TW200822850A - Heat conduction structure - Google Patents
Heat conduction structure Download PDFInfo
- Publication number
- TW200822850A TW200822850A TW95142029A TW95142029A TW200822850A TW 200822850 A TW200822850 A TW 200822850A TW 95142029 A TW95142029 A TW 95142029A TW 95142029 A TW95142029 A TW 95142029A TW 200822850 A TW200822850 A TW 200822850A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- particulate matter
- heat transfer
- transfer structure
- colloid
- Prior art date
Links
- 239000007788 liquid Substances 0.000 claims abstract description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract 2
- 239000013618 particulate matter Substances 0.000 claims description 37
- 238000012546 transfer Methods 0.000 claims description 28
- 239000000084 colloidal system Substances 0.000 claims description 24
- 239000002904 solvent Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 15
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229920006335 epoxy glue Polymers 0.000 claims description 4
- 239000011236 particulate material Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 230000001788 irregular Effects 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 239000012798 spherical particle Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 claims 1
- 150000002118 epoxides Chemical class 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 150000002739 metals Chemical group 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 239000011859 microparticle Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 3
- 238000001802 infusion Methods 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 108010068370 Glutens Proteins 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000021312 gluten Nutrition 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95142029A TW200822850A (en) | 2006-11-14 | 2006-11-14 | Heat conduction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95142029A TW200822850A (en) | 2006-11-14 | 2006-11-14 | Heat conduction structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200822850A true TW200822850A (en) | 2008-05-16 |
| TWI307262B TWI307262B (enrdf_load_html_response) | 2009-03-01 |
Family
ID=44770878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95142029A TW200822850A (en) | 2006-11-14 | 2006-11-14 | Heat conduction structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200822850A (enrdf_load_html_response) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110243216A (zh) * | 2018-03-09 | 2019-09-17 | 双鸿电子科技工业(昆山)有限公司 | 均温板及其制造方法 |
| CN112732047A (zh) * | 2020-12-22 | 2021-04-30 | 宝鸡文理学院 | 一种具有散热功能的计算机网络安全处理器 |
-
2006
- 2006-11-14 TW TW95142029A patent/TW200822850A/zh not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110243216A (zh) * | 2018-03-09 | 2019-09-17 | 双鸿电子科技工业(昆山)有限公司 | 均温板及其制造方法 |
| CN110243216B (zh) * | 2018-03-09 | 2024-06-07 | 双鸿电子科技工业(昆山)有限公司 | 均温板及其制造方法 |
| CN112732047A (zh) * | 2020-12-22 | 2021-04-30 | 宝鸡文理学院 | 一种具有散热功能的计算机网络安全处理器 |
| CN112732047B (zh) * | 2020-12-22 | 2023-03-21 | 宝鸡文理学院 | 一种具有散热功能的计算机网络安全处理器 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI307262B (enrdf_load_html_response) | 2009-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |