TW200827386A - Composites comprising nano-inorganic particles with the organically functional group applied in the manufactures of polyomide film and two-layered flexible copper clad substrate - Google Patents

Composites comprising nano-inorganic particles with the organically functional group applied in the manufactures of polyomide film and two-layered flexible copper clad substrate Download PDF

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TW200827386A
TW200827386A TW95149745A TW95149745A TW200827386A TW 200827386 A TW200827386 A TW 200827386A TW 95149745 A TW95149745 A TW 95149745A TW 95149745 A TW95149745 A TW 95149745A TW 200827386 A TW200827386 A TW 200827386A
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modified
nano
powder
functional group
coupling agent
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TW95149745A
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TWI332016B (en
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Jung-Mu Hsu
Jen-Hsiung Hsiao
Chich-Ming Lin
Wen-Hsien Chou
Jen-Wen Yu
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Ind Tech Res Inst
Asia Electronic Material Co
Career Technology Mfg Co Ltd
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Abstract

Composites of polyimide film and two-layered flexible copper clad substrate, which comprise nano-inorganic particles modified with coupling agent, and therefore the nano-inorganic particles have the organically functional group to react with modified-bismaleimide. The composites of polyimide (PI) film with semi-interpenetration (semi-IPN) were obtained from, which nano-inorganic particles and modified-bismaleimide were served as reactive additive and formulated in the preparations of PI film and two-layered flexible copper clad substrate. The nano-inorganic particles with organically functional group are incorporated in the composites of PI film and two-layered flexible copper clad substrate, which disperse and distribute well over polyimide substrate to results in even products, therefore, coefficient of thermal expansion (CTE) of PI film is efficiently reduced. Thermal resistance and mechanical property of PI film are improved. The stress of two-layered flexible copper clad substrate resulted from high temperature preparation is also reduced efficiently. Productive rate, yield, and peeling strength of two-layered flexible copper clad substrate between PI/copper are also increased. Therefore, curl of composites may be totally prevented while the composites are applied in the manufacture of two-layered flexible copper clad substrate.

Description

200827386200827386

« I 九、發明說明: 【發明所屬之技術領域】 本發明係關於-種具有機反應官能基之無 粒與聚酿亞胺所形成之組成物與複材薄膜之製備,丁尤指、一 種包括聚酿亞胺與改質雙馬來酿亞胺之組成 潯膜之製備。 ~ 【先前技術】 軟性印刷電路板⑺exible Printed如…,㈣ 又稱軟性㈣基板,經曝光、顯影、及㈣加工後, ί望設計之電路導線,可作為電子產品電流訊號傳輸_ "。專人性印刷電路板以立體配線為主要特點訴求,更具有 ° ^ ^ $短小之^性’亦稱為可撓性印刷電路板, 相關產品大致區分為單面板、雙面板及多層板等。由於 FPC具有㈣、短小、可撓曲、防靜電、低消耗功率及 二可依空間設計改變而多樣性特性,在今日電子科技化與通 產口口’皆強调輕缚短小、耐曲折性的趨勢,軟性印刷電 路板應用市場不斷增加,且具龐大市場潛力,諸如筆記型 電腦、摺疊式手機、LCD平面顯示器、數位相機、攝影機、 光碟機等皆需要應用軟板材料。 軟性印刷電路板最主要的原材料為軟性銅荡基板 (FleXlbleC〇PPerClad Laminate,簡稱 FCCL),基板依 其是否含有接著劑,可區分為有膠系三層軟性軟性銅箱基 板(3L-CGL)和無㈣兩層軟性㈣基板(2Lm)二種。 有膠系三層軟性銅ϋ基板(3L_ca)由於含有接著劑因而 19861 5 200827386 在某些性能項目顯得較差 面,在應用上受職多㈣彳如尺寸安定性與耐熱性方 (2L-FCCL)不但在尺1 °热膠系兩層軟性銅落基板« I IX, invention description: [Technical field of the invention] The present invention relates to the preparation of a composition and a composite film formed by a particle-free and polyanilin having an organic reactive functional group, The preparation of a ruthenium film comprising a brewed imine and a modified bismaleimide. ~ [Prior Art] Flexible printed circuit board (7) exible Printed as..., (4) Also known as soft (four) substrate, after exposure, development, and (4) processing, the circuit leads of the design can be used as electronic product current signal transmission _ ". The special-purpose printed circuit board is mainly characterized by three-dimensional wiring, and it is also called a flexible printed circuit board. The related products are roughly classified into single-panel, double-panel and multi-layer boards. Because FPC has (four), short, flexible, anti-static, low power consumption and the diversity of the space design, in today's electronic technology and the mouth of the general production, both emphasize the short binding, resistance to tortuosity The trend is that the market for flexible printed circuit boards is increasing and has huge market potential, such as notebook computers, folding mobile phones, LCD flat panel displays, digital cameras, video cameras, CD players, etc., which require the application of soft board materials. The most important raw material for flexible printed circuit boards is FleXlbleC〇PPerClad Laminate (FCCL). The substrate can be divided into three layers of soft flexible copper box substrates (3L-CGL) according to whether it contains an adhesive. There are no (four) two layers of soft (four) substrates (2Lm). The three-layer soft copper matte substrate (3L_ca) has a poor adhesion to some performance items due to the inclusion of an adhesive. It has many applications in the application (IV) such as dimensional stability and heat resistance (2L-FCCL). Not only in the 1 ° hot glue system, two layers of soft copper drop substrate

