200809293 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種鏡頭模組，尤其係關於一種可防土 雜散光線對成像造成干擾之鏡頭模組。 【先前技術】 目前絕大多數數位相機鏡頭模組由球面鏡片、鏡筒及 影像感測晶片等部件構成。其具體構造一般係將球面鏡片 收容於鏡筒之内部，影像感測晶片設於球面鏡片之出射光 路上。進入鏡筒之光學影像訊號經過球面鏡片聚焦後到達 影像感測晶片，影像感測晶片將光學影像訊號轉換為電子 影像訊號。 由於習知鏡頭模組自身結構之侷限，實際操作中經常 有一些雜散光線進入鏡筒並被影像感測晶片接收，從而對 拍攝效果造成不利影響。請參閱圖1，一習知之鏡頭模级 包括一鏡筒11、一球面鏡片12及一影像感測器13。鏡筒 11係一中空圓柱體，其包括一内圓柱面110、一拍攝端111 及與該拍攝端111相對之封裝端Π2。拍攝端111中心開 設有一開口 113，為防止雜散光線進入鏡筒π内，該開口 113之直徑沿自拍攝端ill向封裝端112之方向逐漸縮 小’從而於該開口 113處之鏡筒11上對應形成一錐面形侧 壁114。球面鏡片12收容於鏡筒u内。影像感測器13包 括一影像感測晶片131、一蓋板132及一基板133。影像感 測晶片131固定於基板133上；蓋板132係由玻璃等透明 材料製成，該蓋板132之邊緣固定於基板133上，並將影 6 200809293 像感測晶片131封裴於該蓋板132與基板133之間。影像 感測器13固定於鏡筒11之封裝端112上，且影像感測晶 片131位於球面鏡片12之出射光路上，蓋板132設於球面 鏡片12與影像感測晶片133之間。使用該習知鏡頭模組擷 取物體影像時，光學影像訊號從開口 113進入鏡筒11，由 球面鏡片12聚焦後到達影像感測晶片131，然後轉換為電 子影像訊號。 該習知鏡頭模組之工作過程中，外部之部份雜散光線 可能沿不同路徑進入鏡筒11並到達影像感測晶片131，對 正常拍攝產生干擾。儘管形成錐面形側壁114之目的即為 阻擋雜散光線，但一部份鄰近錐面形侧壁114傳播且傳播 方向大致與該錐面形側壁114相互平行之雜散光線a仍然 可從開口 13入射至鏡筒11内，到達鏡筒11之内圓挺面 110，並由該内圓柱面110反射至影像感測晶片131上。同 時，錐面形側壁114亦無法阻擋一部份從接近開口 113中 心之位置射入之雜散光線B，該雜散光線b亦可到達鏡筒 11之内圓柱面110，再由該内圓柱面110反射，穿過蓋板 132到達影像感測晶片131上。另一部份從接近開〇 ID 中心之位置射入雜散光線C還可能到達基板U3並由基板 133反射，穿過蓋板132到達球面鏡片12，再由球面鏡片 12之表面反射’再次穿過蓋板132到達影像感測晶片 上。上述之雜散光線A、B及C均能夠對影像感測晶片131 產生干擾，影響影像感測晶片131之影像感測質量，降低 該數位相機模組之成像品質。 200809293 Ί發明内容】 有鑒於此，有必要提供一種能夠有效地防止雜散光線 對成像造成干擾之鏡頭模組。 一種鏡頭模組，該鏡頭模組包括一鏡筒、一球面鏡片 及一遮光層；其中該鏡筒包括一拍攝端，該拍攝端開設有 一開口；該球面鏡片收容於該鏡筒内部；該遮光層係一遮 光薄膜，其環繞該開口裝設於該鏡筒之拍攝端上。 與習知技術相比，所述鏡頭模組可將來自多個方向之 雜散光線阻擋或吸收，防土雜散光線對成像造成干擾，有 效地提南拍攝質量。 【實施方式】 &月參閱圖2 ’本發明鏡頭核組之較佳實施例包括一鏡 筒2、一球面鏡片3、一影像感測器4及一遮光部5。其中 球面鏡片3收容於鏡筒2内部，影像感測器4裝設於鏡筒 2之一端，遮光部5裝設於鏡筒2及影像感測器4上。 鏡间2係一中空圓枉體，可由塑膠等材料通過射出成 型等方式製成。該鏡筒2包括一内圓柱面201、一拍攝端 21及一與該拍攝端相對設置之封裝端22。拍攝端21 中心開設有一開口 23,該開口 23之直徑沿自拍攝端21向 封裝端22之方向逐漸縮小，從而於該開口 23處之鏡筒2 上對應形成一錐面形側壁24。 球面鏡片3收容於鏡筒2内部，該球面鏡片3之邊緣 與内圓柱面201緊密配合，以卡配或膠合之方式固定於鏡 筒2内部。可以理解，鏡筒2内可採用同樣方式收容複數 200809293 •片球面鏡片3，亦可根據需要將若干球面鏡片3更換為平 面透鏡。 影像感測器4包括一影像感測晶片41、一蓋板42及 一基板43。影像感測晶片41固定於基板43上。蓋板42 係由玻璃等透明材料製成，該蓋板42之邊緣固定於基板 43之邊緣上，並將影像感測晶片41封裝於蓋板42與基板 43之間。 請一併參閱圖3、圖4及圖5，遮光部5係採用具有 高吸收率及低反射率之遮光材料如黑色油墨塗層、遮光膠 帶等所形成之薄膜，該遮光部5包括一遮光層51、一第〆 吸收層52及一第二吸收層53。遮光層51環繞開口 23裝 設於鏡筒2之拍攝端21上，該遮光層51中央開設有一採 光孔511。該採光孔511之形狀大致呈圓形，並具有四條 兩兩相對之平直邊緣，每兩條相鄰之平直邊緣之間均由圓 弧形邊緣連接；此種形狀有利於阻擋外界之雜散光線，同 時從外界取得更多拍攝所必需之光學影像訊號。該遮光層 51之内徑小於開口 23於拍攝端21處之直徑，而與開口 23 較接近封裝端22之一端之直徑相當。第/吸收層52可裝 設於球面鏡片3上或蓋板42上，本實施例中該第一吸收層 52裝設於蓋板42頂面之邊緣，且該第一吸收層52中央開 设有一通光孔521。該通光孔521之形狀大致為具有平滑 幫曲邊緣之圓角四邊形，此種形狀有利於陴擋到達蓋板42 之雜散光線，同時允許更多拍攝所必需之光學影像訊號通 過蓋板42。第二吸收層53可裝設於影像感測器4之影像 9 200809293 •感測晶片41週邊，或裝設於基板43上鄰近影像感測晶片 41之位置。本實施例中，該第二吸收層53圍繞影像感測 晶片41阈邊裝設於基板43之邊緣，該第二吸收層53中央 開設有一容置孔531，該容置孔531之形狀大致為圓角矩 形且與影像感測晶片41之形狀相當’有利於吸收更多到達 基板43之雜散光線。影像感測晶片41容置於該容置孔531 内，且該影像感測晶片41之輪廓與該容置孔531相互吻 合，從而避免於基板43上留下可能反射雜散光線之裸露區 域。 組裝時，將影像感測器4固定於鏡筒2之封裝端22 上，影像感測晶片41置於球面鏡片3之出射光路上，且令 蓋板42置於球面鏡片3與影像感測晶片41之間，即完成 本發明鏡頭模組較佳實施例之組裝。 使用所述鏡頭模組進行拍攝時，由於遮光層51之内 徑小於開口 23於拍攝端21處之直徑，一部份鄰近錐面形 側壁24傳播且傳播方向大致與該錐面形側壁24相互平行 之雜散光線Α:將被遮光層51阻擋，不會進入鏡筒2内部 干擾影像感測晶片41。一部份從接近開D 23中心之位置 射入之雜散光線^進入鏡筒2後到達鏡筒2之内圓柱面 201，然後被該内圓柱面201反射至第一吸收層52上並被 第^及收層52所吸收，不會穿過蓋板42到達影像感測^曰 片41。一部份從接近開口 23中心之位置射入雜散光線^ 則於到達基板43後被第二吸收層53所吸收，不會於基板 43、内圓柱面201及球面鏡片3之間多次反射而&致二擾 200809293 •影像感測晶片41。通過以上方式，可以有效地減少來自上 述Αχ、Βχ、Ci等多個方向之雜散光線到達影像感測晶片 41而干擾正常成像’有效地提南鏡頭模組之光學品質。 