200809651 九、發明說明： ' 【發明所屬之技術領域】 本發明有關於一種製造RFID智慧型標籤或智慧型標 鐵板鑲物的方法及裝置，其中，根據申請專利範圍第i及 16項之序言，該等複數個RFID細條與複數個天線係經接 續地接合為一。 【先前技術】 為衣慧型標籤或RFID傳發器，經常會將RFID晶 片直接地架置在一經排置於一網物或長帶上之天線上。或 另者，可按如晶片模組方式架置該等rfid晶片，按如細 條所介置或覆晶橋接預組裝，以作為在該天線上之一單 元而此者又心排置於網物之上。這可如自US 丨 A1之範例所顯示者，其中描述—種為以將晶片模組連接於 經排置於網物上之天線的方法，其中是將一經配適於天線 之載帶與一經配適於該等晶片模組之载帶放置於彼此之 φ上。然後，藉由導引該晶片模組載帶繞於一尖銳邊緣，以 將該等晶片模組自其載帶卸離。將經卸離晶片模組以及後 P通的aa片模組架置在該天線載帶上其經配置之位置處，這 些位置疋對應於在進一步載帶上之天線的位置。 藉由將各個細條組裝在該等經排置於該天線載帶之上 的天線上，即可製造一 RFID嵌鑲物或智慧型標籤嵌鑲物 或RFID傳發器嵌鑲物。而通常會藉轉換機器，將此rfid 嵌鑲物進一步地處理成自黏性智慧型標籤或RFID票卡等 等0 7 200809651 成Γ適於該RFID晶片的細條是由各式基板材料所製 成。對此而言，可為基於金屬、聚合物或 板材料。該等RFID細條的實際連接表面含有=用=基 體膏、導電m、_胃1 f H1銀貝導 貝寻寺，廷些可經運用 狀聚合物或紙質材料，並且έ成 木 貝仍丨丁 I且、、且戍種導電性材料。 對於製作在該等天線與經施用於 ΛΛ、曾^ 4天線載帶之細條間 的V電性連接，可使用各種類型 道棘# — 刃迷接例如像是熱感性 ¥體黏者劑、焊燒製程、雷射焊 、 田母了坪接處理或熱性壓縮作業。 或另者，可利用一鉗夹或卡夾絮 ^ 方法。 乂下灭衣^以作為一種機械性連接 經常會製造…FID細條以使得在_金屬或聚合物 材料的細條基帶之上施用第__導電性放大連接表面，铁後200809651 IX. Description of the invention: 'Technical field to which the invention pertains» The present invention relates to a method and apparatus for manufacturing an RFID smart tag or a smart standard iron plate insert, wherein the preamble according to items i and 16 of the patent application scope The plurality of RFID strips and the plurality of antennas are successively joined into one. [Prior Art] For clothing-type labels or RFID transmitters, RFID wafers are often placed directly on an antenna that is placed on a mesh or long strip. Alternatively, the rfid wafers may be mounted as in a chip module, pre-assembled as a thin strip or flip-chip bridged as a unit on the antenna, and the core is placed on the net Above. This can be as shown in the example of US 丨A1, which describes a method for connecting a wafer module to an antenna arranged on a mesh, wherein a carrier tape adapted to the antenna is used Carrier tapes suitable for the wafer modules are placed on each other's φ. The wafer modules are then detached from their carrier tape by guiding the wafer module carrier tape around a sharp edge. The unloaded wafer module and the rear P-pass aa chip module are placed on the antenna carrier at their configured positions, which correspond to the position of the antenna on the further carrier tape. An RFID inlay or smart tag inlay or RFID transmitter inlay can be fabricated by assembling individual strips onto the antennas that are placed over the antenna carrier tape. The rfid mosaic is usually further processed into a self-adhesive smart label or an RFID ticket card by a conversion machine, etc. 0 7 200809651 The thin strip suitable for the RFID wafer is made of various substrate materials. . In this regard, it can be based on metal, polymer or board materials. The actual connecting surface of the RFID strips contains = base cream, conductive m, _ stomach 1 f H1 silver shell guides, and some can be used as polymer or paper materials, and I, and, and a variety of conductive materials. For the V electrical connection between the antennas and the thin strips applied to the antenna straps of the ΛΛ, 4 antennas, various types of spurs can be used, such as blade splicing, such as thermal sensation, body sticking, welding Burning process, laser welding, fielding, or thermal compression. Alternatively, a clamp or clip can be used. Under the armpits, as a mechanical connection, the FID strips are often made so that the __conductive amplifying joint surface is applied over the strip base of the metal or polymer material, after the iron