製備能力,皆有好與耐熱性,《包含細線路 ...^ A, . 的表現,相較於有膠系基板,更JL 5 :的=解析度、耐熱性佳,良好的尺寸安定性、電 、s ^ 知眭,亦提昇FPC產品應用範圍。 q兩層U·生銅落基板之製作係使用聚醒亞胺 P〇 yimide ’ PI)塗佈於鋼羯基材表面形成兩層銅羯基 ?二於聚酿亞胺的熱膨脹係數卿大於〜I 通大錢的熱膨脹係數約17 8_/t,故必須導入較剛 硬的为子鏈即,減少聚酸亞胺與銅領的⑽差異。該方法 雖然降低了聚酿亞脸的Γτ / ,田”胺的CTE而減少了聚醯亞胺與銅箔的 產〃、仁σ卩使得聚醯亞胺分子結構變得更剛硬 (iigid) ’平整性雖獲得改善,但反而造成聚酿亞胺盘銅 箱間接著力變差’導致線路的製備過程中容易產生線路剝 _之缺陷,無法達到FPC製程之要求。 、中華民國專利公告们5861 9 ?虎「高钻著性聚酸亞胺 組成物」、美國專利公告第52〇〇474與5372891號揭示包 含巴比土酸(Barbituric Acid)改質之雙馬來醯亞胺 (Modified £is蚪leimide’ MBMI)的聚醯亞胺組成物應 用。然而該專利並未教示使用經改質之無機添加物與改質 之雙馬來醯亞胺及聚醯亞胺組成物之應用。 【發明内容】 有鑒於上述問題,本發明之主要目的即係在於提供一 19861 6 200827386 * , 有低搞脹係數之聚酸亞胺組成物與複材薄膜之製 2月之$目的侍、提供—種具有高_熱性之聚职 亞胺組成物與複材薄膜之製備。 本發明之又一目的係芥 &α 係^疋供一種可以降低熱應力之雙 ^層軟性銅箔基板及其製法。 又 本發明之再一目的传接征 、( 、 你徒供一種可以避免表面翹曲 (warp)之雙層軟性銅箱基板及其製法。 ^月之又目的係提供一種具有優異Cu/PI介面 接者力之雙層軟性銅箔基板及其製法。 > v 2達上忒目的本發明提供一種具有機反應官能基之 撕機示米顆粒與聚醯亞胺所 兄妝所形成之組成物,包括聚醯亞 =改貝之又馬來§5&亞胺以及偶合劑改質之無機奈来添加 物。由於該無機奈米添加物係經偶合劑改質而具有有機官 f基’以該組成物製作複材薄膜時,改質之無機奈米添加 、 3木^亞胺泰聚物分子化學反應結合,再盥 :承酉进亞月女分子鏈形成半互穿式交聯網狀結構。本發明具有 機反應官能基之無機太半挪如&取— a 一 …俄不水顆粒與聚醯亞胺所形成之複材 賴中’改質之無機奈米添加物可均句地分佈於聚酿亞胺 土材上t月匕有放地降低該複材薄膜之熱膨服係數、改善 複材薄膜的耐熱性與機械性質,同時增加該複材薄膜與; V白基板間的接著力’故特別適合用於製作雙層軟性銅羯基 板’可以降低薄膜製備時高溫硬化所產生之應力,避免產 品複材發生麵曲之情形。 19861 200827386 本發明亦提供一種製造聚醯亞胺複材薄膜之方法,包 括(a)使用偶合劑改質無機奈米粉體,將有機官能基導入 該無機奈米粉體;(b)將步驟(a)所製得之改質無機奈米粉 體加入含有改質雙馬來醯亞胺之聚醯胺酸組成物溶液;以 及(c)加熱乾燥步驟(b)所製得之聚醯胺酸組成物溶液,使 聚醯胺酸經高温環化轉成為聚醯亞胺基材。 本發明又提供一種製造雙層軟性銅箔基板之方法,包 ‘括(a)使用偶合劑改質無機奈米粉體,將有機官能基導入 該無機奈米粉體;(b)將步驟(a)所製得之改質無機奈米粉 體加入含有改質雙馬來醯亞胺之聚醯胺酸組成物溶液;以 及(c)將步驟(b)所製得之聚醯胺酸組成物溶液塗佈於銅 箔基材,高溫加熱進行環化反應,促成聚醯胺酸轉化為聚 醯亞胺,最後獲得雙層軟性銅结基板之成品。 【實施方式】 本發明具有機反應官能基之無機奈米顆粒與聚醯亞 ; 胺所形成之組成物,包括聚醯亞胺、改質之雙馬來醯亞胺 .以及偶合劑改質之無機奈米添加物;其中,該聚醯亞胺可 由聚醯胺酸經高溫環醯亞胺化而形成。於一具體實例中, 係使用雙酐與二胺進行反應形成聚醯胺酸。該雙酐的實 例包括,但非限於四氫呋喃四羧酸雙酐、環戊四羧酸雙 酐、雙環-[2,2,2]-辛烯(7)-2,3,5,6-四羧酸-2,3,5,6-雙酐、2, 3, 6, 7-萘四羧酸雙酐、3, 3’,4, 4’-二苯基四羧酸 雙酐、1,4, 5, 8-萘四羧酸雙酐、苯均四酸酐、1,2, 5, 6-萘四羧酸雙酐、雙(3,4-二羰苯基)雙酐、及雙(3, 4-二羧 19861 200827386 苯基)醚雙酐。典型的二胺通式為H2N_R,_NH2,其中R,可 為芳香基、脂肪基、環狀脂肪基、或含矽烷之脂肪基。 於一具體實例中,該改質之雙馬來醯亞胺係由式(工) 所不之巴比土酸或其衍生物:The preparation ability is both good and heat resistant. "The performance of the fine line...^ A, . is compared with the adhesive substrate, JL 5 := resolution, heat resistance, good dimensional stability , electricity, s ^ knowledge, also enhance the application range of FPC products. q Two-layer U· raw copper substrate is produced by using Poke yimide 'PI) on the surface of the steel raft substrate to form two layers of copper bismuth base. The thermal expansion coefficient of the two-bulk imine is greater than ~ I have a thermal expansion coefficient of about 17 8 _ / t, so it is necessary to introduce a more rigid sub-chain, that is, reduce the difference between the polyimine and the copper collar (10). Although this method reduces the CTE of the 酿τ / , ” 胺 胺 , , 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少 减少Although the 'flatness is improved, but the resulting adhesion between the copper-binder and the copper box is worse, the defects in the preparation process of the line are easy to occur, and the FPC process cannot be met. The Republic of China Patent Announcement 5861 9 "Tiger's "high-drilled polyimine composition", U.S. Patent Publication Nos. 52,474 and 5,372,891 disclose Bamaimide modified with Barbituric Acid (Modified £is)蚪leimide' MBMI) Polyimine composition application. However, this patent does not teach the use of modified inorganic additives and modified bismaleimide and polyimine compositions. SUMMARY OF THE INVENTION In view of the above problems, the main object of the present invention is to provide a 19861, 2008, 2008, 386, *, a low-incremental coefficient of polyimine composition and a composite film made of February - Preparation of a poly-imine composition having a high _ heat and a composite film. Still another object of the present invention is a mustard & alpha system for providing a double layer soft copper foil substrate which can reduce thermal stress and a method for preparing the same. In addition, the object of the present invention is to provide a double-layer flexible copper box substrate capable of avoiding surface warp and a method for preparing the same. ^The purpose of the month is to provide an excellent Cu/PI interface. A double-layered flexible copper foil substrate and a method for preparing the same. > v 2 OBJECTS OF THE INVENTION The present invention provides a composition formed by a machine-reactive functional group of a tearing machine rice granule and a polyimine. Including the inorganic y = yam and yam y5 & imine and the coupling agent modified inorganic neat additive. Since the inorganic nano additive is modified by a coupling agent to have an organic official When the composition is used to make a composite film, the modified inorganic nano-addition, the 3 wood-imine polymer molecular chemical reaction is combined, and then: the enthalpy into the Asian-month female molecular chain forms a semi-interpenetrating network structure. The inorganic reactive agent having the organic reactive functional group of the present invention can be uniformly obtained as a composite material formed by the combination of the Russian water-free particles and the polyimine. It is distributed on the poly-imine soil and has been lowered to reduce the film of the composite material. The expansion coefficient, the heat resistance and mechanical properties of the composite film are improved, and the adhesion between the composite film and the V white substrate is increased, so that it is particularly suitable for the production of a double-layer soft copper matte substrate, which can reduce the high temperature during film preparation. The stress generated by hardening avoids the occurrence of buckling of the composite material. 19861 200827386 The present invention also provides a method for producing a polyimide film, comprising (a) modifying the inorganic nanopowder with a coupling agent, and organically a functional group is introduced into the inorganic nanopowder; (b) a modified inorganic nanopowder prepared in the step (a) is added to a solution of a polylysine composition containing a modified bismaleimide; and (c) Heating and drying the polyphthalic acid composition solution prepared in the step (b), and converting the polyamic acid to a polyimine substrate by high temperature cyclization. The invention further provides a method for manufacturing a double-layer soft copper foil substrate The package includes (a) using a coupling agent to modify the inorganic nano-powder, introducing an organic functional group into the inorganic nano-powder; (b) adding the modified inorganic nano-powder prepared in the step (a) to the modified Bismaleimide a polyamic acid composition solution; and (c) applying a solution of the polyamic acid composition prepared in the step (b) to a copper foil substrate, heating at a high temperature to carry out a cyclization reaction, thereby promoting conversion of the poly-proline to Polyimine, finally obtaining a finished product of a double-layered soft copper junction substrate. [Embodiment] The invention relates to an inorganic nanoparticle having an organic reactive functional group and a composition formed by an amine, including a polyimine, a modified double-maleimide, and a coupling agent-modified inorganic nano-additive; wherein the poly-imine is formed by polyamidating at high temperature cycloheximide. In a specific example, The phthalic anhydride is reacted with a diamine to form a poly-proline. Examples of the dianhydride include, but are not limited to, tetrahydrofuran tetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, bicyclo-[2,2,2]- Octene (7)-2,3,5,6-tetracarboxylic acid-2,3,5,6-dianhydride, 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, 3, 3', 4 , 4'-diphenyltetracarboxylic acid dianhydride, 1,4,5, 8-naphthalenetetracarboxylic acid dianhydride, pyromellitic anhydride, 1,2,5,6-naphthalenetetracarboxylic acid dianhydride, double ( 3,4-dicarbonylphenyl) dianhydride, and bis(3,4-dicarboxyl 198 61 200827386 Phenyl)ether dianhydride. Typical diamines are of the formula H2N_R, _NH2, wherein R, which may be an aryl group, a fatty group, a cyclic aliphatic group, or a decane-containing aliphatic group. In one embodiment, the modified bismaleimide is a barbituric acid or a derivative thereof:

Λ I IΛ I I

(式中,1與R2係獨立地選自_H、_CH3、_C2il5、_CeH5、 -chc(ch3)2、-CH2CH(CH〇2、-CH2CH2CH(CH3)2、或 - CH(CH〇-(CH2)2-CHs) 與式(Π )所示之雙馬來醯亞胺:(wherein 1 and R2 are independently selected from _H, _CH3, _C2il5, _CeH5, -chc(ch3)2, -CH2CH(CH〇2, -CH2CH2CH(CH3)2, or -CH(CH〇-( CH2)2-CHs) and bismaleimide as shown by formula (Π):