綜上所述’本發明符合發明專利要件，麦依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，於、援依本案創作精神所作之等效 修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1係習知鏡頭模組之示意圖； 圖2係本發明鏡頭模組之較佳實施例之示意圖； 圖3係本發明鏡頭模組之較佳實施例中遮光層之示意 圖； 圖4係本發明鏡頭模組之較佳實施例中第一吸收層之 示意圖；及 圖5係本發明鏡頭模組之較佳實施例中第二吸收層之 示意圖。 【主要元件符號說明】 (習知） hilL 鏡阂 11 内圓枉面 110 拍攝端 111 封裝端 112 開口 113 錐面形侧壁 114 球面鏡片 12 影像感測器 13 影像感測晶片 131 蓋板 132 基板 133 11 200809293 (本發明） hiL· /r/r 鏡闾 2 内圓柱面 201 拍攝端 21 封裝端 22 開口 23 錐面形側壁 24 球面鏡片 3 影像感測器 4 影像感測晶片 41 蓋板 42 基板 43 遮光部 5 遐无層 51 採光孔 511 第一吸收層 52 通光孔 521 第二吸收層 53 容置孔 531 12200809293 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a lens module, and more particularly to a lens module capable of preventing interference caused by soil stray light. [Prior Art] At present, most digital camera lens modules are composed of spherical lenses, lens barrels, and image sensing wafers. The specific structure generally includes the spherical lens being housed inside the lens barrel, and the image sensing chip is disposed on the outgoing light path of the spherical lens. The optical image signal entering the lens barrel is focused by the spherical lens to reach the image sensing chip, and the image sensing chip converts the optical image signal into an electronic image signal. Due to the limitations of the conventional lens module structure, in practice, some stray light often enters the lens barrel and is received by the image sensing chip, thereby adversely affecting the shooting effect. Referring to FIG. 1, a conventional lens module includes a lens barrel 11, a spherical lens 12, and an image sensor 13. The lens barrel 11 is a hollow cylinder including an inner cylindrical surface 110, a photographing end 111 and a package end Π 2 opposite to the photographing end 111. An opening 113 is defined in the center of the shooting end 111. To prevent stray light from entering the lens barrel π, the diameter of the opening 113 gradually decreases from the photographing end ill toward the package end 112, so that the lens 11 is at the opening 113. Correspondingly, a tapered side wall 114 is formed. The spherical lens 12 is housed in the lens barrel u. The image sensor 13 includes an image sensing chip 131, a cover 132, and a substrate 133. The image sensing wafer 131 is fixed on the substrate 133; the cover 132 is made of a transparent material such as glass, the edge of the cover 132 is fixed on the substrate 133, and the shadow 6 200809293 image sensing wafer 131 is sealed on the cover. Between the plate 132 and the substrate 133. The image sensor 13 is fixed on the package end 112 of the lens barrel 11, and the image sensing film 131 is located on the outgoing light path of the spherical lens 12. The cover 132 is disposed between the spherical lens 12 and the image sensing wafer 133. When the object image is captured by the conventional lens module, the optical image signal enters the lens barrel 11 from the opening 113, is focused by the spherical lens 12, reaches the image sensing wafer 131, and is converted into an electronic image signal. During the operation of the conventional lens module, part of the external stray light may enter the lens barrel 11 along different paths and reach the image sensing chip 131, which may interfere with normal shooting. Although the purpose of forming the tapered sidewalls 114 is to block stray light, a portion of the stray light a that propagates adjacent to the tapered sidewalls 114 and whose direction of propagation is substantially parallel to the tapered sidewalls 114 remains open from the opening. 