::F1D晶片排置於此之上。而在此，藉由覆晶方法 於㈣連接表面上沉積出該# RFID晶片，並且與該等電 子連接。而總共具有兩個經放大連接表面的所獲細條或晶 片模組可在該細條轉移處理的過程之中及之後用以較簡易 地接觸到經排置在該天線長帶上之天線的連接表面。 在將該# RFID、細條轉移至該天線長帶之前，正常情 況下S亥等R FID細條是在—細條基板上按橫列方式所排置， 而此者係按-滚捲形式所排置，並藉由將該基板長帶卸捲 =她用於天線細條上。首先，藉由—塵切或切割製程將該 等々RFID細條分離於該基帶，以將該等細條個別地組裝於 «亥等天線及天線長I上。而這會在整個組裝程序裡導致一 t間性的延遲’ ；^疋因為相較於此—裝置裡的其餘處理步 8 200809651 =此：分離步驟具有較高的時間密集性，更遑論由於在 d刀衣私過程中所獲的簡短地握持該細條基帶之故。 ㈣，就以將該等個別娜細條定位於該天線長帶 上]寸別是對於該等待予排置於彼此上方之天線的連接表 面以及RFID細條來說，即以一連 〆u | 埂，私動的天線長帶，此 係對於整個裝置之所欲高產 .^ ^ ^ L 、里旳目铽，將會產生須將細 I精確地沉積於天線長帶之上的問題。 【發明内容】 二，本發明的目標在於備製一種用以製造觸智 心、型^示臧或RFJD智彗型声囍旗趙‘ 曰w生如織敗鑲物的方法及裝置，豆 可達到整個製造裝置的高產通量。 /、 相關於該方法可藉由申請專利範圍帛工項之特性，而 相關於該袭置可藉由申請專利範圍第16項 到該目標。 本發明之-基本特點在於在一種用以製造rfid智慧 型標籤或智慧型標籤嵌鑲物的The ::F1D wafer is placed on top of this. Here, the #RFID wafer is deposited on the (4) connection surface by a flip chip method, and is connected to the electrodes. The resulting strip or wafer module having a total of two enlarged connection surfaces can be used for relatively easy contact with the connection surface of the antenna disposed on the long strip of the antenna during and after the strip transfer process. . Before the #RFID and thin strips are transferred to the long strip of the antenna, the R FID strips such as S Hai are normally arranged on the thin strip substrate in a row manner, and the one is arranged in a rolled-roll form. And by unloading the substrate with a long strip = she is used on the antenna strip. First, the 々RFID strips are separated from the base tape by a dust-cutting or cutting process, and the strips are individually assembled on an antenna such as an antenna and an antenna length I. This will cause an inter-delay delay in the entire assembly process; ^^ because it is compared to the rest of the processing steps in the device 8 200809651 = this: the separation step has a higher time density, let alone due to The short-grained baseband of the strip is obtained in the private process of the knife. (d), the individual strips are positioned on the long strip of the antenna.] For the connection surface of the antenna that is waiting to be placed above each other and the RFID strip, that is, a 〆u | 埂, private The long antenna of the moving antenna, which is the high output of the whole device, will produce the problem that the fine I should be accurately deposited on the long strip of the antenna. SUMMARY OF THE INVENTION Secondly, the object of the present invention is to prepare a method and a device for manufacturing a touch-sensitive heart, a type of 臧 RF or an RFJD 彗 彗 囍 ' ' ' 生 生 生 生 生 织 织 , , , , , Achieve high throughput of the entire manufacturing plant. /, related to the method can be applied for the characteristics of the patented scope of work, and related to the attack can be applied to the target by applying the scope of the patent. The essential feature of the present invention is in a method for manufacturing an RFID smart label or a smart label insert.
,, 繅物的方法，其中應將複數個RFID 細條及複數個天線接續地連接， y 按在一弟一步驟裡，首先必 須為所將製造之智慧型標籤 加戴次曰慧型標戴嵌鑲物，將該等 應予排置於該細條基帶> p & 的RFID細條加以分離並架置 在一基帶上，然後在一後續第― 、灵弟一 v驟裡，必須將天線架置 在该基帶上以及在兮笙0 在°亥等RFID細條的第一連接表面上，使 件各個RFID細條的第一遠 弟運接表面能夠電子接觸到經配置 予该RFID細條之天線的篦— 土 $ 、、的弟一連接表面。如此該等細條並 未被配置於一天線具黑u扯 大線長π上然後在其上排置有天線，而是將 9 200809651 天線配置於一基帶’而其上首先經配置以細條。這表示是 將該等具有其連接表面之天線架置在該等具有其連接表面 的RFID細條上，這可有利地提供兩個天線網物供應與細 條組裝之程序在時間上的分離。藉由大量rfid智慧型標 籤或RFID傳發器的自動化製造，最高的製造裝置可能產 通量先前是受限於首先必須要在線内製程之過程中將該等 RFID細條分離的事實，而這會至少導致不連續的整體裝置 操作。如此意味著即使是先前將該等天線緊密地一起設置 在該天線長帶上，先前所使用之天線長帶的運行速度是由 該等細條之分離製程所決定。相對地，根據本發明製程之 第一步驟的細條組裝作業現在於時間上是獨立於根據本發 明方法之第二步驟的天線網物供應處理，因此並無相互依 賴性，且從而沒有基於該分離步驟的時間限制因素。 又 有利地，可在一較早製程步驟裡於線内製造該等天線， 其中例如是將該等施詩—將予供應至該主基帶之天線長 帶以在時間上平行之方式將該等細條分離且施用於該 主基π。@這表示可縮短每個智慧型標籤或智慧型標鐵私 ㈣的製造時間，並因此整體製造裝置具有較高的產通 量 ° 《等υ應至該主基帶之前既已製成的天線可要不 為線内製作，亦即按其經供應至該主基帶之速度所連續供 應’要不可為依任何供應速度 應至該基帶。 