200825680 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置及系統，特別係一 卻電子元件之散熱裝置及系統。 ；冷 【先前技術】 隨著電子資訊業不斷發展，電子元件（特別 理器）運行頻率和速度在不斷提升。♦，高頻高速使電ς 兀件產生之熱量亦隨之增多，引起溫度升高，影響電子_ 件運行時之性能，為確料子元件能正常運作，^ ^ 排出其所產生之大量熱量。 、、 為此，業界通常使用散熱器對中央處理器進行散熱， 現有散熱般包括與中央處理難觸之—底座和設在'底 座上之複數散熱片，這種散熱器通常係通過增加散熱片之 總散熱，積特別係散熱器之體積來提高散熱性能滿足 越=越高之要求。但隨著電子產品不斷朝高密度封裳和多 功能方向發展’中央處理器周圍聚集越來越多之其他電子 元件，使中央處理器上之散熱器之尺寸受到極大之限制， 如，利用緊縮之空間來實現良好之散熱係業者必須面對之 問題。 【發明内容】 、有鑒於此’有必要提供一種利用電子設備内之電子元 件進行散熱之散熱裝置及系統。 種散熱裝置，用於對電子設備内之電子元件進行散 6 200825680 熱，包括與電子元件接觸之一導熱板、與該導熱板連接之 一熱管；該熱管進一步連接複數散熱鰭片，該散熱鰭片連 •接在該電子設備之殼體上。 一種散熱系統，用於對系統内之電子元件進行散熱， 該政熱系統包括一具有導熱性能之殼體，還包括與電子元 件接觸之一導熱板、與該導熱板連接之一熱管；該熱管進 一步連接複數散熱鰭片，該散熱鰭片連接在該殼體上。 # 上述散熱裝置及系統將散熱鰭片熱連接到殼體上，並 同通過熱管將導熱板之熱量傳導到殼體，充分利用殼體體 積大及直接向外散熱之優點，解決系統空間小而限制散熱 裝置之有效散熱面積之問題，有效地增加散熱裝置之總有、 效散熱面積，進而提升該散熱裝置之散熱性能。 【實施方式】 圖1至圖3示出本發明一個較佳實施例中之散熱裝置 10,該散熱裝置10用於對安裝在電路板2〇正面上之電子元 件’本實施例中為-中央處理器22進行散熱，該電路板= 安裝在-殼體如電腦之機殼動，該散熱裝置跑要包括 與中央處理H 22頂面接觸之—導熱板12、平行排列於電路 板20背面之複數散熱鰭片14和將該導熱板以這執絲 片14連接在一起之一熱管16。 — ”9 材料製成，其大致為 該電路板20安裝在底 該機殼30由導熱性能良好之金屬 一長方體，該機殼30具有一底板31。 板31上面。 7 200825680 該導熱板12—般採用銅、鋁等導熱性能良好之材料製 •成，其大致呈矩形。該導熱板12底面與中央處理器22頂面 -接觸以吸收其產生之熱量。該導熱板12内有一圓管形通道 120,該通道120位於導熱板12中間位置，用於容置熱管16。 該熱管16大致呈U形，包括一第一部分162及從該第一 部分162兩端分別垂直延伸之二第二部分164，其中一第二 部分162容置在熱導板12之通道120内並與導熱板12之通道 120焊接，或在它們之間填充導熱介質入錫膏，另一第二部 分164將這些散熱鰭片14串接在一起。 該散熱鰭片14為一矩形金屬片體，其一般採用銅、鋁 等導熱性能良好之材料製成。這些散熱鰭片14在對應之位 置上均開設穿孔140。為增大散熱鰭片14與熱管16之熱接觸 以提高熱傳導效率，該穿孔140之周緣垂直彎折延伸有環狀 摺邊142。這些散熱鰭片14排列在一起時，這些穿孔140和 摺邊142形成一容置熱管16另一第二部分164之通道，該熱 , 管16之另一第二部分164與散熱鰭片14之通道焊接，或在它 們之間填充導熱介質如錫膏。 該散熱裝置10在使用時，該導熱板12與中央處理器22 緊密接觸，散熱鰭片14平行間隔排列在電路板20與機殼30 底板31之間，該U形熱管16之一第二部分164穿置在導熱板 120中，另一第二部分164穿置在散熱鰭片14摺邊142形成之 通道内，熱管16第一部分162跨過電路板20侧邊將散熱鰭片 14及導熱板12熱連接在一起。為提高導熱效率，散熱鰭片 14可焊接在機殼30底板31上，亦可在它們之間填充導熱介 8 200825680 質如錫膏；同樣，該熱管16之兩第二部分164亦可分別與散 •熱鰭片14穿孔140形成之通道及導熱板12之通道120焊接， •或在它們之間填充導熱介質。 該散熱裝置10將散熱鰭片14熱連接到機殼30之底板31 上，並通過熱管16將導熱板12與機殼30熱連接在一起，從 而使直接與熱源接觸之導熱板12之熱量傳導到機殼，充分 利用機殼體積大、通氣好之優點，解決系統空間小而限制 散熱裝置10之有效散熱面積之問題，有效地增加散熱裝置 之總有效散熱面積，進而提升該散熱裝置之散熱性能。 可以理解，上述散熱裝置10之散熱鰭片14可以根據實 際需要設計為成各種形狀，以便與機殼30熱連接在任一閒 置空間内。另外，為進一步加強散熱，可在靠近機殼上靠 近散熱鰭片14之地方開設通風口，從而促進散熱，還可在 導熱板12上連接一具有數個散熱片之散熱器、水冷散熱裝 置等各式之散熱設備。 、很明顯本發明之應用並不局限於電腦，同樣適用於其 他電子設備，該電子設備包括一具有導熱性能之殼體，上 述散熱鰭片14與該殼體導熱連接。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 9 200825680 圖1係本發明一較佳實施例中散熱裝置之立體圖。 圖2係圖之立體分解圖。 圖3係圖1中散熱裝置之側視圖。 【主要元件符號說明】 散熱裝置 10 導熱板 12 通道 120 散熱鰭片 14 穿孔 140 摺邊 142 熱管 16 第一部分 162 第二部分 164 電路板 20 中央處理器 22 機殼 30 底板 31200825680 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device and system, and more particularly to a heat dissipating device and system for electronic components. Cold [Prior Art] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (special processors) are constantly increasing. ♦ High-frequency high-speed causes the heat generated by the electric pick-up parts to increase, causing the temperature to rise, affecting the performance of the electronic parts during operation, in order to ensure that the sub-components can operate normally, and ^ ^ discharges a large amount of heat generated. For this reason, the industry usually uses a heat sink to dissipate heat from the central processing unit. The existing heat dissipation includes a base and a plurality of heat sinks disposed on the base. The heat sink is usually added by adding heat sinks. The total heat dissipation, especially the volume of the heat sink to improve the heat dissipation performance meets the requirements of higher = higher. However, as electronic products continue to develop toward high-density and multi-functionality, 'there are more and more electronic components gathered around the central processing unit, so that the size of the heat sink on the central processing unit is greatly limited, for example, using the tightening. The space to achieve a good thermal system must face the problem. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink and system for dissipating heat using electronic components in an electronic device. The heat dissipating device is configured to dissipate the heat of the electronic component in the electronic device, including a heat conducting plate in contact with the electronic component, and a heat pipe connected to the heat conducting plate; the heat pipe further connecting a plurality of heat radiating fins, the heat radiating fin The chip connection is connected to the housing of the electronic device. A heat dissipation system for dissipating heat from electronic components in a system, the thermal insulation system including a housing having thermal conductivity, a heat conduction plate in contact with the electronic component, and a heat pipe connected to the heat conduction plate; the heat pipe Further, a plurality of heat dissipation fins are connected, and the heat dissipation fins are connected to the housing. # The heat dissipating device and the system thermally connect the heat dissipating fins to the casing, and conduct heat of the heat conducting plate to the casing through the heat pipe, thereby fully utilizing the advantages of large volume of the casing and direct heat dissipation, thereby solving the problem of small system space. The problem of limiting the effective heat dissipation area of the heat sink device effectively increases the total effective heat dissipation area of the heat sink device, thereby improving the heat dissipation performance of the heat sink device. 1 to 3 show a heat dissipating device 10 in a preferred embodiment of the present invention. The heat dissipating device 10 is used for an electronic component mounted on the front surface of the circuit board 2 in the present embodiment. The processor 22 performs heat dissipation. The circuit board is mounted on a casing such as a computer casing. The heat dissipation device runs to include a heat conduction plate 12 in contact with the top surface of the central processing unit H 22, and is arranged in parallel on the back surface of the circuit board 20. The plurality of heat dissipating fins 14 and the heat conducting plate are connected to the heat pipe 16 by the stencil 14. - "9" material, which is substantially the circuit board 20 mounted on the bottom of the casing 30 is made of a metal rectangular parallelepiped having a good thermal conductivity. The casing 30 has a bottom plate 31. The upper surface of the plate 31. 7 200825680 The heat conducting plate 12 - Generally, a material having good thermal conductivity such as copper or aluminum is used, which is substantially rectangular. The bottom surface of the heat conducting plate 12 is in contact with the top surface of the central processing unit 22 to absorb the heat generated therefrom. The heat conducting plate 12 has a circular tube shape. The channel 120 is located at an intermediate position of the heat conducting plate 12 for accommodating the heat pipe 16. The heat pipe 16 is substantially U-shaped and includes a first portion 162 and two second portions 164 extending perpendicularly from opposite ends of the first portion 162 One of the second portions 162 is received in the channel 120 of the heat guide plate 12 and soldered to the channel 120 of the heat conducting plate 12, or a heat conductive medium is filled between them into the solder paste, and the other second portion 164 is used to dissipate the heat sink fins. The heat dissipating