13 is incident into the lens barrel 11 and reaches the inner round face 110 of the lens barrel 11 and is reflected by the inner cylindrical surface 110 onto the image sensing wafer 131. At the same time, the tapered side wall 114 can not block a part of the stray light B incident from the position near the center of the opening 113, and the stray light b can also reach the inner cylindrical surface 110 of the lens barrel 11, and then the inner cylinder The face 110 reflects and passes through the cover 132 to the image sensing wafer 131. Another portion of the stray light C incident from the location near the center of the open ID may also reach the substrate U3 and be reflected by the substrate 133, pass through the cover 132 to the spherical lens 12, and be reflected by the surface of the spherical lens 12 again. The cover plate 132 reaches the image sensing wafer. The above-mentioned stray light rays A, B and C can interfere with the image sensing chip 131, affect the image sensing quality of the image sensing chip 131, and reduce the imaging quality of the digital camera module. 200809293 ΊInventive content] In view of this, it is necessary to provide a lens module that can effectively prevent stray light from interfering with imaging. A lens module includes a lens barrel, a spherical lens and a light shielding layer; wherein the lens barrel includes a shooting end, the shooting end defines an opening; the spherical lens is received inside the lens barrel; The layer is a light-shielding film which is mounted around the opening on the photographing end of the lens barrel. Compared with the prior art, the lens module can block or absorb stray light from multiple directions, prevent the stray light from interfering with the imaging, and effectively improve the quality of the shooting. [Embodiment] Referring to Figure 2, a preferred embodiment of the lens core assembly of the present invention comprises a lens barrel 2, a spherical lens 3, an image sensor 4 and a light shielding portion 5. The spherical lens 3 is received in the lens barrel 2, and the image sensor 4 is mounted on one end of the lens barrel 2. The light shielding portion 5 is mounted on the lens barrel 2 and the image sensor 4. Mirror 2 is a hollow round body that can be made by injection molding or other materials. The lens barrel 2 includes an inner cylindrical surface 201, a photographing end 21, and a package end 22 disposed opposite the photographing end. An opening 23 is formed in the center of the shooting end 21, and the diameter of the opening 23 is gradually reduced from the photographing end 21 toward the package end 22, so that a tapered side wall 24 is formed on the lens barrel 2 at the opening 23. The spherical lens 3 is housed inside the lens barrel 2, and the edge of the spherical lens 3 is closely fitted to the inner cylindrical surface 201, and is fixed to the inside of the lens barrel 2 by snapping or gluing. It can be understood that the lens barrel 2 can be accommodated in the same manner in the same manner. 