連度&“成之天線產品方式供 帶上之細條具有 在供應天線之前即經預架置於該主基 10 200809651 相關於傳統RFID晶片的經放 於將扁* # 表面，精以電子接觸 於將在天線沉積處理過程中 後u 用之天線的連接表面。然 線之間進行-導電性連接。藉以種側上該專天 於該基帶上的線内製迭平n;線及細條經預組裝 並且…即可供應該天線長帶 …：地前送兩者，藉此達到製造裝置的最高可 此紅里。或另者’亦可構想到不連續性的操作。,, the method of stolen goods, in which a plurality of RFID strips and a plurality of antennas should be connected successively, y, in a step of a younger brother, firstly, the smart label to be manufactured must be worn with a sub-type The inset, the RFID strips that should be placed in the strip base strip > p & are separated and mounted on a base strip, and then in a subsequent first, the same brother, the antenna frame must be Laying on the base tape and on the first connecting surface of the RFID strip such as 兮笙0, the first remote transport surface of each RFID strip can be electrically contacted to the antenna configured to the RFID strip. — Earth, the younger brother, connected to the surface. Thus, the strips are not disposed on an antenna having a black line length π and then an antenna is arranged thereon, but the 9 200809651 antenna is disposed on a base strip' and the strip is first configured thereon. This means that the antennas having their connecting surfaces are placed on the RFID strips having their connecting surfaces, which advantageously provides a temporal separation of the two antenna web supply and strip assembly procedures. With the automated manufacturing of a large number of rfid smart tags or RFID transmitters, the highest manufacturing throughput may have previously been limited by the fact that the RFID strips must first be separated during the in-line process, and this will at least Resulting in a discontinuous overall device operation. This means that even if the antennas were previously placed closely together on the long strip of the antenna, the operating speed of the previously used antenna long strip is determined by the separation process of the strips. In contrast, the strip assembly operation of the first step of the process according to the invention is now temporally independent of the antenna mesh supply process of the second step of the method according to the invention, and therefore is not interdependent and thus not based on the separation The time limit factor of the steps. Advantageously, the antennas can be fabricated in-line in an earlier process step, wherein, for example, the antennas are to be supplied to the antenna strips of the main baseband to be parallel in time. The strips are separated and applied to the main group π. @This means that the manufacturing time of each smart label or smart standard iron (4) can be shortened, and therefore the overall manufacturing device has a higher throughput. "Equivalent to the antenna that has been made before the main baseband can be made. If it is not made in-line, that is, it is continuously supplied at the speed supplied to the main base belt, 'it should not be at any supply speed to the base belt. The degree of connection & "The antenna product is supplied with the strips that are placed on the main base before the antenna is supplied. 200809651 Related to the conventional RFID wafer, the flat surface is placed on the surface. For the connection surface of the antenna to be used after the antenna deposition process, the conductive connection is made between the wires, whereby the wire is laid on the substrate on the side of the substrate, and the line and the thin strip are Pre-assembled and ... can supply the long strip of the antenna...: forward both to the ground, thereby achieving the highest possible redness of the manufacturing device. Alternatively, the operation of the discontinuity can also be conceived.