fins 14 are made of a material having good thermal conductivity such as copper or aluminum, and the heat dissipating fins 14 are provided with perforations 140 at corresponding positions. Increase the heat sink fin 14 is in thermal contact with the heat pipe 16 to improve heat transfer efficiency, and the periphery of the through hole 140 is bent vertically to extend the annular flange 142. When the heat dissipation fins 14 are arranged together, the through holes 140 and the flange 142 form a heat pipe. 16 another second portion 164 of the passage, the heat, the other second portion 164 of the tube 16 is welded to the passage of the heat sink fin 14, or is filled with a heat conductive medium such as solder paste between the heat sink 10. The heat conducting plate 12 is in close contact with the central processing unit 22, and the heat dissipating fins 14 are arranged in parallel between the circuit board 20 and the bottom plate 31 of the casing 30. One of the second portions 164 of the U-shaped heat pipe 16 is disposed on the heat conducting plate 120. The other second portion 164 is disposed in the channel formed by the folded edge 142 of the heat dissipation fin 14. The first portion 162 of the heat pipe 16 thermally connects the heat dissipation fin 14 and the heat conduction plate 12 across the side of the circuit board 20. To improve the heat conduction efficiency, the heat dissipation fins 14 may be soldered on the bottom plate 31 of the casing 30, or may be filled with a thermal conductive material 8 200825680 as a solder paste; likewise, the second portions 164 of the heat pipe 16 may also be separated from each other. • Channels and guides formed by the perforations 140 of the fins 14 The channels 120 of the board 12 are soldered, or filled with a thermally conductive medium. The heat sink 10 thermally connects the heat sink fins 14 to the bottom plate 31 of the casing 30 and heats the heat conducting plates 12 and the casing 30 through the heat pipes 16. Connected together, so that the heat of the heat conducting plate 12 directly contacting the heat source is transmitted to the casing, and the advantages of large volume and good ventilation of the casing are utilized, and the problem that the system space is small and the effective heat dissipation area of the heat dissipating device 10 is limited is effectively solved. The heat dissipation fins of the heat dissipating device 10 can be designed into various shapes according to actual needs, so as to be thermally connected to the casing 30. In the idle space. In addition, in order to further enhance heat dissipation, a vent may be opened near the heat sink fin 14 on the casing to promote heat dissipation, and a heat sink with a plurality of heat sinks, a water cooling device, and the like may be connected to the heat conductive plate 12. Various types of heat sinks. It is obvious that the application of the present invention is not limited to a computer, and is equally applicable to other electronic devices including a housing having thermal conductivity, and the heat dissipation fins 14 are thermally connected to the housing. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS 9 200825680 FIG. 1 is a perspective view of a heat sink according to a preferred embodiment of the present invention. Figure 2 is a perspective exploded view of the figure. Figure 3 is a side elevational view of the heat sink of Figure 1. [Main component symbol description] Heat sink 10 Thermal plate 12 Channel 120 Heat sink fin 14 Perforation 140 Fold 142 Heat pipe 16 Part 1 162 Part 2 164 Circuit board 20 Central processor 22 Case 30 Backplane 31