includes: -37-200830145 The air blowing unit 3 2 1 is provided with a radial blade member 3 2 1 1 on the rotating shaft, and includes a motor for rotating the rotating shaft and the blade member 3 2 1 1 ( The housing 322 is a housing 322 in which the components are housed. The air blowing unit 3 2 1 sucks the air outside the casing 3 2 2 from the air inlets 3 23 1 , 3244 which are formed in the casing 3 22 by the blade members 321 1 that rotate with the rotation of the motor, and the air blows from the casing 3 2 1 . The outlet 3 2 7, 3 2 8 spits out the air after the suction. The cooling air blown by the rotation of the motor and the blade member 3 2 1 1 is cooled by heat transmitted to the heat radiating fins 3245, 3246 via the heat receiving block 325 provided later in the casing 322. The frame 3 22 is formed into a substantially rectangular parallelepiped shape, and is formed of a metal such as aluminum in order to improve heat dissipation and strength. In the lower portion 3 23 of the casing 322, that is, the lower portion 3 23 opposed to the lower casing 22, as shown in Fig. 22, an intake port 3 23 1 having a substantially circular shape in plan view is formed. At this intake port 3 23 1, the cooling air introduced into the exterior of the exterior casing 2 via the intake port 2212 formed in the front portion 221 of the lower casing 22 is introduced. The upper surface portion 32 of the cooling unit 32, that is, the upper surface portion 324 opposed to the control unit 31, is formed by two plate members 324 1, 3242 as shown in FIG. The plate members 324 1, 3 242 are attached to the frame 3 22 by a plurality of upper and lower mounting members 3243. At the approximate center of the upper face portion 3 24, a suction port 3 244 having a substantially circular shape in plan view is formed so as to be able to span the two plate members 3 24 1, 3242. At the intake port 3244, the cooling air after the cooling device body 3 is introduced into the cooling unit 32 in accordance with the rotation of the blade member -38 - 200830145 3 2 1 1 of the air blowing portion 321. Inside the frame 322 are provided heat releasing fins 3245, 3246 which are respectively connected to the plate members 324 1, 3242 to dissipate the heat conducted to the plate members 324 1, 3 242. More specifically, the heat radiating fins 3246 are connected to the plate member 324 1 and the heat radiating fins 3 245 are connected to the plate member 3242. The heat radiating fins 3 24 5, 3 246 have a hierarchical structure in which a plurality of metal thin plates are formed and connected to each other. Further, in the heat releasing fins 3245, 3246, the air sucked into the casing 322 is blown by the rotation of the blade member 3211, and the radiating fins 3245, 3246 are cooled. Further, at this time, the cooling fins 3 245, 3 246 allow the cooling air to flow between the thin plates, so that the rectification of the cooling air can be achieved. In addition, the radiating fin 3245 and the radiating fin 3246 are separated and independently provided. Further, two heat receiving blocks 325 (3250, 325G) are provided on the upper surface portion 3 24. The heat receiving block 325 is a heat receiving portion corresponding to the present invention, and is a metal member having high thermal conductivity, and is formed in a shape corresponding to the opening 41, 42 formed in the main frame 4. In the center of the heat receiving block 3 2 5, a flat portion 3 2 5 1 having a substantially rectangular shape in plan view is formed, and a step portion 3 2 5 2 lower than the flat portion 3 2 5 1 is formed at both ends. The flat portion 3 2 5 1 is placed. In the step portion 3252 of the heat receiving block 3 25, a screw hole 3 252 1 is formed, and in the screw hole 32 5 2 1 , a hole portion 3 63 2 of a leaf spring 36 to be described later is inserted (FIG. 24). The screw portion 37 (Fig. 18) of the control substrate 5 and the hole portion 412, 422 of the main frame 4 are screwed together. Thereby, the cooling unit 32 is mounted to the control unit 31. That is, the screw hole -39- 200830145 3 2 5 2 1 is a locking portion corresponding to the screw 37 of the locking mounting member. In the heat receiving block 325, the heat receiving block 325C (the left side of Fig. 23) is disposed at a position covering a portion of the suction port 3 244 and corresponds to the position of the CPU 51 of the control board 5. Moreover, when the cooling unit 32 is mounted on the control unit 31, the flat portion 325 1 of the heated block 3 2 5 C abuts against the CPU 51, and the heat generated by the CPU 51 is transmitted in the heated block 325C, and the heated block is heated. 3 25G (the right side of FIG. 23) is disposed at a position covering each of the suction port 3244 and the plate member 3242, and corresponds to the position of the GPU 52 of the control substrate 5. Moreover, when the cooling unit 32 is mounted on the control unit 31, the flat portion 3 2 5 1 of the heated block 3 2 5 G abuts against the GPU 52, and the heat generated by the GPU 52 is conducted in the heated block 325 G. . The flat portions 3251 of the heat receiving blocks 325C and 325G face the CPU 51 and the GPU 52 and abut against the surfaces of the CPU 51 and the GPU 52, and are coated with a grease for reducing the thermal resistance. With the lubricating oil, the heat of the CPU 51 and the GPU 52 can be easily transferred to the heat receiving block 325. Alternatively, the heat conductive sheet can be attached instead of the lubricating oil, but in order to maintain the heated block 3 2 5 C, For each height of 3 25 G, it is best to use lubricating oil. Here, in the cooling unit 32, the heights of the heat receiving blocks 3 25 C, 3 25G are different. Specifically, the heat receiving block 3 2 5 C that is in contact with the CPU 51 is disposed at a position higher than the heat receiving block 3 2 5 G that is in contact with the GPU 52. This is because the outer casing of the CPU 51 is smaller than the GPU 52, so that the position of the heated block 3 25 C that the -40-200830145 abuts against the CPU 51 is higher than that of the heated block 325G. Thereby, the respective heat receiving blocks 325C, 325G can be pressed against the CPU 51 and the GPU 52 under substantially the same pressure. Further, as described above, in the plate members 3241, 3242 connecting the heat receiving blocks 325C, 325G, the plate member 3242 on which the heat receiving block 3 25 G is placed is configured to be movable up and down. Therefore, the height of the heated block 325G to the heated block 325C can be adjusted. Therefore, the heated blocks 325C, 325G can be reliably abutted to the CPU 51 and the GPU 52. A plurality of heat pipes 326 (326C, 326G) are disposed in the heated blocks 3 2 5 and are coupled to the heated block 325 and extend along the upper surface portion 324. Among them, three heat pipes 326C are connected to the heat receiving block 325C and the plate member 3241, and the heat transmitted to the CPU 51 of the heat receiving block 325C is absorbed to be conducted to the plate member 324 1 . Further, the two heat pipes 326G are connected to the heat receiving block 325G and the plate member 3242, and heat the GPU 52 conducted to the heat receiving block 3 25 G to absorb heat to be transmitted to the plate member 3242. Then, the heat transferred to the CPU 51 and the GPU 52 of the plate member 3 24 1, 3242 is respectively conducted to the heat radiating fins 3246, 3 245, which are carried out by the motor and the blade member 3 2 1 which constitute the blower portion 31 The cooling air flowing by the rotation of 1 is cooled. Between such a heated block 3 25 and the main frame 4, when the cooling unit 32 is mounted on the control unit 31, the clamping piece 4A (FIGS. 15 to 17) is attached to the main frame 4. The extended portion 41,421 formed by the end edges of the openings 41,42. Further, on the side of the heated block 3 25, the protruding portion 4A11 (Figs. 15 and 17) holding the -41 - 200830145 piece 4A abuts, and by the holding piece 4A, the heated block 325 is located at the opening 41, 42 Inside. In the four side faces other than the lower surface portion 323 and the upper surface portion 324 of the casing 322, as shown in Figs. 22 and 23, the two adjacent side surfaces are formed with discharge ports 327, 328, which are sucked to the frame. The air in the body 322 is spit out. Among the discharge ports 327 and 328, the discharge port 327 is an exhaust port 2 2 2 1, 2 2 2 2 formed by the side surface portion 2 2 2 of the lower casing 2 2, via which the exhaust port 222 1 is formed. 