200822008 九、發明說明 【發明所屬之技術領域】 本發明是有關於一種可撓性電路板，且特別是有關於一 種具有至少二種間隔（pitch)之導線（Channel)的可撓性電路 板，可應用在平面顯示裝置上。 【先前技術】 - 隨著平面顯示技術的蓬勃發展，再加上平面顯示器具有 f 重量輕且體積薄小等優勢，平面顯示器已成為目前顯示設備 的市場主流。一般常見之平面顯示器包括液晶顯示器（LCD)以 及電漿顯示器。 目鈾’為因應平面顯示器之高解析度的需求以及各製造 廠所推行之降低成本（Cost Down)政策，捲帶自動接合（Tape Automated Bonding ·，TAB)/覆晶薄膜（Chip 〇n Film ; c〇F)之多 重導線（Multi-channel)接合技術已成為趨勢。TAB/c〇F多重導 線之概念為相同寬度之TAB/C0F帶包含更多之導線，因此每 U 一導線相對應之間隔必須縮小。於是，為增加可佈置之導線 數量，一般係採用細間隔（Fine Pitch)方式（通常間隔< m 來設置導線。 . ^照第1圖’其係纷示傳統覆晶薄膜/捲帶自動接合帶 上之導線的佈置示意圖。覆晶磕贈 ^ 帶自動接合帶100主要 係由T狀基板1 02、積體電路丨〇4、 ^ ^ ^ , υ4數條輸入導線10ό以及數 條輸出導線108所構成。一私而^ ^ 般而吕，積體電路104大都設在 I板102之中央區域上， ^ 上而輸入導線10ό與輸出導線108則 200822008 通常分別接合在積體電路104之相對二側的基板1〇2上，且 延伸至基板1 02之側邊邊緣。 目前，輸入導線106與輸出導線108均係以固定間隔的 方式排列。請參照第2圖，其係繪示第1圖之輸出導線之放 大示意圖。在第2圖中，於基板1〇2上佈置輸出導線1〇8時， 係以相同間隔方式進行排列，因此每個輸出導線i 〇8具有之 間隔110均相同。 間隔縮小則相對應之製程精度的需求則更高，其令製程 ，度包括TAB/COF帶之製程精度與液晶模組（LCM)之對位壓 著精度。若採用一般細間隔方式來佈置導線，必須提高 TAB/COF本身之製作精度，如此將會造成帶製作以 及液晶模組製程精度的挑戰。 【發明内容】 因此’本發明之目的就是在提供_種可撓性電路板，其 在現仃之導線製作精度下，設置至少二組具不同間隔的導 線，而可在製程限制下，大幅增加可佈置之導線數量。 、本發明之另一目的是在提供一種平面顯示面板，其可在 不、加製私成本負擔與預設精度下，於一定寬度之可撓性電 路板内叹置更多之導線，有助於可撓性電路板接合技術應用 在實際產品中，有效提升平面顯示面板之產品良率。 本lx明之又一目的是在提供一種平面顯示裝置，其可在 固定寬度之可撓性電路板上設置更多導線，因此可提高平面 顯示裝置之解析度，而獲得較佳之顯示品質。 6 200822008 根據本發明之上述目的，提出一種可撓性電路板，適用 於一平面顯示裝置，其中此可撓性電路板至少包括：—可撓 性基板；一積體電路，設於可撓性基板上；一輸入導線組， 設於積體電路之一側的可撓性基板上，並與積體電路電性連 接，及至少二輸出導線組，相鄰而設於可撓性基板上並與積 體電路電性連接’其中這些輸出導線組係以不同之間隔進行 排列。 〜 根據本發明之目的，另外提出一種平面顯示面板，至少 ^括：-玻璃基板，其中玻璃基板之周邊上設有複數個接觸 端子；一平面顯示單元，設於玻璃基板上；以及複數個可撓 性電路板，接合在玻璃基板之周邊上。其中，每一可撓性； 路板至夕包括.-可撓性基板；-積體電路，設於可撓性美 板上；-輸入導線組’設於積體電路之一側的可撓性基板二 並與積體電路電性連接；以及至少二輸出導線組，相鄰而設 ::撓，基板上並與積體電路電性連接，且每一輸出導線組 個輸出導線分料應電性連接前述接觸端子，其中 迫些輸出導線組係以不同之間隔進行排列。 :據本發明之另一目的，更提出一種平面顯示裝置，至 V匕括一平面顯示面板、一北 ^ 月光模組，設於平面顯示面 ^ ^ m . 至夕包括·一玻璃基板，其中玻 ^ ^ , 接觸^子，一平面顯示單元，設 於玻璃基板上；以及複數 之周邊上m = w性電路板，接合在玻璃基板 ^ 70 14電路板至少包括：一可撓性基 板’積體電路’設於可Μ把苴4cr 凡丨生基板上；一輸入導線組，設於 7 200822008 連接； 與積體 線分別 係以不 具有最 輸出導 具有最 積體電路之—側的可撓性基板上，並與積體電路電性 以及至少二輪出導線組，相鄰而設於可撓性基板上 電路電性i表4^ ^ 接’且母一輸出導線組包括複數個 對應電性連接μ^ 建接上述之接觸端子，其中這些輸出導線组 同之間隔進行排列。 、 依照本發明一較佳實施例，上述之輸出導線組中 网之者0又於可撓性基板之一側的中央區域，而 線組中具有次小間隔之—者鄰設於這些輪出導線組中 小間‘隔者的二側。 【實施方式] 本發明揭露一種可撓性電路板及其在平面顯示裝置上之 應用，可在現行最佳製作精度下，於固^寬度之基板上，設 置更多之導線’因此可進一步提高平面顯示裝置之解析度， 亚降低生產成本。為了使本發明之敘述更加詳盡與完備，可 參照下列描述並配合第3圖至第5圖之圖示。 請參照第3圖，其繪示依照本發明—較佳實施例的—種 可撓性電路板之上視示意圖。本發明之可撓性電路板細可 例如為覆晶薄膜帶（C0F tape)或捲帶自動接合帶（ταβ匕㈣， 而可適用於-般平面顯示裝置’例如液晶顯示器或電衆顯示 器等之平面顯示才莫組與外部訊號之電性接合介自。可撓性電 路板200主要包括可撓性基板繼、積體電路2〇4、輸入導線 206以及輸出導線2〇8,其中積體電路咖—般可為驅動積體 電路，以驅動平面顯示模組等顯示單元。積體電路綱通常 200822008 5又於可撓性基板202之_心區域，而輪入導線寫 線208則通常係分別設於積體電路2〇4之二側的可換拓 2〇2上，其中，這些輸入導線寫與輸出導線2〇8之—端= 積體電路204接合而形成電性連接，而另一端則分別朝可撓 性基板202的二側邊延伸。對於平面顯示裝置而言，i ^ L電之路數板曰所需之輸入導線2〇6之數量通常遠“ 08之數！少。因此，本發明提出一種新導線佈局方式 現行導線佈置之最佳製作精度下’於固定寬度之 上設置更多之輸出導線。 ·"攸 對於可撓性電路板200，例如TAB帶或c〇F帶等 :’於固定寬度之導線佈置區域下’配合現行平面顯示模組 衣程的需求’佈置不同間隔之導線時，所對應之可撓性電路 板200的導線製作精度不同，亦即可撓性電路板_的可容 許總誤差率（T〇tal Pitch Tolera叫不同。在此可容許總誤差率 定義為可容許之總間隔誤差與可佈置導線區域之寬产的比 值…般而言’假如可撓性電路板之導線佈置設計之^差 率’大於該導線間隔所對應之可容許總誤差率，則可能 後續製程良率降低。舉例而言，在可撓性電路& 2〇〇之導線 的可佈置區域為28 mm下，可撓性電路板⑽200822008 IX. Description of the Invention The present invention relates to a flexible circuit board, and more particularly to a flexible circuit board having at least two pitch channels. Can be applied to flat display devices. [Prior Art] - With the rapid development of flat panel display technology and the advantages of flat panel display with light weight and small size, flat panel display has become the mainstream market for display devices. Commonly used flat panel