200825578 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種液晶顯示面板、液晶顯示面板之製 作方法及液晶顯示裝置之製作方法，特別關於一種利用光 罩製程形成配向層之液晶顯示面板、液晶顯示面板之製作 方法及液晶顯示裝置之製作方法。 【先前技術】 請參閱圖1，係為習知之一種液晶顯示裝置1之剖面 示意圖，其包含一液晶顯示面板20與一設置於液晶顯示 面板20之一側之背光模組30。其中，液晶顯示面板20具 有一彩色濾光片基板21、設置於彩色濾光片基板21 —侧 之一薄膜電晶體基板22,以及設置於薄膜電晶體基板22 與彩色濾光片基板21間之一液晶層24。另外，彩色濾光 片基板21具有一基板本體211，以及設置於基板本體211 一側之一彩色濾光層212、一黑色矩陣層213、一電極層 214及一配向層215。此外，薄膜電晶體基板22具有一基 板本體221，且基板本體221係經過五道光罩製程後，而 依序於基板本體221 —侧形成一第一金屬層222、一半導 體層223、一第二金屬層224、一絕緣層225及一電極層 226，而後，再於電極層226之一側設置一配向層227。 另外，液晶層24係設置於彩色濾光片基板21之配向 層215與薄膜電晶體基板22之配向層227間，使得液晶 層24之複數液晶分子得以沿著配向層215、227之複數溝 200825578 • · 轨紋路（圖中未示）排列。 如圖2所示，薄膜電晶體基板22之基板本體221上 係形成複數資料線（data line ) 228、複數掃描線（scan line ) 229及複數薄膜電晶體（TFT) 230 (如圓形虛線處所示）。 而每相鄰2條資料線228與每相鄰2條掃描線229交錯所 一 圍繞之區域即稱為一晝素（pixel) 231。而且，基板本體 221具有一顯示區域232 (如圖中虛線區域所示）與一周 緣區域233，其中，顯示區域232係對應於薄膜電晶體基 ⑩ 板22具有該等晝素231之區域，而周緣區域233係設置 於顯示區域232周緣，而周緣區域233具有一導線層（圖 中未示）。一驅動單元D係透過一軟性電路板B與周緣區 域233之導線層電性連接，使得驅動單元D得以驅動控制 該等晝素231來顯示影像。 請參閱圖3，係為一配向層印刷裝置4之一示意圖， 接下來係說明彩色濾光片基板21之配向層215與薄膜電 晶體基板22之配向層227之製作方法。 如圖3所示，配向層印刷裝置4包含一移動平台41、 一配向材料喷嘴42、一第一滾筒43及一第二滾筒44，其 中，第二滾筒44表面設置有一凸版441。 ' 首先，係將彩色濾光片基板21製程中已形成電極層 214之基板本體211或薄膜電晶體22製程中已形成電極層 226之基板本體221放置於移動平台41上，而配向材料喷 嘴42係將配向材料滴落於第一滾筒43上，而後，第一滾 筒43係將配向材料均勻地轉印於第二滾筒44上，使得第 200825578 •，二滾筒44可依照凸版441具有之溝槽紋路將配向材料印 刷於基板本體211或221之一側而形成配向層215或227。 由上述可知，無論是彩色濾光片基板21或是薄膜電 晶體基板22，皆係必須將其基板本體211、221移至配向 層印刷裝置4方能進行印製配向層215、227之動作，使 得製作程序複雜且浪費製作時間。另外，隨著液晶面板薇 世代增加，亦即母基板尺寸增大，印刷配向材料之滚筒尺 寸亦必須隨之增大，造成操作不易且維護困難。此外，配 籲向層215、227之材質通常具有吸水與黏著之特性，使得 位於彩色遽光片基板21或是薄膜電晶體基板22周緣區域 233之配向層215、227 ’容易吸收外界水氣而晕開。除此 =外，當外界污染微粒不慎落人彩色濾光片基板Η或是 薄膜電晶體基板22時，污染微粒容易黏在配向層215、227 之中而不易移除’使得彩色據光片基板21與薄膜電晶體 基板22短路’或甚至改變了容置液晶層之間距（㈣ ❿卿）’使得液晶顯示裝置1產生邊緣黑丸（edgemura)現 象之缺因而衫響液晶顯示裝置i之產品品質 待改進。 【發明内容】 t鑑於上述課題’本發明之目的為提供一種液晶顯示 面板、液晶顯不面板之製作方法及液晶顯示裝置之製作方 法’具有製程便利、減少工時、對位容易及提高製作品質 之優點。 8 200825578 緣是，為達上述目的，依本發明之液晶顯示面板，包 含一第一基板、一第二基板及一液晶層。第一基板包含一 圖案化電極層與一圖案化配向層，而圖案化電極層包含一 第一電極部、一第二電極部以及一第一開口部，圖案化配 向層包含一配向部、一第二開口部及一第三開口部，其 ‘ 中，圖案化配向層之第二開口部與圖案化電極層之第一開 、口部相對應，圖案化配向層之第三開口部與圖案化電極層 之第一電極部相對應，圖案化配向層之配向部與圖案化電 馨 極層之第二電極部相對應。第二基板與第一基板相對設 置，液晶層夾設於第一基板與第二基板之間。 爲達上述目的，依本發明之液晶顯示面板之製作方 法，包含下列步驟：於一基板本體上設置一電極層；於電 極層上形成一配向層；於配向層上形成一圖案化光阻層， 圖案化光阻層具有一第一光阻部、一第二光阻部及一開口 部；移除對應於圖案化光阻層之開口部之電極層及配向 層，使電極層與配向層分別形成一第一開口部與一第二開 φ 口部；移除第一光阻部以及對應於第一光阻層之配向層以 露出電極層之一第一電極部；移除第二光阻部以露出配向 層並形成一第一基板；設置一第二基板於第一基板之一 ^ 側；以及設置一液晶層於第一基板與第二基板之間。 為達上述目的，依本發明之液晶顯示裝置之製作方 法，包含下列步驟：於一基板本體上形成一電極層；於電 極層上形成一配向層；於配向層上形成一圖案化光阻層， 圖案化光阻層具有一第一光阻部、一第二光阻部及一開口 200825578 部；移除對應於圖案化光阻層之開口部之電極層及配向 層，使電極層與配向層分別形成一第一開口部與一第二開 口部；移除第一光阻部以及對應於第一光阻層之配向層以 露出電極層之一第一電極部；移除第二光阻部以露出配向 層並形成一第一基板；設置一第二基板於第一基板之一 " 側；設置一液晶層於第一基板與第二基板之間以形成一液 晶顯示面板；以及設置一背光模組於液晶顯示面板之一 侧。 ⑩ 為達上述目的，依本發明所述之液晶顯示面板之製作 方法，包含下列步驟：於一基板本體上形成一電極層；於 電極層上形成一圖案化感光配向層，圖案化感光配向層具 有一第一感光配向部、一第二感光配向部及一第一開口 部；移除對應於圖案化感光配向層之第一開口部之電極 層，使電極層形成一第二開口部；移除第一感光配向部而 暴露一第一電極部並形成一第一基板；設置一第二基板於 第一基板之一側；以及設置一液晶層於第一基板與第二基 馨板之間。 為達上述目的，依本發明所述之液晶顯示裝置之製作 方法，包含下列步驟：於一基板本體上形成一電極層；於 電極層上形成一圖案化感光配向層，圖案化感光配向層具 有一第一感光配向部、一第二感光配向部及一第一開口 部；移除對應於圖案化感光配向層之第一開口部之電極 層，使電極層形成一第二開口部；移除第一感光配向部而 暴露一第一電極部以形成一第一基板；設置一第二基板於 200825578 第一基板之一侧；設置一液晶層於第一基板與第二基板之 間以形成一液晶顯示面板；以及設置一背光模組於液晶顯 示面板之一側。 承上所述，依本發明之液晶顯示面板、液晶顯示面板 之製作方法及液晶顯示裝置之製作方法，係可利用既有光 罩製程技術形成配向層或圖案化感光配向層。相較習用技 術而言，本發明之液晶顯示面板、液晶顯示面板之製作方 法及液晶顯示裝置之製作方法，確實具有簡化製程、節省 工時之優點。此外’由於配向層具有第二開口部、第三開 口部或圖案化感光配向層具有第一開口部之設置，係可改 善水氣進入而造成配向層或圖案化感光配向層暈染之缺 點，亦可改善外界污染微粒不慎落入配向層或圖案化感光 配向層可能造成邊緣黑丸(edge mura)現象之缺陷，確實可 提高液晶顯示面板及液晶顯示裝置之產品品質。 【實施方式】 以下將參照相關圖式，說明依本發明若干實施例之液 晶顯示面板、液晶顯示面板之製作方法及液晶顯示裝置之 製作方法。 首先，請參閱圖4至圖11，以說明本發明第一實施例 之液晶顯示裝置5之製作方法。 請參閱圖4，係為第一實施例之液晶顯示裝置5之製 作方法之一流程圖，其中，步驟S1至步驟S9係為本實施 例之液晶顯示裝置5製作方法之步驟。 11 200825578 請搭配圖5，於步驟S1中，於一基板本體611之一侧 形成一電極層612。於本實施例中，基板本體611係已經 過四道光罩製程而於其一側形成一第一金屬層613、一半 導體層614、一第二金屬層615及一絕緣層616，並於基 板本體611上形成一薄膜電晶體TFT。另外，電極層612 係形成於絕緣層616上，材質可為銦錫氧化物（indium tin oxide，ITO )、銦鋅氧化物(indium zinc oxide，IZO)或是多晶 石夕（polyslicon)。 請繼續參閱圖5，於步驟S2中，於電極層612上形成 一配向層/ 617。於本實施例中，配向層617之材質係為聚 亞醯胺(polyimide)，係以旋轉塗佈（spin coating)或狹縫 塗佈（slit coating)之方式將配向層617形成於電極層612 上。 如圖6所示，於步驟S3中，於配向層617上形成一 圖案化光阻層（patterned photoresist layer) 618，圖案化光 阻層618具有一第一光阻部618a、一第二光阻部618b及 一開口部618c。於本實施例中，係利用光罩製程於電極層 612之一側形成圖案化光阻層618。於此光罩製程中，係 了利用半色階光罩（halftone mask )使得圖案化光阻層 618形成第一光阻部618a、第二光阻部618b及開口部 618c，其中，第一光阻部618a之厚度係小於第二光阻部 618b之厚度。當然，若要達到第一光阻部618a之厚度係 小於第二光阻部618b之厚度，也可以利用較多製程的光 罩來達成，以加厚第二光阻部618b的厚度。當然，本發 12 200825578 明之圖案化光阻層618亦可利用兩道光罩製程分別製作第 光阻β卩618a與苐一光阻部618b，而形成第一光阻部 之厚度小於第二光阻部618b之厚度之結構。 - 如圖7所示，於步驟S4中，移除對應於圖案化光阻 ' 層618之開口部6l8c之電極層612及配向層617，使電極 層612與配向層617分別形成一第一開口部612&與_第二 開口部617a。於本實施例中，係以第一光阻部618&與第 馨 二光阻部618b當遮罩層，經蝕刻以於電極層612及配向 層617分別形成第一開口 612a及第二開口部617a。 如圖8所示，於步驟S5中，移除第一光阻部618&以 及對應第一光阻部618a之配向層617以露出電極層612 之第電極部612b。於本實施例中，係進行一臭氧灰化（ ashing)以移除第一光阻部618a，而以蝕刻方式於配向層 6Π中形成一第三開口 617b，使得電極層612之第一電極 部612b得以由第三開口 617b露出且第一電極部612b可 _ 為一導電接腳。當然，本發明亦可進行其他灰化（ashing) 方式，例如是電漿灰化，或是利用一去光阻液（ stripper)、 • 乾蝕刻法等方式來移除第一光阻部618a。另外，第二光阻 、 部618b也可能於灰化時，而導致厚度減少。 如圖9所示，於步驟S6中，移除第二光阻部618b以 暴露配向層617並形成一第一基板61。於本實施例中，係 可以灰化、去光阻液或蝕刻之方式移除第二光阻部618b， 以暴露配向層617之一配向部617c。另外，對應於第二光 阻部618b之電極層612為一第二電極部612c，且第二電 13 200825578 極部612c與配向層617之配向部617c具有相同之圖案。 此時，電極層612係形成一圖案化電極層612 ’而配向層 617係形成一圖案化配向層617。此外’本實施例之第一 基板61係以一配設有溥膜電晶體TFT之基板為例。^然’ 第一基板61亦可為一配設有彩色濾光片之基板或一整合 有彩色濾光片之薄膜電晶體基板(color filter 〇n array)。 