2222 to discharge the air that cools the radiating fin 3245. Around the discharge port 3 27, specifically, a sponge 327 1 is formed on the lower surface and the side surface of the frame body 3 22 forming the discharge port 3 27, and is abutted against the inner surface portion 226 of the lower frame body 22. Abutting portion 2265. The sponge 327 1 , the discharge port 3 27 and the exhaust port 2222 ( FIG. 1 ) formed in the lower casing 22 are connected, and the apparatus body 3 in the exterior casing 2 is cooled and discharged from the discharge port 3 27 . The cooling air is not leaked and is discharged from the exhaust ports 222 1, 2222. The discharge port 328 is connected to the exhaust port 2248 formed by the rear surface portion 224 of the lower casing 22, and is cooled by the exhaust port 2248. The air after the fins 3 246 is exhausted. Around the discharge port 3 28, specifically, the upper surface (the surface shown in Fig. 23) and the side surface of the frame 322 forming the discharge port 328 are provided with a sponge 3 2 8 1 . The spout 3328 and the sponge 2264 (FIG. 6) provided in the inner surface portion 226 of the lower casing 22, the discharge port 328 and the exhaust port 2248 formed in the rear surface portion 224 of the lower casing 22 (FIG. 3) When it is connected, the cooling air discharged from the discharge port 3 28 can be leaked from the exhaust port 2248 and discharged to the outside of the exterior casing 2 . Further, when the information processing device 1 is placed horizontally, the cooling unit 32 discharges the cooling air after cooling the inside to the side (surface 2A (Fig. 1) side) and the back side, and when it is vertically placed, it is discharged to the upper side. Back side. Further, a total of four positioning pins 329 projecting from the upper surface portion 324 in the out-of-plane direction are provided on the upper surface portion 32. Two of the positioning pins 329 are protruded from the vicinity of the discharge port 327 of the plate member 324 1 , and two of them are protruded from the vicinity of the discharge port 3 2 8 of the plate member 3 242. The positioning pins 329 are such that the upper surface portion 324 of the cooling unit 32 can face the lower surface of the main frame 4 of the control unit 31, and when the main frame 4 is positioned by the cooling unit 32, the main body 4 is inserted and formed in the main body. The pin of the frame 4 is entrance 40 1 . (6) Configuration of the leaf spring 36 Next, the configuration of the leaf spring 36 will be described. Fig. 24 is a perspective view of the leaf spring 36 as seen from above. 25 is a cross-sectional view showing the leaf spring 36. As described above, the two leaf springs 36 are members for mounting the cooling unit 32 in the control unit 31, and correspond to the elastic plate of the present invention. The leaf spring 36, as shown in Fig. 24, forms a substantially point-symmetrical planar view with a substantially oblong shape. Specifically, the leaf spring 36 has a shape corresponding to the openings 61, 62 of the sub-frame 6, and is fitted to the openings 61, 62 of the sub-frame 6, respectively. In the approximate center of the leaf spring 36, as shown in Figs. 24 and 25, an elongated flat portion 361 is formed, and a protruding portion 3 6 1 1 ' is formed in the center of the flat portion 361. It protrudes from the side of the sub-frame 6 and abuts on the upper surface of the plate-like bodies 63, 64 of the sub-frame 6 of the -43-200830145. Further, the plate spring 36 is formed with a pair of inclined portions 3 62 which are inclined upward so as to be able to sandwich the flat portion 361. Further, a flat portion 3 63 which is substantially parallel to the flat portion 36 is formed so as to be able to sandwich the pair of inclined portions 326. In each of the flat portions 3 6 3 , two hole portions 3 6 3 1, 3 6 3 2 are formed, respectively, and the hole portion 3 63 1 in which the hole portion 3 632 is formed on the inner side is the plate spring 36 6 When connected to the plate-like bodies 63 and 64, they are provided at positions corresponding to the projections 6 3 1, 6 4 1 exposed on the upper surface side of the plate-like bodies 63, 64. Further, the hole portion 633 formed at both ends of the leaf spring 36 is a screw 3 3 5 2 1 (Fig. 23) screw 3 7 which is screwed to the heat receiving block 3 2 5 of the cooling unit 32. (Figure 1 2) will pass. Then, a screw 37 is inserted into the hole portions 3 632, and once the screw 3 7 is screwed to the screw hole 3 2 5 2 1 of the cooling unit 32, the flat portions 3 6 3 of the leaf spring 36 are pressed. Lower on the lower side (the side of the sub-frame 6). Here, in the flat portion 363, the inclined portions 362 located on the inner side of the flat portion 363 are inclined, respectively, so that the flat portions 36 of the pair of inclined portions 3 62 are sandwiched. 1 is pressed below. At this time, the protruding portion 361 1 formed on the lower side of the flat portion 361 contacts the plate-like members 63 and 64 of the sub-frame 6, and the plate-like members 63 and 64 apply a load at one point. The CPU 51 and the GPU 52 of the control board 5 are pressed against the heat receiving blocks 325C, 325G of the cooling unit 32 via the plate-like bodies 63, 64 of the sub-frame 6, respectively, by the load applied by the leaf springs 36, and the cooling unit 32. Will be pulled to the direction of the control -44- 200830145 unit 3 1 . Therefore, the CPU 51 and the GPU 52 can be reliably pressed against the heat receiving blocks 325C and 325G, and the heat transfer efficiency from the CPU 51 and the GPU 52 to the heat receiving blocks 325C and 325G can be improved. (7) Manufacturing Process of Information Processing Apparatus 1 Here, a manufacturing process of the information processing apparatus 1 according to the present embodiment will be described. FIG. 26 is a flowchart showing a manufacturing process of the information processing device 1. As shown in FIG. 26, the information processing device 1 is a cooling unit positioning project S01, a control substrate positioning project S02, a sub-frame positioning project S03, a cooling unit mounting project S04, a unit reversing project S05, and a lower frame covering project S06. The lower frame reversing project S07, the disc unit mounting project S08, the power supply unit mounting project S09, the substrate mounting project S10, the card reader mounting project S11, the upper frame mounting project S12, and the casing mounting project S 1 3 are manufactured. Hereinafter, the respective items S 0 1 to S 1 3 will be specifically described. The cooling unit positioning project S0 1 is a cooling means positioning project corresponding to the present invention, and in the project S01, the cooling unit 32 is positioned in the main frame 4 of the control unit 31. In this process S 0 1 , the positioning unit 329 protruding from the upper surface portion 324 of the cooling unit 32 can be inserted into the pin inlet 4 0 1 formed by the main frame 4, and the cooling unit 32 can be positioned. In the main frame 4. The control substrate positioning project S 02 is a substrate positioning project corresponding to the present invention, and in the project S02, the control substrate 5 is positioned for the main frame 4 positioned on the cooling unit 32. In addition, in each of the openings 441 to 444 (FIG. 13) formed on the side 44 of the main frame 4 as the abutting portion, each terminal 59 as an engaging portion provided on the back side of the control substrate is inserted (FIG. 13) 1 9), the end portion = the engagement portion with the openings 441 to 444 as an axis, so that the main frame 4 can be rotated by the substrate 5, and the control substrate 5 is placed on the main frame at this time to control the substrate 5 The notch 5 6R, 5 6L (Fig. 18) can be in the inner portion of the rising portions 47R, 47L (Fig. 13) formed by the main frame 4, and the hole portion 5 5 R, 5 5 L of the control substrate 5 (Fig. 1 8) The substrate 4 can be positioned on the main frame 4 in such a manner that the pins 4 6 R, 4 6 L (Fig. 13) of the main frame 4 are opened. At this time, the control substrate 5 and the main frame are in contact with each other at the edge of the recess 40, i.e., the end edge of the main frame 4, and the edge of the frame 4 is aligned with the edge of the control substrate 5. Thereby, the CPU 51 and the GPU 52 mounted on the control board 5 are not inserted into the openings 41, 42 of the main frame 4, and the CPU 51 and the GPU 52 are directed to the heated block of the cooling unit 32 located below the main frame 4, 32 5 G. Therefore, the position at which the control substrate 5 is positioned can be directed to the main frame 4. The sub-frame positioning project S 03 is a second frame project corresponding to the present invention, and in the project S03, the