(Π ) 脂肪基、環狀脂肪基、或含;g夕烧 (式中’R可為芳香基 之脂肪基) 進行反應所製得。雙馬來驢亞胺的實例包括,但非 限於Ν,Ν’-乙烯—雙馬來醯亞胺、N,N,—丁烯-雙馬來醯亞 胺、N,N’ —六亞曱基-雙馬來醯亞胺、N,N,-苯撐-雙馬來醯 亞月女Ν’N -4, 4 -二苯基曱烧-雙馬來醮亞胺、n,n,-4, 4,- 本_雙馬來醯亞胺、Ν,ν’-4,4’-二苯颯-雙馬來酸亞 胺、Ν,Ν’—4,4’-二環己基甲烷-雙馬來醯亞胺、Ν,Ν,一 9 19861 200827386. 苯二曱基-雙馬來醯亞胺、及Ν,Ν’-二苯基環己烷-雙馬來 醯亞胺。 含有巴比土酸改質之雙馬來醯亞胺與聚醯胺酸之組 成物溶液,經高溫加熱聚醯胺酸環化轉換成聚醯亞胺,醯 亞胺環化過程中之脫水縮合與改質雙馬來醯亞胺自由基 架橋之雙重效應下,經均勻混合與高溫環化之加工,最終 固化形成半互穿式交聯網狀結構(semi-ΙΡΝ),如第1圖之 結構示意圖所示。使得聚si亞胺複材薄膜之熱膨脹係數有 效下降,並加強了聚醯亞胺複材薄膜與銅箔基材間之剝離 接著強度,因此改善傳統聚醯亞胺樹脂與銅箔間剝離強度 不足之缺陷。 本發明之組成物更進一步添加經偶合劑改質之無機 奈米添加物,特別是無機奈米粉體。利用偶合劑之改質, 將有機官能基導入無機奈米粉體,在巴比土酸觸媒的加成 反應下,與改質之雙馬來醯亞胺行部份自由基開環反應, - 最後在高溫架橋反應與聚醯亞胺形成半互穿式交聯網狀(Π) A fat-based, cyclic aliphatic group, or a compound containing glycerin (wherein 'R may be an aliphatic group of an aromatic group) is reacted. Examples of bismaleimide include, but are not limited to, hydrazine, Ν'-ethylene-bismaleimide, N,N,-butene-bismaleimide, N,N'-hexamidine --Bismaleimide, N,N,-phenylene-double-malay 醯亚月女Ν'N -4, 4 -diphenyl oxime-shuangma quinone imine, n,n,- 4, 4,- Ben _Bismaleimide, hydrazine, ν'-4,4'-diphenylhydrazine-bis-maleic acid imine, hydrazine, Ν'-4,4'-dicyclohexylmethane- Bismaleimide, anthraquinone, anthraquinone, a 9 19861 200827386. benzodiazepine-bismaleimide, and hydrazine, Ν'-diphenylcyclohexane-bismaleimide. a solution containing a mixture of bismaleimide and polylysine modified with barbituric acid, which is cyclized by polypyridyl acid to a polyimine at a high temperature, and dehydrated and condensed in the cyclization process of ruthenium Under the dual effect of the modified double-maleimide free radical bridging, after uniform mixing and high-temperature cyclization processing, the final solidification forms a semi-interpenetrating cross-linked network structure (semi-ΙΡΝ), such as the structure of Figure 1. The schematic shows. The thermal expansion coefficient of the polysiimide composite film is effectively reduced, and the peeling strength between the polyimide film and the copper foil substrate is enhanced, thereby improving the peel strength between the conventional polyimide resin and the copper foil. Defects. Further, the composition of the present invention is further added with an inorganic nano-additive modified with a coupling agent, particularly an inorganic nano-powder. The organic functional group is introduced into the inorganic nano-powder by the modification of the coupling agent, and the partial free radical ring-opening reaction with the modified bismaleimide is carried out under the addition reaction of the barbituric acid catalyst. Finally, the high temperature bridging reaction and the polyamidene form a semi-interpenetrating network

A t 結構之奈米混成複材。本發明所使用之改質無機添加物, 具有活性有機官能基,能與馬來醯亞胺寡聚物及聚醯亞胺 形成半互穿式交聯網狀結構。如第2圖之結構示意圖,聚 醯亞胺高分子基材a、改質之馬來醯亞胺寡聚物b與偶合 劑改質之無機奈米粉體c醯亞胺,係經高溫環化而醯亞胺 形成半互穿式交聯網狀結構。由於改質之無機添加物不是 隨機或任意(random)分散於聚醢亞胺基材中,而是有效 與聚醯亞胺且與馬來醯亞胺寡聚物形成半互穿式交聯網 10 19861 200827386 狀結構,因此促成改質之盔機 , A、 …、械奈+粉體能均勻分佈於聚醯 取:土 ’不f杳生巨相分離與團聚現象,可大幅提昇 聚廳亞胺複材薄膜之機械性質與耐熱性質。因此、僅需^ =的改質奈米粉體’即可有效添加於㈣亞胺組成物, ⑻艮制聚醯亞胺自由體積的鬆他行為(relaxatlon behaVlor),進而低聚醯亞胺之熱膨脹係數。 該偶合劑的實例包括具有乙稀基官能基之石夕烧偶合 劑、具有胺基官能基之錢偶合劑、以及油酸偶合劑,並 中,油酸偶合劑係具有下式所示之結構 八The nano structure of the A t structure is compounded. The modified inorganic additive used in the present invention has an active organic functional group and can form a semi-interpenetrating network structure with a maleimide oligomer and a polyimine. As shown in the structure diagram of Fig. 2, the polyimine polymer substrate a, the modified maleic imine oligomer b and the coupling agent modified inorganic nano powder c醯 imine are subjected to high temperature cyclization. The quinone imine forms a semi-interpenetrating cross-linked network structure. Since the modified inorganic additive is not randomly or randomly dispersed in the polyimide substrate, it is effective to form a semi-interpenetrating network with the polyimide and the maleimide oligomer. 19861 200827386 Shaped structure, thus promoting the upgrade of the helmet machine, A, ..., the mechanical nai + powder can be evenly distributed in the poly-pick: soil 'no f 杳 giant phase separation and agglomeration phenomenon, can greatly enhance the poly-imine The mechanical properties and heat resistance properties of the composite film. Therefore, only the modified nano-powder of ^ = can be effectively added to the (iv) imine composition, (8) the free-volume relaxation behavior of the polyimine (relaxatlon behaVlor), and then the thermal expansion of the oligomeric quinone imine coefficient. Examples of the coupling agent include a sulphur coupling agent having a vinyl functional group, a money coupling agent having an amino functional group, and an oleic acid coupling agent, and the oleic acid coupling agent has a structure represented by the following formula Eight