如圖10所示，於步驟S7中，設置一第二基板62於 第一基板61之一侧。於本實施例中，第二基板62係為一 配設有彩色濾光片之基板62，且第二基板62具有一基板 本體621、一彩色濾光層622、一黑色矩陣層623、一電極 層624及一配向層625。其中，第二基板62係可利用依照 步驟S1至步驟S6之方式來形成配向層625。 請繼續參閱圖10，於步驟S8中，設置一液晶層63於 第一基板61與第二基板62之間，以形成一液晶顯示面板 60 ° 如圖11所示，於步驟S9中，設置一背光模組70於 液晶顯示面板60之一侧，以形成液晶顯示裝置5。背光模 組70係可依據實際需要而成為一直下式背光模組7〇或是 一侧光式背光模組70。 由此可見，本發明第一實施例之液晶顯示裝置5之製 作方法，於製作過程中，第一基板61 (配設有薄膜電晶體 TFT之基板）係可於既有五道光罩製程之中一併形成配向 層617。相較習用結構而言，可省略將基板本體611移至 配向印刷裝置之麻煩，確實可節省製作手續與時間。此 200825578 外，第一基板61之配向層617具有第二開口部617a與第 三開口部617b之設置，相較習用技術而言，即可避免因 水氣進入導致配向部617c暈開之問題。此外，亦可避免外 界污染微粒不慎落入配向部617c可能造成邊緣黑丸(edge mura)現象之缺陷，確實可提高液晶顯示裝置5之製作品 質。 接著，請配合參閱圖4至圖10，以說明本發明第二實 施例之液晶顯示面板60之製作方法。 於本實施例中，係利用第一實施例之步驟S1至步驟 S8之方法來製作一液晶顯示面板60，在此給予相同標號 且容不贅述。 接著，請參閱圖10，係為本發明第三實施例之液晶顯 示面板60，具有一第一基板61、一第二基板62及一液晶 層63 〇 於本實施例中，第一基板61、第二基板62及液晶層 63之結構及元件連結關係係與第一實施例之第一基板 61、第二基板62及液晶層63相同.，在此給予相同標號且 容不贅述。 接著，請配合參閱圖12至圖18，以說明本發明第四 較佳實施例之液晶顯示裝置8。 請參閱圖12,係為本發明第四較佳實施例之液晶顯示 裝置8之製造方法之一流程圖。 如圖13所示，於步驟S10中，於一基板本體811上 形成一電極層812。 15 200825578 如圖14所示，於步驟S11中，於電極層812上形成 一圖案化感光配向層（patterned photosensitive alignment layer) 813，圖案化感光配向層813具有一第一感光配向 部813a、一第二感光配向部813b及一第一開口 813c。於 本貫施例中，可先利用旋轉塗佈或狹缝塗佈之方式將圖案 化感光配向層813形成於電極層812上，且圖案化感光配 向層813之材質係為光敏性的材質，接著，圖案化感光配 向層813可再經由一半色階光罩圖案化之後，而形成第一 春感光配向部813a、第二感光配向部813b及第一開口部 813c。其中，第一感光配向部813a之厚度係小於第二感光 配向部813b之厚度。 如圖15所示，於步驟S12中，移除對應圖案化感光 配向層813之第一開口部813c之電極層812，使電極層812 形成一第二開口部812a。利用圖案化感光配向層813來圖 案化電極層812,也就是說，利用圖案化感光配向層813 ❿ 來作為遮罩層，以將電極層812形成一第一開口部812a、 第一電極部812b及一第二電極部812c。其中，第一電極 •部812\與第二電極部812M系分別對應該第一感光配向部 813a與第二感光配向部813b，且第二電極部812c與第二 感光配向部813b具有相同圖案。 如圖16所示，於步驟⑴巾，移除第—感光配向部 ' 813a—而暴露第—電極部議，以形成—第—基板μ。另 外，第一感光配向部81%係以一臭氧灰化法移除，合欽， 亦可以其他灰化法或乾餘刻法移除第—感光配田向部 16 200825578 813 a。於本實施例中，第一基板81係為一配設有薄膜電晶 體之基板。 如圖17所示，於步驟S14中，設置一第二基板82於 第一基板81之一侧。於本實施例中，第二基板82係為一 配設有彩色濾光片之基板。此外，第二基板82之配向層 821之製作方法亦可以第一基板81之製作方法製作。 再請參考圖17所示，於步驟S15中，設置一液晶層 83於第一基板81與第二基板82之間，以形成一液晶顯示 面板80。 如圖18所示，於步驟S16中，設置一背光模組90於 液晶顯示面板80之一側，以形成一液晶顯示裝置8。 由此可見，本發明第四實施例之液晶顯示裝置8之製 作方法，同樣可利用光罩製程使得圖案化感光配向層813 具有第一感光配向部813a與第二感光配向部813b，確實 可節省製作手續與時間。此外，圖案化感光配向層813具 有第一開口部813c之設置，同樣可避免因水氣進入造成圖 案化感光配向層813暈開之問題，以及外界污染微粒不慎 落入所造成之缺陷，確實可提高液晶顯示裝置8之製作品 質。 接著，請配合參閱圖12至圖17，以說明本發明第五 實施例之液晶顯示面板80之製作方法。 於本實施例中，係利用第四實施例之步驟S10至步驟 S15之方法製作液晶顯示面板80，在此給予相同標號且容 不贅述。 17 200825578 承上所述’依本發明之液晶顯不面板、液晶顯不面板 之製作方法及液晶顯示裝置之製作方法，係可利用既有光 罩製程技術形成配向層或圖案化感光配向層。相較習用技 術而言，本發明之液晶顯示面板、液晶顯示面板之製作方 法及液晶顯示裝置之製作方法，確實具有簡化製程、節省 工時之優點。此外，由於配向層具有第二開口部、第三開 口部或圖案化感光配向層具有第一開口部之設置，係可改 善水氣進入而造成配向層或圖案化感光配向層暈染之缺 點，亦可改善外界污染微粒不慎落入配向層或圖案化感光 配向層可能造成邊緣黑丸(edge mura)現象之缺陷，確實可 提高液晶顯示面板及液晶顯示裝置之產品品質。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1係為習知之液晶顯示裝置之一示意圖； 圖2係為習知之薄膜電晶體基板之一示意圖； 圖3係為習知之配向印刷裝置之一示意圖； 圖4係為本發明第一實施例之液晶顯示裝置之製作方 法之一流程圖； 圖5係為本發明第一實施例之液晶顯示裝置之製作方 法之一不意圖5係顯不基板本體設置電極層之癌樣， 圖6係為本發明第一實施例之液晶顯示裝置之製作方 18 200825578 法之一不意圖’係顯不電極層之一側設置圖案化光阻層之 態樣； 圖7係為本發明第一實施例之液晶顯示裝置之製作方 法之一示意圖，係顯示圖案化電極層與配向層之態樣； 圖8係為本發明第一實施例之液晶顯示裝置之製作方 ' 法之一示意圖，係顯示暴露第一電極部之態樣； 圖9係為本發明第一實施例之液晶顯示裝置之製作方 法之一示意圖； ⑩ 圖10係為本發明第一實施例之液晶顯示裝置之製作 方法之一示意圖，以及第二實施例與第三實施例之液晶顯 示面板之態#； 圖11係為本發明第一實施例之液晶顯示裝置之製作 方法之一示意圖，係顯示形成一液晶顯示裝置之態樣； 圖12係為本發明第四實施例之液晶顯示裝置之製作 方法之一流程圖； 圖13係為本發明第四實施例之液晶顯示裝置之製作 _ -一· 方法之*^不意圖’係顯不基板本體設置電極層之悲樣， 圖14係為本發明第四實施例之液晶顯示裝置之製作 方法之一示意圖，係顯示電極層之一侧設置圖索化感光配 向層之態樣； 圖15係為本發明第四實施例之液晶顯示裝置之製作 方法之一示意圖，係顯示圖案化電極層與圖案化感光配向 層之態樣； 圖16係為本發明第四實施例之液晶顯示裝置之製作 \ 19 200825578 方法之一示意圖，係顯示暴露第一電極部之態樣； 圖17係為本發明第四實施例之液晶顯示裝置及第五 實施例之液晶顯示面板之製作方法之一示意圖；以及 圖18係為本發明第四實施例之液晶顯示裝置之製作 方法之一示意圖，係顯示形成第四實施例之液晶顯示裝置 之態樣。200825578 IX. Description of the Invention: The present invention relates to a liquid crystal display panel, a method of fabricating a liquid crystal display panel, and a method of fabricating the liquid crystal display device, and more particularly to a liquid crystal display panel using an reticle process to form an alignment layer , a method of fabricating a liquid crystal display panel, and a method of fabricating a liquid crystal display device. [Previous Art] Referring to FIG. 1, a cross-sectional view of a conventional liquid crystal display device 1 includes a liquid crystal display panel 20 and a backlight module 30 disposed on one side of the liquid crystal display panel 20. The liquid crystal display panel 20 has a color filter substrate 21, a thin film transistor substrate 22 disposed on the side of the color filter substrate 21, and a thin film transistor substrate 22 and a color filter substrate 21. A liquid crystal layer 24. In addition, the color filter substrate 21 has a substrate body 211, a color filter layer 212 disposed on one side of the substrate body 211, a black matrix layer 213, an electrode layer 214, and an alignment layer 215. In addition, the thin film transistor substrate 22 has a substrate body 221, and the substrate body 221 is formed by a five-mask process, and a first metal layer 222, a semiconductor layer 223, and a second layer are sequentially formed on the substrate body 221 side. The metal layer 224, an insulating layer 225 and an electrode layer 226 are then provided with an alignment layer 227 on one side of the electrode layer 226. In addition, the liquid crystal layer 24 is disposed between the alignment layer 215 of the color filter substrate 21 and the alignment layer 227 of the