sub-frame 6 is positioned with respect to the frame 4 on which the control board 5 is placed. At this time, the opening 4 4 5 to 4 4 7 (FIG. 13) formed on the side surface portion 44 of the abutting portion of the main frame 4, and the opening 4 5 1 of the side surface portion 45 formed as the abutting portion ( FIG. 1 is a rising portion of the end portion of the rear side of the sub-frame 6 as an engaging portion, and the rising portion 65 and the opening portion 445 to 447, 451 of the card portion 5 f 59 Control 4 〇 configuration side is enough to be controlled by the frame 4, the main meeting will be 3 2 5 C in the appropriate positioning main frame as the formation (the joint part -46- 200830145 bit as the axis to cover the main frame 4 The frame 6 is rotated and disposed so as to control the substrate 5. At this time, similarly to the case of the control board 5, the notches 67R, 67L (FIG. 20) formed in the sub-frames can be disposed in the vertical frame 7 7R, 47L of the main frame 4. In the inner side of (Fig. 13), the hole portion 6 6 R, 6 6 L (Fig. 20) formed in the sub-frame can be provided in the pin of the main frame 4, and 4 6 L (Fig. 13) In this manner, the sub-frame 6 is positioned at the main frame. At this time, the sub-frame 6 and the control substrate 5 are in contact with each other at the edge of the recess 60, that is, the end edge of the sub-frame 6, and the end frame 6 of the main frame 4 The edge edges are aligned. Thereby, the plate-like bodies 63, 64 are positioned at positions corresponding to the control substrate CPU 51 and the GPU 52, and the sub-frame 6 can be positioned at an appropriate position for the control substrate 5 and the main frame. Then, the fixing member 31 is assembled by screwing so as to be able to insert the hole portions (not shown) formed in the main frame 4 and the sub-frame 6. Fig. 27 shows the components constituting the control unit 31. 4 to 6 and a cross-sectional view of the unit 32. Fig. 28 is a cross-sectional view of the control unit 31 and the cooling unit 32 in a state in which the unit 31 is not mounted in the control unit 31. In addition, Fig. 28 is a CPU 51 corresponding to the control board 5. In the positional view, the components of the GPU 52 having the same configuration are given to the bracket cooling unit mounting work S04, which is a cooling hand-held project corresponding to the present invention. In the project S 04, the leaf spring 36 and the cooling 3 2 are used. 'Encapsulation of the control unit 3 1, the unit is mounted on the control unit 31, and the sub-frame 6 is mounted on the outer frame of the sub-frame 6 46R frame 4 and the sub-frame 5 -47- 200830145 Unit 32. Specifically, in engineering In S〇4, first, the control unit 31 positioned as described above is aligned with the opening 6 i formed by the sub-frame 6 of the control unit 31 as shown in Figs. 27 and 28, respectively. The leaf spring 36. At this time, the protruding portion 3 6 1 1 of the flat portion 316 formed by the central plate 36 is abutted against the center of the plug opening 6 1 '62. (only the plate-like body 63 is shown in Fig. 28), and the leaf springs 3 are arranged such that the direction of the frame 6 can be formed in the extending direction of the inclined portion 3 62 extending from both ends of the flat. 6. Thereafter, the screw 3 7 is inserted into the hole portion 3 6 3 2 ( FIG. 27 ) formed by the flat portion of the leaf spring 36, the opening 61 of the sub-frame 6, the hole portion 5 4 formed by the substrate 5, and The hole portion of the main frame 4. Then, the screw 3 7 is screwed to the screw hole 3 2 5 2 1 formed by the heat E, 3 2 5 G of the cooling unit 3 2 , and the leaf spring 3 6 is supplied to the cooling unit 3 2 . At this time, by screwing the screw holes 3 2 5 2 1 , the inclined portion 3 6 2 and the flat portion 3 6 3 of the leaf spring 36 are bent over the control substrate 5, whereby the flat portion 3 6 3 The protruding portion 361 1 of the cannula 361 that is biased by the screw 3 7 cooling unit 3 2 to the side of the control unit 3 1 is pressed against the cooling unit 32 by the CPU 51 and the GPU 52 of the plate 5 via the plate-like bodies 63, 64. 25C, 325 G. Here, the leaf spring 36 and the plate-like bodies 63, 64 are abutted at a point of the protruding portion 3 6 1 1 formed by the flat portion 361 of the j-j, and are mutually mutually capable of being able to The middle can resist 63, 64, and the 3 3 1 leaves the sub-frame 3 63 shape 62, control 412, 422 [block 325C is screwed to the ί 3 7 screw to close to enable simultaneous control of the base The heated block has a spring 36, and the leaf spring-48-200830145 36 is fixed to the plate-like bodies 63, 64 by the projections 361 1 so as to be capable of applying a load of 10 kg. Therefore, the load of 10 kg applied to the plate-like bodies 63, 64 is equally applied to the control substrate 5 ° by the projections 6 3 1, 6 4 1 provided at the four corners of the plate-like body 63, and The plate-like body 63'64 is formed in substantially the same size as the CPU 51 and the GPU 52 of the control board 5, and is disposed at a position corresponding to the CPU 51 and the GPU 52. Therefore, the load applied from the projections 631, 641 provided at the four corners of the plate-like members 63, 64 is such that the four corners of the CPU 51 and the GPU 52 are equally pressed against the heat receiving blocks 325C, 325G, respectively. Therefore, it is possible to prevent the CPU 51 and the GPU 52 from being inserted into the displacement of the terminals of the sockets 5 1 1 , 5 2 1 provided on the control board 5, and the CPU 51 and the GPU 52 can be reliably and appropriately pressed against the heat. Block 325C, 325G. Here, the screw 3 7 will be described. As shown in Fig. 27, the screw 3 7 is a mounting member corresponding to the present invention, and is formed to be thin at the distal end side in the insertion direction and thick at the proximal end side in the plunging direction. More specifically, the screw 3 7 is formed with a screw head 317 having a substantially circular shape in plan view, a cylindrical portion 3 72 protruding outward from the screw head 317, and more The front end portion of the cylindrical portion 3 72 protrudes from the substantially cylindrical screw portion 3 73 which is smaller than the outer diameter of the cylindrical portion 3 72. Wherein, the outer diameter of the screw head 371 is larger than the inner diameter of the hole portion 633 2 of the leaf spring 36, and the outer diameter of the cylindrical portion 372 is larger than the leaf spring 36, the control substrate 5, and the main Each of the hole portions 3 63 2 , 54 , 412 , 422 formed by the frame 4 is slightly small. Further, the outer diameter of the screw portion 3 73 is an inner diameter dimension of the screw hole 3 2 5 2 1 formed by the heat-receiving block 3 25, and a screw is formed on the outer circumference of the screw portion 73. ditch. When such a screw 3 7 is screwed to the screw of the heated block 3 2 5, the locking force of the screw 37 against the screw hole 3252 1 does not propagate to the carriage 6, the control substrate 5, and the main frame 4. Further, the pressing of the CPU 51 and the heated blocks 325C and 325G is performed by the pulling of the raw cooling unit 32 of the leaf spring 36 and the pressing of the plate 63, the CPU 51 and the GPU 52 to the heated block 35. It is possible to suppress the displacement of the screw 37 by controlling the bending or the like of the mounting of the heated block 35. Fig. 29 is a perspective view showing the heat receiving block 3 25 held by the holder attached to the extension portion 411. Thus, when the CPU 51 of the control board 5 and the heat receiving blocks 325C, 325G of the GPUs 52 and 32 are pressed, as shown in Fig. 29, the extension of the end edge of the opening 41, 42 of the main frame 4 is attached (in Fig. 29). Only the one of the extension portions 411) is shown to hold the heat receiving blocks 325C, 325G (only 325C is illustrated in Fig. 29). Therefore, the heat receiving zone 325C, 325G can be appropriately abutted in the openings 41, 42 to expose the CPU 51 and the GPU 52 on the side of the cooling unit 32. The holding piece 4A is formed by a thermally conductive metal, so that heat to the heated block 325 is further transmitted to the main frame 4 to radiate heat. As described above, the heating block 325C, 325G and the holding piece 4A are connected to the CPU 51 and the GPU 52 and the main frame 4, so that the _ is slightly smaller, and the I hole 3 2 5 2 1 is conveyed by the sub-frame GPU 52 and the deformation. Therefore, the r 4 a of the substrate 5 is shown by the cooling unit, and by the 41 1,421 ' 4A, the heated block ghost 325C, from the opening 4 1 again, because of the conduction, the former caller is connected to t EMI ( -50- 200830145