CH3-(CH2)n-CH= CH-(CH2)n-c〇〇HCH3-(CH2)n-CH= CH-(CH2)n-c〇〇H

^式_中η為1至14之整數)。本發明中可使用無機奈米 粉脰作為添加物’其實例包括氧切、氧化錯、氧化錫、 氧化鉛、氧化硒、氧化銻、氧化鋁、氧化鋅、氧化碲、氧 ㈣、氧化鎵、氧化銦、或氧化M之奈米粉體。於一具體 實例中,係使用具有乙稀基官能基之料偶合劑改質二氧 化石夕奈米粉體,如第3圖之化學機制示意所示。為了獲得 完全純化具有機反應官能基之二氧切奈米顆粒,較佳係 選擇與偶合劑溶解參數相近之溶劑進行純化分離未反應 之偶合劑,例如使用A151矽烷偶合劑.(溶解參數為7 8 car/2/cra3/2),可選用溶解參數亦為7 8 cai】/2/cm3/2之己 烷溶劑,而獲得1〇0%純化末端帶有乙烯基官能基之二氧 化矽奈米粉體。 本發明之組成物中’經偶合劑改質之無機奈米添加物 可佔固含量總重之0.5至15% ,較佳為〇 5至1〇% ,更 19861 11 200827386 * * 佳為0· 5至5% ;巴比土酸改質之雙馬來醯亞胺可佔固含 量總重之1至10% ,其餘為聚醯亞胺。 本發明亦提供一種具有機反應官能基之無機奈米顆 粒與聚醯亞胺所形成之複材薄膜,包括聚醯亞胺、改質之 雙馬來醯亞胺、以及偶合劑改質之無機奈米添加物,其 .中,亞胺無機奈米添加物係經偶合劑改質而具有有機官 、能基,與巴比土酸改質之馬來醯亞胺寡聚物分子化學反應 結合後,再與聚醯亞胺分子鏈形成半互穿式交聯網狀結構 (semi-IPN),故該無機添加物得以均勻分佈於該聚醯亞胺 基材。可使用具有乙烯基官能基之矽烷偶合劑、具有胺基 b月匕基之矽烷偶合劑、或油酸偶合劑改質無機奈米添加 物。於一具體實例中,係使用矽烷偶合劑改質二氧化矽奈 米粉體,將乙烯基官能基帶入二氧化矽奈米粉體。接著, 所衣得之改質二氧化石夕奈米粉體加入含有巴比土酸改質 雙馬來醯亞胺之聚醯胺酸組成物溶液。該改質二氧化矽奈 :【米粉體的含量係佔固含量總重之〇· 5至丨5%,較佳為〇· 5 :至10% ,更佳為0· 5至5% ,巴比土酸改質之雙馬來醯亞 胺的含量係佔固含量總重之丨至1〇% 。加熱該添加有改 貝一氧化矽奈米粉體之溶液,使該改質之二氧化矽奈米粉 體與巴比土酸改質之馬來醯亞胺寡聚物分子化學反應結 合,再與高溫環化之聚醯亞胺分子鏈形成半互穿式交聯網 狀結構,而均勻地分佈於該聚醯亞胺基材,即為本發明之 聚酿亞胺複材薄膜。 該複材薄膜可應用於製作雙層軟性銅箔基板。首先, 19861 12 200827386 . 使用偶合劑改質無機奈米粉體,將有機官能基導入該無 奈米粉體,例如使用石夕烧偶合劑改質二氧化石夕奈米粉體, 將乙細基官能基導入該二氧化石夕奈米粉體表面。接著 所製得之改質二氧化石夕奈米粉體加入含有巴比土酸改/ 雙馬來醯亞胺之聚醯胺酸組成物溶液,其中該改質、 矽奈米粉體的含量係佔固含量總重之〇.5i 15% ,較平 為0.5至10% ’更佳為〇5至5%,巴比土酸改質之: ^㈣的含量係佔固含量總重之…⑽。將該添又加、 有改質二乳化石夕奈米粉體之溶液塗佈於銅箱基材,加 订乾餘’使聚酿胺酸酸亞胺經高溫環化為聚酸亞胺, 製得表面形成有該聚醒亞胺複材薄膜之雙層軟性銅镇其 板。 土 乂下係4由付定之具體實施例進一步說明本發明之 特點與功效,但非用於限制本發明之範疇。 實施例 將偶合齊"151與正己烧溶劑攪拌均句,再加入粒經 二12二之一乳化矽奈米粉體攪拌均句,二氧化矽奈米粉 肢與:合劑之重量比為1:2。在8〇t迴流加熱4小時進 订改負反應,使將有機官能基導入二氧化石夕奈米粉體表 、二過滤=應後之溶液’取出沉殿物。使用正己燒清洗沉 氣物^人後,置於供箱内以烘烤12至16小時獲得 白色粉末’即為偶合劑改質之二氧化石夕奈米粉體。 19861 13 200827386 FTIR官能基的圖譜之特徵鑑定係以未改質之二氧化 石夕表面 Si-〇H(3400 cnT1 : 0-H 鍵結拉伸(bonding stretching))以及偶合劑官能基 CH3-CH2 ( 544,470 cm-1 : 變形振動(deformation vibration))消失與否做為改質 反應與純化程度之參考依據。第4圖係顯示偶合劑、未改 質之二氧化矽奈米粉體、及經偶合劑改質具有乙烯基官能 ~ 基之二氧化矽奈米粉體的FTIR圖譜。經偶合劑改質之二 氧化矽表面Si-ΟΗ ( 3400 cnT1 ·· 0-Η鍵結拉伸(bonding stretching)),與偶合劑官能基 CH3-CH2 ( 544,470 cm—1 : 變形振動(deformation vibration))完全消失,代表反 應完全與100%純化,而=CH2 ( 2975 cnT1 :對稱拉伸振動 (symmetric stretching vibration))禮支弱白勺波秦,β 表 改質後之二氧化矽奈米粉體具有乙烯基官能基。 在氮氣環境下,以10°C/min昇溫速率進行熱重量分 析(Ihermo泾ravimetr ic 包nalysis : TGA)° 第 5 圖之 TGA • 圖譜顯示其間重量殘存量,經計算,改質後具有乙烯基官 ,能基之二氧化矽奈米粉體,有機相含量約為11% ,與第4 圖結果符合,證明偶合劑已有效改質二氧化矽奈米粉體使 其具有乙烯基官能基。 針對未改質之二氧化矽奈来粉體以及經偶合劑改質 具有乙烯基官能基之二氧化矽奈米粉體,使用 Photal-Otsuka Electronics LPA-3100 Laser Particle Analyzer進行動態雷射散射測試(dynamic Laser fatter: DLS)。以N-曱基咯烷酮(NMP)作為溶劑,確認 14 19861 200827386 :貝則後之—氧化矽奈米粉體溶於特定溶劑之粒徑尺 寸,測忒粒徑範圍丨〜2〇 ^ ^ a ^ r . 如表1所不,經偶合劑 ”一、布土 ^旎基之二氧化矽奈米粉體的粒徑< 20 :::示二氧化石夕奈米粉體經改質後,依然維持其原來奈 米尺寸且無顆粒聚集現象產生。^ where η is an integer from 1 to 14). In the present invention, inorganic nano-powder can be used as an additive. Examples thereof include oxygen cutting, oxidation, tin oxide, lead oxide, selenium oxide, antimony oxide, aluminum oxide, zinc oxide, antimony oxide, oxygen (IV), gallium oxide, and oxidation. Indium, or oxidized M nano powder. In one embodiment, the powdered ceramsite powder is modified using a compound coupling agent having an ethylenic functional group, as schematically illustrated by the chemical mechanism of Figure 3. In order to obtain completely purified dioxonide particles having an organic reactive functional group, it is preferred to select a solvent similar to the coupling agent dissolution parameter for purification to separate the unreacted coupling agent, for example, using an A151 decane coupling agent. (Dissolution parameter is 7) 8 car/2/cra3/2), hexane solvent with a solubility parameter of 7 8 cai]/2/cm3/2 can be used to obtain 1〇0% purified ruthenium dioxide with vinyl functional group at the end. Rice flour. In the composition of the present invention, the inorganic nano-additive modified by the coupling agent may account for 0.5 to 15% by weight of the total solid content, preferably 〇5 to 1%, and further, 19861 11 200827386 * * preferably 0. 5 to 5%; Barbituric acid modified bismaleimide can account for 1 to 10% of the total solid content, and the rest is polyimine. The invention also provides a composite film formed by inorganic nano particles and polyimine having an organic reactive functional group, comprising polyimine, modified bismaleimide, and inorganic modified by a coupling agent. Nano-additive, in which the imine inorganic nano-additive is modified by a coupling agent to have an organic official, an energy group, and is combined with a molecular chemical reaction of a barbituric acid-modified maleic imine oligomer. Thereafter, a semi-interpenetrating network-like structure (semi-IPN) is formed with the polyimine molecular chain, so that the inorganic additive is uniformly distributed on the polyimide substrate. The inorganic nano-additive may be modified using a decane coupling agent having a vinyl functional group, a decane coupling agent having an amine b-mercapto group, or an oleic acid coupling agent. In one embodiment, the cerium oxide coupling is used to modify the cerium oxide nanopowder to carry the vinyl functional group into the cerium oxide