thin film transistor substrate 22, so that the plurality of liquid crystal molecules of the liquid crystal layer 24 are along the plurality of grooves of the alignment layers 215 and 227. • · Track lines (not shown) are arranged. As shown in FIG. 2, a plurality of data lines 228, a plurality of scan lines 229, and a plurality of thin film transistors (TFTs) 230 are formed on the substrate body 221 of the thin film transistor substrate 22 (such as a circular dotted line). Shown). The area surrounded by each adjacent two data lines 228 and each adjacent two scanning lines 229 is called a pixel 231. Moreover, the substrate body 221 has a display area 232 (shown in the dashed area in the figure) and a peripheral area 233, wherein the display area 232 corresponds to the area of the thin film transistor substrate 10 having the elements 231, and The peripheral region 233 is disposed on the periphery of the display region 232, and the peripheral region 233 has a wire layer (not shown). A driving unit D is electrically connected to the wiring layer of the peripheral area 233 through a flexible circuit board B, so that the driving unit D can drive and control the pixels 231 to display images. Referring to Fig. 3, which is a schematic diagram of an alignment layer printing apparatus 4, a method of fabricating the alignment layer 215 of the color filter substrate 21 and the alignment layer 227 of the thin film transistor substrate 22 will be described. As shown in Fig. 3, the alignment layer printing device 4 includes a moving platform 41, an alignment material nozzle 42, a first roller 43 and a second roller 44, wherein a surface of the second roller 44 is provided with a relief 441. First, the substrate body 221 on which the electrode layer 226 has been formed in the substrate body 211 or the thin film transistor 22 in which the electrode layer 214 has been formed in the color filter substrate 21 process is placed on the moving platform 41, and the alignment material nozzle 42 is disposed. The alignment material is dropped onto the first roller 43, and then the first roller 43 uniformly transfers the alignment material onto the second roller 44, so that the second roller 44 can follow the groove of the relief 441. The texture prints the alignment material on one side of the substrate body 211 or 221 to form the alignment layer 215 or 227. As described above, it is understood that the color filter substrate 21 or the thin film transistor substrate 22 must be moved to the alignment layer printing device 4 to perform the operations of printing the alignment layers 215 and 227. Make the production process complicated and waste production time. In addition, as the liquid crystal panel generation increases, that is, the size of the mother substrate increases, the size of the roller for printing the alignment material must also increase, resulting in difficulty in operation and difficulty in maintenance. In addition, the materials of the alignment layers 215 and 227 generally have the characteristics of water absorption and adhesion, so that the alignment layers 215, 227 ′ located on the peripheral surface 233 of the color slab substrate 21 or the thin film transistor substrate 22 are easy to absorb external moisture. Halo. In addition to this, when the externally contaminated particles inadvertently fall on the color filter substrate or the thin film transistor substrate 22, the contaminated particles are easily adhered to the alignment layers 215, 227 and are not easily removed. The substrate 21 is short-circuited with the thin film transistor substrate 22 or even changes the distance between the liquid crystal layers ((4) ' ”), so that the liquid crystal display device 1 produces a lack of edge black film (edgemura) phenomenon, so that the product of the liquid crystal display device i Quality to be improved. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a liquid crystal display panel, a method for fabricating a liquid crystal display panel, and a method for fabricating a liquid crystal display device, which are convenient in process, reduced in man-hours, easy to align, and improved in production quality. The advantages. 8 200825578 The liquid crystal display panel according to the present invention comprises a first substrate, a second substrate and a liquid crystal layer. The first substrate comprises a patterned electrode layer and a patterned alignment layer, and the patterned electrode layer comprises a first electrode portion, a second electrode portion and a first opening portion, and the patterned alignment layer comprises an alignment portion and a a second opening portion and a third opening portion, wherein the second opening portion of the patterned alignment layer corresponds to the first opening and the opening portion of the patterned electrode layer, and the third opening portion and the pattern of the patterned alignment layer The first electrode portion of the electrode layer corresponds, and the alignment portion of the patterned alignment layer corresponds to the second electrode portion of the patterned electrode layer. The