Electro Magnetic Interference、電磁干渉）。 藉此，可一體構成控制單元31及冷卻單元3 2，可將 該等單元31，32成爲1個單元。而且，藉由如此的構成 ，可使冷卻單元3 2的受熱區塊3 2 5壓著於控制基板5的 CPU51及GPU52，且可經由板狀體63，64來將CPU51及 GPU52按壓於受熱區塊3 25 C，3 2 5 G。因此，可將CPU51 及GPU5 2所產生的熱迅速地傳導至受熱區塊325C，325G 。然後，被傳導至該等受熱區塊325C，325G的熱可藉由 熱管326C，326G (圖23)經由板構件3241，3242(在圖 27中僅圖示板構件324 1 )來傳導至放熱鰭3 246，3 245。 在該等放熱鰭3 245，3246，隨著構成送風部321的馬達及 葉片構件3 2 1 1的旋轉來將冷卻空氣予以送風，藉由該冷 卻空氣，被傳導至放熱鰭3246，3245之CPU51及GPU52 的熱會被冷卻。 回到圖26，單元反轉工程S05是相當於本發明的第1 框架反轉程序，使在工程S04被一體化的控制單元3 1及 冷卻單元3 2反轉。 具體而言，在工程S05中，是以主框架4的下面（圖 14)及冷卻單元32的下面部323 (圖22)能夠朝向上方 的方式，亦即能夠形成圖2 2的狀態之方式，使藉由板彈 簧3 6及螺絲3 7而一體化的控制單元3 1及冷卻單元3 2反 轉。在此狀態下，設於主框架4的銷4 8 ( 4 8 R，4 8 L )會 形成朝向上方。 圖30是表示以下部框體22來覆蓋被反轉的控制單元 -51 - 200830145 31及冷卻單元32的工程。另外，在圖30中，控制單元 3 1是僅圖示主框架4，省略了控制基板5及副框架6的圖 不 ° 下部框體被覆工程S06是相當於本發明的第1框體被 覆程序，在該工程S06中，如圖30所示，以能夠覆蓋在 工程S05被反轉的控制單元31及冷卻單元32之方式，將 該等控制單元3〗及冷卻單元32定位於下部框體22。 具體而言，突設於控制單元3 1的主框架4的銷4 8 R ，48L會分別嵌合於下部框體22所形成的嵌合穴226 1， 2 2 62 (圖6 )，而使該控制單元31及冷卻單元32定位於 下部框體22。此時，如前述般，因爲嵌合穴226 1具有長 圓形狀，所以即使主框架4的各銷4 8 R，4 8 L與嵌合穴 226 1，2262的位置稍微偏離，照樣該銷48R，48L可分別 嵌合於嵌合穴2261，2262。 如此的單元反轉工程S05及下部框體被覆工程S06是 相當於本發明的第1框架定位工程。 然後，如圖26所示，在下部框體反轉工程S07中， 以該下部框體22的開口 22A能夠開口於上方，控制單元 3 1的副框架6能夠位於上方的方式，來使内部定位有控制 單元31及冷卻單元32的下部框體22反轉。 在碟片單元安裝工程S08中，是將碟片單元33(圖7 〜圖9 )載置於副框架6上，且藉由螺絲等來將該碟片單 元3 3安裝於副框架6。 在電源單元安裝工程S09中，是將電源單元34 (圖7 -52- 200830145 〜圖9 )載置於副框架6上，且藉由螺絲等來將該電源單 元3 4安裝於副框架6。此時，設於控制基板5，且經由副 框架6的開口 601來朝上方突出的電源連接端子57的電 源銷571 (圖18)會被插入電源單元34的下面所形成的 銷揷入口（圖示省略），而使該電源單元3 4對副框架6 定位。然後，藉由螺絲等來將電源單元3 4安裝於副框架6 所設置的支持部6 9 (圖2 0 )。 在基板安裝工程S 1 0中，是藉由螺絲等來將構成讀卡 機單元3 5的基板3 5 2 (圖7〜圖9 )安裝於副框架6的上 面所設置的台座681，682的延出部6811，6821 (圖20) 〇 在讀卡機安裝工程S 1 1中，是藉由螺絲等來將構成讀 卡機單元3 5的讀卡機3 5 1 (圖7〜圖9 )安裝於上部框體 2 1的内面，且對應於卡槽部2 1 1 3的開口 2 1 1 3 1 (圖2 )之 位置。此讀卡機3 5 1是在後述的上部框體安裝工程S 1 2中 ，藉由插通上部框體2 1所形成的螺絲孔之螺絲來固定於 副框架6所設置的台座6 8 1，6 8 2的延出部6 8 1 2，6 8 2 2 ( 圖 20 )。 另外，該等各工程S 0 8〜S 1 1的順序亦可適當變更。 圖31是表示裝置本體3及下部框體22、及安裝於該 下部框體22時的上部框體21的立體圖。 上部框體安裝工程S 1 2是相當於本發明的第2框體安 裝工程，在該工程S12中，是對下部框體22安裝上部框 體21。 -53- 200830145 此時，首先，使上部框體21的正面部21 1的端緣抵 接於下部框體22的正面部221的端緣，而使卡合成互相 垂直。然後，如圖3 1所示，以該抵接部位爲軸，使轉動 成上部框體2 1接近下部框體22，而來組合上部框體2 1與 下部框體22。藉此，下部框體22的開口 22A會藉由上部 框體2 1來閉塞，構成裝置本體3的碟片單元3 3、電源單 元34及讀卡機單元35的基板352會被上部框體21所覆 蓋。另外，在上部框體2 1往下部框體22安裝時，是使從 上部框體2 1所安裝的讀卡機3 5 1延伸出的信號線連接至 下部框體22内所収納的基板3 52。 如此與下部框體22組合的上部框體2 1會藉由插通該 上部框體2 1的上面部2 1 2所形成的螺絲揷入口 2 1 23之螺 絲來固定於下部框體22。 在罩殻安裝工程S 1 3中，是使形成於上部框體2 1的 上面部212的卡合部2122(圖4)與罩殻24(圖3)的卡 止部（圖示省略）卡合，使該罩殻24沿著溝部21 21來滑 動於上面部212上。藉此，卡合部2122與卡止部會互相 卡止動作，罩殼24會被安裝於上部框體21，形成於上面 部2 1 2的溝部2 1 2 1、卡合部2 1 22及螺絲揷入口 2 1 23不會 露出。 經由以上的工程S 0 1〜S 1 3來製造資訊處理裝置1。 (8 )本實施形態的效果 若利用以上本實施形態的資訊處理裝置1，則可發揮 -54- 200830145 以下的效果。 亦即，在資訊處理裝置1的製造工程中，是在控制基 板定位工程S02，以形成於控制基板5的孔部55能夠揷 通主框架4所設置的銷46之方式，將該控制基板5定位 於主框架4，在副框架定位工程S03，以形成於副框架6 的孔部66能夠揷通該銷46之方式，將副框架6定位於主 框架4。然後，在下部框體被覆工程S06，使設置於主框 架4，且突出於和銷4 6呈相反的方向的銷4 8嵌合於下部 框體22的嵌合穴2261，2262，而將主框架4定位於下部 框體22内，在上部框體安裝工程S12，將上部框體21安 裝於下部框體22。 藉此，由於控制基板5及副框架6是分別定位於主框 架4，因此可防止在該等主框架4及副框架6與控制基板 5之間產生位移。 又，由於定位該等控制基板5及副框架6的主框架4 是在設於該主框架4的銷48嵌合於下部框體22的嵌合穴 226 1，2262之下定位於下部框體22，因此可在外裝框體2 内的適當位置定位主框架4、控制基板5及副框架6。所 以，不僅可防止各個構件4〜6的位移，且可防止各構件4 〜6互相干擾。 並且，在主框架4的背面側的端部形成具有開口 44 1 〜447，451的側面部44，45，前述的銷46是被突設於主 框架4的正面側的兩端部。然後，在控制基板定位工程 S 02，是將設於控制基板5的端子59插入開口 441〜444 -55- 200830145 ’以該端子59和開口 441，444的卡合部位作爲軸來使控 制基板5轉動，用該控制基板5覆蓋主框架4，且使銷4 6 插通於孔部5 5 ’而將控制基板5定位於主框架4。而且， 在副框架定位工程S03，同樣在開口 445〜447，451中插 入立起部65，以該立起部65和側面部44，45的卡合部位 作爲軸來使副框架6轉動，用該副框架6覆蓋控制基板5 ’且使銷4 6插通於孔部6 6，而將副框架6定位於主框架 4 ° 藉由，由於控制基板5及副框架6是以背面側的側面 部4 4，4 5及正面側的銷4 6來定位於主框架4，因此可確 實防止該等主框架4上的控制基板5及副框架6的位移。 並且，在主框架4中，藉由分別設於相反側的側面部 44，45及銷46來定位的控制基板5及副框架6是在分別 以和側面部44，45的卡合部位作爲軸來使轉動下定位於 主框架4上。 藉此，使和主框架4大略平行來將控制基板5及副框 架6載置於該主框架4上時相較之下，可簡易進行定位工 程。更，因爲可確實地進行側面部44，4 5與控制基板5 及副框架6的卡合，所以可更確實地防止該控制基板5及 副框架6對主框架4的位移。 因此，除了可使控制基板5及副框架6的定位工程簡 略化以外，還可更確實地防止該等的位移。 並且，在主框架4的長邊方向的兩端，於短邊方向的 大略中央分別形成有立起部4 7，在控制基板5及副框架6 -56 - 200830145 中，對應於該立起部47的位置形成有缺口 56，67。 藉此，由於可利用立起部47來引導控制基板5 框架6的轉動，因此可簡易地進行該控制基板5及副 6的定位。並且，在將控制基板5及副框架6載置於 架4時，在形成缺口 56，67的部份，藉由各立起部 4 7 R，4 7 L )來挾持控制基板5及副框架6，因此可確 防止主框架4上的控制基板5及副框架6往長邊方向 移。 因此，除了可簡易進行控制基板5及副框架6的 工程S02，S 03以外，還可更確實地防止該等的位移。 並且，設於主框架4的銷46 ( 46R，46L)是分 於該主框架4的正面側的左右兩端（長邊方向的兩端： 藉此，由於可使控制基板5及副框架6對主框架 定位處增多，因此可更確實防止該控制基板5及副框 的位移。 並且，在將控制單元3 1及冷卻單元3 2收納於下 體22内時，是在單元反轉工程S05，以設於主框架 銷4 8的突出方向能夠朝向上方的方式來使控制單元3 冷卻單元32反轉。然後，在下部框體被覆工程S06 下部框體22來被覆控制單元31及冷卻單元32，而 48嵌合於嵌合穴226 1，2262。 藉此，由於在定位下部框體2 2、控制單元3 1及 單元3 2時，可使下部框體22比該控制單元3 1及冷 元32更輕易移動，因此可容易進行定位。 及副 框架 主框 47 ( 定地 的位 定位 別設 丨0 4的 架6 部框 4的 1及 ，以 使銷 冷卻 卻單 -57- 200830145 在此，當控制單元3 1及冷卻單元3 2被収納於下部框 體22内時，因爲該控制單元3 1及冷卻單元3 2與下部框 體22之間只有些微的間隙，所以若利用治具等從上方來 將控制單元31及冷卻單元32定位於下部框體22内，則 難以拔出該治具。 相對的，以能用下部框體22來覆蓋的方式，定位控 制單元3 1及冷卻單元3 2與下部框體22，因此治具可一面 把持下部框體22的外側，一面以往上方突出的銷48能夠 嵌合於嵌合穴226 1，2262的方式來使該下部框體22移動 ，藉此定位控制單元31及冷卻單元32與下部框體22。因 此，可更簡易地進行下部框體22與控制單元3 1及冷卻單 元3 2的定位工程。 並且，在資訊處理裝置1設有冷卻單元3 2，其係抵接 於構成控制單元3 1的控制基板5的C P U 5 1及GP U 5 2，傳 導在該CPU51及CPU52所產生的熱。此冷卻單元32是具 備：抵接於CPU51及 GPU52的受熱區塊325(325C， 3 25 G )、及經由受熱區塊3 2 5來傳導CPU51及GPU52的 熱之放熱鰭3 245，3246、及對該放熱鰭3245，3246送出 冷卻空氣，而來冷卻傳導至放熱鰭3245，3246的熱之送 風部321。藉此，可有效率地冷卻在CPU51及GPU52所 產生的熱。因此，可使CPU51及GPU52安定地驅動。 更在對向於冷卻單元32的控制單元31之上面部324 設有突出於面外方向的複數個定位銷3 2 9，在控制單元3 1 的主框架4形成有插通該定位銷3 29的銷揷入口 401。 -58- 200830145 藉此，可容易且適當地進行冷卻單元定位工程SOI之 主框架4與冷卻單元32的定位。因此，除了可謀求工程 S 0 1的簡略化以外，還可防止主框架4與冷卻單元3 2的 位移。 並且’控制單元31是藉由冷卻單元32及板彈簧36( 藉由螺絲3 7來安裝於該冷卻單元3 2 )所挾持，利用該板 彈簧3 6的彈壓力來將冷卻單元3 2牽引至控制單元3 1側 的同時，將控制基板5的CPU5 1及GPU52按壓於冷卻單 元32的受熱區塊325。 藉此，可使CPU5 1及GPU52往受熱區塊3 25的熱傳 導效率提升。因此，可更有效率地冷卻CPU51及GPU52 〇 更在往控制單元3 1安裝冷卻單元3 2時，螺絲3 7的 螺絲頭3 7 1會與板彈簧3 6卡合，且突出方向前端部的螺 合部3 73會螺合於冷卻單元32所形成的螺絲孔3 25 2 1。相 對的，位於中間的圓筒部3 72是僅插通副框架6的開口 6 1 ，62、控制基板5及主框架4的各孔部54，412，422，該 圓筒部3 72不會將力量作用於該等副框架6、控制基板5 及主框架4。 藉此，螺絲3 7往螺絲孔3 2 5 2 1的鎖緊力不會被傳達 至控制單兀3 1，因此，可抑止冷卻單元3 2藉由螺絲等來 直接安裝於控制單元3 1時所產生的彎曲等的變位發生於 控制單元3 1。 因此，可在不使變位產生於控制單元3 1下，使該控 -59- 200830145 制單元31及冷卻單元32 —體化，可容易進行該等的處理 。並且，藉此，可簡易進行前述的單元反轉工程S05。 並且，在控制單元31中，在主框架4及副框架6形 成有凹部40，60，其係沒入於與對向於控制基板5的側呈 相反的側，控制基板5是配置於藉由該凹部40，60所形 成的空間内。 藉此，可將主框架4及副框架6形成覆蓋控制基板5 時所必要的最小限度的尺寸。因此，可謀求所被形成之控 制單元3 1的薄型化及小型化。 又，控制基板5是在凹部40，60的端緣、亦即主框 架4及副框架6的端緣與該主框架4及副框架6抵接。 藉此，除了可用主框架4及副框架6來確實地覆蓋控 制基板5以外，還可使產生於該控制基板5的不要輻射雜 訊確實地導通至主框架4及副框架6。因此，可確實地防 止資訊處理裝置1的EMI。 (9 )實施形態的變形 用以實施本發明的最佳構成等，雖是揭示於以上的記 載，但本發明並非限於此。亦即，限定以上所揭示的形狀 、材質等的記載，是爲了容易理解本發明而示的記載，並 非限定本發明者。 在上述實施形態中，是在主框架4突設銷4 6，在控制 基板5及副框架6形成有插通該銷4 6的孔部5 5，6 6，但 本發明並非限於此。例如，亦可將突出於接近控制基板5 -60 - 200830145 的方向之銷設於副框架6，插通該銷的孔部爲形成於控制 基板5及主框架4。另外，只要在構成控制單元31之下， 位於下方，在位於接近冷卻單元3 2側的主框架4突設銷 46 ’便可容易對該主框架4進行位於上方的控制基板5及 副框架6對主框架4的定位。又，同樣，亦可容易進行冷 卻單元3 2對主框架4的定位。 在上述實施形態中，是在形成於主框架4的側面部44 之開口 441〜444插通控制基板5的端子59，以該端子59 與開口 4 4 1〜4 4 4的卡合部位作爲軸來使控制基板5轉動 ，而將該控制基板5定位於主框架4，但本發明並非限於 此。並且，將形成於副框架6的立起部65插入形成於側 面部44，45的開口 445〜447，451，以該立起部65作爲 軸來使副框架6轉動，而將該副框架6定位於主框架4， 但本發明並非限於此。亦即，亦可使對主框架4平行移動 ，以能夠覆蓋該主框架4的方式來定位控制基板5及副框 架6 〇 在上述實施形態中，是在與從形成有抵接控制基板5 及副框架6的側面部44，45的背面側往形成有銷46的正 面側的方向正交的方向（上述實施形態中爲主框架4的長 邊方向）的兩端的大略中央（上述實施形態中爲主框架4 的短邊方向的大略中央）形成有立起部47，在控制基板5 及副框架6中對應於主框架4的立起部4 7的位置形成有 缺口 5 6，6 7，但本發明並非限於此。亦即，立起部4 7及 缺口 56，67的位置亦可適當設定。另外，藉由立起部47 -61 - 200830145 形成於主框架4的端緣、特別是與形成有側面部44，45 的一邊相異的另一端緣，可不形成貫通控制基板5的缺口 ，因此可使該控制基板5的設計自由度提升。 在上述實施形態中，是在定位控制單元3 1及冷卻單 元32與下部框體22時，在單元反轉工程S05，使控制單 元31及冷卻單元32反轉之後，在下部框體被覆工程S0 6 ，以銷48能夠嵌合於嵌合穴226 1，2262的方式，以下部 框體22來被覆控制單元3 1及冷卻單元32，但本發明並非 限於此。例如，若是可藉由治具等來支持一體化的控制單 元31及冷卻單元32，亦可不使反轉在該單元31，32定位 下部框體22。 在上述實施形態中，插通控制基板5及副框架6的銷 46是從主框架4的上面突出至面外方向，嵌合於下部框體 22的嵌合穴2261，2262之銷48是從主框架4的下面突出 至面外方向，但本發明並非限於此。例如，該等銷46，48 的突出方向亦可爲相同。此情況，只要將嵌合銷4 8的嵌 合穴形成於上部框體2 1，在該上部框體2 1安裝下部框體 2 2即可。並且，此情況，銷4 6亦可嵌合於上部框體2 1所 形成的肷合八。藉此’銷48可省略。又，銷46，48亦可 爲一體的構件。 在上述實施形態中，是在冷卻單元32的上面部324 突設定位銷3 2 9，在主框架4形成插通該定位銷3 2 9的銷 插入口 4 01 ’但本發明並非限於此。亦即，亦可在主框架 4的下面（對向於冷卻單元3 2的面）設置銷，在冷卻單元 -62- 200830145 3 2形成插入該銷的孔部。另外，若在冷卻單元3 2形成 入銷的孔部，則因爲銷的揷入，有可能了阻礙設於冷卻 元3 2内部的馬達及葉片構件3 2 1 1的旋轉。相對的，藉 在冷卻單元3 2側設置銷，可排除如此的可能性。 在上述實施形態中，控制單元3 1是由冷卻單元3 2 板彈簧3 6所挾持，但本發明並非限於此。例如，亦可 由螺絲等來將冷卻單元3 2直接固定於控制單元3 1。如 的情況，雖會因冷卻單元3 2的重量等，有可能在控制 元3 1發生彎曲等的變位，但藉由板彈簧3 6及冷卻單元 來挾持控制單元3 1，除了可抑止該變位的發生以外，還 使安裝於控制基板5的CPU51及GPU52適當地壓著於 卻單元32的受熱區塊3 25。 在上述實施形態中，控制基板5是分別抵接於主框 4及副框架6的端緣，但本發明並非限於此。例如，亦 在藉由主框架4及副框架6的各凹部40，60所形成的 間内收納控制基板5全體。 在上述實施形態中，電子機器是構成可再生從光碟 記憶卡所取得的資訊、及經由網路所取得的資訊中含的 像資訊及音聲資訊，且構成可執行該資訊中所含的程式 資訊處理裝置1爲例，但本發明並非限於此。例如，亦 適用於光碟再生裝置等，具有該等機能的其中至少之一 電子機器、或具有其他機能的電子機器。又，電子機器 例如可爲印表機等的印刷裝置、或圖像顯示裝置等。亦 ’只要是具備：具有電路基板及挾持該電路基板的一對 插 單 由 及 藉 此 單 32 可 冷 架 可 空 或 圖 之 可 的 ， 即 框 -63- 200830145 架構件的裝置本體、及於組合下收納裝置本體的2個框體 之電子機器，便可適用本發明。 〔產業上的利用可能性〕 本發明可作爲電子機器的製造方法利用，特別是可適 合利用於具備裝置本體（具有藉由一對的框架來挾持電路 基板的構成）之電子機器。 【圖式簡單說明】 圖1是由正面側來看本發明的一實施形態的資訊處理 裝置的立體圖。 圖2是由正面側來看圖1中開放蓋構件後的資訊處理 裝置的立體圖。 圖3是由背面側來看移開上述實施形態的罩殼後的狀 態之資訊處理裝置的立體圖。 圖4是由正面側來看移開上述實施形態的罩殼後的狀 態之資訊處理裝置的立體圖。 圖5是由下方來看上述實施形態的資訊處理裝置的立 體圖。 圖6是表示上述實施形態的下部框體的内面部的平面 圖。 圖7是由正面側來看圖1中移開上部框體後的狀態之 資訊處理裝置的立體圖。 圖8是由正面側來看上述實施形態的裝置本體的立體 -64- 200830145 圖。 圖9是表示上述實施形態的裝置本體的分解立體圖。 圖1 〇是由上方來看上述實施形態的控制單元的立體 圖。 圖11是由下方來看上述實施形態的控制單元的立體 圖。 圖1 2是表示上述實施形態的控制單元及冷卻單元的 分解立體圖。 