displays include liquid crystal displays (LCDs) and plasma displays. MU's response to the high resolution requirements of flat panel displays and the Cost Down policy implemented by various manufacturers, Tape Automated Bonding (TAB)/Chip 〇n Film; The multi-channel bonding technique of c〇F) has become a trend. The concept of the TAB/c〇F multiple wire is that the TAB/C0F band of the same width contains more wires, so the interval corresponding to each U wire must be reduced. Therefore, in order to increase the number of wires that can be arranged, the Fine Pitch method is generally used (usually the interval < m is used to set the wires. ^ According to Figure 1), the conventional flip chip/reel automatic bonding Schematic diagram of the arrangement of the conductors on the belt. The flip-chip gift belt automatic bonding tape 100 is mainly composed of a T-shaped substrate 102, an integrated circuit 丨〇4, ^^^, υ4 number of input wires 10ό and a plurality of output wires 108 The composition circuit 104 is mostly disposed on the central area of the I board 102, and the input line 10ό and the output line 108 are respectively connected to the opposite side of the integrated circuit 104 in 200822008. The substrate 1〇2 on the side extends to the side edge of the substrate 102. Currently, the input wire 106 and the output wire 108 are arranged at a fixed interval. Referring to FIG. 2, it is shown in FIG. An enlarged view of the output wires. In Fig. 2, when the output wires 1〇8 are arranged on the substrate 1〇2, they are arranged in the same interval, so that each of the output wires i 〇8 has the same interval 110. The interval is reduced, the corresponding process The demand for precision is higher, which makes the process, including the process precision of the TAB/COF tape and the alignment accuracy of the liquid crystal module (LCM). If the wire is arranged in a fine interval, the TAB/COF itself must be improved. The manufacturing precision, which will cause challenges in the manufacturing process of the tape and the precision of the process of the liquid crystal module. [The present invention] Therefore, the object of the present invention is to provide a flexible circuit board which is manufactured under the precision of the current wire. At least two sets of wires having different intervals are disposed, and the number of wires that can be arranged can be greatly increased under the limitation of the process. Another object of the present invention is to provide a flat display panel, which can be burdened with no private cost. With preset accuracy, sigh more wires in a flexible circuit board of a certain width, which helps the flexible circuit board bonding technology to be applied in actual products, effectively improving the product yield of the flat display panel. Another object of the invention is to provide a flat display device which can provide more wires on a flexible circuit board of a fixed width, thereby improving the solution of the flat display device. According to the above object of the present invention, a flexible circuit board is proposed, which is suitable for a flat display device, wherein the flexible circuit board comprises at least: a flexible substrate; The integrated circuit is disposed on the flexible substrate; an input wire group is disposed on the flexible substrate on one side of the integrated circuit, and is electrically connected to the integrated circuit, and at least two output wire groups are adjacent to each other. And disposed on the flexible substrate and electrically connected to the integrated circuit. The output lead sets are arranged at different intervals. 