nanopowder. Next, the modified oxidized oxidized ceramsite powder was added to a polyamic acid composition solution containing barbituric acid modified bismaleimide. The modified cerium oxide: [the content of the rice powder is 5 5 to 5% of the total weight of the solid content, preferably 〇 5: to 10%, more preferably 0.5 to 5%, The content of the bismaleimide which is modified by the acid is based on the total weight of the solid content to 1%. Heating the solution containing the modified cerium oxide nanometer powder to combine the modified cerium oxide nanometer powder with the barbituric acid modified maleic imine oligomer molecular chemical reaction, and then with high temperature The cyclized polyimine molecular chain forms a semi-interpenetrating crosslinked network structure, and is uniformly distributed on the polyimine substrate, which is the polyaniline composite film of the present invention. The composite film can be applied to produce a double-layer flexible copper foil substrate. First, 19861 12 200827386 . Using a coupling agent to modify the inorganic nano-powder, introducing an organic functional group into the nano-toner powder, for example, using a Shixi sinter coupling agent to modify the cerium oxide cerium powder, and introducing the ethylenic functional group The surface of the silica dioxide glutinous rice powder. Then, the modified oxidized oxidized ceramsite powder is added to a polyamic acid composition solution containing barbituric acid modified / bismaleimide, wherein the content of the modified and glutinous rice powder is occupied. The total weight of solid content is 55. 15i, 0.5 to 10% flatter. 'More preferably 〇5 to 5%. Barbituric acid is modified: ^(4) is the total weight of solid content... (10). Applying the solution of the modified and emulsified emulsified granules to the copper box substrate, and adding the dry residue to cyclize the poly-nitrile acid imide to a polyamicimide at a high temperature. The double-layered soft copper film of the polyamidite composite film is formed on the surface. The underarms 4 further illustrate the features and utilities of the present invention by way of specific examples, but are not intended to limit the scope of the invention. In the embodiment, the coupling is fused with the solvent and the solvent is stirred, and then the granules are mixed with the emulsified glutinous rice powder. The weight ratio of the cerium oxide nanoparticle to the mixture is 1:2. . The reaction was changed by reflux heating at 8 Torr for 4 hours, and the organic functional group was introduced into the cerium oxide powder surface, and the second solution = the solution after the application was taken out. After the immersion gas is cleaned by using the hexahydrate, it is placed in a box for baking for 12 to 16 hours to obtain a white powder, which is a coupling agent-modified cerium oxide powder. 19861 13 200827386 The FTIR functional map is characterized by unmodified silica dioxide Si-〇H (3400 cnT1: 0-H bonding stretching) and coupling agent CH3-CH2 ( 544,470 cm-1 : Deformation vibration) disappeared or not as a reference for the degree of modification and purification. Fig. 4 is a FTIR spectrum showing a coupling agent, an unmodified cerium oxide nanopowder, and a bismuth dioxide nanopowder having a vinyl functional group based on a coupling agent. Si-ΟΗ (3400 cnT1 ·· 0-Η bonding stretching) modified by coupling agent, and coupling agent CH3-CH2 (544,470 cm-1 : deformation vibration ( Deformation vibration)) completely disappeared, indicating that the reaction is completely 100% purified, while =CH2 (2975 cnT1: symmetric stretching vibration) is weakly weakened by Boqin, and after β-modified cerium oxide Rice flour has a vinyl functional group. Thermogravimetric analysis (Ihermo泾ravimetr ic packet analysis: TGA) under a nitrogen atmosphere at a heating rate of 10 ° C / min ° TGA of Figure 5 • The spectrum shows the residual weight during the calculation, after calculation, the vinyl has been modified Guan, the energy-based bismuth dioxide nano-powder, the organic phase content is about 11%, which is consistent with the results of Figure 4, which proves that the coupling agent has effectively modified the cerium oxide nano-powder to have a vinyl functional group. Dynamic laser scattering test using the Photal-Otsuka Electronics LPA-3100 Laser Particle Analyzer for unmodified cerium oxide nanopowder and modified cerium oxide nanopowder with vinyl functional group via coupling agent Laser fatter: DLS). Using N-fluorenylpyrrolidone (NMP) as a solvent, it was confirmed that 14 19861 200827386: the particle size of the cerium oxide nano-powder dissolved in a specific solvent, and the particle size range 丨~2〇^ ^ a ^ r . As shown in Table 1, the coupling agent "I. The particle size of the cerium oxide nano-powder powder of the sulphate 旎 旎 & & 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 Maintain its original nanometer size and no particle aggregation.

