TW200808890A - Paste composition and plasma display panel - Google Patents

Paste composition and plasma display panel Download PDF

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TW200808890A
TW200808890A TW096118577A TW96118577A TW200808890A TW 200808890 A TW200808890 A TW 200808890A TW 096118577 A TW096118577 A TW 096118577A TW 96118577 A TW96118577 A TW 96118577A TW 200808890 A TW200808890 A TW 200808890A
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paste composition
mass
dielectric layer
composition according
acid
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TW096118577A
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Chinese (zh)
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Tomoyuki Inoue
Shigeru Suzuki
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Tokyo Ohka Kogyo Co Ltd
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    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/38—Dielectric or insulating layers

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  • Glass Compositions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
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Abstract

Disclosed is a paste composition which can be coated by a conventional coating method and enables to form a thin film-like dielectric layer. Specifically disclosed is a paste composition containing a binder resin (A) containing an acrylic polymer having a mass average molecular weight of 150,000-300,000 and a glass transition temperature of 30-100 DEG C, a solvent (B) containing at least one substance selected from monocyclic monoterpenes and hydrogenated compounds thereof, and an inorganic powder (C).

Description

200808890 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種糊漿組成物，該糊漿組 以形成使用氣體放電之自發光形式的電漿顯示i 下亦稱為PDP)的介電體層，及有關於一種電漿 板’其具備使用該糊漿組成物所形成的介電體層 【先前技術】 PDp係前面板與背面板相向配設並整體化而 元件；在該前面板形成有互相平行之由透明電極 電極所構成的複合電極，而在該背面板以與上述 正交的方式形成有互相平行的定址電極。 該前面板具有由顯示面所構成的透明玻璃基 玻璃基板的内側，亦即在背面板側配置有上述複 而且，以覆蓋該複合電極的方式形成有介電體層 電體層上設置有已圖案化的間隔物層，在該介電 隔物層的表面，形成有由金屬氡化物所構成的保 另一方面，在該背面板之基板的前面板側， 述定址電極’並以覆蓋該定址電極的方式形成 層，在該介電體層上形成有下述的發光部。 PDP的介電體層’係在基板表面塗佈由例如 璃、PbO系玻璃等的低熔點破螭、樹脂、及有機 成的糊漿組成物’並藉由培燒來形成。 從改良導電性的觀點’在介電體層側表面的 成物係用 面板（以 顯示器面 成之顯示 及匯流排 複合電極 板’在該 合電極。 ，在該介 體層及間 護膜。 配置有上 有介電體 ZnO系玻 溶劑所構 基板或電 5200808890 IX. Description of the Invention: [Technical Field] The present invention relates to a paste composition which is formed by forming a plasma display i-formed as a PDP in a self-luminous form using a gas discharge. An electric layer, and a dielectric board having a dielectric layer formed using the paste composition. [Prior Art] The PDp front panel and the back panel are oppositely disposed and integrated with the components; the front panel is formed There are composite electrodes composed of transparent electrode electrodes which are parallel to each other, and the back surface plates are formed with mutually parallel address electrodes so as to be orthogonal to the above. The front panel has an inner side of a transparent glass-based glass substrate formed of a display surface, that is, the above-mentioned multilayer is disposed on the back surface side, and a dielectric layer is formed on the dielectric layer to cover the composite electrode. a spacer layer on the surface of the dielectric spacer layer formed with a metal halide. On the other hand, on the front panel side of the substrate of the back panel, the address electrode 'is addressed to cover the address electrode The layer is formed in such a manner that a light-emitting portion described below is formed on the dielectric layer. The dielectric layer of the PDP is formed by coating a surface of the substrate with a low melting point, such as glass or PbO glass, a resin, and an organic paste composition, and is formed by firing. From the viewpoint of improving conductivity, a panel for forming a substrate on the side of the dielectric layer (displayed by a display surface and a composite electrode plate of a bus bar) is placed at the junction electrode. The dielectric layer and the interlayer film are disposed. There is a dielectric ZnO-based glass solvent substrate or electricity.

200808890 極之任一者使用銅時，會有自銅表面產生氣泡，且在焙 後亦在介電體層中殘留氣泡之問題。結果，會有無法得 充分的平坦性，且有無法得到良好的介電體層之問題。 因此，已進行研討能夠抑制從銅表面產生氣泡之介 體層（參照專利文獻1、2)。 [專利文獻1]日本特開2006-008792號公報 [專利文獻2]日本特開2006-1 07947號公報 【發明内容】 [發明所欲解決之課題] 但是，即便使用專利文獻1、2所記載之糊漿組成物 亦無法完全抑制氣泡的發生，難以得到具有充分平坦性 介電體層。 因此，正研討一種將介電體層的厚度以先前的一半 右的薄膜狀來形成，用以使發生的氣泡穿過而脫離之 法。但是，因為先前的介電體層厚度係比氣泡的内徑厚 會有所產生氣被關閉在其中間、或是殘留於表面之情形 為了得到薄膜狀的介電體層，考慮一種減小基板與 佈裝置的間隔（以下稱為間隙）來更薄地塗佈糊漿組成物 方法。但是，間隙變為越小時，塗佈裝置與基板接觸的 能性越高，會有無法使用與先前相同的塗佈方法（塗佈裝 之可能性。 鑑於以上課題，本發明之目的係提供一種糊漿組 物，能夠使用與先前相同的塗佈方法，且能夠形成薄膜 燒 到 電 之 左 方 〇 塗 之 可 置） 成 狀 6 200808890 •的介電ϋ層’及提供一種具備由該糊漿組成物所形成的介 電體層之電漿顯示器面板。 [解決課題之手段] 本月的發明人，發現藉由降低糊漿組成物的固體成 分濃度’並對所塗佈的糊漿組成物進行焙燒來使其收縮， 能夠使介電體層薄膜化。又，本發明者發現為了使用與先 前相同的塗佈方法，必須提高糊漿組成物的黏度，而完成200808890 Whenever copper is used, there is a problem that bubbles are generated from the copper surface and bubbles remain in the dielectric layer after baking. As a result, there is a problem that sufficient flatness cannot be obtained and a good dielectric layer cannot be obtained. Therefore, a dielectric layer capable of suppressing generation of bubbles from the copper surface has been studied (see Patent Documents 1 and 2). [Patent Document 1] JP-A-2006-008792 [Patent Document 2] JP-A-2006-1 07947 [Claim of the Invention] [Problems to be Solved by the Invention] However, the use of Patent Documents 1 and 2 is described. The syrup composition also cannot completely suppress the occurrence of bubbles, and it is difficult to obtain a dielectric layer having a sufficient flatness. Therefore, a method of forming the thickness of the dielectric layer in the form of the previous half-right film is being studied for the passage of the generated bubbles. However, since the thickness of the previous dielectric layer is thicker than the inner diameter of the bubble, there is a case where the gas is closed in the middle or remains on the surface. In order to obtain a film-like dielectric layer, consider reducing the substrate and the cloth. The spacing of the devices (hereinafter referred to as the gap) is used to apply the paste composition method thinner. However, the smaller the gap becomes, the higher the energy of the coating device in contact with the substrate, and the same coating method as before (the possibility of coating is not possible). In view of the above problems, an object of the present invention is to provide a The paste composition can be used in the same coating method as before, and can form a film that can be burned to the left of the electric coating. The shape of the dielectric layer 6 200808890 • and the provision of a paste provided by the paste A plasma display panel of a dielectric layer formed by the composition. [Means for Solving the Problem] The inventors of the present invention found that the dielectric layer can be thinned by reducing the solid component concentration of the paste composition and baking the applied paste composition to shrink it. Further, the inventors have found that in order to use the same coating method as before, it is necessary to increase the viscosity of the paste composition and complete