second substrate is disposed opposite to the first substrate, and the liquid crystal layer is interposed between the first substrate and the second substrate. In order to achieve the above object, a method for fabricating a liquid crystal display panel according to the present invention comprises the steps of: disposing an electrode layer on a substrate body; forming an alignment layer on the electrode layer; and forming a patterned photoresist layer on the alignment layer. The patterned photoresist layer has a first photoresist portion, a second photoresist portion and an opening portion; and the electrode layer and the alignment layer corresponding to the opening portion of the patterned photoresist layer are removed to make the electrode layer and the alignment layer Forming a first opening portion and a second opening portion respectively; removing the first photoresist portion and the alignment layer corresponding to the first photoresist layer to expose one of the first electrode portions of the electrode layer; removing the second light The resisting portion exposes the alignment layer and forms a first substrate; a second substrate is disposed on one side of the first substrate; and a liquid crystal layer is disposed between the first substrate and the second substrate. In order to achieve the above object, a method for fabricating a liquid crystal display device according to the present invention comprises the steps of: forming an electrode layer on a substrate body; forming an alignment layer on the electrode layer; and forming a patterned photoresist layer on the alignment layer. The patterned photoresist layer has a first photoresist portion, a second photoresist portion and an opening 200825578 portion; the electrode layer and the alignment layer corresponding to the opening portion of the patterned photoresist layer are removed to make the electrode layer and the alignment layer Forming a first opening portion and a second opening portion respectively; removing the first photoresist portion and the alignment layer corresponding to the first photoresist layer to expose one of the first electrode portions of the electrode layer; removing the second photoresist a portion to expose the alignment layer and form a first substrate; a second substrate disposed on one of the first substrates; a liquid crystal layer disposed between the first substrate and the second substrate to form a liquid crystal display panel; A backlight module is on one side of the liquid crystal display panel. In order to achieve the above object, a method for fabricating a liquid crystal display panel according to the present invention comprises the steps of: forming an electrode layer on a substrate body; forming a patterned photosensitive alignment layer on the electrode layer, and patterning the photosensitive alignment layer Having a first photosensitive alignment portion, a second photosensitive alignment portion and a first opening portion; removing an electrode layer corresponding to the first opening portion of the patterned photosensitive alignment layer, so that the electrode layer forms a second opening portion; Excluding a first photosensitive portion and exposing a first electrode portion and forming a first substrate; disposing a second substrate on one side of the first substrate; and disposing a liquid crystal layer between the first substrate and the second substrate . In order to achieve the above object, a method for fabricating a liquid crystal display device according to the present invention comprises the steps of: forming an electrode layer on a substrate body; forming a patterned photosensitive alignment layer on the electrode layer, wherein the patterned photosensitive alignment layer has a first photosensitive alignment portion, a second photosensitive alignment portion and a first opening portion; removing an electrode layer corresponding to the first opening portion of the patterned photosensitive alignment layer, so that the electrode layer forms a second opening portion; a first photosensitive portion to expose a first electrode portion to form a first substrate; a second substrate disposed on one side of the first substrate of 200825578; a liquid crystal layer disposed between the first substrate and the second substrate to form a a liquid crystal display panel; and a backlight module disposed on one side of the liquid crystal display panel. As described above, according to the liquid crystal display panel, the method of fabricating the liquid crystal display panel, and the method of fabricating the liquid crystal display device of the present invention, the alignment layer or the patterned photosensitive alignment layer can be formed by using the existing mask process technology. Compared with the conventional technology, the liquid crystal display panel, the method for fabricating the liquid crystal display panel, and the method for fabricating the liquid crystal display device of the present invention have the advantages of simplifying the process and saving man-hours. In addition, since the alignment layer has the second opening