質之雙馬來醮凸脸 表 將8· 66克N,N’-4, 4’-二苯基曱烷一雙馬來醯亞胺溶 於20克r-丁内酯,並於混合溶液中加入i克巴比土酸。 於11 o°c之溫度條件下攪拌加熱丨小時,製得巴比土酸改 質之雙馬來醯亞胺。 合成例3 :聚醯胺酸 將 17.45 克(0.087M)之 4, 4’-二胺基二苯醚(DDE)置 於500毫升四頸反應器中,加入130毫升之N-甲基咯烷 酮(NMP)及30毫升之二曱苯使其溶解。接著,添加is. 55 克(0· 085M)之苯均四酸酐(PMDA)於氮氣及室溫條件下反 應3小時,再加入〇· 436克(〇· 〇2M)之苯均四酸酐繼續反 應2小時,獲得固含量18. 5%之聚醯胺酸溶液。 15 19861 200827386 , 實施例 1 將合成例1之改質二氧化矽奈米粉體與合成例2所製 得巴比土酸改質之雙馬來醯亞胺加入合成例3之聚醯胺 酸溶液,其中,改質二氧化矽奈米粉體係佔固含量總重之 1% ,巴比土酸改質之雙馬來醯亞胺係佔固含量總重之5 % ,聚醯胺酸則佔固含量總重之94% 。將聚醯胺酸組成 溶液離心脫去泡沫,使用塗佈機將該聚醯胺酸組成物溶液 塗佈於銅箔基材上,放入高溫氮氣(I)烘箱以階梯式升 溫方式進行烘烤。首先,在8(rc烘烤3〇分鐘。接著,逐 次升溫至120°C、15(TC、及200°C分別烘烤30分鐘,再 以350t烘烤60分鐘。最後,得到完全環化與乾燥之兩 層軟性銅箔基板(2L-FCCL)。 實施例2 重複實施例1之相同方法製備兩層軟性銅箔基板。該 改貝一氧化矽奈米粉體改為固含量總重之,巴比土酸 改質之雙馬來醯亞胺係佔固含詈她番 丁丨〇 U 3里、、、心垔之5% ,聚醯胺酸則 佔固含量總重之92% 。 實施例3 兩層軟性銅箔基板。該 總重之5% ,巴比土酸 重之5 %,聚酿胺酸則 重複實施例1之相同方法製備 改質二氧化矽奈米粉體改為固含量 改質之雙馬來醯亞胺係佔固含量總 佔固含量總重之90% 。 19861 16 200827386 比較例1 使用合成例3之聚酸胺酸溶液重複實施例1之方法製 備兩層軟性銅箔基板。該聚醯胺酸溶液並未添加巴比土酸 改貝之雙馬來酿亞胺及改質之二氧化發奈求粉體。 比較例2 重複貫施例1之相同方法製備二層軟性銅箔基板。該 聚醯胺酸溶液並未添加巴比土酸改質之雙馬來醯亞胺,並 使用未改質之二氧化矽奈米粉體,該二氧化矽奈米粉體佔 固含量總重之15% ,聚醯胺酸則佔固含量總重之85% 。 比較例3 重複實施例1之相同方法製備二層軟性銅箔基板。該 聚醯胺酸溶液並未添加改質之二氧化矽奈米粉體,該巴比 土 S欠改貝之雙馬來醯亞胺係佔固含量總重之,酹 酸則佔固含量總重之95% 。 m 將上述各實施例及比較例所製得之二層軟性銅箔基 板放置於25%之過硫酸銨溶液中,將溫度控制並設定為 6+〇C,元全將銅羯餘刻絲,得到聚酸亞胺複材薄膜。接 者’取出聚酿亞胺複材薄膜充分水洗乾淨,放置於烘箱以 120(32/里度條件烘烤3〇分鐘。使用聚醯亞胺複材薄膜與 兩層軟性銅落基板做為測試樣品,以下列 ^ 各樣品之特性,特性結果於表2。 収 19861 17 200827386 本毛月之尤、重里分析、剝離強度、及熱膨脹係數測試 方法,根據下列方法進行測試: 熱重 1 分析儀(Ihermogjavimetric 卽 aiysis: TGA):通入氮氣,以1〇t/min昇溫速率測試樣品熱裂解 起始溫度(以 〇n—Set temPerature of 5% wt· Loss 為比 較與分析標準)。 (2)剝離強度:使用lpc一ΤΜ—65〇(2·4·9)測試方法a 與C,測試各實施例與比較例之銅箔基板,蝕刻後的測試 、、表路忒片置於9 0度角剝離夾具,以萬能測試機測定其對 應拉力,測試銅箔被拉離聚醯亞胺膜的單位寬度之拉力 (kgf/cm )。 (3)熱膨脹係數:以熱機械分析儀 (l_hermo亚echanical达nalysis: TMA)測量,在氮氣環境以 及30至300°C溫度範圍間,以1(rC/min升溫速率,測試 各實施例與比較例之聚醯亞胺複材薄膜,在受熱前後單位 溫度下的長度差及原始長度比值(ppm/°C )。 表2 ,V飞 熱重量分析°C 剝離強度 (kgf/cm) 熱膨服係數 (ppm/°C ) 貫施例1 585·73 1. 18 24. 65 tjUH 2 587.65 1. 32 22. 15 實施例3 595·96 1. 48 20. 17 比較例1 555.42 0. 40 35.60 比較例2 580.78 1. 08 24. 76 比較例3 585·26 1. 13 26. 48 18 19861 200827386 根據表2之結果可得知,添加}、3、5%經改質具有 乙烯基官能基之二氧化矽奈米粉體配合改質雙馬來醯亞 胺寡聚物所形成的聚醯亞胺複材薄膜具有顯著性能的提 昇效果,尤指較佳的熱重力分析(TGA)、熱穩定性、及較 佳剝離強度’同時亦呈現較低的熱膨脹係數。實施例3 •與無添加任何添加物的比較例1比較,發現實施例3之聚 、醯亞胺複材薄膜的膨脹係數從35. 60 ppm/t下降至2〇. ^ PPm/l剝離強度由〇4〇 kgf/cm提升至i48 kg"』。 $較例2中、添加傳統二氧化秒奈米粉體佔全體組成 物重量比15%所得之聚醯亞胺複材塑膠膜和實施例卜3 具有相近的熱膨脹侈麥 與 〇 ^ ^ 比較例2佳。本發明!、二:二二的剝離強度皆較 iJ I加入1至5% ,即可有效逵 =聚醯亞胺膜機械性能之目的。比較例3中,只添加 ^亞胺寡聚物並無添加改f二氧切奈求粉體,和 較可發現,添加少量改質二氧切奈米粉 .L有效大幅提升聚醯亞胺膜之機械性能。 : #由掃描式電子顯微鏡(S E Μ)觀察本發明皆施例之取 醯亞胺組成物所势成夕、^ 一 ,一、戶'%幻之个 组織可.被充八旬Γί 材湾膜,半互穿式交聯網狀結構 刀&疋返視。第6a圖為添加傳統未改質之二 氧化妙示来粉體,番旦 、 亞胺驾肢 里 王肢組成物固含量1%之聚醯 3之^=^ 子顯微鏡㈣;第⑼關為實施例 ^ Μ絲所製成之複材相 片。第6a圖中明銪1 士 4 β 只佩說…、 未改質之二氧化石夕夺料 1夕=左級立的顆粒和凹洞,足見 ” 一叔紅王現奴思散佈且有凝聚成較 19861 19 200827386 大顆粒的傾向。第6b圖t,並沒有發現明顯的凹洞 粒二可見經改質之二氧化矽奈米粉體、改質之雙馬來醯亞 胺养聚物和聚醯亞胺組成互呈半互穿式交聯網,造成改柄 之雙馬來醯亞胺寡聚物和經改質之二氧化矽貝 句地分佈於聚釀亞胺基材上,因此不會有明顯的凹洞二 體凝集的顆粒現象產生。 a知 惟上述實_僅相稀說明本發明之原理及其功 效’並:非用於限制本發明’任何熟習此項技藝之人士 在不迷背本發明之精神及範訂,對上述實施例進行修 與變=。因此’本發明之權利保護範圍,應如後述之申於 專利範圍所列。 月 【圖式簡單說明】 第1圖係顯示聚醯亞胺與改質雙馬來酿亞 互穿式交聯網狀結構之示意圖; 成丰 第2圖係顯示聚醯亞胺、改質之馬來醯亞胺、及偶合 劑改質之無機添加物形成半互穿式交聯網狀結構之示意° 第3圖係顯示偶合·f無機添加物之化學機 意圖; ^ 第4圖係顯示偶合劑、未改質之二氧切奈米粉體、 及經偶合劑改質具有乙烯基官能基之二氧切奈米粉體 的FTIR圖譜; 第5圖係顯示偶合劑、未改質之二氧化石夕奈米粉體、 及經偶合劑改質具有乙歸基官能基之二氧化石夕奈米粉體 19861 20 200827386t 的TGA圖譜與其間重量殘存量; 第6a圖係添加傳統未改質之二氧化矽奈米粉體,重 量比佔全體組成物固含量之聚醯亞胺薄膜之掃描式 電子顯微鏡照片;以及 第6b圖係本發明實施例3之聚醯亞胺組成物所製成 之複材薄膜電子顯微鏡照片。 ’【主要元件符號說明】 a 聚醯亞胺高分子基材 b 改質之馬來醯亞胺寡聚物 c 偶合劑改質之無機奈米粉體 A 未改質之二氧化矽奈东粉體 B 偶合劑 C 經偶合劑改質之二氧化矽奈米粉體 21 19861Qualitative double Malay 醮 convex face table 8.66 g N, N'-4, 4'-diphenyl decane a pair of maleimide dissolved in 20 g of r-butyrolactone, and mixed solution Add i grams of barbituric acid. The mixture was heated and stirred at a temperature of 11 ° C for a few hours to prepare a bismale acid-modified bismaleimide. Synthesis Example 3: Polylysine 17.45 g (0.087 M) of 4,4'-diaminodiphenyl ether (DDE) was placed in a 500 ml four-necked reactor, and 130 ml of N-methylrrolidine was added. Ketone (NMP) and 30 ml of diphenylbenzene were dissolved. Next, add 55 g (0·085 M) of pyromellitic anhydride (PMDA) under nitrogen at room temperature for 3 hours, and then add 436 g (〇·〇2M) of pyromellitic anhydride to continue the reaction. 2小时的聚聚胺酸溶液。 2 hours, a solid content of 18.5% of a polyamic acid solution. 15 19861 200827386 , Example 1 The modified cerium oxide nano powder of Synthesis Example 1 and the bismale acid modified bismaleimide prepared in Synthesis Example 2 were added to the polyaminic acid solution of Synthesis Example 3. Among them, the modified cerium oxide nano-powder system accounts for 1% of the total solid content, and the barbituric acid-modified double-maleimide-based yttrium accounts for 5% of the total solid content, while the poly-proline contains The total weight of the content is 94%. The polyamic acid composition solution was centrifuged to remove the foam, and the polyamic acid composition solution was applied onto a copper foil substrate using a coater, and placed in a high-temperature nitrogen (I) oven to be baked in a stepwise heating manner. . First, bake at 8 (rc for 3 minutes. Then, heat up to 120 ° C, 15 (TC, and 200 ° C for 30 minutes, then 350t for 60 minutes. Finally, get complete cyclization and Dry two layers of soft copper foil substrate (2L-FCCL). Example 2 Two layers of soft copper foil substrate were prepared in the same manner as in Example 1. The modified bismuth oxide nano-powder was changed to the total solid content. Compared with the acid-modified Bismaleimide, it accounts for 5% of her solids, U3, and 5% of heart, and polyamine contains 92% of the total solid content. 3 Two layers of soft copper foil substrate. The total weight is 5%, the barbituric acid is 5% by weight, and the poly-aracine is repeated in the same manner as in Example 1 to prepare the modified cerium oxide nanopowder to change the solid content. The quality of the double-maleimide-based solid content accounts for 90% of the total solid content. 