本發明提供一種糊漿組成物，係用以形成電漿顯示器 面板的介電體層之糊漿組成物，含有：（A)黏合劑樹脂，其 含有質量平均分子量為15〇〇〇〇〜3〇〇〇〇〇、且玻璃轉移溫度 為3 0°C〜lOOt的丙烯酸系聚合物；溶劑，其含有單環 單薛烯及其加氫化合物中至少1種；及（c)無機粉末。 又，本發明提供一種具備由該糊漿組成物所形成的介 電體層之電漿顯示器面板。 [發明之效果] Φ 依照本發明，能夠提供一種即便係低固體成分濃度但 是具有高黏性之糊漿組成物，係藉由使用（A)黏合劑樹脂， 其含有質量平均分子量為15 0000〜3 00 000、且破璃轉移溫 度為30°C〜100°C的丙烯酸系聚合物；及（B)溶劑，其含有 單環單褡婦及其加氫化合物中至少1種而成。 藉此，即便使間隙減小亦能夠使用與先前相同的塗佈 方法，且能夠形成薄膜狀的介電體層。 7The present invention provides a paste composition for forming a paste composition of a dielectric layer of a plasma display panel, comprising: (A) a binder resin having a mass average molecular weight of 15 〇〇〇〇 3 〇 And an acrylic polymer having a glass transition temperature of from 30 ° C to 100 volts; a solvent comprising at least one of monocyclic monoxene and a hydrogenated compound thereof; and (c) an inorganic powder. Further, the present invention provides a plasma display panel having a dielectric layer formed of the paste composition. [Effect of the Invention] Φ According to the present invention, it is possible to provide a paste composition having a high viscosity even at a low solid content concentration, which comprises a mass average molecular weight of 15 0000 by using (A) a binder resin. An acrylic polymer having a glass transition temperature of 30 ° C to 100 ° C; and (B) a solvent containing at least one of a monocyclic monosaccharide and a hydrogenated compound. Thereby, even if the gap is made small, the same coating method as before can be used, and a film-like dielectric layer can be formed. 7

200808890 【實施方式】 本發明之糊聚組成物含有：（A)黏合劑樹脂（以下 為（A)成分）、（B)溶劑（以丁亦稱為（B)成分）及（c)無機 (以下亦稱為（C)成分）。以下詳細地說明本發明之實 態。 [(A)黏合劑樹脂] (A)黏合劑樹脂，係使用質量平均分子 150000〜300000，較佳是200000〜300000的丙婦酸系 物。藉由使丙烯酸系聚合物之質量平均分子量在上 圍’即便係低固體成分濃度亦能夠製造具有高黏度的 組成物。藉此，能夠形成薄膜狀的介電體層。 上述丙烯酸系聚合物之玻璃轉移溫度為 3〇 t °C，以50°C〜80°C為佳，以60°C〜7(TC為更佳。藉由 烯酸系聚合物的玻璃轉移溫度在上述範圍，可提供一 夠更增加糊漿組成物的黏度之糊漿組成物，藉此，即 低固體成分濃度亦能夠使用與先前相同的塗佈方法來 塗佈。 又，相對於溶劑以外之1 00質量份總固體成分， 丙烯酸系聚合物的含量為5質量份〜40質量份，以i 〇 份〜35質量份為佳，以15質量份〜30質量份為更佳。 使丙烯酸系聚合物的含量在上述範圍，能夠製造低固 分濃度且高黏度的糊漿組成物。 此種丙婦酸系聚合物，以使用（a 1)具有經基之聚 單體（以下亦稱為（al)成分）、與（a2)以下述結構所示之 亦稱 粉末 施形 聚合 述範 糊漿 〜100 使丙 種能 便係 進行 前述 質量 藉由 體成 合性 聚合 8200808890 [Embodiment] The paste composition of the present invention contains: (A) a binder resin (hereinafter referred to as component (A)), (B) a solvent (also referred to as component (B)), and (c) inorganic ( Hereinafter also referred to as component (C)). The embodiment of the present invention will be described in detail below. [(A) Adhesive Resin] (A) A binder resin is a propylene glycol acid compound having a mass average molecular weight of from 150,000 to 300,000, preferably from 200,000 to 300,000. A composition having a high viscosity can be produced by making the mass average molecular weight of the acrylic polymer in the upper portion even at a low solid content concentration. Thereby, a thin film dielectric layer can be formed. The glass transition temperature of the above acrylic polymer is 3 〇 t ° C, preferably 50 ° C to 80 ° C, and 60 ° C to 7 (TC is more preferred. The glass transition temperature by the olefinic polymer) In the above range, a paste composition capable of increasing the viscosity of the paste composition can be provided, whereby the low solid content concentration can also be applied using the same coating method as before. The content of the acrylic polymer is from 5 parts by mass to 40 parts by mass, preferably from 1 part by mass to 35 parts by mass, more preferably from 15 parts by mass to 30 parts by mass, based on 100 parts by mass of the total solid content. The content of the polymer is in the above range, and it is possible to produce a paste composition having a low solid concentration and a high viscosity. The use of the (a1) polysiloxane having a warp group (hereinafter also referred to as a polymer) (al) component), and (a2) a powder as described in the following structure, which is also referred to as a powder, to form a syrup, which is exemplified by the following structure.