〜 According to the purpose of the present invention, a flat display panel is additionally proposed, at least: - glass a substrate, wherein a plurality of contact terminals are disposed on a periphery of the glass substrate; a flat display unit is disposed on the glass substrate; and a plurality of flexible circuit boards are bonded on the periphery of the glass substrate. Wherein, each flexible; the road board includes: a flexible substrate; an integrated circuit disposed on the flexible color plate; - the input wire group is disposed on one side of the integrated circuit The substrate is electrically connected to the integrated circuit; and at least two output wires are disposed adjacent to each other:: the substrate is electrically connected to the integrated circuit, and each of the output wires is outputted. The foregoing contact terminals are electrically connected, wherein the output conductor sets are arranged at different intervals. According to another object of the present invention, a flat display device is further provided, which comprises a flat display panel and a north moonlight module, which are disposed on the flat display surface, and include a glass substrate. Glass ^ ^ , contact ^ , a flat display unit, disposed on the glass substrate; and a plurality of m = w circuit boards on the periphery of the plurality, bonded to the glass substrate ^ 70 14 circuit board at least includes: a flexible substrate 'product The body circuit 'is set on the 苴 4cr 丨 丨 ; ; ; ; ; ; ; ; ; ; cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr cr On the substrate, and the electrical circuit of the integrated circuit and at least two turns of the wire set, adjacent to the circuit on the flexible substrate, the electrical conductivity of the circuit is shown in FIG. 4 and the female output wire set includes a plurality of corresponding electrical properties. The connection μ is connected to the above contact terminals, wherein the output conductor groups are arranged at intervals. According to a preferred embodiment of the present invention, the net 0 of the output wire group is in the central region on one side of the flexible substrate, and the second smallest interval in the line group is adjacent to the rounds. The small side of the wire group is the two sides of the compartment. [Embodiment] The present invention discloses a flexible circuit board and its application to a flat display device, which can provide more wires on a substrate having a fixed width under the current optimum fabrication precision, thereby further improving The resolution of the flat display device reduces the production cost. In order to make the description of the present invention more detailed and complete, reference is made to the following description in conjunction with the drawings of Figures 3 through 5. Referring to Figure 3, there is shown a top plan view of a flexible circuit board in accordance with the present invention. The flexible circuit board of the present invention can be, for example, a CF tape or a tape automatic bonding tape (ταβ匕(4), and can be applied to a general-purpose display device such as a liquid crystal display or an electric display. The flexible display circuit board 200 mainly includes a flexible substrate, an integrated circuit 2〇4, an input wire 206, and an output wire 2〇8, wherein the integrated circuit is integrated with the external signal. The coffee maker can drive the integrated circuit to drive a display unit such as a flat display module. The integrated circuit is usually in the center of the flexible substrate 202, and the rounded wire write line 208 is usually The two sides of the integrated circuit 2〇4 are provided on the replaceable extension 2〇2, wherein the input wires are written and connected to the output terminal 2〇8=the integrated circuit 204 to form an electrical connection, and the other end is connected. Then extending toward the two sides of the flexible substrate 202. For a flat display device, the number of input wires 2〇6 required for the number of plates of the i ^ L circuit is usually far less than the number of 08; therefore, The invention proposes a new wire layout method The best manufacturing precision of the line arrangement is to set more output wires above the fixed width. ·"攸For flexible circuit boards 200, such as TAB tapes or c〇F tapes, etc.: 'Wire arrangement at fixed width When the wires of different spacings are arranged under the area of 'the requirements of the current flat display module clothing process', the corresponding precision of the wire manufacturing of the flexible circuit board 200 is different, that is, the allowable total error rate of the flexible circuit board _ (T〇tal Pitch Tolera is different. The total allowable error rate is defined here as the ratio of the allowable total spacing error to the wide yield of the configurable conductor area... as in the case of a flexible circuit board layout design. The difference rate 'is greater than the allowable total error rate corresponding to the wire interval, and the subsequent process yield may be lowered. For example, in the configurable area of the flexible circuit & Flexible circuit board (10)
差率與所^應之導線卩一所示 奋开μ决 可容許總^^率 9 200822008The difference between the rate and the line of the wire should be shown in the first step. The total rate can be tolerated. 9 200822008
如上表-所示，隨著導線間隔的縮小，為了避 生 成後續製程對位誤差使得相鄰導線短路的情況，故所能容= 之：撓性電路板的總誤差率就愈小。因此，本發明根據導線 間Ik與可撓性f路板之製作精度的對應關係，將導線以非單 間隔的方式進仃排列，以於現行之可挽性電路板的製作精As shown in the above table, as the wire spacing is reduced, in order to avoid the subsequent process alignment error, the adjacent wires are short-circuited, so that the total error rate of the flexible circuit board is smaller. Therefore, according to the corresponding relationship between the manufacturing precision of the inter-wire Ik and the flexible f-way board, the present invention arranges the wires in a non-single-space manner to facilitate the fabrication of the current disposable circuit board.