圖1 3是由上方來看上述實施形態的主框架的立體圖 〇 圖1 4是由下方來看上述實施形態的主框架的立體圖 〇 圖1 5是由正面側來看上述實施形態的挾持片的立體 圖。 圖1 6是由背面側來看上述實施形態的挾持片的立體 圖。 圖17是表示上述實施形態的主框架的開口周邊的立 體圖。 圖1 8是由上方來看上述實施形態的控制基板的立體 圖。 圖1 9是由下方來看上述實施形態的控制基板的立體 圖。 圖2 0是由上方來看上述實施形態的副框架的立體圖 -65- 200830145 圖2 1是由下方來看上述實施形態的副框架的立體圖 〇 圖22是由下方來看上述實施形態的控制單元及冷卻 單元的立體圖。 圖23是由上方來看上述實施形態的冷卻單元的立體 圖。 匱I 24是由上方來看上述實施形態的板彈簧的立體圖 〇 圖25是表示上述實施形態的板彈簧的剖面圖。 圖26是表示上述實施形態的資訊處理裝置的製造工 程的流程圖。 圖2 7是表示上述實施形態的控制單元及冷卻單元的 剖面圖。 圖2 8是表示上述實施形態的控制單元及冷卻單元的 剖面圖。 圖2 9是表示上述實施形態的挾持片及受熱區塊的立 體圖。 圖3 〇是表示上述實施形態的控制單元及冷卻單元、 以及下部框體的立體圖。 圖31是表示上述實施形態的裝置本體、下部框體及 上部框體的立體圖。 【主要元件符號說明】 1 :資訊處理裝置 -66 - 200830145 2 :外裝框體 3 ;裝置本體 4 :主框架 4A :挟持片 4 A 1 :正面部 4A2 :背面部 4A1 1 :突出部 4A12 :缺口 4A21:開口 5 :控制基板 6 :副框架 2 1 :上部框體 22 :下部框體 22A :開口 23 :蓋構件 24 :罩殼 3 1 :控制單元 3 2 :冷卻單元 3 3 :碟片單元 34 :電源單元 3 5 :讀卡機單元 3 6 :板彈簧 3 7 :螺絲 40 :凹部 -67 200830145 41 ， 42 :開口 43 :開口 44，45 :側面部 46 :銷 4 6R，4 6L ··銷 4 7 :立起部 47R，4 7L ：立起部 48R ， 48L ：銷 49 : HDD安裝部 50 :開口Electro Magnetic Interference, Electromagnetic Interference). Thereby, the control unit 31 and the cooling unit 32 can be integrally configured, and the units 31, 32 can be made into one unit. Further, with such a configuration, the heat receiving block 3 2 5 of the cooling unit 32 can be pressed against the CPU 51 and the GPU 52 of the control board 5, and the CPU 51 and the GPU 52 can be pressed to the heated area via the plate-like bodies 63, 64. Block 3 25 C, 3 2 5 G. Therefore, the heat generated by the CPU 51 and the GPU 52 can be quickly conducted to the heat receiving blocks 325C, 325G. Then, the heat conducted to the heated blocks 325C, 325G can be conducted to the radiating fins via the heat pipes 326C, 326G (FIG. 23) via the plate members 3241, 3242 (only the plate member 324 1 is illustrated in FIG. 27). 3 246, 3 245. The heat radiating fins 3 245, 3246 supply air to the cooling air as the motor constituting the air blowing portion 321 and the blade member 3 2 1 1 are rotated, and the cooling air is transmitted to the CPU 51 of the heat radiating fins 3246, 3245. And the heat of GPU52 will be cooled. Referring back to Fig. 26, the unit inversion project S05 corresponds to the first frame inversion program of the present invention, and the control unit 31 and the cooling unit 32 integrated in the project S04 are reversed. Specifically, in the item S05, the lower surface of the main frame 4 (FIG. 14) and the lower surface portion 323 (FIG. 22) of the cooling unit 32 can be directed upward, that is, the state of FIG. 2 can be formed. The control unit 31 and the cooling unit 32, which are integrated by the leaf spring 36 and the screw 3, are reversed. In this state, the pins 4 8 ( 4 8 R, 4 8 L ) provided in the main frame 4 are formed to face upward. Fig. 30 shows the construction of the lower casing control unit -51 - 200830145 31 and the cooling unit 32 by the lower casing 22 . In addition, in FIG. 30, the control unit 31 is only the main frame 4, and the control board 5 and the sub-frame 6 are omitted. The lower frame covering process S06 is the first frame covering procedure corresponding to the present invention. In the item S06, as shown in FIG. 30, the control unit 3 and the cooling unit 32 are positioned in the lower casing 22 so as to cover the control unit 31 and the cooling unit 32 that are reversed in the process S05. . Specifically, the pins 4 8 R , 48L protruding from the main frame 4 of the control unit 31 are respectively fitted to the fitting holes 226 1 , 2 2 62 ( FIG. 6 ) formed by the lower frame 22 , and The control unit 31 and the cooling unit 32 are positioned in the lower casing 22. At this time, as described above, since the fitting hole 226 1 has an oblong shape, even if the positions of the pins 4 8 R, 4 8 L of the main frame 4 and the fitting holes 226 1, 2262 are slightly deviated, the pin 48R is still 48L can be separately fitted to the chimera 2261, 2262. Such a unit inversion project S05 and a lower frame covering project S06 are the first frame positioning projects corresponding to the present invention. Then, as shown in FIG. 26, in the lower casing reversing project S07, the opening 22A of the lower casing 22 can be opened upward, and the sub-frame 6 of the control unit 31 can be positioned upward to position the interior. The lower casing 22 having the control unit 31 and the cooling unit 32 is reversed. In the disc unit mounting work S08, the disc unit 33 (Figs. 7 to 9) is placed on the sub-frame 6, and the disc unit 3 3 is attached to the sub-frame 6 by screws or the like. In the power supply unit mounting work S09, the power supply unit 34 (Fig. 7-52-200830145 to Fig. 9) is placed on the sub-frame 6, and the power supply unit 34 is attached to the sub-frame 6 by screws or the like. At this time, the power supply pin 571 (FIG. 18) of the power supply connection terminal 57 which is provided on the control board 5 and protrudes upward via the opening 601 of the sub-frame 6 is inserted into the pin inlet formed by the lower surface of the power supply unit 34 (Fig. The power supply unit 34 is positioned to position the sub-frame 6. Then, the power supply unit 34 is attached to the support portion 6 9 provided in the sub-frame 6 by screws or the like (Fig. 20). In the substrate mounting work S 1 0, the substrate 353 (FIG. 7 to FIG. 9) constituting the card reader unit 35 is attached to the pedestal 681, 682 provided on the upper surface of the sub-frame 6 by screws or the like. The extension unit 6811, 6821 (Fig. 20) is installed in the card reader installation project S 1 1 by screwing the card reader 3 5 1 (Fig. 7 to Fig. 9) constituting the card reader unit 35. It is located on the inner surface of the upper casing 21 and corresponds to the position of the opening 2 1 1 3 1 (Fig. 2) of the slot portion 2 1 1 3 . This card reader 351 is fixed to the pedestal 6 8 provided in the sub-frame 6 by a screw that is inserted into the screw hole formed in the upper housing 21 in an upper housing mounting work S 1 2 to be described later. , 6 8 2 extension 6 8 1 2, 6 8 2 2 (Figure 20). Further, the order of the respective items S 0 8 to S 1 1 may be changed as appropriate. Fig. 31 is a perspective view showing the apparatus main body 3 and the lower casing 22, and the upper casing 21 when attached to the lower casing 22. The upper housing mounting work S 1 2 is a second housing mounting project corresponding to the present invention, and in the above-described project S12, the upper housing 21 is attached to the lower housing 22. -53- 200830145 At this time, first, the end edge of the front portion 21 1 of the upper casing 21 is brought into contact with the edge of the front portion 221 of the lower casing 22, and the card formation is perpendicular to each other. Then, as shown in Fig. 31, the upper frame 21 and the lower frame 22 are combined by rotating the upper frame 2 1 close to the lower frame 22 with the abutting portion as the axis. Thereby, the opening 22A of the lower casing 22 is closed by the upper casing 21, and the substrate 352 constituting the disc unit 3 3 of the apparatus main body 3, the power supply unit 34, and the card reader unit 35 is blocked by the upper casing 21 Covered. Further, when the upper housing 21 is attached to the lower housing 22, the signal line extending from the card reader 35 that is attached to the upper housing 21 is connected to the substrate 3 accommodated in the lower housing 22. 52. The upper casing 2 1 combined with the lower casing 22 is fixed to the lower casing 22 by the screw of the screw 揷 inlet 2 1 23 formed by the upper surface portion 2 1 2 of the upper casing 2 1 . In the casing mounting work S 1 3, the engaging portion 2122 (FIG. 4) formed on the upper surface portion 212 of the upper casing 21 and the locking portion (not shown) of the casing 24 (FIG. 3) are stuck. The casing 24 is slid along the groove portion 21 21 to the upper surface portion 212. Thereby, the engaging portion 2122 and the locking portion are locked to each other, and the cover 24 is attached to the upper housing 21, and is formed in the groove portion 2 1 2 1 and the engaging portion 2 1 22 of the upper surface portion 2 1 2 and The screw 揷 inlet 2 1 23 will not be exposed. The information processing apparatus 1 is manufactured via the above-described projects S 0 1 to S 1 3 . (8) Effects of the present embodiment When the information processing device 1 of the present embodiment is used, the effects of -54 to 200830145 can be exhibited. That is, in the manufacturing process of the information processing apparatus 1, the substrate positioning process S02 is controlled so that the hole portion 55 formed in the control substrate 5 can pass through the pin 46 provided in the main frame 4, and the control substrate 5 is attached. The sub-frame 6 is positioned in the main frame 4 so as to be positioned