200808890 性單體（以下亦稱為（a 2)成分）之共聚物為佳。 [化學式1] CH2 = CR-COOCnH2n + 1 [式中，R係氫原子或碳數1〜5的烷基、η係1〜1( 藉由含有（al)成分，在焙燒時（C)無機粉末與 為容易 '，能夠提升（C)無機粉末的分散性。藉此， 所形成的介電體層之平坦性。 又，藉由含有（a2)成分，能夠提升丙烯酸系 玻璃轉移溫度。又，亦能夠提升所形成的介電體 性。 (al)成分若是能夠將羥基導入黏合劑樹脂之 體時，沒有特別限定。具體上，可舉出：丙烯酸： 苯氧基丙酯、酞酸 2-丙稀醯基乙基-2-羥基乙酯 甲基丙烯醯基乙基-2-羥基丙酯、丙烯酸2-羥基乙 丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯、甲基i 羥基丙酯、丙烯酸3 -羥基丙酯、甲基丙烯酸3 _經 丙烯酸2 -羥基丁酯、曱基丙烯酸2 -羥基丁酯、| 羥基丁酯、甲基丙烯酸3 -羥基丁酯、丙烯酸4 -類 曱基丙烯酸4-羥基丁酯、乙二醇一丙烯酸酯、乙 基丙烯酸酯、甘油丙烯酸酯、甘油甲基丙烯酸酯 四醇一丙豨酸S旨、二新戊四醇一曱基丙烯酸S旨、 氫糠酯、甲基丙婦酸四氫糠酯、鄰經基苯乙烯、 乙烯、對羥基苯乙烯等。 在（A)黏合劑樹脂中之（a 1)成分的含有率以 )的整數] 氫鍵結變 能夠提升 聚合物的 層之柔軟 聚合性單 2 ·經基-3 -、酞酸 2-酯、甲基 两烯酸2-.基丙fi旨、 两烯酸3 -.基丁酯、 二醇一曱 、二新戊 丙烯酸四 間羥基苯 10莫耳 9 200808890 %〜90莫耳％為佳，以1〇冑耳％〜5〇莫耳％為更佳，以 莫耳％〜30莫耳％為最佳。藉由使前述⑷)成分的含有率在 上述範圍，在焙燒時（c)無機粉末與氫鍵結變為容处 提升（C)無機粉末的分散性。 (a·2)成分係下述結構式所示之聚合性單體。 [化學式2] CH2 = CR.C〇〇CnH2n + 1200808890 A copolymer of a monomer (hereinafter also referred to as (a 2) component) is preferred. [Chemical Formula 1] CH2 = CR-COOCnH2n + 1 [In the formula, R is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and η is 1 to 1 (by containing an (al) component, when calcined (C) inorganic The powder is easy to ', and the dispersibility of the (C) inorganic powder can be improved. Thereby, the flatness of the formed dielectric layer can be improved. Further, by containing the component (a2), the transfer temperature of the acrylic glass can be increased. The (al) component is not particularly limited as long as it can introduce a hydroxyl group into the binder resin. Specifically, acrylic acid: phenoxypropyl ester and citric acid 2- Acetylethyl-2-hydroxyethyl methacrylate decylethyl-2-hydroxypropyl ester, 2-hydroxyethyl 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, methyl i hydroxy propyl Ester, 3-hydroxypropyl acrylate, methacrylic acid 3 _ 2-hydroxybutyl acrylate, 2-hydroxybutyl methacrylate, | hydroxybutyl ester, 3-hydroxybutyl methacrylate, 4-gerene acrylate 4-hydroxybutyl acrylate, ethylene glycol monoacrylate, ethyl acrylate, glycerin acrylate, glycerin Acrylate tetraol-propionic acid S, dipentaerythritol monodecyl acrylate S, hydroquinone ester, methyl propyl acetoate tetrahydrofurfuryl ester, o-butyl styrene, ethylene, p-hydroxystyrene Etc. In the (A) binder resin, the content of the (a1) component is an integer] hydrogen bonding can enhance the soft polymerizability of the polymer layer. 2 2, thiol-3, and citric acid 2 - ester, methyl 2-enoic acid 2-. propyl propyl, 3, butyl succinate, diol hydrazine, di-pivalic acid tetra-hydroxy benzene 10 Mo 9 9 200808890 % ~ 90 mol % It is better to use 1% ear %~5〇% of the ear is better, and the molar %~30% is the best. By setting the content of the component (4)) to the above range, (c) the inorganic powder and the hydrogen bond become a container at the time of firing to enhance the dispersibility of the (C) inorganic powder. The component (a·2) is a polymerizable monomer represented by the following structural formula. [Chemical Formula 2] CH2 = CR.C〇〇CnH2n + 1

[式中，R係氫原子或碳數1〜5的烷基，η係1〜〗〇从龄 1 υ的整數] 碳數1〜5的烷基亦可以是直鏈狀亦可以是分枝狀。盆 中，從熱分解性的觀點，以甲基為佳。又，η以iMO \其 以1〜8為更佳，以^為最佳。而且，n係3从上整數=， 末端的燒基可以是直鏈狀亦可以是分枝狀。 w取别述（a2)成 例 σ 1平體，可舉出 如丙烯酸甲酯、甲基丙烯酸甲酯、丙烯酸乙酯、 烯酸乙酯、丙烯酸正丙酯、曱基丙烯酸正丙酯 土丙 丙酯、曱基丙烯酸異丙酯、丙烯酸正 " T s. , ^ ^ 』自曰T基丙烯酸正 t 烯酸異丁酯、甲基丙烯酸異丁酯、丙烯酸第二丁 知、曱基丙烯酸第二丁酯、丙婦酸第三丁酯、 篦二丁缺松 7基丙稀酸 ::丁知專。…合性單體之中’從所形成的介電體声 、八軟性之觀點，以甲基丙烯酸異丁酯為佳。 " (A)點合劑樹脂中之（a2)成分的含有率以 莫耳％為私 ,手乂 10莫耳〇/〇〜90 斗為铨，以30莫耳％〜90莫耳％為更佳，以 莫耳％為爭莫耳/。〜8 5 马最佳。藉由使前述（a2)成分的含量在 上，能热a 莫耳％以 夠抑制對黏合劑樹脂中的羥基之立體障 予聚。又，藉 10 200808890 由使（a2)成分的含有率為90莫耳％以下，能夠使所形成介 電體層的柔軟性變為良好。 (A) 黏合劑樹脂在不損害本發明效果的範圍，除了前述 (al)成分及（a2)成分以外，亦可含有其他的聚合性單體（相 當於後述之（D2)成分）。[In the formula, R is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and η is 1 to 〇 from an integer of 1 υ]. The alkyl group having 1 to 5 carbon atoms may be linear or branched. shape. In the pot, from the viewpoint of thermal decomposition, a methyl group is preferred. Further, η is preferably iMO \ which is preferably 1 to 8, and is preferably the same. Further, the n-form 3 is from the upper integer =, and the alkyl group at the end may be linear or branched. w 取 (a2) σ 1 flat body, for example, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl enoate, n-propyl acrylate, n-propyl methacrylate Propyl ester, isopropyl methacrylate, acrylic acid " T s. , ^ ^ 』 self-tanning T-based acrylic acid isobutyl methacrylate, isobutyl methacrylate, acrylic acid second known, methacrylic acid Second butyl ester, tributyl butyl acrylate, bismuth butyl sulphonate 7-based acrylic acid: Ding Zhizhuan. Among the conjugate monomers, isobutyl methacrylate is preferred from the viewpoint of the formation of the dielectric sound and the eight softness. " (A) The content of the (a2) component in the point-in-resin resin is in the form of mol%, and the handcuffs are 10 〇 〇 / 〇 ~ 90 铨 铨, with 30 mol % ~ 90 mol % Good, with Moll% as a contempt. ~ 8 5 horses best. By setting the content of the component (a2) above, it is possible to heat a mole % to suppress the stereoscopic barrier polymerization of the hydroxyl group in the binder resin. Further, by using 10 200808890, the content of the component (a2) is 90 mol% or less, and the flexibility of the formed dielectric layer can be improved. (A) The binder resin may contain other polymerizable monomers (corresponding to the component (D2) described later) in addition to the components (a) and (a2), insofar as the effects of the present invention are not impaired.