度與平面顯示模組的對位壓著精度下，對應增加可撓性電路 板之多重導線的數量的需求。 口月多…、第4圖，在本較佳實施例中，這些輸出導線2〇8 至少分成二導線組210與212，其中導線組21〇包括數個導線 208a，導線組212包括數個導線2〇8b。這些導線2〇8a與2〇讣 之一端均與積體電路2〇4電性連接，而另一端則延伸至可撓 性基板202之一側邊上。導線組21〇設於可撓性基板2〇2之 側的中央區域，而導線組212則平均鄰設於導線組21 〇之 一側’如第4圖所示。導線組21〇之導線2〇8a以使每一導線 208a具有間隔214a的方式來進行排列，而導線組2丨2之導線 208b則以使每一導線208b具有間隔214b的方式來進行排 列。其中，導線組21 〇之間隔2丨4a不同於導線組212之間隔 214b ’且間隔214a對應於一製作精度，間隔214b則對應於 另一製作精度。此外，位於可撓性基板2〇2之一側邊中央區 的導線組210的間隔214a小於位於兩旁之導線組212的間隔 214b。 在本實施例中，於可撓性基板202上佈置導線組2 1 0與 200822008 212時，導線2〇8&與2〇813均係在一預設精度下進行設置，其 中導線2G8a之間隔214a所對應之製作精度較此預設精度高， 而導線208b之間隔2l4b所對應之製作精度即為此預設精 在 κ土貝施例中，上述之預設精度為製作可撓性電路 板的現行最佳製作精度，即現行可量產而符合平面顯示模組 衣=而求之最佳製作精度。也就是說，雖然目前之技術只能 確貝衣作出對應於現行最佳製作精度之間隔的導線，即導線 208b，而無法在高於現行最佳製作精度之製作精度下確實妒 〇作出具有對應間隔之導線，即在導線208a之間隔214a所對應 衣作精度下確貝製作出導線2〇8a，亦即製作導線Μ。時， 其實際製作精度可能低於其間隔214a所對應之最佳製作精 度。 舉例而s，根據珂述之表一，若以現行TAB/c〇F帶之最 佳製作精度為G.G4G%下，於可佈置導線之區域寬度為28 _ 的TAB/COF ▼上設置導線。首先，依照傳統固定間隔的方式 進行導線佈置時，由表一可知對應於製作精度〇〇4〇%之間隔 為45 // m，因此 月匕佈置之導線數量為·· 28 mm+45 μ m与620， 總間隔誤差為·· 620x45 /ζιηχ〇·〇4〇〇/。与 ιι·ΐ6 //m。 。另方面，依照本發明之方法，同樣在現行ΤΑΒ/COF帶 之取仏製作精度為〇 〇4〇%下，於可佈置導線之區域寬度為Μ mm的TAB/COF帶上設置導線。若考慮佈置導線具有的間隔 所對應之製作精度較高於現行最佳製作精度時，例如間隔為 4〇 //m時，28 mm寬的可佈置區域所能容許之總誤差為μ 11 200822008 Χ〇.〇25%=7 "m。既然於整個28mm寬的可佈置區域内， 所能容許之總誤差為7 内，才能符合平面顯示模組 位製程需求。因此，本發明在低於間隔為4〇 #①所對應 作精度的現行最佳製作精度下，佈置間隔為4〇 ‘導線: 其中在總誤差需在7 "瓜以内下’可容納之導線數量為、 7 // m+(40 // mx〇.〇40%)= 440 〇 Ο 再將整個可佈置區域的寬度減去佈置間隔為糾” 線的區域寬度後’剩下寬度之區域可再佈置對應於現行 製作精度之導線，亦即間隔為4…之導線。此時，剩下： 度之區域可容納導線數量為 見 [28mm-(40 /z mx440)]-45 //m^ 230 〇 如此一來，在此實施例中，總共可佈置44〇+23〇=6川 條導線，而由於所有導線之佈置均係在預設製作精度下 即現行最佳製作精度〇._%下，因此總間隔誤差為 、 (440x40 ^m+ 230x45 // m)x〇.〇4〇〇/0 = ! 1 ] 〇 • a 上· 1 〇 从 m 〇 與傳統方式相較之下，運用本發明實施例之方法可 乎相同之總間隔誤差下，於具相同寬度之可佈置區域 性基板上佈置更多之導線。 仇 在本發明中，可撓性電路板200在後續之熱接合製程中， j料可能會有熱膨脹現象產生’而材料結構之膨 :中央朝外《增’亦即在材料結構之中央部分的偏移量較 =，而在材料結構之外圍部分的偏移量較大。有蓉於材料姓 二：熱膨脹現象，因此在本發明中，間隔較小且對應之製； 精度較高的導線組210係設置在可撓性基板2〇2之一側 12 200822008 央區域，而間隔較大且對應之製作精度較低的導線組2i2則 鄰設於導線組210兩旁的可撓性基板2〇2上。 因此，本發明之一特徵就是在可撓性基板之一側上設置 至少二組間隔不同之輸出導線組，且較佳為這些輸出導線电 所對應之間隔從可撓性基板之一側的中央朝外側漸次遞增。 如此一來，可在現行之可撓性電路板之製作精度與平面顯示 模組之對位壓著精度下，於固定寬之可撓性電路板内，大幅 、增加輸出導線之佈置數量。此外，可在平面顯示模組製程與 ί:可撓性電路板封裝廠不需更高的精度要求下，有效提升製程 良率，更可輕易導入產品並量產。 本發明之可撓性電路板可適用於一般平面顯示裝置，例 如液晶顯示器或電漿顯示器。平面顯示裝置主要係由平面顯 示面板以及背光模組所組成，其中背光模組設在平面顯示面' 板之背面，以提供平面顯示面板光源。而可撓性電路板則係 设置在平面顯示面板中。 ’' 請參照第5圖，其係繪示依照本發明一較佳實施例的一 種平面顯示面板之裝置示意圖。平面顯示面板300主要包括 玻璃基板302、平面顯示單元3〇4以及數個如同前述之可撓性 電路板200。玻璃基板之周邊上設有數個接觸端子3〇6，其中 這些接觸端子306分別對應於可撓性電路板2〇〇之輸出導線 2〇8。平面顯示單元3〇4則設於玻璃基板3〇2之上，而接觸蠕 子306之一端與平面顯示單元3〇4接合，另一端則向外側延 伸至破璃基板3〇2之一側邊處。這些可撓性電路板則利 用例如熱壓著方式對位接合在玻璃基板302之周邊上，其中 13 200822008 可撓性電路板2〇〇之輸出導線208分別對準玻璃基板3〇2上 之接觸端子306，並透過壓著而接合在一起以形成電性連接。 =於相同寬度之可撓性電路板綱可佈置更多之輸出導 線308,目此可進一步提高平面顯示裝置之解析度。 Γ ^上述本發明較佳實施例可知，本發明之—優點就是因 m之可撓性電路板可在現行之導線製作精度 =組製程精度下，設置至少二組具不同間隔的導線，因： 不增加製程負擔下，有效增加可佈置之導線數量。 因a述本發明較佳實施例可知’本發明之另—優點就是 精G:::!顯示面板可在不增加製程成本負擔與預設 ' ；疋見度之可撓性電路板内設置更多之導線，因 m::於可撓性電路板接合技術應用在實際產品及量 產更可如升平面顯示面板之產品良率。 因為=本發明較佳實施例可知，本發明之又-優點就是 設置更；=平面顯示!、置可在固定寬度之可撓性電路板上 到提升顯示裝置之顯示品質的目的。解析《進而達 雖然本發明已以一較佳實施例揭露如 =本發任何熟習此技藝者，在不脫離本發明== =内’虽可作各種之更動與潤飾，； 當視後附之申請專利範圍所界定者為準。“之保-圍 【圖式簡單說明】 弟1圖係綠示傳統覆晶薄膜/捲帶自動接合帶上之導線的 14 200822008 佈置示意圖。 第2圖係繪示第丨圖之輸出導線之放大示意圖。 第3圖係繪不依照本發明一較佳實施例的一種可撓性電 路板之上視示意圖。 第4圖係繪示第3圖之輪出導線的佈置放大示意圖。 第5圖係繪示依照本發明一較佳實施例的一種平面顯示 面板之裝置示意圖。 Γ 主要元件符號說明】 100 ： 覆晶薄膜/捲帶自 102 ： 基板 106 ： 輸入導線 110 : 間隔 202 ： 可撓性基板 206 ： 輸入導線 208a •導線 210 ： 導線組 214a =間隔 300 ： 平面顯示面板 304 ： 平面顯示單元 C； 動接合帶 104 :積體電路 108 =輸出導線 200 :可撓性電路板 2〇4 :積體電路 2〇8 :輸出導線 218b :導線 212 :導線組 214b :間隔 3〇2 :玻璃基板 15Under the alignment accuracy of the degree and the flat display module, the requirement for increasing the number of multiple wires of the flexible circuit board is required. In the preferred embodiment, the output wires 2〇8 are divided into at least two wire sets 210 and 212, wherein the wire group 21〇 includes a plurality of wires 208a, and the wire group 212 includes a plurality of wires. 