200809293 • The spherical lens 3 can be replaced with a spherical lens as needed. The image sensor 4 includes an image sensing wafer 41, a cover 42 and a substrate 43. The image sensing wafer 41 is fixed to the substrate 43. The cover 42 is made of a transparent material such as glass. The edge of the cover 42 is fixed to the edge of the substrate 43 and the image sensing wafer 41 is sealed between the cover 42 and the substrate 43. Referring to FIG. 3, FIG. 4 and FIG. 5 together, the light shielding portion 5 is a film formed by a light-shielding material having a high absorption rate and a low reflectance, such as a black ink coating, a light-shielding tape, or the like, and the light shielding portion 5 includes a light shielding portion. The layer 51, a second absorption layer 52 and a second absorption layer 53. The light shielding layer 51 is mounted on the imaging end 21 of the lens barrel 2 around the opening 23, and a light collecting hole 511 is defined in the center of the light shielding layer 51. The light collecting hole 511 has a substantially circular shape and has four opposite flat edges, and each of the two adjacent straight edges is connected by a circular arc edge; the shape is favorable for blocking the outside world. The light is scattered, and at the same time, more optical image signals necessary for shooting are obtained from the outside. The inner diameter of the light shielding layer 51 is smaller than the diameter of the opening 23 at the photographing end 21, and is comparable to the diameter of the opening 23 closer to one end of the package end 22. The first absorbing layer 52 is disposed on the edge of the top surface of the cover 42 and is disposed at the center of the first absorbing layer 52. There is a light aperture 521. The shape of the light-passing aperture 521 is substantially a rounded quadrilateral having a smooth curved edge. This shape facilitates the stray light reaching the cover 42 while allowing more optical image signals necessary for shooting to pass through the cover 42. . The second absorbing layer 53 can be mounted on the image of the image sensor 4 . 200809293 • The periphery of the sensing chip 41 or the substrate 43 is adjacent to the image sensing wafer 41 . In this embodiment, the second absorbing layer 53 is disposed on the edge of the substrate 43 around the threshold of the image sensing wafer 41. The accommodating hole 531 is defined in the center of the second absorbing layer 53. The accommodating hole 531 is substantially shaped. The rounded rectangle is similar to the shape of the image sensing wafer 41' to facilitate absorption of more stray light reaching the substrate 43. The image sensing chip 41 is received in the receiving hole 531, and the contour of the image sensing chip 41 and the receiving hole 531 are matched to each other, thereby avoiding leaving a bare area on the substrate 43 that may reflect stray light. When assembled, the image sensor 4 is fixed on the package end 22 of the lens barrel 2, the image sensing