前述（A)黏合劑樹脂能夠藉由眾所周知的自由基聚合 來製造。亦即，能夠在聚合溶劑中將聚合性單體及眾所周 知的自由基聚合引發劑溶解後，藉由加熱攪拌來製造。 相對於溶劑以外之1 00質量份總固體成分，在本發明 之糊漿組成物中之（A)黏合劑樹脂的含量，以5質量份〜4 0 質量份為佳，以10質量份〜30質量份為更佳。 在本發明之糊漿組成物中的（A)黏合劑樹脂，在不損害 本發明效果的範圍，亦可含有丙烯酸系聚合物以外的共聚 物（相當於後述之（D1)成分）。 [(B)溶劑] (B) 溶劑係含有單環單萜烯及其加氫化合物中至少1 種。單環單萜烯可舉出葶烯、葱品醇、香旱芹酮等。又， 單環單萜烯之加氫化合物可舉出蓋烷醇。此等可單獨或組 合2種以上使用。 單環單萜烯因為具有比作為先前溶劑用之酯系溶劑高 的黏性，所以能夠增加糊漿組成物的黏度。藉此，即便低 固體成分濃度的糊漿組成物，亦能夠使用與先前相同塗佈 裝置來進行塗佈。其中，因為葱品醇或盖烷醇具有較高的 黏性，以使用此等中至少一種為佳。 11 200808890 若糊漿組成物的黏度為 SOOOmPa · s^SOOOOmPa 較佳是5500m Pa· 質量％〜70質量％、 s〜45000mPa · s，且固體成分濃度為4〇 較佳是45質量％〜65質量％、更佳是50 質里/〇〜60貝I 〇/〇的範圍時，在本發明之糊漿組成物中的 溶劑含量沒有特別限定。 [無機粉末] 本發明之糊漿組成物含有無機粉末。The above (A) binder resin can be produced by a well-known radical polymerization. In other words, the polymerizable monomer and the well-known radical polymerization initiator can be dissolved in a polymerization solvent and then produced by heating and stirring. The content of the (A) binder resin in the paste composition of the present invention is preferably 5 parts by mass to 40 parts by mass, based on 100 parts by mass of the total solid content other than the solvent, and 10 parts by mass to 30 parts by mass. The mass portion is better. The (A) binder resin in the syrup composition of the present invention may contain a copolymer other than the acrylic polymer (corresponding to a component (D1) to be described later) insofar as the effects of the present invention are not impaired. [(B) Solvent] (B) The solvent contains at least one of monocyclic monoterpene and a hydrogenated compound thereof. The monocyclic monoterpene may, for example, be a terpene, an onion alcohol, or a sulphonone. Further, a hydrogenated compound of monocyclic monoterpene may be a caprolactam. These may be used alone or in combination of two or more. The monocyclic monoterpene has a higher viscosity than the ester solvent used as the solvent, so that the viscosity of the paste composition can be increased. Thereby, even if the paste composition having a low solid content concentration can be applied by using the same coating apparatus as before. Among them, since onion alcohol or alkanol has a high viscosity, it is preferred to use at least one of these. 11 200808890 The viscosity of the paste composition is SOOOmPa · s ^ SOOOOmPa, preferably 5500 m Pa · mass % ~ 70 mass %, s ~ 45000 mPa · s, and the solid content concentration is 4 〇, preferably 45 mass % ~ 65 mass The content of the solvent in the paste composition of the present invention is not particularly limited as long as it is more preferably in the range of 50 质/60 to 60 Å I 〇/〇. [Inorganic Powder] The paste composition of the present invention contains an inorganic powder.

(C)無機粉末以藉由焙燒來加以玻璃化之玻璃透明轴 為佳。可舉出例如Pb〇_Si〇2系、pb〇-B2〇3_si〇2系、(C) The inorganic powder is preferably a glass transparent shaft which is vitrified by baking. For example, Pb〇_Si〇2 system, pb〇-B2〇3_si〇2 system,

Zn0-Si02 系、Zn〇.B2〇3-Si〇2 系、Bi〇_si〇2 系、 Bi0-B203-Si02 系、Pb〇-B2〇”Si〇2_Al2〇3 系、pb〇 Zn〇· B203-Si02 系、等。 其中’從對地球環境的影響來考量，以未含有錯之玻 璃透明釉為佳。 又，除了玻璃透明釉以外，並且亦可使用陶瓷（堇青 石’ cordiente等）、金屬等的無機粉末。此種無機粉末具 體上可舉出氧化鈷、氧化鐵、氧化鉻、氧化鎳、氧化銅、 氧化錳、氧化鈦、氧化釩、氧化鈽陶瓷釉黃、氧化鎘、氧 化釕、二氧化矽、氧化鎂、晶尖石等的各種氧化物等。 又，可舉出 ZnO : Zn、Zn3(P04)2 : Mn、Y2Si05 : Ce、 CaW04 : Pb、BaMgAl14023 : Eu、ZnS : (Ag、Cd)、Y2〇3 : Eu、Y2Si05 : Eu、Υ3Α15〇12 : Eu、YB〇3 : Eu、（Y、Gd)B03 : Eu、GdB03 : Eu、ScB03 : Eu、LuB03 : Eu、Zn2Si04 : Mn、 BaAl12019: Mn、SrAl13〇19: Mn、CaAl12〇i9: Mn、YB03 : 12 200808890Zn0-Si02 system, Zn〇.B2〇3-Si〇2 system, Bi〇_si〇2 system, Bi0-B203-SiO2 system, Pb〇-B2〇”Si〇2_Al2〇3 system, pb〇Zn〇· B203-Si02 system, etc. Among them, 'from the influence on the global environment, it is better to use a glass transparent glaze that does not contain the wrong one. In addition to the glass transparent glaze, ceramics (cordierite 'cordiente, etc.) can also be used. An inorganic powder such as a metal. The inorganic powder may specifically be cobalt oxide, iron oxide, chromium oxide, nickel oxide, copper oxide, manganese oxide, titanium oxide, vanadium oxide, cerium oxide ceramic glaze, cadmium oxide or cerium oxide. And various oxides such as cerium oxide, magnesium oxide, and crystallites. Examples thereof include ZnO: Zn, Zn3(P04)2: Mn, Y2Si05: Ce, CaW04: Pb, BaMgAl14023: Eu, ZnS: ( Ag, Cd), Y2〇3 : Eu, Y2Si05 : Eu, Υ3Α15〇12 : Eu, YB〇3 : Eu, (Y, Gd) B03 : Eu, GdB03 : Eu, ScB03 : Eu, LuB03 : Eu, Zn2Si04 : Mn, BaAl12019: Mn, SrAl13〇19: Mn, CaAl12〇i9: Mn, YB03: 12 200808890