=等RFm細條係依—與稍後施用之天線的所提議間 岡目5步之預設定間隔而經架置於該基帶上。這也可能受 到該細條基帶及/或該主基帶的運行速度所影燮。 总該間隔最好是藉由將該基帶上之RFID二條位置的光 :5己錄貧料，與來自該基帶上之天線的所提議位置之資 料’加以比較而同步化。 在從該所獲智慧型標籤或智慧型標籤㈣物組裝該等 imD細條及天線之後，可將作為辅助載帶之用的基帶予以 々或另者’可壓切出該等智慧型標籤或智慧型標鐵钱 鑲物並自該基帶移除’而如自黏性智慧型標籤或智慧型標 籤嵌鑲物。 ，組裝該細條之前，於該等RDFID細條的頂部處施以 一黏著層，此者是用來固定將予後續地架置的天線。對此， 可在細條組裝之前或之後將該黏著層加熱。 根據一較佳具體實施例，該等RFID細條在其底侧上 具有一黏著層，藉此將該RFID細條固定於該基帶，而其 中此黏著層是在組裝之前先經施用於該基帶。為此，亦可 200809651 藉由一經點狀施用於該基帶以固定該等細條之黏著層，以 另替地或額外地執行或支援。 θ 由於可將該等基帶並連同其整體表面而構成為呈有自 黏性，因此可在壓力之下將該等天線疊貼於此自黏性基帶 上，而無熱性效應。 一種為以藉由將複數個RFID細條於複數個天線接續 地接合以製造RFID智慧型標籤或智慧型標籤嵌鑲物的^ 置，就以該基帶的運行方向而觀之，首先是具有一裝置， 此者係為以施用個別的RFID細條，而後續地為一裝置， 此者是用以供應該等天線並施用於該基帶。 、 可從子請求項衍生出進一步的有利具體實施例。 【實施方式】 圖1顯示根據本發明之方法的平行化處理之基本原 理線内天線製造或是對該主基板之天線供應的平行化處 理，以及具分離性之細條供應與主基帶上的預組裝作業， 將了有利地郎省時間，並且結果為天線架置於細條上而非 相反方式。 圖2顯示一裝置的側視略圖，此者構成根據本發明之 方法的基本原理。一主基帶1係自一滾捲2所卸捲並經捲 繞至一滾捲3。該基帶係透過一滚捲4所偏折。 该裝置具有一為以分離且施用一 RFID細條的裝置。 此裝置5包含一細條基帶5a，此者係繞於偏折滾捲6及7 所偏折’並藉由一分離裝置8而分離於該長帶5a，且經施 用於一滾捲以予傳送至該基帶1。 12 200809651 經放大顯示且經標註以編號10之基帶丨擁有複數個且 可預定間隔的接續性RFID細條u，此間隔係依據該滾捲 9的旋轉速度與該基帶丨的運行速度，以及在該滾捲9上 之經分離RFID細條的間隔而定。 藉由一光學感測器12，可測量出在該滾捲9上之rfid 細條的間隔，並且為同步仆作豐 + ~ N /化作菜而比較該等後續地施加之 天線的間隔、天線網物之谨^ _ 心連订逯度以及先雨既經排置於其The equal RFm strip is placed on the base tape at a predetermined interval of 5 steps from the proposed antenna of the antenna to be applied later. This may also be affected by the running speed of the strip base strip and/or the main base strip. Preferably, the interval is synchronized by comparing the light at the RFID locations on the baseband: 5 recorded poor material to the information from the proposed location of the antenna on the baseband. After assembling the imD strips and antennas from the acquired smart label or smart label (4), the base tape used as the auxiliary carrier tape can be smashed or the other can be pressed out of the smart label or wisdom. The type of iron money insert is removed from the base belt' and is like a self-adhesive smart label or a smart label insert. Prior to assembly of the strip, an adhesive layer is applied to the top of the RDFID strips for securing the antenna to be subsequently mounted. In this regard, the adhesive layer can be heated before or after the strip is assembled. According to a preferred embodiment, the RFID strips have an adhesive layer on their bottom side whereby the RFID strip is secured to the base strip, wherein the adhesive layer is applied to the base tape prior to assembly. To this end, it is also possible to additionally or additionally perform or support by applying a dot-like application to the base tape to fix the adhesive layers of the strips. Since θ can be constructed to be self-adhesive along with its integral surface, the antennas can be laminated to the self-adhesive base tape under pressure without a thermal effect. One is to manufacture an RFID smart tag or a smart tag insert by successively joining a plurality of RFID strips to a plurality of antennas, and in view of the running direction of the base tape, firstly, having a device This is for the application of individual RFID strips, and subsequently a device for supplying the antennas and applying to the base strips. Further advantageous embodiments may be derived from the sub-requests. [Embodiment] FIG. 1 shows the basic principle of parallelization processing according to the method of the present invention. In-line antenna manufacturing or parallelization processing of the antenna supply to the main substrate, and separation of thin strips and pre-master strips The assembly operation will save the time for the Langer, and the result is that the antenna frame is placed on the strip instead of the opposite. Figure 2 shows a side elevational view of a device which constitutes the basic principle of the method according to the invention. A main base tape 1 is unwound from a roll 2 and wound up to a roll 3. The baseband is deflected by a roll 4. The device has a device for separating and applying an RFID strip. The device 5 comprises a strip of base strip 5a which is deflected around the deflecting rolls 6 and 7 and separated from the strip 5a by a separating device 8 and applied to a roll for delivery. To the baseband 1. 