in the sub-frame positioning project S03 so that the hole portion 66 formed in the sub-frame 6 can pass through the pin 46. Then, in the lower casing covering project S06, the pin 4 8 provided in the main frame 4 and protruding in the opposite direction to the pin 46 is fitted into the fitting holes 2261, 2262 of the lower casing 22, and the main The frame 4 is positioned in the lower casing 22, and the upper casing 21 is attached to the upper casing 21, and the upper casing 21 is attached to the lower casing 22. Thereby, since the control board 5 and the sub-frame 6 are respectively positioned on the main frame 4, displacement between the main frames 4 and the sub-frame 6 and the control board 5 can be prevented. Further, the main frame 4 for positioning the control substrate 5 and the sub-frame 6 is positioned below the fitting hole 226 1, 2262 in which the pin 48 provided in the main frame 4 is fitted to the lower frame 22, and is positioned below the lower frame 22 Therefore, the main frame 4, the control board 5, and the sub-frame 6 can be positioned at appropriate positions in the exterior casing 2. Therefore, not only the displacement of the respective members 4 to 6 but also the members 4 to 6 can be prevented from interfering with each other. Further, side portions 44, 45 having openings 44 1 to 447, 451 are formed at the end portions on the back side of the main frame 4, and the aforementioned pins 46 are protruded from both end portions of the front side of the main frame 4. Then, in the control substrate positioning project S 02, the terminal 59 provided on the control substrate 5 is inserted into the opening 441 to 444 - 55 - 200830145 ' with the engagement portion of the terminal 59 and the openings 441, 444 as the axis to control the substrate 5 Rotating, the main frame 4 is covered with the control substrate 5, and the pin 4 6 is inserted into the hole portion 5 5 ' to position the control substrate 5 on the main frame 4. Further, in the sub-frame positioning project S03, the rising portion 65 is inserted into the openings 445 to 447, 451, and the sub-frame 6 is rotated by the engaging portion of the rising portion 65 and the side surface portions 44, 45 as the shaft. The sub-frame 6 covers the control substrate 5' and inserts the pin 46 into the hole portion 66, and positions the sub-frame 6 at the main frame 4°, since the control substrate 5 and the sub-frame 6 are sides on the back side. Since the portions 4 4, 4 5 and the pins 46 on the front side are positioned on the main frame 4, the displacement of the control substrate 5 and the sub-frame 6 on the main frames 4 can be surely prevented. Further, in the main frame 4, the control board 5 and the sub-frame 6 which are positioned by the side surface portions 44, 45 and the pins 46 provided on the opposite sides are respectively engaged with the side portions 44, 45 as the axes. To position the rotation under the main frame 4. Thereby, the positioning process can be easily performed by placing the control board 5 and the sub-frame 6 on the main frame 4 in a substantially parallel manner with the main frame 4. Further, since the engagement of the side surface portions 44, 45 with the control board 5 and the sub-frame 6 can be surely performed, the displacement of the control board 5 and the sub-frame 6 to the main frame 4 can be more reliably prevented. Therefore, in addition to simplifying the positioning of the control board 5 and the sub-frame 6, the displacement can be more reliably prevented. Further, at both ends in the longitudinal direction of the main frame 4, a rising portion 47 is formed at a substantially center in the short-side direction, and the control substrate 5 and the sub-frames 6-56 - 200830145 correspond to the rising portion. The position of 47 is formed with notches 56, 67. Thereby, since the rotation of the frame 6 of the control board 5 can be guided by the rising portion 47, the positioning of the control board 5 and the sub 6 can be easily performed. Further, when the control board 5 and the sub-frame 6 are placed on the holder 4, the control board 5 and the sub-frame are held by the rising portions 4 7 R, 4 7 L ) at the portions where the notches 56 and 67 are formed. 6. Therefore, it is possible to surely prevent the control substrate 5 and the sub-frame 6 on the main frame 4 from moving in the longitudinal direction. Therefore, in addition to the simple operation of the control of the substrate 5 and the sub-frames S02, S03, the displacement can be more reliably prevented. Further, the pins 46 (46R, 46L) provided in the main frame 4 are divided into left and right ends on the front side of the main frame 4 (both ends in the longitudinal direction: whereby the control substrate 5 and the sub-frame 6 can be made) Since the positioning of the main frame is increased, the displacement of the control board 5 and the sub-frame can be more reliably prevented. When the control unit 31 and the cooling unit 32 are housed in the lower body 22, the unit reversal project S05 is performed. The control unit 3 cooling unit 32 is reversed so that the protruding direction of the main frame pin 48 can be directed upward. Then, the lower frame 22 is coated with the lower frame 22 to cover the control unit 31 and the cooling unit 32, And 48 is fitted to the fitting hole 226 1, 2262. Thereby, since the lower frame 22, the control unit 31 and the unit 3 2 are positioned, the lower frame 22 can be made smaller than the control unit 31 and the cold element. 32 is easier to move, so it can be easily positioned. And the sub-frame main frame 47 (the positioning of the ground is not set to 丨0 4 of the frame 6 of the frame 4 and so that the pin is cooled but the single-57-200830145 is here When the control unit 31 and the cooling unit 32 are housed in the lower casing 22 Since there is only a slight gap between the control unit 31 and the cooling unit 32 and the lower casing 22, if the control unit 31 and the cooling unit 32 are positioned in the lower casing 22 from above by a jig or the like, It is difficult to pull out the jig. In contrast, the control unit 31 and the cooling unit 32 and the lower frame 22 are positioned so as to be covered by the lower frame 22, so that the jig can hold the outer side of the lower frame 22 at one side. The lower frame 22 is moved by the pin 48 protruding upward in the conventional manner so as to be fitted to the fitting hole 226 1, 2262, whereby the control unit 31 and the cooling unit 32 and the lower frame 22 are positioned. The positioning process of the lower casing 22 and the control unit 31 and the cooling unit 32 is simplified. Further, the information processing device 1 is provided with a cooling unit 32 that abuts on the control substrate 5 constituting the control unit 31. The CPU 5 1 and the GP U 5 2 conduct heat generated by the CPU 51 and the CPU 52. The cooling unit 32 includes a heating block 325 (325C, 3 25 G) that abuts on the CPU 51 and the GPU 52, and a heat receiving area. Block 3 2 5 to conduct the heat release of CPU51 and GPU52 The fins 3 245, 3246 and the cooling fins 3245, 3246 send cooling air to cool the hot air supply portion 321 that is conducted to the heat radiating fins 3245, 3246. Thereby, the CPU 51 and the GPU 52 can be efficiently cooled. Therefore, the CPU 51 and the GPU 52 can be stably driven. Further, the upper surface 324 of the control unit 31 opposite to the cooling unit 32 is provided with a plurality of positioning pins 3 2 9 protruding in the out-of-plane direction, and the control unit 3 1 The main frame 4 is formed with a pin opening 401 through which the positioning pin 3 29 is inserted. -58- 200830145 Thereby, the positioning of the main frame 4 and the cooling unit 32 of the cooling unit positioning engineering SOI can be easily and appropriately performed. Therefore, in addition to the simplification of the work S 0 1 , the displacement of the main frame 4 and the cooling unit 32 can be prevented. And the control unit 31 is held by the cooling unit 32 and the leaf spring 36 (mounted by the screw 3 7 to the cooling unit 3 2 ), and the cooling unit 3 2 is pulled by the elastic pressure of the leaf spring 36 to At the same time as the control unit 31 side, the CPU 51 and the GPU 52 of the control board 5 are pressed against the heat receiving block 325 of the cooling unit 32. Thereby, the heat transfer efficiency of the CPU 51 and the GPU 52 to the heat receiving block 3 25 can be improved. Therefore, the CPU 51 and the GPU 52 can be cooled more efficiently. When the cooling unit 32 is mounted to the control unit 31, the screw head 371 of the screw 3 7 is engaged with the leaf spring 36, and the front end portion of the protruding direction is protruded. The screw portion 73 is screwed to