2〇8b. One of the wires 2〇8a and 2〇讣 is electrically connected to the integrated circuit 2〇4, and the other end extends to one side of the flexible substrate 202. The wire group 21 is disposed in a central portion on the side of the flexible substrate 2〇2, and the wire group 212 is adjacently disposed on the side of the wire group 21' as shown in Fig. 4. The wires 2〇8a of the wire group 21 are arranged such that each wire 208a has a space 214a, and the wires 208b of the wire group 2丨 are arranged in such a manner that each wire 208b has a space 214b. Wherein, the interval 2丨4a of the wire group 21 is different from the interval 214b' of the wire group 212 and the interval 214a corresponds to a manufacturing precision, and the interval 214b corresponds to another manufacturing precision. Further, the interval 214a of the wire group 210 located at the central portion of one side of the flexible substrate 2〇2 is smaller than the interval 214b of the wire group 212 located at both sides. In this embodiment, when the wire group 2 1 0 and 200822008 212 are arranged on the flexible substrate 202, the wires 2〇8& and 2〇813 are set at a preset precision, wherein the interval 214a of the wires 2G8a is set. The corresponding manufacturing precision is higher than the preset precision, and the manufacturing precision corresponding to the interval 2l4b of the wire 208b is preset in the κ土贝 example, and the preset precision is the flexible circuit board. The current best production accuracy, that is, the current mass production and the flat display module clothing = the best production accuracy. That is to say, although the current technology can only make the wire which corresponds to the interval of the current best manufacturing precision, that is, the wire 208b, it cannot be made to have a corresponding accuracy in the production precision higher than the current optimum manufacturing precision. The wires of the spacing, that is, the precision of the clothing corresponding to the spacing 214a of the wires 208a, are made to produce the wires 2〇8a, that is, the wires are fabricated. In practice, the actual production accuracy may be lower than the optimum production accuracy corresponding to the interval 214a. For example, according to Table 1 of the above description, if the current production accuracy of the current TAB/c〇F band is G.G4G%, the wire is set on the TAB/COF ▼ with the width of the area where the wire can be arranged 28 _ . First, when the wire arrangement is performed in accordance with the conventional fixed interval method, it can be seen from Table 1 that the interval corresponding to the manufacturing precision 〇〇4〇% is 45 // m, so the number of wires arranged in the moon is 28 mm+45 μm. With 620, the total spacing error is 620x45 /ζιηχ〇·〇4〇〇/. With ιι·ΐ6 //m. . On the other hand, according to the method of the present invention, the wire is placed on the TAB/COF tape having a width of Μ mm in the area where the wire can be arranged, also in the current ΤΑΒ/COF tape production accuracy of 〇 4〇%. If the manufacturing precision of the arrangement of the wires is higher than the current optimum fabrication accuracy, for example, when the interval is 4 〇//m, the total error that can be tolerated by the 28 mm wide arrangable area is μ 11 200822008 Χ 〇.