portion, the third opening portion or the patterned photosensitive alignment layer has the first opening portion, it can improve the ingress of moisture and cause the shortcoming of the alignment layer or the patterned photosensitive alignment layer. It can also improve the defect that the externally contaminated particles inadvertently fall into the alignment layer or the patterned photosensitive alignment layer may cause the edge mura phenomenon, which can improve the product quality of the liquid crystal display panel and the liquid crystal display device. [Embodiment] Hereinafter, a liquid crystal display panel, a method of fabricating a liquid crystal display panel, and a method of fabricating a liquid crystal display device according to some embodiments of the present invention will be described with reference to the accompanying drawings. First, referring to Figures 4 through 11, a method of fabricating the liquid crystal display device 5 of the first embodiment of the present invention will be described. Referring to Fig. 4, a flow chart of a method of fabricating the liquid crystal display device 5 of the first embodiment is shown. Steps S1 to S9 are the steps of the method for fabricating the liquid crystal display device 5 of the present embodiment. 11 200825578 In conjunction with FIG. 5, in step S1, an electrode layer 612 is formed on one side of a substrate body 611. In this embodiment, the substrate body 611 has formed a first metal layer 613, a semiconductor layer 614, a second metal layer 615, and an insulating layer 616 on one side thereof through four mask processes. A thin film transistor TFT is formed on 611. In addition, the electrode layer 612 is formed on the insulating layer 616, and the material may be indium tin oxide (ITO), indium zinc oxide (IZO) or polyslicon. Referring to FIG. 5, in step S2, an alignment layer / 617 is formed on the electrode layer 612. In the present embodiment, the material of the alignment layer 617 is polyimide, and the alignment layer 617 is formed on the electrode layer 612 by spin coating or slit coating. on. As shown in FIG. 6, in step S3, a patterned photoresist layer 618 is formed on the alignment layer 617. The patterned photoresist layer 618 has a first photoresist portion 618a and a second photoresist layer. a portion 618b and an opening portion 618c. In the present embodiment, the patterned photoresist layer 618 is formed on one side of the electrode layer 612 by a photomask process. In the mask process, the patterned photoresist layer 618 is formed into a first photoresist portion 618a, a second photoresist portion 618b, and an opening portion 618c, wherein the first light is formed by a halftone mask. The thickness of the resist portion 618a is smaller than the thickness of the second photoresist portion 618b. Of course, if the thickness of the first photoresist portion 618a is smaller than the thickness of the second photoresist portion 618b, it may be achieved by using a plurality of process masks to thicken the thickness of the second photoresist portion 618b. Of course, the patterned photoresist layer 618 of the present invention can also be used to fabricate the first photoresist layer 卩 618a and the first photoresist portion 618b by using two mask processes, and the thickness of the first photoresist portion is smaller than the second photoresist layer. The structure of the thickness of the portion 618b. - as shown in FIG. 7, in step S4, the electrode layer 612 and the alignment layer 617 corresponding to the opening portion 610c of the patterned photoresist layer 618 are removed, so that the electrode layer 612 and the alignment layer 617 form a first opening, respectively. The portion 612 & and the second opening portion 617a. In this embodiment, the first photoresist portion 618 & and the second chromonic photoresist portion 618 b are used as a mask layer, and the electrode layer 612 and the alignment layer 617 are respectively formed to form a first opening 612 a and a second opening portion. 617a. As shown in FIG. 8, in step S5, the first photoresist portion 618 & and the alignment layer 617 corresponding to the first photoresist portion 618a are removed to expose the electrode portion 612b of the electrode layer 612. In this embodiment, an ozone ashing is performed to remove the first photoresist portion 618a, and a third opening 617b is formed in the alignment layer 6Π by etching, so that the first electrode portion of the electrode layer 612 is formed. 612b is exposed by the third opening 617b and the first electrode portion 612b can be a conductive pin. Of course, the present invention can also perform other ashing methods, such as plasma ashing, or removing the first photoresist portion 618a by means of a stripper, dry etching, or the like. In addition, the second photoresist portion 618b may also be reduced in thickness when ashing. As shown in FIG. 9, in step S6, the second photoresist portion 618b is removed to expose the alignment layer 617 and form a first substrate 61. In this embodiment, the second photoresist portion 618b may be removed by ashing, photoresist removal or etching to expose one of the alignment portions 617. Further, the electrode layer 612 corresponding to the second photoresist portion 618b is a second electrode portion 612c, and the second portion 1360225578 pole portion 612c has the same pattern as the alignment portion 617c of the alignment layer 617. At this time, the electrode layer 612 forms a patterned electrode layer 612' and the alignment layer 617 forms a patterned alignment layer 617. Further, the first substrate 61 of the present embodiment is exemplified by a substrate on which a bismuth film transistor TFT is disposed. The first substrate 61 can also be a substrate provided with a color filter or a color filter 整合n array integrated with a color filter. As shown in Fig. 10, in step S7, a second substrate 62 is disposed on one side of the first substrate 61. In this embodiment, the second substrate 62 is a substrate 62 provided with a color filter, and the second substrate 62 has a substrate body 621, a color filter layer 622, a black matrix layer 623, and an electrode. Layer 624 and an alignment layer 625. Wherein, the second substrate 62 can form the alignment layer 625 by means of the steps S1 to S6. Referring to FIG. 10, in step S8, a liquid crystal layer 63 is disposed between the first substrate 61 and the second substrate 62 to form a liquid crystal display panel 60°. As shown in FIG. 11, in step S9, a The backlight module 70 is on one side of the liquid crystal display panel 60 to form the liquid crystal display device 5. The backlight module 70 can be a continuous backlight module 7 or a side backlight module 70 according to actual needs. Thus, in the manufacturing method of the liquid crystal display device 5 of the first embodiment of the present invention, the first substrate 61 (the substrate provided with the thin film transistor TFT) can be formed in the process of the existing five masks during the manufacturing process. The alignment layer 617 is formed together. Compared with the conventional structure, the trouble of moving the substrate body 611 to the alignment printing device can be omitted, and the manufacturing procedure and time can be saved. Further, in addition to 200825578, the alignment layer 617 of the first substrate 61 has the arrangement of the second opening portion 617a and the third opening portion 617b, and the problem that the alignment portion 617c is smudged due to the entry of moisture can be avoided as compared with the conventional technique. In addition, it is also possible to prevent the external contamination particles from falling into the alignment portion 617c, which may cause defects in the edge mura phenomenon, and the quality of the liquid crystal display device 5 can be improved. Next, please refer to Figs. 4 to 10 to explain a method of fabricating the liquid crystal display panel 60 of the second embodiment of the present invention. In the present embodiment, a liquid crystal display panel 60 is fabricated by the method of the step S1 to the step S8 of the first embodiment, and the same reference numerals are used herein. Next, referring to FIG. 10, a liquid crystal display panel 60 according to a third embodiment of the present invention has a first substrate 61, a second substrate 62, and a liquid crystal layer 63. In this embodiment, the first substrate 61, The structure and the element connection relationship of the second substrate 62 and the liquid crystal layer 63 are the same as those of the first substrate 61, the second substrate 62, and the liquid crystal layer 63 of the first embodiment. The same reference numerals are used herein and will not be described again. Next, please refer to Figs. 12 to 18 to explain the liquid crystal display device 8 of the fourth preferred embodiment of the present invention. Referring to Figure 12, there is shown a flow chart of a method of fabricating a liquid crystal display device 8 according to a fourth preferred embodiment of the present invention. As shown in FIG. 13, in step S10, an electrode layer 812 is formed on a substrate body 811. 15200825578 As shown in FIG. 14, in step S11, a patterned photosensitive alignment layer 813 is formed on the electrode layer 812, and the patterned photosensitive alignment layer 813 has a first photosensitive alignment portion 813a, a first The second photosensitive alignment portion 813b and a first opening 813c. In the present embodiment, the patterned photosensitive alignment layer 813 may be formed on the electrode layer 812 by spin coating or slit coating, and the material of the patterned photosensitive alignment layer 813 is a photosensitive material. Next, the patterned photosensitive alignment layer 813 can be patterned by the half-tone mask to form the first spring photosensitive alignment portion 813a, the second photosensitive alignment portion 813b, and the first opening portion 813c. The thickness of the first photosensitive alignment portion 813a is smaller than the thickness of the second photosensitive alignment portion 813b. As shown in Fig. 15, in step S12, the electrode layer 812 of the first opening