the screw hole 3 25 2 1 formed by the cooling unit 32. In contrast, the cylindrical portion 3 72 located in the middle is only the openings 6 1 , 62 of the sub-frame 6 , the control holes 5 , 412 , 422 of the control substrate 5 and the main frame 4 , and the cylindrical portion 3 72 does not Force is applied to the sub-frame 6, the control board 5, and the main frame 4. Thereby, the locking force of the screw 3 7 to the screw hole 3 2 5 2 1 is not transmitted to the control unit 3 1, so that the cooling unit 3 2 can be prevented from being directly mounted to the control unit 31 by screws or the like. The displacement of the generated bending or the like occurs in the control unit 31. Therefore, the control unit 59 and the cooling unit 32 can be integrated without causing the displacement to be generated by the control unit 31, and the processing can be easily performed. Further, the above-described unit inversion project S05 can be easily performed. Further, in the control unit 31, the main frame 4 and the sub-frame 6 are formed with recesses 40, 60 which are immersed on the side opposite to the side opposite to the control board 5, and the control board 5 is disposed by The recesses 40, 60 are formed in the space. Thereby, the main frame 4 and the sub-frame 6 can be formed to have the minimum size necessary for covering the control substrate 5. Therefore, it is possible to reduce the thickness and size of the control unit 31 to be formed. Further, the control board 5 is in contact with the main frame 4 and the sub-frame 6 at the end edges of the recesses 40, 60, that is, the end edges of the main frame 4 and the sub-frame 6. Thereby, in addition to the main frame 4 and the sub-frame 6, the control substrate 5 can be surely covered, and the unnecessary radiation noise generated in the control substrate 5 can be surely conducted to the main frame 4 and the sub-frame 6. Therefore, the EMI of the information processing apparatus 1 can be surely prevented. (9) Modification of the embodiment The best configuration and the like for carrying out the invention are disclosed in the above description, but the invention is not limited thereto. In other words, the description of the shapes, materials, and the like disclosed above is intended to facilitate the understanding of the present invention and is not intended to limit the invention. In the above embodiment, the pin 4 is protruded from the main frame 4, and the hole portion 5 5, 6 6 through which the pin 46 is inserted is formed in the control substrate 5 and the sub frame 6. However, the present invention is not limited thereto. For example, a pin protruding in a direction approaching the control board 5 - 60 - 200830145 may be provided in the sub-frame 6, and a hole through which the pin is inserted may be formed in the control board 5 and the main frame 4. Further, as long as the lower portion of the control unit 31 is located below, the main frame 4 located on the side closer to the cooling unit 3 2 protrudes from the pin 46', and the control substrate 5 and the sub-frame 6 located above the main frame 4 can be easily performed. Positioning of the main frame 4. Further, similarly, the positioning of the main frame 4 by the cooling unit 32 can be easily performed. In the above embodiment, the terminals 59 formed in the side surface portions 44 of the main frame 4 are inserted into the terminals 59 of the control board 5, and the engaging portions of the terminals 59 and the openings 4 4 1 to 4 4 4 are used as the axes. The control substrate 5 is rotated to position the control substrate 5 on the main frame 4, but the present invention is not limited thereto. Further, the rising portion 65 formed in the sub-frame 6 is inserted into the openings 445 to 447, 451 formed in the side surface portions 44, 45, and the sub-frame 6 is rotated by the rising portion 65 as an axis, and the sub-frame 6 is rotated. It is located in the main frame 4, but the present invention is not limited thereto. In other words, the main frame 4 can be moved in parallel, and the control substrate 5 and the sub-frame 6 can be positioned so as to cover the main frame 4. In the above embodiment, the abutment control substrate 5 is formed and The back side of the side surface portions 44, 45 of the sub-frame 6 is substantially at the center of both ends in the direction in which the direction of the front side of the pin 46 is orthogonal (the longitudinal direction of the main frame 4 in the above embodiment) (in the above embodiment) A rising portion 47 is formed in a substantially central portion of the main frame 4 in the short-side direction, and a notch 5 6,6 7 is formed in the control board 5 and the sub-frame 6 at a position corresponding to the rising portion 47 of the main frame 4. However, the invention is not limited thereto. That is, the positions of the rising portion 47 and the notches 56, 67 can be appropriately set. Further, the rising edge portion 47 - 61 - 200830145 is formed on the end edge of the main frame 4, in particular, the other end edge different from the side on which the side surface portions 44, 45 are formed, so that the gap that penetrates the control substrate 5 is not formed. The degree of freedom in design of the control substrate 5 can be improved. In the above embodiment, when the positioning control unit 31 and the cooling unit 32 and the lower casing 22 are positioned, in the unit reversing project S05, after the control unit 31 and the cooling unit 32 are reversed, the lower casing is covered with the engineering S0. 6 that the control unit 31 and the cooling unit 32 are covered by the lower frame 22 so that the pin 48 can be fitted to the fitting holes 226 1, 2262, but the present invention is not limited thereto. For example, if the integrated control unit 31 and the cooling unit 32 can be supported by the jig or the like, the lower housing 22 can be positioned without reversing the units 31, 32. In the above embodiment, the pin 46 that is inserted into the control board 5 and the sub-frame 6 protrudes from the upper surface of the main frame 4 to the out-of-plane direction, and the pin 48 of the fitting hole 2261, 2262 that is fitted to the lower frame 22 is The lower surface of the main frame 4 protrudes to the out-of-plane direction, but the present invention is not limited thereto. For example, the protruding directions of the pins 46, 48 may be the same. In this case, the lower frame 2 2 may be attached to the upper frame 2 1 by forming the fitting hole of the fitting pin 48 in the upper frame 2 1 . Further, in this case, the pin 46 may be fitted to the coupling eight formed by the upper casing 2 1 . Thus, the 'pin 48' can be omitted. Further, the pins 46, 48 can also be an integral member. In the above embodiment, the position pin 3 2 9 is formed on the upper surface portion 324 of the cooling unit 32, and the pin insertion port 4 01 ' in which the positioning pin 3 29 is inserted into the main frame 4 is formed. However, the present invention is not limited thereto. That is, a pin may be provided under the main frame 4 (the surface facing the cooling unit 32), and a hole portion into which the pin is inserted may be formed in the cooling unit -62-20083014532. Further, when the hole portion of the pin is formed in the cooling unit 3 2, the rotation of the pin and the rotation of the motor and the blade member 3 2 1 1 provided inside the cooling unit 3 2 may be hindered. In contrast, by placing pins on the side of the cooling unit 32, this possibility can be ruled out. In the above embodiment, the control unit 31 is held by the cooling unit 3 2 leaf spring 36, but the present invention is not limited thereto. For example, the cooling unit 32 may be directly fixed to the control unit 31 by screws or the like. In the case of the cooling unit 32, the displacement of the control unit 31 may be caused by bending or the like, but the control unit 3 1 may be held by the leaf spring 36 and the cooling unit. In addition to the occurrence of the displacement, the CPU 51 and the GPU 52 mounted on the control board 5 are appropriately pressed against the heat receiving block 325 of the unit 32. In the above embodiment, the control substrate 5 is in contact with the end edges of the main frame 4 and the sub-frame 6, respectively, but the present invention is not limited thereto. For example, the entire control substrate 5 is housed in the space formed by the recesses 40, 60 of the main frame 4 and the sub-frame 6. In the above embodiment, the electronic device is configured to reproduce information obtained from the optical disk memory card and image information and audio information contained in the information acquired via the network, and constitutes a program included in the information. The