12 200809651 The base tape 放大, shown enlarged and numbered 10, has a plurality of predetermined spacing strips of continuous RFID strips u depending on the rotational speed of the coils 9 and the operating speed of the base strips, and The spacing of the separated RFID strips on the roll 9 is determined. By means of an optical sensor 12, the spacing of the rfid strips on the roll 9 can be measured, and the spacing of the subsequently applied antennas, the antenna, can be compared for the synchronous servant + ~ N / vegetable The net of things ^ _ heart-to-tail and the first rain is placed in it
上之天線的間隔。 即如編號14所表示，_天線長帶15係由_卸捲滾捲 13所卸捲，並且透過一偏折滾捲16及進一步的滾捲η、 1 8供應至該基帶1，令玄夭錄亚 & 天線要不為在一先前與時間無關之 衣造步驟裡既經施用於兮妥妗且册 ^ 用於忒天線長帶，要不即為按如該天線 1 V 1 5之運行速度的函數所線内製造。 現可於-該基帶i上的RFm細條預組裝之後所進行 而弟-步驟裡’將料天㈣置在該RFm細條的連接表 =，使得該等天、線20之連接表面，即如在放大視圖中 1不者’能夠導電接觸於該等肌D細# U的連接表面。 出導為以於該等細條與天線的連接表面之間製造 受由 奴21裡，错由例如一熱黏著劑而承 觸。""、23及滾捲24所施加㈣力以獲致-永久接 據本二3:方示面略視圖及侧視圖，其中顯示-用於根 明之-第— Wn, ρ 建構。而根據本發 ”體只轭例，即如圖4中所顯示者，此Rfid 13 200809651 細條適合於運用在一裝置内以 貝乍出根據本發明的方法。 根據圖3之rfIF細倏n 上铖g卩罟古 /、 電子隔離基帶2 5，其 、<配置有兩個連接表面26。這此導雷 以R KTT7曰u ~ ^笔連接表面係經佔置 曰曰片，而該晶片的連接表 + 7 u々 按表面27則與該等連接表面 電子接觸。 K佼衣曲 其中該長帶 RFID細條 一具有保護長帶29的導體性黏著帶28, 係於其上而作為電子絕緣之用，係經排置於該The spacing of the antennas on them. That is, as indicated by the number 14, the _ antenna long strip 15 is unwound by the unwinding roll 13, and is supplied to the base tape 1 through a deflecting roll 16 and a further roll η, 1 8 Does the recording of the antennas of the recordings and the antennas not be applied to the antennas in a previously unrelated time-making process and is used for the long antennas of the antennas, or the operation of the antennas 1 V 1 5 The function of speed is manufactured in-line. It is now possible to carry out the pre-assembly of the RFm strips on the base tape i, and in the step-step, to place the material (four) in the connection table of the RFm strips, so that the connecting surfaces of the days and lines 20 are as In the enlarged view, 1 is not able to electrically contact the connecting surface of the muscle D. The guide is such that the slave strip is manufactured between the strips and the connecting surface of the antenna, and is contacted by, for example, a thermal adhesive. "", 23, and roll 24 apply (four) force to obtain - permanent access to this two 3: square view and side view, which shows - for the root - the first - Wn, ρ construction. According to the present invention, the Rfid 13 200809651 thin strip is suitable for use in a device to extract the method according to the invention. According to the rfIF fine n on Figure 3铖 卩罟 卩罟 / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / The connection table + 7 u々 is in electronic contact with the connection surfaces according to the surface 27. The long strip of RFID strips has a conductive adhesive strip 28 with a protective strip 29 attached thereto as an electronic insulation. Used for