portion 813c corresponding to the patterned photosensitive alignment layer 813 is removed, so that the electrode layer 812 forms a second opening portion 812a. The electrode layer 812 is patterned by using the patterned photosensitive alignment layer 813, that is, the patterned photosensitive alignment layer 813 ❿ is used as a mask layer to form the electrode layer 812 into a first opening portion 812a and a first electrode portion 812b. And a second electrode portion 812c. The first electrode portion 812\ and the second electrode portion 812M respectively correspond to the first photosensitive alignment portion 813a and the second photosensitive alignment portion 813b, and the second electrode portion 812c and the second photosensitive alignment portion 813b have the same pattern. As shown in FIG. 16, in the step (1), the first photosensitive alignment portion '813a' is removed, and the first electrode portion is exposed to form a -first substrate μ. In addition, the first photosensitive alignment portion 81% is removed by an ozone ashing method, and the other ashing method or the dry residual method may be used to remove the first photosensitive field portion 16 200825578 813 a. In the present embodiment, the first substrate 81 is a substrate provided with a thin film transistor. As shown in Fig. 17, in step S14, a second substrate 82 is disposed on one side of the first substrate 81. In the embodiment, the second substrate 82 is a substrate provided with a color filter. Further, the method of fabricating the alignment layer 821 of the second substrate 82 can also be fabricated by the method of fabricating the first substrate 81. Referring to FIG. 17, in step S15, a liquid crystal layer 83 is disposed between the first substrate 81 and the second substrate 82 to form a liquid crystal display panel 80. As shown in FIG. 18, in step S16, a backlight module 90 is disposed on one side of the liquid crystal display panel 80 to form a liquid crystal display device 8. It can be seen that the manufacturing method of the liquid crystal display device 8 of the fourth embodiment of the present invention can also utilize the photomask process so that the patterned photosensitive alignment layer 813 has the first photosensitive alignment portion 813a and the second photosensitive alignment portion 813b, which can save money. Production procedures and time. In addition, the patterned photosensitive alignment layer 813 has the arrangement of the first opening portion 813c, which can also avoid the problem that the patterned photosensitive alignment layer 813 is fainted due to moisture ingress, and the defects caused by the inadvertent leakage of externally contaminated particles. The manufacturing quality of the liquid crystal display device 8 can be improved. Next, please refer to FIG. 12 to FIG. 17 to explain a method of fabricating the liquid crystal display panel 80 of the fifth embodiment of the present invention. In the present embodiment, the liquid crystal display panel 80 is manufactured by the method of the step S10 to the step S15 of the fourth embodiment, and the same reference numerals will be given thereto. 17 200825578 According to the above description, the liquid crystal display panel, the liquid crystal display panel manufacturing method and the liquid crystal display device manufacturing method can form the alignment layer or the patterned photosensitive alignment layer by using the existing mask process technology. Compared with the conventional technology, the liquid crystal display panel, the method for fabricating the liquid crystal display panel, and the method for fabricating the liquid crystal display device of the present invention have the advantages of simplifying the process and saving man-hours. In addition, since the alignment layer has the second opening portion, the third opening portion or the patterned photosensitive alignment layer has the first opening portion, the difference of the entry of the moisture into the alignment layer or the patterned photosensitive alignment layer can be improved. It can also improve the defect that the externally contaminated particles inadvertently fall into the alignment layer or the patterned photosensitive alignment layer may cause the edge mura phenomenon, which can improve the product quality of the liquid crystal display panel and the liquid crystal display device. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional liquid crystal display device; FIG. 2 is a schematic view of a conventional thin film transistor substrate; FIG. 3 is a schematic view of a conventional alignment printing device; FIG. 5 is a flowchart of a method for fabricating a liquid crystal display device according to a first embodiment of the present invention; FIG. 5 is a diagram showing a method for fabricating a liquid crystal display device according to a first embodiment of the present invention. 6 is a manufacturing method of a liquid crystal display device according to a first embodiment of the present invention. 