Tb、BaMgAl“〇23 : Μη、LuB03 : Tb、GdBO : Tb、ScB03 : Tb、Sr6Si303Cl4 · Eu、ZnS : (Cu、Al)、ZnS : Ag、Y202S ··Tb, BaMgAl "〇23 : Μη, LuB03 : Tb, GdBO : Tb, ScB03 : Tb, Sr6Si303Cl4 · Eu, ZnS : (Cu, Al), ZnS : Ag, Y202S ··

Eu、ZnS : Zn、（Y、Cd)B〇3 : Eu、BaMgAli2〇23 ·· Eu 等的 螢光體粉末、鐵、鎳、把、鎢、鋼、鋁、銀、金、鉑等的 金屬粉末等。Eu, ZnS: Zn, (Y, Cd) B〇3 : Eu, BaMgAli2〇23 ·· Eu, etc., phosphor powder, iron, nickel, tungsten, steel, aluminum, silver, gold, platinum, etc. Powder, etc.

(c)無機粉末的平均粒徑為〇1微米〜1〇微米，以〇.5〜8 微米為更佳。藉由使平均粒徑為1〇微米以下，能夠防止焙 燒後的表面粗縫增加。X，藉由使平均粒徑4 0.1徼米以 上，焙燒時能夠形成微細的空洞，能夠防止產生絕緣不良。 前述無機粉末的形狀可舉出球狀、塊狀、薄片R、及松林 石狀，可以單獨使用亦可組合使用2種以上。 相對於溶劑以外之100質量份總固體成分，本發明之 =蓼組成物中之（C)無機粉末的含量，以50質量份〜\5質 量份為佳，以7〇質量份〜9〇質量份為更佳。 、 [其他] (CW八發明之糊聚組成物，除了上述(A)成分、（B)成分及 刀以外’亦可按照必要含有其他的成分。 例心 成分六，能夠將上述（A)成分以外的樹脂（以了稱為（D1) 基=/加作為黏合劑樹脂。具體上，能夠使用纖維素、羥 i基：：維素、羥基乙基纖維素、經基丙基纖維素、緩基 維素扩：f、羧基乙基纖維素、羧基乙基曱基纖維素等纖 τ物、或此等纖維素衍生物與乙烯性不飽和羧酸或 土）丙烯酸酯化合物等之共聚物。 日 ’黏合劑樹脂可舉出聚乙烯醇與丁醛的反應生成 13(c) The inorganic powder has an average particle diameter of from 1 μm to 1 μm, more preferably from 55 to 8 μm. By making the average particle diameter to 1 μm or less, it is possible to prevent an increase in the surface roughness after baking. X, by making the average particle diameter of 4 0.1 徼 or more, fine voids can be formed during firing, and insulation failure can be prevented. The shape of the inorganic powder may be a spherical shape, a block shape, a sheet R, or a pine forest. They may be used alone or in combination of two or more. The content of the (C) inorganic powder in the 蓼 composition of the present invention is preferably 50 parts by mass to 5 parts by mass, based on 100 parts by mass of the total solid content other than the solvent, and is preferably 7 parts by mass to 9 parts by mass. The serving is better. (Others) (In addition to the above-mentioned (A) component, (B) component, and a knife, the paste composition of the CW eight invention may contain other components as necessary. Example core component 6 can be the above component (A) Resin other than the resin (referred to as (D1) base = / added as a binder resin. Specifically, cellulose, hydroxy i group: vitamin, hydroxyethyl cellulose, propyl propyl cellulose, slow The kovavirin is a copolymer of f, carboxyethyl cellulose, carboxyethyl fluorenyl cellulose or the like, or a copolymer of such a cellulose derivative and an ethylenically unsaturated carboxylic acid or earth acrylate compound. The day's binder resin can be exemplified by the reaction of polyvinyl alcohol with butyraldehyde.