〇25%=7 "m. Since the total error allowed in the entire 28mm wide arrangable area is 7, it can meet the requirements of the flat display module process. Therefore, the present invention has an arrangement interval of 4 〇 'wires at a current optimum fabrication accuracy lower than the accuracy of the interval of 4 〇 #1: wherein the total error needs to be within the range of 7 " The quantity is, 7 // m+(40 // mx〇.〇40%)= 440 〇Ο and then the width of the entire arrangable area is subtracted from the arrangement interval to correct the area width of the line. Arrange the wires corresponding to the current production precision, that is, the wires with a spacing of 4... At this time, the remaining: the area can accommodate the number of wires as seen [28mm-(40 /z mx440)]-45 //m^ 230 In this way, in this embodiment, a total of 44 〇 + 23 〇 = 6 Sichuan wires can be arranged, and since all the wires are arranged under the preset production precision, the current optimum production precision 〇._% Therefore, the total spacing error is (440x40 ^m + 230x45 // m) x 〇.〇4〇〇/0 = ! 1 ] 〇• a upper · 1 〇 from m 〇 compared with the conventional method, using the present invention The method of the embodiment can arrange more wires on the arrangable regional substrate having the same width under the same total spacing error. In the present invention, in the subsequent thermal bonding process of the flexible circuit board 200, the material may have a thermal expansion phenomenon and the material structure is expanded: the center is outwardly "increased", that is, in the central portion of the material structure. The offset is larger than =, and the offset of the peripheral part of the material structure is larger. There is a material surname 2: thermal expansion phenomenon, so in the present invention, the interval is small and corresponding; the high precision wire group The 210 series is disposed on one side of the flexible substrate 2〇212 in the central region of 200822008, and the wire group 2i2 having a large interval and correspondingly low precision is adjacent to the flexible substrate 2〇2 on both sides of the wire group 210. Therefore, one feature of the present invention is that at least two sets of output wire groups having different intervals are disposed on one side of the flexible substrate, and it is preferable that the output wires are electrically spaced from one side of the flexible substrate. The center gradually increases toward the outside. In this way, the accuracy of the current flexible circuit board and the alignment accuracy of the flat display module can be greatly increased in the fixed wide flexible circuit board. Output wire cloth In addition, the flat display module process and the flexible circuit board package factory can effectively improve the process yield without requiring higher precision requirements, and can be easily introduced into the product and mass-produced. The flexible circuit board can be applied to a general flat display device, such as a liquid crystal display or a plasma display. The flat display device is mainly composed of a flat display panel and a backlight module, wherein the backlight module is disposed on the back surface of the flat display surface. The flat display panel light source is provided, and the flexible circuit board is disposed in the flat display panel. '' Referring to FIG. 5, it is a schematic diagram of a device for a flat display panel according to a preferred embodiment of the