19861 16 200827386 Comparative Example 1 The two-layer soft copper foil was prepared by repeating the method of Example 1 using the polyamic acid solution of Synthesis Example 3. Substrate. The polyamic acid solution is not added with barbituric acid modified bismuth, and the modified oxidized hair is obtained. Example 2 A two-layer flexible copper foil substrate was prepared in the same manner as in Example 1. The polyamic acid solution was not added with barbituric acid-modified bismaleimide, and unmodified cerium oxide was used. For the nano powder, the cerium oxide nano powder accounts for 15% of the total solid content, and the polyamic acid accounts for 85% of the total solid content. Comparative Example 3 The same method as in Example 1 was repeated to prepare a two-layer soft copper foil. Substrate. The polyamic acid solution does not add modified cerium oxide nanopowder, and the barbary soil S is not modified, and the bismuth ylide is the total solid content, and the citric acid accounts for the solid content. The total weight is 95%. m The two layers of soft copper foil substrate prepared in each of the above examples and comparative examples are placed in a 25% ammonium persulfate solution, and the temperature is controlled and set to 6 + 〇C. The copper wire is engraved to obtain a film of polyiminoimide composite material. The carrier is taken out of the polyamidide composite film and washed thoroughly, and placed in an oven at a temperature of 120 (32/R) for 3 minutes. Amine composite film and two layers of soft copper drop substrate are used as test samples, and the characteristics of the following samples are used. In Table 2. Received 19861 17 200827386 This test method of Maoyue, zhongli analysis, peel strength, and thermal expansion coefficient was tested according to the following method: Ihermogjavimetric 卽aiysis: TGA: nitrogen gas was introduced 1 〇 t / min heating rate test sample thermal cracking initiation temperature (by 〇 n - Set temPerature of 5% wt · Loss for comparison and analysis criteria). (2) peel strength: using lpc ΤΜ -65 〇 (2 · 4·9) Test methods a and C, the copper foil substrates of the respective examples and comparative examples were tested, and the test after etching and the surface film were placed at a 90-degree angle peeling jig, and the corresponding tensile force was measured by a universal testing machine. The tensile force per unit width (kgf/cm) at which the copper foil was pulled away from the polyimide film was tested. (3) Coefficient of thermal expansion: measured by a thermomechanical analyzer (l_hermo sub-echanical analysis: TMA), and tested at 1 (rC/min heating rate) in a nitrogen atmosphere and a temperature range of 30 to 300 °C. For example, the length difference of the polyimide film at the unit temperature before and after heating and the ratio of the original length (ppm/°C). Table 2, V-flying heat analysis °C Peel strength (kgf/cm) Thermal expansion Coefficient (ppm/°C) Example 1 585·73 1. 18 24. 65 tjUH 2 587.65 1. 32 22. 15 Example 3 595·96 1. 48 20. 17 Comparative Example 1 555.42 0. 40 35.60 Comparison Example 2 580.78 1. 08 24. 76 Comparative Example 3 585·26 1. 13 26. 48 18 19861 200827386 According to the results of Table 2, it was found that the addition of 1, 3, 5% was modified with a vinyl functional group. The polyimide film formed by the cerium oxide nano-powder combined with the modified bismaleimide oligomer has a remarkable performance improving effect, especially a preferred thermal gravity analysis (TGA), thermal stability, And better peel strength' also exhibits a lower coefficient of thermal expansion. Example 3 • Comparison with Comparative Example 1 without any added additives, The coefficient of expansion of the polyimide film of Example 3 was found to decrease from 35.60 ppm/t to 2 〇. ^ The peel strength of PPm/l was increased from 〇4〇kgf/cm to i48 kg". In Example 2, the polyimide film of the polyimine composite material obtained by adding the conventional second-peroxide nano-nano powder to the weight ratio of the whole composition of 15% has the same thermal expansion and the same as in the comparative example 2. The peel strength of the invention is the same as that of the iJ I, and the mechanical properties of the polyimide film can be effectively used. In the comparative example 3, only the imine oligomer is added. No added modified f-dioxine to find powder, and it can be found that adding a small amount of modified dioxynectin powder. L effectively greatly enhances the mechanical properties of the polyimide film: # by scanning electron microscope (SE Μ Observing the composition of the present invention, the composition of the bismuth imine is in the eve of the day, ^ one, one, the household '% illusion of the organization can be filled with eighteen Γ material Bay film, semi-interpenetrating network Structural knife & 疋 疋 。 。 。 。 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第1% of the 醯 3 ^ ^ ^ sub-microscope (four); (9) off for the example ^ Μ silk made of composite photo. In the 6a picture, alum 1 4 4 only said ..., not modified The sulphur dioxide dissipates the eve of the eve = the particles and pits of the left-level standing, which shows that the uncle of the red king is scattered and has a tendency to condense into larger particles than the 19861 19 200827386. Figure 6b, t, did not find obvious pits and grains. The modified cerium oxide nanopowder, the modified bismaleimide eutrophic polymer and polyamidimide were semi-interpenetrating. The network is interconnected, causing the modified double-maleimide oligomer and the modified cerium oxide to be distributed on the polyimide intermediate substrate, so that there is no obvious pit-aggregated particles. The phenomenon occurs. A singularity of the above-mentioned embodiments is merely illustrative of the principles of the present invention and its efficiencies. It is not intended to limit the invention. Any person skilled in the art will not be obscured by the spirit and scope of the present invention. Repair and change =. Therefore, the scope of protection of the present invention should be as set forth in the scope of the patent as described later. Month [Simple description of the diagram] Figure 1 shows a schematic diagram of the interpenetrating cross-linked network structure of polyimine and modified double Malay; Chengfeng 2 shows polyimine, modified horse Schematic diagram of the semi-interpenetrating cross-linked network structure of inorganic additives modified with hydrazine and coupling agents. Fig. 3 shows the chemical machine intention of coupling/f inorganic additives; ^ Figure 4 shows the coupling agent FTIR spectrum of unmodified dioxonine powder and oxydicarbide powder modified with a vinyl functional group via a coupling agent; Figure 5 shows a coupling agent, unmodified sulphur dioxide The nano-powder and the coupling agent are modified to have a TGA spectrum of the sulphur dioxide sulphate 19861 20 200827386t and its residual weight; the 6a figure is the addition of the traditional unmodified cerium oxide Scanning electron micrograph of rice powder, weight ratio of polyimine film which accounts for the solid content of the whole composition; and Fig. 6b is a composite film electron microscope made of the polyimide composition of Example 3 of the present invention photo. '[Main component symbol description] a Polyimine polymer substrate b Modified maleic imine oligomer c Coupled agent modified inorganic nanopowder A Unmodified copper dioxide Nddong powder B coupling agent C oxidized cerium oxide nano-powder modified by coupling agent 21 19861