之上。 一具體實施例 同與等同元件 裡， 載有 圖4側視略圖顯示一種在本發明之一第 為以執行根據本發明之方法的裝置。相 相同的參考編號。 -可利用-經石夕質鑛置之辅助載$la作為一基帶。此一 、、工放大顯不且標註以編號1〇a的辅助載帶具有一寬度b， 而此寬度係針對於簡易處理或進一步處理的要求。 該辅助載帶最好是連續地沿箭頭21前進，並且在該細 I、、且衣置及供應裝置5的下方通過之後，載荷有該等贿〇 細條而具1 1 1 a的相互間隔。 在一為以施用黏著劑以進行細條固定的裝置32裡，該 黏者劑係例如藉由一塗佈製程或一喷射製程，而在對於該 等細條之經提議黏著劑位置處至少局部地施用於該輔助 帶la 〇 在將個別細條施用於該輔助載帶1 a之前，會先將該保 護性長帶29自該細條11上移除，並且藉由一熱輻射器將 經施用其下各層的黏著劑28加以活化。 200809651 該等細條11在該辅助載帶1〇a上的沉積位置是對應於 稱後將予架置之天線20的施用位置之間隔。從而，該等 、’、田ir'的間距疋等同於該等天線連接位置的間距。對此，可 藉由=光學感測器12，即如—相機，將間隔加以同步化。 當在該第二步驟裡既已將該等天線施用於該預組裝細 7，亚且藉由一裝置予以架置而具導電性且經機械性固定 H可像疋在繞於一偏折滚捲4a所偏折之後，或是藉由一 晶粒切割製程予以壓切，將該輔助載帶U再度地㈣，而 在此不予贅述。 =度地猎-基帶或網物執行細條供應％，即如經顯示 為芩考編號34者。 者總::天線長帶15係經顯示於-放大視圖中，並經標以參 式排：亥天、、泉2〇的左方及右方部份係按兩個橫列方Above. DETAILED DESCRIPTION OF THE INVENTION In the same and equivalent elements, there is shown a side elevational view of a device in accordance with one embodiment of the present invention for performing the method according to the present invention. Same reference number. - Available - A supplementary load of $la is used as a baseband. The auxiliary carrier tape, numbered 1〇a, has a width b, which is for simple processing or further processing. Preferably, the auxiliary carrier tape is continuously advanced along the arrow 21, and after passing through the fine I, and under the clothing and supply device 5, the brittle strips are loaded with a distance of 11.1 a. In a device 32 for applying an adhesive for strip fixation, the adhesive is applied at least locally at a proposed adhesive location for the strips, for example by a coating process or a spraying process. Before the auxiliary strips are applied to the auxiliary carrier tape 1 a, the protective long strips 29 are first removed from the strips 11 and the lower layers are applied by a heat radiator. The adhesive 28 is activated. 200809651 The deposition position of the strips 11 on the auxiliary carrier tape 1a is the interval corresponding to the application position of the antenna 20 to be mounted later. Thus, the spacing 该 of the , 、, ir' is equivalent to the spacing of the antenna connection locations. In this regard, the spacing can be synchronized by the = optical sensor 12, i.e., the camera. When the antenna is applied to the pre-assembled thinner 7 in the second step, and is electrically mounted by a device and mechanically fixed, the H can be wound around a deflection roller. After the deflection of the roll 4a, or by a die cutting process, the auxiliary carrier tape U is again (four), and will not be described herein. = degree hunting - baseband or netting performs a thin strip supply %, ie if it is shown as reference number 34. Total:: The antenna long belt 15 series is displayed in the - magnified view, and is marked with the parameter row: the left and right parts of the sea, the spring, and the right side are in two horizontal rows.
:…此天線長Y上，藉以構成例如雙極天線，俾接觸 於该荨RFID細條η的+ 士 β I 有-間隔36。木1的左方及右方連接表面。該等天線具 圖5顯示_在_本發明之第二具體實施例裡 進:’為；運用在-根據本發明之方法的_細條内！ V可旎建構的側邊或截面視圖。 頂部處並無黏著層，而是在底部以卿細條建構在 並不具導電性。此外，：用有：—黏著層37,且此者 帶38。 "移除的電子絕緣保護長 圖6顯示一根據本發明之一 行根據本發明之方、丰士 _貝方歹Γ，為以執 / 、衣置之結構的側視略圖。再度地， 15 200809651 相同與等同元件载有相同的參考編號。 圖5内略圖顯示的 -辅助載帶lb上，此者条係經施加而其底側是在 將該黏製劑施用於”二夕質鑛置。對此，首先是 用於该專RFID細條之基板或基帶25的底側 護長ΐ 35將Γ::用於該輔助载帶1b之前，會先將該保 著劑:化。〃 4細條移除’並藉由-熱性輻射器將該黏 令所„助載帶b上之條帶的沉積位置是對應於該等稍 :==叫化一，在“ 再度地，是藉由光學感測器以將間隔予以同步化。 =中介步驟裡’在施用該等天線2〇之前，會先藉 衣以將一導體性黏著劑施用於該等RFID細停 u的圖連=然後在一進一步步驟裡，施以該等天線、、： "‘，、丁根據本發明之一第三具體實施例，為以勃 f根據f發明之方法的裝置之侧視略圖。並非以-輔助載 ^ ^制-線條lc、1〇c，此線條具有一自黏著表面（例 :在”、：保s蔓長帶之後)，其中可將該黏著層施用於一進 -：的黏膠層。該線條具有至少稍後所將施用之天線長 的寬度30。該線條亦可經設計為具有自黏著性，因而^不 需要移除一保護長帶。 /等RFID細條丨！係藉其底側而經膠黏於該線條，而 於施用該等細條之前，不僅會先移除該線條的保護長帶， 同時也移除在該等RFID細條之上的保護長帶。現在藉由 16 200809651 一熱性輻射器對該黏著層28進行加熱。 再度地，可例如藉由一光學感測器，將該等細條11及 天線20的間隔予以同步化。 =據本發明之方法的第二步驊裡，在_選擇 =者劑施用作業之後’現藉由滚捲疊貼器17、i8施： 經由一冷疊貼製程該等天線可自上方而連接於該等 細條及線條。 Λ寻 • #者’在該連接製程裡，可於該等天線與細條連接表 面之間進行-導電連接（參見編號22、23及24)。在此矛 =按：預設時段長度之溫度及壓力下，將該等線條、細 铽人天線網物的材料成分予以壓縮合一。 :該裝置4〇内的後續旋轉晶粒切割製程裡， 地 等智慧型標鐵(天線及細條)，並且移除剩餘的材 =捲滾如一格，點41。將自此所製造出之自黏著灯1〇天 線供應給該捲繞器3。 該等RFID細條可在頂部處具有_黏著層，即如圖^ 《者可把加-後績的導體黏著層，即如參考編號 42所標示者。 在本申請文件中所揭示之所有特性皆經主張為對於本 二明具有關鍵性，而相關於先前技藝則可為個別地，或是 文組合方式，具有新穎性。 【圖式簡單說明】 目。Si::间於後载圖式以描述本發明之優點與應用項 。5亥荨圖式顯示出·· 17 200809651 :1其在-第-略視圖，里，根據本發明之方法 化處理之基本原理； τ 圖2.在一略視圖裡，—種用以在一主要結構中執行 根據本發明之方法的製造裝置； 圖3 ·在一侧視略圖裡，一種為以運用在根據本發明 之方法中的可能RFID細條之結構； 圖4 ·在一侧視略圖裡，一種根據一第一具體實施例， 為以執行本發明方法之裝置的結構； 圖5 ·在一側視略圖裡，一種運用在圖6中所示裝置 内之RFID細條的進一步結構； 圖6··在一側視略圖裡，一種根據—第二具體實施例， 為以執行本發明方法之進一步裝置的結構；以及 圖7:在一側視略圖裡，一種根據-第三具體實施例， 為以執行本發明方法之進一步裝置的結構。 【主要元件符號說明】 1 la lb 1 c 2 3 4 4a 基帶 輔助載帶 辅助載帶 線段 卸繞滾捲 捲繞滾捲 偏折滾捲 偏折滾捲 供應及施用RFID細條之裝置 18 200809651 5 a 細條基板網物 6 偏折滾捲 7 偏折滾捲 8 細條分離 9 滾捲 10 基帶 l〇a輔助載帶 1 〇b辅助載帶 10c線段 11 RFID細條 11 a間隔 12 光學感測器 13 卸繞滾捲 14 天線製造或直接天線供應 15 天線長帶 16 偏折滾捲 17 偏折及壓按滾捲 18 偏折及壓按滾捲 19 RFID細條上之天線組裝 2 0 天線 21 製造導電連接之站台 22 用於製造一導電連接之裝置 23 用於製造一導電連接之裝置 24 用於製造一導電連接之裝置 19 200809651 25 基帶 26 連接表面 27 連接 28 導體性黏著長帶 29 絕緣保護長帶 30 輔助載帶之寬度 31 輔助載帶的移動方向 32 黏著劑施用 3 3 細條供應 34 細條基帶 35 天線長帶 3 6 天線間隔 37 黏著層 3 8 電子絕緣保護長帶 3 9 導體性黏著劑施用 40 壓切裝置 41 移除經壓切之剩餘材料 42 導體性黏著劑施用 20:... This antenna is on the length Y to form, for example, a dipole antenna, and the 俾 is in contact with the +β β I-interval 36 of the 荨RFID strip η. The left and right sides of the wood 1 are joined to the surface. These antennas are shown in Fig. 5 in the second embodiment of the invention: 'is used; in the thin strip of the method according to the invention! A side or cross-sectional view of the construction of the V. There is no adhesive layer at the top, but it is constructed with fine strips at the bottom and is not electrically conductive. In addition, the use of: - adhesive layer 37, and this belt 38. "Removed Electronic Insulation Protection Length Figure 6 shows a side elevational view of a structure according to the present invention in accordance with the present invention, Fengshi_贝方歹Γ, which is a structure for holding/clothing. Again, 15 200809651 the same as the equivalent components carry the same reference number. Figure 5 is a schematic view of the auxiliary carrier tape lb, which is applied and the bottom side of the adhesive is applied to the "European mineral deposit. For this, the first is for the special RFID strip. The bottom side guard 35 of the substrate or base tape 25 will be: before the auxiliary carrier tape 1b, the retaining agent will be first: the 细 4 strip removed 'and the sticky by the heat radiator Let the deposition position of the strip on the auxiliary carrier b correspond to the slightly: == calli, in "again, by means of an optical sensor to synchronize the intervals. 'Before applying the antennas 2, a coating is applied to apply a conductive adhesive to the RFID relays. Then, in a further step, the antennas are applied, " According to a third embodiment of the present invention, it is a side elevational view of the apparatus according to the method of the invention according to the invention of F. The line is not provided by the auxiliary line - lc, 1〇c, which has A self-adhesive surface (eg, after), which can be applied to an adhesive layer. The line has a width 30 that is at least the length of the antenna to be applied later. The line can also be designed to be self-adhesive so that there is no need to remove a protective long strip. / Wait for the RFID strips! It is glued to the line by its bottom side, and before applying the strips, not only the protective long strip of the line is removed, but also the protective long strip above the RFID strips is removed. The adhesive