200808890 物之聚丁縮醛樹脂等的聚乙烯醇類、5 -戊内酯、ε 酉旨、沒-丙内酉旨、曱基-沒-丙内醋、沒-甲基-β-丙 α， α -二曱基-沒-丙内酯、沒，冷-二曱基-泠·丙内 内酯類開環聚合而成的聚酯類、乙二醇、丙二醇、二 三甘醇、二伸丙甘醇、新戊二醇等伸烷基二醇單獨 以上的二醇類與順丁烯二酸、反丁烯二酸、戍二酸 酸等二羧酸類之縮合反應所得到的聚酯類、聚乙二 丙二醇、聚伸丁二醇、聚伸戍二醇等的聚醚類、雙 氫醌、二羥基環己烷等的二醇類與碳酸二苯酯、光 珀酸酐等羰基化合物的反應生成物之聚碳酸酯類。 脂可單獨或使用2種以上的混合物。 又，為了控制物性，亦可添加單體（以下稱為 分）。單體可舉出上述（al)成分所例示的單體，以具 以上能夠聚合的乙烯性不飽和鍵之單體（以下為多 單體）為佳。 多官能性單體，可舉出例如乙二醇、丙二醇等 二醇的二丙烯酸酯或二甲基丙烯酸酯類、聚乙二醇 二醇等聚伸烷基二醇的二丙烯酸酯或二曱基丙烯酸 甘油、三羥曱基丙烷、新戊四醇、二新戊四醇等多 聚丙烯酸酯或聚甲基丙烯酸酯類或此等的二羧酸 等。其中，具體上，可舉出乙二醇二丙烯酸酯、乙 甲基丙烯酸酯、三甘醇二丙烯酸酯、三甘醇二曱基 酯、四甘醇二丙烯酸酯、四甘醇二甲基丙烯酸酯、 二丙烯酸酯、丙二醇二甲基丙烯酸酯、聚丙二醇二 -己内 内酯、 醋等的 甘醇、 或二種 、己二 醇、聚 齡A、 氣、琥 此等樹 (D2)成 有2個 官能性 伸烷基 、-聚丙 酯類、 元醇的 改性物 二醇二 丙婦酸 丙二醇 丙烯酸 14 200808890 酯、聚乙二醇的甲基丙烯酸二g旨（Polypropylene glycol di met ha cry late)、三羥曱基丙烷三丙烯酸酯、三羥甲基丙 烷三甲基丙烯酸酯、四羥甲基丙烷四丙烯酸酯、四羥甲基 丙烧四甲基丙烯酸酯、新戊四醇三丙烯酸酯、新戊四醇三 甲基丙烯酸酯、新戊四醇四丙烯酸酯、新戊四醇四甲基丙 烯酸酯、二新戊四醇五甲基丙烯酸酯、二新戊四醇六曱基 丙烯酸酯、二新戊四醇六甲基丙烯酸醋等。 而且，為了賦予可塑性，亦可添加可塑劑（以下稱為（D3) 成分）。可塑劑能夠使用眾所周知的可塑劑，以沸點為2 〇 〇 °0上且在室溫環境中之液體的透明性優良之物為佳。 具體上’可舉出·敌酸一甲i旨或醜酸二乙_、歐酸二 丁酯或酞酸二庚酯、酞酸二·2-乙基己酯或酞酸二異丁醋、 酞酸二異壬酯、酞酸二異癸酯或酞酸二丁氧基乙酯、醜酸 二丁基苄酯、酞酸二辛酯或鄰笨二曱酸丁基乙醇酸丁醋 (butyl phthalyl butyl glycolate)等的酞酸系化合物； 己·一酸一^曱S曰或己一酸·一乙s曰、己二酸二丁 §旨或己二醇二 庚酯、己二酸二-2 -乙基己S旨或己二酸二異丁醋、己二酸一 異壬酯、己二酸二異癸酯或己二酸二丁氧基乙酯、己二酸 二丁基苄醋、己二酸二辛酿等的己二酸系化合物；癸二酸 二甲酯或癸二酸二乙酯、癸二酸二丁酯或癸二酸二庚醋、 癸二酸二-2 -乙基己酯或癸二酸二異丁醋、癸二酸二異壬 酯、癸二酸二異癸酯或癸二酸二丁氧基乙酯、癸二酸二丁 基苄酯、癸二酸二辛酯等的癸二酸系化合物；壬二酸二甲 酯或壬二酸二乙酯、壬二酸二丁酯或壬二酸二庚酯、壬二 15 200808890200808890 Polyvinyl alcohol, 5-pentanolactone, ε 、, - 丙 酉 曱, 曱---------- , α-dimercapto-nor-propiolactone, no, cold-dimercapto-indolyl lactone ring-opening polymerization of polyesters, ethylene glycol, propylene glycol, ditriethylene glycol, two a polyester obtained by condensation reaction of a diol having a single alkyl diol such as propylene glycol or neopentyl glycol with a dicarboxylic acid such as maleic acid, fumaric acid or sebacic acid Polyethers such as polydiethylenedipropylene glycol, polytetramethylene glycol, poly(ethylene terephthalate), glycols such as dihydroanthracene and dihydroxycyclohexane, and carbonyl compounds such as diphenyl carbonate and photolatic acid anhydride The polycarbonate of the reaction product. The fat may be used singly or in combination of two or more kinds. Further, in order to control the physical properties, a monomer (hereinafter referred to as a fraction) may be added. The monomer exemplified as the above (al) component is preferably a monomer having an ethylenically unsaturated bond capable of being polymerized (hereinafter, a monomer). Examples of the polyfunctional monomer include diacrylates or dimethacrylates of diols such as ethylene glycol and propylene glycol, and diacrylates or dioximes of polyalkylene glycols such as polyethylene glycol diol. Polyacrylic acid esters such as glycerin, trihydroxydecylpropane, neopentyl alcohol, and dipentaerythritol, or polymethacrylates or such dicarboxylic acids. Specific examples thereof include ethylene glycol diacrylate, ethyl methacrylate, triethylene glycol diacrylate, triethylene glycol didecyl ester, tetraethylene glycol diacrylate, and tetraethylene glycol dimethacrylate. Ester, diacrylate, propylene glycol dimethacrylate, polypropylene glycol di-caprolactone, glycerin, etc., or two, hexanediol, poly-age A, gas, amber, etc. Modified diol dipropionate propylene glycol acrylate with two functional alkylene groups, -polypropyl esters, and alcohols. 200808890 ester, polyethylene glycol methacrylic acid dimethyl acrylate (Polypropylene glycol di met ha cry Late), trihydroxydecylpropane triacrylate, trimethylolpropane trimethacrylate, tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, neopentyl alcohol triacrylate Ester, neopentyl alcohol trimethacrylate, neopentyl alcohol tetraacrylate, neopentyl alcohol tetramethacrylate, dipentaerythritol pentamethyl acrylate, dipentaerythritol hexamethylene acrylate Ester, dipentaerythritol hexamethacrylate vinegar, and the like. Further, in order to impart plasticity, a plasticizer (hereinafter referred to as (D3) component) may be added. The plasticizer can use a well-known plasticizer, and it is preferred that the liquid has a boiling point of 2 〇 〇 ° and the transparency of the liquid in a room temperature environment is excellent. Specifically, it may be mentioned that it may be exemplified by a dilute acid or a succinic acid, a dibutyl sulphate or a diheptyl phthalate, a di-2-ethylhexyl phthalate or a diisobutyl phthalate. Diisodecyl phthalate, diisononyl phthalate or dibutoxy phthalate, dibutyl benzyl acrylate, dioctyl phthalate or butyric acid butyl glycolic acid butyl vinegar (butyl a phthalic acid-based compound such as phthalyl butyl glycolate; hexyl-monohydric acid, monohexanoic acid, monoethyl sulphate, dihexadecyl adipate or hexanediol diheptyl ester, adipic acid di- 2-ethylhexyl or diisobutyl acetonate, monoisodecyl adipate, diisononyl adipate or dibutoxyethyl adipate, dibutyl benzyl acetonate Adipic acid compound such as adipic acid dioctyl alcohol; dimethyl sebacate or diethyl sebacate; dibutyl sebacate or diheptaic acid azelaic acid; Ethylhexyl ester or diisobutyl succinate, diisononyl sebacate, diisononyl sebacate or dibutoxyethyl sebacate, dibutyl benzyl sebacate, bismuth a sebacic acid compound such as dioctyl acid ester; dimethyl sebacate or diethyl sebacate; Dibutyl azelate or heptyl ester, azelaic 15200808890