Claims (1)

200827386 十、申請專利範圍: !.一種具有機反應官能基之無機奈米顆粒與聚醯亞胺 所形成之組成物,包括: * (A)聚醯亞胺; (B )改夤之雙馬來酸亞胺;以及 (C)偶合劑改質之無機奈米添加物。 2· 3· 如申請專利範圍第1項之組成物,其中, e t 6亥偶合劑係 選自具有乙烯基官能基之矽烷偶合劑、具有胺基官能 基之矽烷偶合劑、及油酸偶合劑所構成之組群。月 如申請專利範圍第2項之組成物,其中,該油酸偶合 劑係具有下式所示之結構 口 CH3-(CH2)n-CH= CHh(CH2)n-C00H 式中,n為1至14之整數。 4·200827386 X. Patent application scope: !. A composition formed of inorganic nanoparticle and polyamidimide having an organic functional group, including: * (A) polyimine; (B) modified double horse Inorganic nano-additives modified with acidimine; and (C) coupling agents. 2· 3· The composition of claim 1, wherein the et 6 coupling agent is selected from the group consisting of a decane coupling agent having a vinyl functional group, a decane coupling agent having an amino functional group, and an oleic acid coupling agent. The group formed. The composition of the second aspect of the patent application scope, wherein the oleic acid coupling agent has a structural port CH3-(CH2)n-CH=CHh(CH2)n-C00H represented by the following formula, wherein n is 1 An integer of up to 14. 4· 5· 6·5· 6· 如申請專利範圍。歡組絲,其巾,該無機奈米 外加物仏廷自氧化矽、氧化鍺、氧化錫、氧化鉛、氧 :硒、氧化銻、氧化鋁、氧化鋅、氧化碲、氧化硼、 τι化鎵、乳化銦、及氧化鉍所構成之組群之奈米粉體。 如申請專利範圍第1項之組成物,其中,該無機奈米 添加物係二氧化矽奈米粉體。 :申請專利範圍第1項之組成物,其中,I亥成分(c) 仏為經矽烷偶合劑改質而具有乙烯基官能基之二氧 化石夕奈米粉體。 :申請專利範圍第1項之組成物,其中,該成分(c) (丁、占組成物固含量總重之〇. 5至j 5% 。 19861 22 200827386 8. 如申請專利範圍第1項之組成物,其中,該成八(B) 係Μ巴比土酸改質之雙馬來趨亞胺。 9. 如申請專利範圍第1項之組成物,其 7么 邊成分(Β) k占組成物固含量總重之1至1 〇% 。 10. 一種具有機反應官能基之無機奈米顆粒與聚隨亞胺 所形成之複材薄膜,包括聚酿亞胺、改質之雙馬來隨 =胺、以及偶合劑改質之無機奈米添加物,其中,該 聚隨亞胺分子鍵交會成有機高分子基材,偶2劑改°質 2無機奈米添加物與巴比土酸改質之馬來醯亞:寡、 聚物分子鏈結合後,再與聚酿亞胺分子鍵形成半1穿 式交聯網狀結構(Semi-IPN)。 / u·如申請專利範圍第10項之複材薄膜,其中,該改質 之雙馬來醯亞胺係為經巴比土酸改質之雙馬來醯亞貝 胺。 •=申=專利範圍第10項之複材薄膜,其中,該偶合 j =質之無機奈米添加物係為經矽烷偶合劑改質而 具$乙烯基官能基之二氧化矽奈米粉體。 13·如申請專利範圍帛12項之複材薄膜,其中,該經石夕 烧偶合劑改質而具有乙烯基官能基之二氧化石夕奈求 1知體係均勻分佈於該聚醯亞胺基材。 4·,雙層軟性銅基板,包括銅箔基材以及形成於該 =箔基材表面如申請專利範圍10項之複材薄膜。 • 1製造聚酿亞胺複材薄膜之方法,包括下列步驟: (a)使用偶合劑改質無機奈米粉體,將有機官能 19861 23 200827386 . 基導入該無機奈求粉體表面, (b)將步驟(a)所製得之改質無機奈米粉體加入 含有改質雙馬來醯亞胺之聚醯胺酸組成物溶液;以及 (c )加熱乾燥步驟(b )所製得之聚廳胺酸組成物 溶液,使聚醯胺酸高溫環化為聚醯亞胺。 1 6.如申請專利範圍第15項之方法,其中,該改質無機 奈米粉體係為經矽烷偶合劑改質而具有乙烯基官能 基之二氧化矽奈米粉體。 1 7.如申請專利範圍第15項之方法,其中,該改質無機 奈米粉體係以固含量總重之0. 5至1 5%的量添加至含 有巴比土酸改質雙馬來醯亞胺之聚醯胺酸組成物溶 液。 1 8.如申請專利範圍第15項之方法,其中,該改質雙馬 來醯亞胺係為經巴比土酸改質之雙馬來醯亞胺。 1 9· 一種製造雙層軟性銅箔基板之方法,包括下列步驟: (a) 使用偶合劑改質無機奈米粉體,將有機官能 基導入該無機奈米粉體; (b) 將步驟(a)所製得之改質無機奈米粉體加入 包含改賓雙馬來醯亞胺之聚醯胺酸組成物溶液;以及 (c) 將步驟(b)所製得之聚醯胺酸組成物溶液塗 佈於銅箔基材,加熱進行乾燥,使聚醯胺酸高溫環化 為聚醯亞胺。 20·如申請專利範圍第19項之方法,其中,該改質無機 奈米粉體係為經矽烷偶合劑改質而具有乙烯基官能 24 19861 200827386 基之二氧化矽奈米粉體。 21·如申請專利範圍第19項之方法,其中,該改質無機 奈米粉體係以固含量總重之〇· 5至i 5%的量添加至含 有巴比土酸改質雙馬來醯亞胺之聚醯胺酸組成物溶 液。 2 2 ·如申请專利範圍苐19項之方法,其中,該改質雙馬 來醯亞胺係為經巴比土酸改質之雙馬來酸亞胺。 19861 25Such as the scope of patent application. Huan silk, its towel, the inorganic nano-additives, such as antimony oxide, antimony oxide, tin oxide, lead oxide, oxygen: selenium, antimony oxide, aluminum oxide, zinc oxide, antimony oxide, boron oxide, τι gallium A nano-powder composed of a group of emulsified indium and cerium oxide. The composition of claim 1, wherein the inorganic nano-additive is cerium oxide nano-powder. The composition of the first aspect of the invention, wherein the component I (c) is a silica dioxide having a vinyl functional group modified by a decane coupling agent. : The composition of claim 1 of the scope of the patent, wherein the component (c) (d, accounting for the total weight of the solid content of the composition. 5 to j 5%. 19861 22 200827386 8. If the scope of claim 1 a composition in which the octa (B) is a bismaleimide modified by barbituric acid. 9. If the composition of the first item of the patent application has 7 components (Β) k accounted for The composition has a total solid content of 1 to 1% by weight. 10. A composite film of inorganic nanoparticle and polyimine with an organic reactive functional group, including a poly-imine, a modified double horse An inorganic nano-additive modified with an amine and a coupling agent, wherein the poly-imine molecular bond is bonded to an organic polymer substrate, and the two-agent is modified into a 2 inorganic nano-additive and a barbituric acid. Modified Malayia: After the molecular chain of the oligo-polymer is combined, it is bonded to the molecular state of the poly-imine to form a semi-IPN structure. / u·If the patent application is the 10th item The composite film, wherein the modified bismaleimide is a bismaleide modified by barbituric acid. The composite film of the item 10, wherein the coupling j = the inorganic inorganic nano-additive is a cerium oxide nano-powder having a vinyl functional group modified by a decane coupling agent. The composite film of the 帛12 item, wherein the silica-functional sulphur dioxide having a vinyl functional group is uniformly distributed on the polyimine substrate. A double-layered flexible copper substrate comprising a copper foil substrate and a composite film formed on the surface of the foil substrate as claimed in claim 10. 1. A method for producing a polyimide-based composite film comprising the following steps: The use of a coupling agent to modify the inorganic nano-powder, the organic functional group 19861 23 200827386 . base is introduced into the surface of the inorganic neat powder, (b) the modified inorganic nano-powder prepared in the step (a) is added to the modified a solution of a polymulphonic acid composition of bismaleimide; and (c) heating and drying a solution of the polyhedral acid composition prepared in the step (b) to cyclize the polyglycine to a polyimine 1 6. The method of claim 15, wherein the modification is The nano-powder system is a cerium oxide nano-powder having a vinyl functional group modified by a decane coupling agent. The method of claim 15, wherein the modified inorganic nano-powder system has a solid content A total weight of 0.5 to 1 5% is added to a solution of a polyamic acid composition containing barbituric acid modified bismaleimide. 1 8. The method of claim 15, wherein The modified bismaleimide is a bismaleimide modified by barbituric acid. 1 9· A method for manufacturing a double-layered soft copper foil substrate, comprising the following steps: (a) using even The mixture is modified into inorganic nano-powder, and the organic functional group is introduced into the inorganic nano-powder; (b) the modified inorganic nano-powder prepared in the step (a) is added to the polyfluorene containing the modified bismaleimide a solution of the amine acid composition; and (c) applying a solution of the polyamic acid composition prepared in the step (b) to a copper foil substrate, heating and drying to cyclize the polyglycine to a polypyrene amine. The method of claim 19, wherein the modified inorganic nano-powder system is a cerium oxide nano-powder having a vinyl functional group of 24 19861 200827386 modified by a decane coupling agent. 21. The method of claim 19, wherein the modified inorganic nano-powder system is added to a barley-containing acid-modified double-Malaysia with a total solid content of 〇·5 to i 5%. A solution of a polyamic acid composition of an amine. 2 2 . The method of claim 19, wherein the modified bismaleimide is a bismaleimide modified with barbituric acid. 19861 25
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WO2020199086A1 (en) * 2019-04-01 2020-10-08 律胜科技股份有限公司 Flexible display cover substrate
TWI706995B (en) * 2017-12-05 2020-10-11 財團法人工業技術研究院 Resin composition

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TWI706995B (en) * 2017-12-05 2020-10-11 財團法人工業技術研究院 Resin composition
US10941294B2 (en) 2017-12-05 2021-03-09 Industrial Technology Research Institute Resin composition
US11414545B2 (en) 2017-12-05 2022-08-16 Industrial Technology Research Institute Resin composition
WO2020199086A1 (en) * 2019-04-01 2020-10-08 律胜科技股份有限公司 Flexible display cover substrate
US11442201B2 (en) 2019-04-01 2022-09-13 Microcosm Technology Co., Ltd. Flexible display cover substrate

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