18 200825578 One of the methods is not intended to provide a patterned photoresist layer on one side of the display electrode layer; A schematic diagram of a method for fabricating a liquid crystal display device according to a first embodiment of the present invention, showing a pattern of a patterned electrode layer and an alignment layer; FIG. 8 is a diagram of a method for fabricating a liquid crystal display device according to a first embodiment of the present invention. FIG. 9 is a schematic view showing a method of fabricating a liquid crystal display device according to a first embodiment of the present invention; FIG. 10 is a view showing a liquid according to a first embodiment of the present invention; FIG. 11 is a schematic view showing a method of fabricating a liquid crystal display device according to a first embodiment of the present invention; FIG. 11 is a schematic view showing a method of fabricating a liquid crystal display device according to a first embodiment of the present invention; FIG. 12 is a flow chart showing a method of fabricating a liquid crystal display device according to a fourth embodiment of the present invention; FIG. 13 is a diagram of a liquid crystal display device according to a fourth embodiment of the present invention. The method of the method is not a schematic diagram of the electrode layer of the substrate body. FIG. 14 is a schematic view showing a method of fabricating the liquid crystal display device according to the fourth embodiment of the present invention. FIG. 15 is a schematic view showing a method of fabricating a liquid crystal display device according to a fourth embodiment of the present invention, showing a pattern electrode layer and a patterned photosensitive alignment layer; FIG. 16 is Manufacture of a liquid crystal display device according to a fourth embodiment of the present invention\19 200825578 A schematic diagram showing a state in which a first electrode portion is exposed; FIG. 17 is a fourth embodiment of the present invention. A schematic diagram of a liquid crystal display device and a method for fabricating the liquid crystal display panel of the fifth embodiment; and FIG. 18 is a schematic view showing a method of fabricating the liquid crystal display device according to the fourth embodiment of the present invention, showing the liquid crystal of the fourth embodiment. The aspect of the display device.
元件符號說明： 1 液晶顯示裝置 20 液晶顯不面板 21 彩色濾、光片基板 211 基板本體 212 彩色濾光層 213 黑色矩陣層 214 電極層 215 配向層 22 薄膜電晶體基板 221 基板本體 222 第一金屬層 223 半導體層 224 第二金屬層 225 絕緣層 226 電極層 227 配向層 20 200825578 228 資料線 i 229 掃描線 230 薄膜電晶體 231 晝素 232 顯示區域 233 周緣區域 24 液晶層 30 背光模組 4 配向層印刷裝置 41 移動平台 42 配向材料噴嘴 43 第一滾筒 44 第二滚筒 441 凸版 5 液晶顯示裝置 60 液晶顯不面板 61 第一基板 611 基板本體 612 圖案化電極層 612a 第一開口部 612b 第一電極部 612c 第二電極部 613 第一金屬層 614 半導體層 21 200825578 615 616 617 617a 617b 617c 618 618a • 618b 618c 62 621 622 623 624 625 63 70 :8 80 81 811 812 812a 第二金屬層 絕緣層 圖案化配向層 第二開口部 第三開口部 配向部 圖案化光阻層 第一光阻部 第二光阻部 開口部 第二基板 基板本體 彩色濾光層 黑色矩陣層 電極層 配向層 液晶層 背光模組 液晶顯不裝置 液晶顯不面板 第一基板 基板本體 電極層 第一開口 22 200825578 812b 第一電極部 812c 第二電極部 813 圖案化感光配向層 813a 第一感光配向部 813b 第二感光配向部 813c 第一開口部 82 第二基板 821 配向層 83 液晶層 90 背光模組 B 軟性電路板 D 驅動單元 TFT 薄膜電晶體 S1-S16 製作液晶顯示裝置之步驟DESCRIPTION OF REFERENCE NUMERALS 1 liquid crystal display device 20 liquid crystal display panel 21 color filter, light substrate 211 substrate body 212 color filter layer 213 black matrix layer 214 electrode layer 215 alignment layer 22 thin film transistor substrate 221 substrate body 222 first metal Layer 223 semiconductor layer 224 second metal layer 225 insulating layer 226 electrode layer 227 alignment layer 20 200825578 228 data line i 229 scan line 230 thin film transistor 231 pixel 232 display area 233 peripheral area 24 liquid crystal layer 30 backlight module 4 alignment layer Printing device 41 moving platform 42 alignment material nozzle 43 first roller 44 second roller 441 relief 5 liquid crystal display device 60 liquid crystal display panel 61 first substrate 611 substrate body 612 patterned electrode layer 612a first opening portion 612b first electrode portion 612c second electrode portion 613 first metal layer 614 semiconductor layer 21 200825578 615 616 617 617a 617b 617c 618 618a • 618b 618c 62 621 622 623 624 625 63 70 : 8 80 81 811 812 812a second metal layer insulating layer patterned alignment Layer second opening portion third opening portion alignment portion Patterned photoresist layer first photoresist portion second photoresist portion opening portion second substrate substrate body color filter layer black matrix layer electrode layer alignment layer liquid crystal layer backlight module liquid crystal display device liquid crystal display panel first substrate substrate Main electrode layer first opening 22 200825578 812b First electrode portion 812c Second electrode portion 813 Patterned photosensitive alignment layer 813a First photosensitive alignment portion 813b Second photosensitive alignment portion 813c First opening portion 82 Second substrate 821 Alignment layer 83 Liquid crystal Layer 90 Backlight Module B Flexible Circuit Board D Drive Unit TFT Thin Film Transistor S1-S16 Steps for Making Liquid Crystal Display Device
23twenty three