information processing device 1 is taken as an example, but the present invention is not limited thereto. For example, it is also applicable to an optical disc reproducing apparatus or the like, and has at least one of electronic functions of the functions, or an electronic machine having other functions. Further, the electronic device may be, for example, a printing device such as a printer or an image display device. Also, as long as it has: a circuit board having a circuit board and a pair of plug-in boards for holding the circuit board, and a single 32-piece cold standable space or a figure, that is, a device body of the frame-63-200830145 frame member, and The present invention can be applied to an electronic device in which two housings of the main body of the apparatus are combined. [Industrial Applicability] The present invention can be utilized as a method of manufacturing an electronic device, and in particular, it can be suitably used in an electronic device including a device body (having a configuration in which a circuit board is held by a pair of frames). BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of an information processing apparatus according to an embodiment of the present invention as seen from the front side. Fig. 2 is a perspective view of the information processing apparatus after the cover member is opened in Fig. 1 as seen from the front side. Fig. 3 is a perspective view of the information processing apparatus in a state in which the casing of the above embodiment is removed as seen from the back side. Fig. 4 is a perspective view of the information processing apparatus in a state in which the casing of the above embodiment is removed as seen from the front side. Fig. 5 is a perspective view of the information processing apparatus of the above embodiment as seen from below. Fig. 6 is a plan view showing an inner surface portion of the lower casing of the embodiment. Fig. 7 is a perspective view of the information processing apparatus in a state in which the upper casing is removed in Fig. 1 as seen from the front side. Fig. 8 is a perspective view of the apparatus main body of the above embodiment taken from the front side of the perspective of -64-200830145. Fig. 9 is an exploded perspective view showing the main body of the apparatus of the above embodiment. Fig. 1 is a perspective view of the control unit of the above embodiment as seen from above. Fig. 11 is a perspective view of the control unit of the above embodiment as seen from below. Fig. 12 is an exploded perspective view showing the control unit and the cooling unit of the embodiment. Fig. 13 is a perspective view of the main frame of the above embodiment as seen from above. Fig. 14 is a perspective view of the main frame of the above embodiment as seen from below. Fig. 15 is a front view showing the holding piece of the above embodiment. Stereo picture. Fig. 16 is a perspective view of the holding piece of the above embodiment as seen from the back side. Fig. 17 is a perspective view showing the periphery of the opening of the main frame of the above embodiment. Fig. 18 is a perspective view of the control board of the above embodiment as seen from above. Fig. 19 is a perspective view of the control board of the above embodiment as seen from below. Fig. 20 is a perspective view of the sub-frame of the above embodiment as seen from above. -65-200830145. FIG. 21 is a perspective view of the sub-frame of the above embodiment as seen from below. FIG. 22 is a control unit of the above embodiment as seen from below. And a perspective view of the cooling unit. Fig. 23 is a perspective view of the cooling unit of the above embodiment as seen from above.匮I 24 is a perspective view of the leaf spring of the above embodiment as seen from above. Fig. 25 is a cross-sectional view showing the leaf spring of the above embodiment. Fig. 26 is a flow chart showing the manufacturing process of the information processing device of the above embodiment. Fig. 27 is a cross-sectional view showing the control unit and the cooling unit of the above embodiment. Fig. 26 is a cross-sectional view showing the control unit and the cooling unit of the above embodiment. Fig. 29 is a perspective view showing the holding piece and the heat receiving block of the above embodiment. Fig. 3 is a perspective view showing the control unit, the cooling unit, and the lower casing of the above embodiment. Fig. 31 is a perspective view showing the apparatus main body, the lower casing, and the upper casing of the above embodiment. [Description of main component symbols] 1 : Information processing device - 66 - 200830145 2 : Exterior frame 3 ; Device body 4 : Main frame 4A : Holding piece 4 A 1 : Front portion 4A2 : Back portion 4A1 1 : Projection portion 4A12 : Notch 4A21: Opening 5: Control substrate 6: Sub frame 2 1 : Upper frame 22: Lower frame 22A: Opening 23: Cover member 24: Case 3 1 : Control unit 3 2 : Cooling unit 3 3 : Disc unit 34: power supply unit 3 5 : card reader unit 3 6 : leaf spring 3 7 : screw 40 : recessed portion - 67 200830145 41 , 42 : opening 43 : opening 44 , 45 : side portion 46 : pin 4 6R, 4 6L ·· Pin 4 7 : rising portion 47R, 4 7L : rising portion 48R , 48L : pin 49 : HDD mounting portion 50 : opening
51 ： CPU51 : CPU
52 ： GPU 5 3 :端子連接部 54 :孔部 5 5 :孔部 5 5 R，5 5 L ··孔部 5 6 :缺口 5 6 R :缺口 5 6 L :缺口 5 7 :電源連接端子 5 8 :連接器 5 9 :端子 60 :凹部 6 1，6 2 :開口 -68- 200830145 63，64 :板狀體 65 :立起部 66 :孔部 6 6 R，6 6 L :孑L 部 67 :缺口 67R，67L ：缺口 6 8 :台座構件 69 :支持部 2 1 1 :正面部 2 1 2 :上面部 2 1 3，2 1 4 :側面部 2 2 1 :正面部 222， 223 ：側面部 2 2 4 :背面部 225 :底面部 2 2 6 :内面部 3 2 1 :送風部 322 :框體 3 2 3 :下面部 3 2 4 :上面部 3 25 :受熱區塊 325C，3 25 G ：受熱區塊 3 2 7 :吐出口 3 2 8 :吐出口 -69- 200830145 3 29 :定位銷 33 1 :單元本體 3 3 2 :框體 3 5 1 :讀卡機 3 5 2 :基板 401 :銷揷入口 402 :開口 4 1 1，4 2 1 :延出部 4 12，422 ：孔部 44 1 - 444 ：開口 445〜447， 451 ：開口 5 1 1，52 1 :插座 53 1： U S B 端子 5 7 1 :電源銷 5 72 :框體 5 8 1 :連接部 5 82 :框體 6 0 1 :開口 6 1 1，6 2 1 ··螺絲 6 3 1，6 4 1 :突起部 6 8 1 :左側台座 682 :右側台座 6 9 1 :延出部 2 1 1 1，2 1 1 2 :突出部 -70- 200830145 2 1 1 3 :卡槽部 2 1 1 4 :碟片揷入口 2 1 2 1 :溝部 2 1 2 2 :卡合部 2 123 :螺絲揷入口 2 1 3 1 :吸氣口 2 1 4 1 :脚部 2211：開口 2212 :吸氣口 2213 ：吸氣口 2221 ， 2222 ：排氣口 223 1 :脚部 2232 ：開口 223 3 :吸氣口 2241〜2244 :開口 2245:電源開關 224 6 ··開口 2247 :插入口連接器 2248 :排氣口 225 1 :第1階差部 2252 :第2階差部 2261， 2262 :嵌合穴 2 2 6 3 :海綿 3211 :葉片構件 -71 200830145 3 23 1， 3 2 4 4 :吸氣口 324 1， 3 242 :板構件 3 24 3 ： 安裝構件 3 245， 3246 :放熱鰭 3 25 1 ： 平坦部 3 2 52 ： 階差部 3 27 1 ： 海綿 3 2 8 1 ： 海綿 3 3 2 1 ： 開口 4 111： 突起部 4 9 11 ： 開口 5 72 1 ： 突出部 5722 ： 卡止爪 6811， 682 1 :延出部 6812， 6822 :延出部 2 113 1 ••開口 22521 :脚部52 : GPU 5 3 : terminal connection portion 54 : hole portion 5 5 : hole portion 5 5 R, 5 5 L · hole portion 5 6 : notch 5 6 R : notch 5 6 L : notch 5 7 : power connection terminal 5 8: Connector 5 9 : Terminal 60 : recessed portion 6 1,6 2 : opening - 68 - 200830145 63, 64 : plate-like body 65 : rising portion 66 : hole portion 6 6 R, 6 6 L : 孑 L portion 67 : notch 67R, 67L: notch 6 8 : pedestal member 69 : support portion 2 1 1 : front portion 2 1 2 : upper surface portion 2 1 3, 2 1 4 : side surface portion 2 2 1 : front portion 222, 223: side portion 2 2 4 : back portion 225 : bottom portion 2 2 6 : inner surface portion 3 2 1 : air blowing portion 322 : frame 3 2 3 : lower portion 3 2 4 : upper surface portion 3 25 : heated block 325C, 3 25 G : Heated block 3 2 7 : Discharge port 3 2 8 : Discharge port - 69 - 200830145 3 29 : Locating pin 33 1 : Unit body 3 3 2 : Frame 3 5 1 : Card reader 3 5 2 : Substrate 401 : Pin揷 Entrance 402: opening 4 1 1, 4 2 1 : extension 4 12, 422: hole 44 1 - 444 : opening 445 447 447, 451 : opening 5 1 1, 52 1 : socket 53 1: USB terminal 5 7 1 : Power pin 5 72 : Frame 5 8 1 : Connection part 5 82 : Frame 6 0 1 : Opening 6 1 1,6 2 1 ··screw 6 3 1,6 4 1 : protrusion 6 8 1 : left side pedestal 682 : right side pedestal 6 9 1 : extension 2 1 1 1,2 1 1 2 : protrusion -70- 200830145 2 1 1 3 : card slot Part 2 1 1 4 : Disc 揷 Entrance 2 1 2 1 : Groove 2 2 2 2 2 : Engagement 2 123 : Screw 揷 Entrance 2 1 3 1 : Suction port 2 1 4 1 : Foot 2211: Opening 2212: Suction port 2213 : intake port 2221 , 2222 : exhaust port 223 1 : leg portion 2232 : opening 223 3 : intake port 2241 to 2244 : opening 2245 : power switch 224 6 · · opening 2247 : insertion port connector 2248 : exhaust port 225 1 : first step portion 2252 : second step portion 2261, 2262 : fitting hole 2 2 6 3 : sponge 3211 : blade member - 71 200830145 3 23 1, 3 2 4 4 : inhalation Port 324 1, 3 242 : Plate member 3 24 3 : Mounting member 3 245, 3246 : Radiating fin 3 25 1 : Flat portion 3 2 52 : Step portion 3 27 1 : Sponge 3 2 8 1 : Sponge 3 3 2 1 : Opening 4 111 : projection 4 9 11 : opening 5 72 1 : projection 5722 : locking claws 6811, 682 1 : extensions 6812, 6822 : extension 2 113 1 •• opening 22521 : foot