present invention. . The flat display panel 300 mainly includes a glass substrate 302, a flat display unit 3〇4, and a plurality of flexible circuit boards 200 as described above. A plurality of contact terminals 3〇6 are provided on the periphery of the glass substrate, wherein the contact terminals 306 correspond to the output leads 2〇8 of the flexible circuit board 2〇〇, respectively. The flat display unit 3〇4 is disposed on the glass substrate 3〇2, and one end of the contact creeper 306 is joined to the flat display unit 3〇4, and the other end extends outward to one side of the glass substrate 3〇2. At the office. The flexible circuit boards are bonded to the periphery of the glass substrate 302 by, for example, thermal pressing, wherein the output wires 208 of the flexible circuit board 2 are aligned with the contacts on the glass substrate 3〇2, respectively. Terminals 306 are joined together by crimping to form an electrical connection. = More output wires 308 can be placed on the flexible board of the same width, which further improves the resolution of the flat display device. Γ ^ The preferred embodiment of the present invention can be seen that the advantage of the present invention is that the flexible circuit board of m can be provided with at least two sets of wires with different intervals under the current wire making precision=group process precision, because: Effectively increase the number of wires that can be placed without increasing the process burden. It can be seen from the preferred embodiment of the present invention that 'the other advantage of the present invention is that the fine G:::! display panel can be set in a flexible circuit board without increasing the process cost burden and preset' visibility; Many wires, because m:: in the flexible circuit board bonding technology applied in the actual product and mass production can be as good as the flat panel display panel product yield. Since it is understood from the preferred embodiment of the present invention, the further advantage of the present invention is that the setting is more; = the flat display!, the purpose of setting the display quality of the display device on the flexible circuit board of a fixed width. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The scope defined in the scope of application for patent application shall prevail. "Bao Bao-Wei [Simple Diagram] The brother 1 is a green display of the traditional flip chip / tape on the automatic bonding tape 14 200822008 layout diagram. Figure 2 shows the enlargement of the output wire of the second diagram Fig. 3 is a top plan view showing a flexible circuit board which is not in accordance with a preferred embodiment of the present invention. Fig. 4 is an enlarged schematic view showing the arrangement of the wheel wires of Fig. 3. A schematic diagram of a device for a flat display panel according to a preferred embodiment of the present invention. Γ Description of main components: 100: flip chip/reel from 102: substrate 106: input lead 110: spacer 202: flexible substrate 206: Input wire 208a • Wire 210: Wire group 214a = Space 300: Flat display panel 304: Flat display unit C; Dynamic joint tape 104: Integrated circuit 108 = Output wire 200: Flexible circuit board 2〇4: Product Body circuit 2〇8: output wire 218b: wire 212: wire group 214b: interval 3〇2: glass substrate 15