layer 28 is now heated by a thermal radiator of 16 200809651. Again, the spacing of the strips 11 and antennas 20 can be synchronized, for example, by an optical sensor. According to the second step of the method of the present invention, after the _selection=agent application operation, the present invention is now applied by the roll stackers 17, i8: the antennas can be connected from above via a cold stack process For these thin strips and lines. • • • #者’ In this connection process, a conductive connection can be made between the antennas and the strip connection surface (see Nos. 22, 23 and 24). In this spear = according to the temperature and pressure of the length of the preset period, the material components of the lines and the fine antenna net are compressed and combined. : In the subsequent rotating die cutting process in the device, the smart iron (antenna and thin strip) is removed, and the remaining material is removed. The self-adhesive lamp 1 manufactured from this was supplied to the winder 3. The RFID strips may have an _adhesive layer at the top, i.e., a conductor-adhesive layer that may be added as shown in FIG. All of the features disclosed in this application are claimed to be critical to the present invention, and the prior art may be novel, either individually or in combination. [Simple description of the schema] The Si:: is followed by a pattern to describe the advantages and applications of the present invention. 5 荨 荨 显示 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 Manufacturing apparatus for carrying out the method according to the invention in a main structure; Fig. 3 - In a side view, a structure for possible RFID strips used in the method according to the invention; Fig. 4 - in a side view A structure of a device for performing the method of the present invention according to a first embodiment; Fig. 5 is a side view, a further structure of an RFID strip used in the device shown in Fig. 6; Fig. 6 In a side view, a structure according to a second embodiment, which is a further device for carrying out the method of the invention; and FIG. 7: in a side view, a third embodiment, The structure of a further apparatus for carrying out the method of the invention. [Main component symbol description] 1 la lb 1 c 2 3 4 4a Baseband auxiliary carrier tape auxiliary carrier tape segment unwinding roll winding roll deflection roll deflection roll supply and application of RFID strips 18 200809651 5 a Thin strip substrate mesh 6 deflection roll 7 deflection roll 8 strip separation 9 roll 10 base belt l〇a auxiliary carrier tape 1 〇b auxiliary carrier tape 10c line segment 11 RFID strip 11 a interval 12 optical sensor 13 unwinding Rolling 14 Antenna manufacturing or direct antenna supply 15 Antenna long belt 16 Deflection roll 17 Deflection and pressing roll 18 Deflection and pressing roll 19 Antenna assembly on RFID strip 2 0 Antenna 21 Manufacturing conductive connection platform 22 Device for making a conductive connection 23 Device for making a conductive connection 24 Device for making a conductive connection 19 200809651 25 Base band 26 Connection surface 27 Connection 28 Conductive adhesive strip 29 Insulation protection strip 30 Auxiliary load Width of the belt 31 Direction of movement of the auxiliary carrier tape 32 Adhesive application 3 3 Thin strip supply 34 Thin strip base belt 35 Antenna long belt 3 6 Antenna spacing 37 Adhesive layer 3 8 Electronic insulation protection Long belt 3 9 Conductive adhesive Application 40 Press-cutting device 41 Removal of press-cut residual material 42 Conductive adhesive application 20