酸二-2-乙基己酯或壬二酸二異丁酯、壬二酸二異壬酯、壬 二酸二異癸酯或壬二酸二丁氧基乙酯、壬二酸二丁基苄 酯、壬二酸二辛酯等的壬二酸系化合物；磷酸三乙酯或磷 酸三苯酯、磷酸三甲苯酯或磷酸參（二甲苯酯）、磷酸甲苯 基苯酯等的磷酸系化合物；癸二酸二辛酯或甲基乙醯基蓖 麻醇酸酯等的脂肪酸系化合物；4，5 -環氧四氫酞酸二異癸 酯等的環氧系化合物、1，2,4-苯三甲酸三丁酯或1，2,4-苯三 甲酸三-2·乙基己酯、1，2,4-苯三甲酸三正辛酯或 1，2,4-苯 三曱酸三異癸酯等的1，2,4·苯三甲酸系化合物；此外可舉 出油酸丁酯或氯化石蠟、聚丁烯或聚異丁烯等。此等可按 照必要單獨或組合調配2種以上。 亦可添加其他眾所周知的分散劑、表面張力調整劑、 安定劑、消泡劑等各種添加劑。 [糊漿組成物的調製方法] 本發明之糊漿組成物能夠藉由混合上述（A)成分至（C) 成分、及按照必要之（D)其他成分而得到。 各成分的混合順序沒有特別限定。例如，能夠將（A) 黏合劑樹脂及（C)無機粉末一次混合，亦可將（A)黏合劑樹 脂溶解在（B)溶劑中調製成黏合劑成分後，在該黏合劑成分 添加（C)無機粉末而混合。以下，以後者的方法為例子，來 詳細說明調製本發明的糊漿組成物之方法，但是未限定於 此。 首先，在（B)溶劑添加（A)黏合劑樹脂，藉由攪拌機混 合使黏合劑樹脂溶解，來調製黏合劑成分。此時亦可添加 16Di-2-ethylhexyl or diisobutyl phthalate, diisononyl sebacate, diisononyl sebacate or dibutoxyethyl sebacate, dibutyl sebacate a sebacic acid compound such as benzyl ester or dioctyl sebacate; a phosphate compound such as triethyl phosphate or triphenyl phosphate, tricresyl phosphate, ginsyl phosphate or tolylphenyl phosphate. a fatty acid compound such as dioctyl sebacate or methyl ethyl ricinoleate; an epoxy compound such as 4,5-epoxytetrahydrofurfuryl dihydroxamic acid, 1, 2, 4 Tributyl benzenetricarboxylate or tris-2-ethylhexyl 1,2,4-benzenetricarboxylate, tri-n-octyl 1,2,4-benzenetricarboxylate or 1,2,4-benzenetridecanoic acid A 1,2,4-benzenetricarboxylic acid-based compound such as triisodecyl ester; and examples thereof include butyl oleate or chlorinated paraffin, polybutene or polyisobutylene. These may be formulated separately or in combination of two or more as necessary. Various additives such as a well-known dispersant, a surface tension adjuster, a stabilizer, and an antifoaming agent may be added. [Preparation Method of Paste Composition] The paste composition of the present invention can be obtained by mixing the above components (A) to (C) and, if necessary, other components (D). The order of mixing the components is not particularly limited. For example, the (A) binder resin and the (C) inorganic powder may be mixed at once, or the (A) binder resin may be dissolved in the solvent (B) to prepare a binder component, and then added to the binder component (C). ) Inorganic powder and mixed. Hereinafter, the method of modulating the paste composition of the present invention will be described in detail as an example, but is not limited thereto. First, the binder component is prepared by dissolving (A) a binder resin in (B) a solvent and mixing the binder resin by a mixer. Can also be added at this time 16

200808890 單體或可』綃、分散劑、表面張力調整劑、安 泡劑等的各種添加劑。 接著在該黏合劑成分中，添加（C)無機粉末 合物’藉由混煉該混合物來使無機粉末分散，而 明之糊漿組成物。 [電漿顯示器面板之製法j 以下’使用本發明的糊漿組成物來說明製造 法。首先’在玻璃基板之電極設置面均勻地塗佈 糊漿組成物。此時基板與塗佈裝置之間隙以20 微米為佳，以50微米〜9〇微米為更佳。塗佈方法 頭塗佈器等。 接著，在90 °C〜180 °C將形成有塗膜的玻璃基 燥5分鐘〜60分鐘後，在500°C〜700°C焙燒15 鐘。藉由該赔燒，糊漿組成物中的玻璃透明釉祐 形成介電體層。又，因為糊漿組成物中的溶劑筹 揮發、分解，實質上未殘留在所形成的膜中。 在此，前述電極以使用鋼或銀為佳。 藉由上述製程，能夠得到本發明之電聚顯牙 前面板。 又，製造電漿顯示器面板後，將露出表面之/ 使用例如MgO之金屬氧化膜的保護膜加以被覆 背面板係使用上述同樣的方法，在如玻璃邊 的電極設置面形成介電體層，而且，能夠藉由薄 方法形成阻隔壁（barrier rib)及螢光體層而得到· 定劑、消 來調整混 得到本發 PDP的方 本發明之 微米〜1 0 0 可使用模 .板加熱乾 卜鐘〜6 0分 :燒結，並 因加熱而 :器面板的 介電體層， 為佳。 ^板之基板 L所周知的 9又，上述 17200808890 Various additives such as monomers or oximes, dispersants, surface tension modifiers, foaming agents, etc. Next, in the binder component, (C) inorganic powder composition is added, and the inorganic powder is dispersed by kneading the mixture to form a paste composition. [Method for Producing Plasma Display Panel j Hereinafter] The manufacturing method will be described using the paste composition of the present invention. First, the paste composition was uniformly applied to the electrode installation surface of the glass substrate. At this time, the gap between the substrate and the coating device is preferably 20 μm, more preferably 50 μm to 9 μm. Coating method Head coater, etc. Next, the glass on which the coating film is formed is dried at 90 ° C to 180 ° C for 5 minutes to 60 minutes, and then calcined at 500 ° C to 700 ° C for 15 minutes. By this calcination, the glass transparent glaze in the paste composition forms a dielectric layer. Further, since the solvent in the paste composition is volatilized and decomposed, it does not substantially remain in the formed film. Here, the aforementioned electrode is preferably steel or silver. According to the above process, the electro-convex front panel of the present invention can be obtained. Further, after the plasma display panel is manufactured, the surface of the exposed surface is covered with a protective film of a metal oxide film such as MgO, and the dielectric layer is formed on the electrode installation surface such as glass by the same method as described above. It is possible to form a barrier rib and a phosphor layer by a thin method to obtain a constant agent, and to adjust and mix the obtained PDP. The present invention can be used in the form of a micron~1 0 0. 60 points: Sintering, and due to heating: the dielectric layer of the panel is preferred. ^The board of the board L is well known 9 again, the above 17