wafer 41 is placed on the outgoing light path of the spherical lens 3, and the cover 42 is placed on the spherical lens 3 and the image sensing wafer. Between 41, the assembly of the preferred embodiment of the lens module of the present invention is completed. When the lens module is used for photographing, since the inner diameter of the light shielding layer 51 is smaller than the diameter of the opening 23 at the photographing end 21, a portion is propagated adjacent to the tapered side wall 24 and the propagation direction is substantially opposite to the tapered side wall 24. Parallel stray light Α: will be blocked by the light shielding layer 51, and will not enter the inside of the lens barrel 2 to interfere with the image sensing wafer 41. A portion of the stray light incident from the position near the center of the opening D 23 enters the lens barrel 2 and reaches the inner cylindrical surface 201 of the lens barrel 2, and is then reflected by the inner cylindrical surface 201 onto the first absorption layer 52 and is The first and second layers 52 are absorbed and do not pass through the cover 42 to reach the image sensing sheet 41. A portion of the stray light incident from the center of the opening 23 is absorbed by the second absorbing layer 53 after reaching the substrate 43, and is not reflected multiple times between the substrate 43, the inner cylindrical surface 201 and the spherical lens 3. And & 2, 200809293 • Image Sensing Wafer 41. In the above manner, the stray light from the plurality of directions, such as Αχ, Βχ, and Ci, can be effectively reduced to reach the image sensing wafer 41 and interfere with the optical quality of the normal imaging unit. In summary, the invention conforms to the patent requirements of the invention, and the patent application is filed by Mai. The above descriptions are only the preferred embodiments of the present invention, and those skilled in the art will be able to include the equivalent modifications or variations of the present invention in the spirit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional lens module; FIG. 2 is a schematic view of a preferred embodiment of the lens module of the present invention; FIG. 3 is a light shielding layer in a preferred embodiment of the lens module of the present invention. 4 is a schematic view of a first absorbent layer in a preferred embodiment of the lens module of the present invention; and FIG. 5 is a schematic view of a second absorbent layer in a preferred embodiment of the lens module of the present invention. [Main component symbol description] (conventional) hilL mirror 11 inner circular surface 110 imaging end 111 package end 112 opening 113 tapered surface side wall 114 spherical lens 12 image sensor 13 image sensing wafer 131 cover plate 132 substrate 133 11 200809293 (Invention) hiL· /r/r Mirror 2 Inner cylindrical surface 201 Shooting end 21 Package end 22 Opening 23 Tapered side wall 24 Spherical lens 3 Image sensor 4 Image sensing wafer 41 Cover 42 Substrate 43 opaque portion 5 遐 no layer 51 lighting aperture 511 first absorbing layer 52 light passing hole 521 second absorbing layer 53 accommodating hole 531 12