200808890 電極以定位電極為佳。 焙燒後之前面板的介電體層厚度為5微米〜3 0微 以5微米〜2 0微米為佳，以7微米〜1 5微米為更佳。 使焙燒後的厚度為3 〇微米以下，能夠得到良好的穿透 藉由使焙燒後的厚度為5微米以上，能夠得到作為介 層之充分的特性。 背面板的介電體層膜厚度為5微米〜30微米，以 米〜20微米為佳。又，在形成介電體層時，亦可複數 複上述製程（在基板塗佈糊漿組成物後，進行焙燒，再 板上塗佈糊漿組成物後，進行焙燒之製程），來形成介 層。 依照本實施形態時，藉由使用本發明之糊漿組成 形成介電體層，能夠使用與先前相同的塗佈方法進 佈。又，所形成之介電體層，其膜厚度係能夠使前述 所產生的氣泡穿過而脫離的程度。 [實施例] [實施例1〜6、比較例1〜7] 使用下述表1所示之組成，來調製糊漿組成物。与 在行星式混合機的槽中投入（A)成分、（C)成分後，進 煉3小時。接著，添加（B)成分而得到規定固體成分濃 糊漿組成物。黏度係使用黏度計（東機產業社製：商 RE550V)來測定。此時之剪切速度為20/秒。表1中 的數值單位為質量份。 米， 藉由 率〇 電體 5微 次重 次基 電體 物來 行塗 焙燒 I； gp ， 行混 度的 品名 之[] 18 200808890 [表l]200808890 The electrode is preferably a positioning electrode. The thickness of the dielectric layer of the front panel after firing is 5 μm to 30 μm, preferably 5 μm to 20 μm, and more preferably 7 μm to 15 μm. When the thickness after firing is 3 Å or less, good penetration can be obtained. By making the thickness after firing 5 μm or more, sufficient characteristics as a dielectric layer can be obtained. The thickness of the dielectric film of the back panel is from 5 μm to 30 μm, preferably from 〜20 μm. Further, when the dielectric layer is formed, the above-described process may be repeated (the substrate is coated with the paste composition, calcined, and then the paste composition is applied to the plate, followed by baking) to form a via. . According to this embodiment, the dielectric layer can be formed by using the paste composition of the present invention, and it can be applied by the same coating method as before. Further, the dielectric layer formed has a film thickness which is such that the bubble generated as described above can be detached. [Examples] [Examples 1 to 6 and Comparative Examples 1 to 7] The paste composition was prepared using the compositions shown in Table 1 below. After the components (A) and (C) were placed in a tank of a planetary mixer, the mixture was aged for 3 hours. Next, the component (B) is added to obtain a predetermined solid component concentrated paste composition. The viscosity was measured using a viscometer (manufactured by Toki Sangyo Co., Ltd.: RE550V). The shear rate at this time is 20/sec. The numerical units in Table 1 are parts by mass. m, by calcining the electric 5 micron sub-substrate electric object to roast I; gp, the name of the mixed product [] 18 200808890 [Table l]

I 0體成分濃度 黏度 薄膜塗佈試驗 玻璃透明釉 (A)成分 (Β)成分 (C)成分 (質量％) (mPa*s) 的分散性 實施例1 (A>1 (Β)-1 (0-1 56 42950 〇 ◎ P5] [75] (A)-l (C)-l 〇 實施例2 (Β)·1 54 28850 ◎ [25] Ρ5] (Α)·1 (C)-l 〇 實施例3 (Β)-1 52 21100 ◎ Ρ5] Γ75] (Α)·1 (CH 實施例4 ⑼-1 50 15400 〇 ◎ [25] Ρ5] (Α)-1 (C>1 〇 實施例5 [25] (Β)-2 [75] 60 12500 ◎ (Α)-1 (CH 〇 實施例6 (Β)-2 55 5950 〇 Ρ5] R5] (Α)-2 (C)-l X 比較例1 (Β)-3 81 22900 〇 [25] Γ75] (19微米） (Α)-2 (〇-1 X 比較例2 Ρ5] (Β)-3 Γ75] 75 3720 (17微米） X (Α>2 (Q-1 X 比較例3 [25] (Β)-2 [75] 80 49750 (18微米） ◎ (Α)-2 (C)-l X 比較例4 (Β)-2 77 31900 ◎ [25] Ρ5] (17.5微米） (Α)-2 (C)-l X 比較例5 Ρ5] (Β)-2 [75] 75 19900 (17微米) ◎ (Α)-2 (C)，l X 比較例6 [25] (Β)-2 [75] 73 11900 (15.5微米) 〇 (Α)-2 (Q-l X 比較例7 [25] (Β>2 Ρ5] 71 7700 (14.5微米） X 表 1 中，（Α)·1、（A)-2、（A)-3、（B)-l、（B)-2、（B)-3、 19 200808890 (C)-l係各自如下。 (A)-1 :下述化學式所表示之共聚物（新中村化學社製：商 品名TKO系列）。組成比（莫耳比）x:y = 8:2、玻璃轉移溫度 (Tg) = 63°C、質量平均分子量（Mw) = 250000。 [化學式3]I 0 body component concentration viscosity film coating test glass transparent glaze (A) component (Β) component (C) component (% by mass) (mPa*s) Dispersibility Example 1 (A>1 (Β)-1 ( 0-1 56 42950 〇◎ P5] [75] (A)-l (C)-l 〇Example 2 (Β)·1 54 28850 ◎ [25] Ρ5] (Α)·1 (C)-l 〇 Example 3 (Β)-1 52 21100 ◎ Ρ5] Γ75] (Α)·1 (CH Example 4 (9)-1 50 15400 〇◎ [25] Ρ5] (Α)-1 (C>1 〇Example 5 [25] (Β)-2 [75] 60 12500 ◎ (Α)-1 (CH 〇Example 6 (Β)-2 55 5950 〇Ρ5] R5] (Α)-2 (C)-l X Comparative Example 1 (Β)-3 81 22900 〇[25] Γ75] (19 microns) (Α)-2 (〇-1 X Comparative Example 2 Ρ5] (Β)-3 Γ75] 75 3720 (17 microns) X (Α> 2 (Q-1 X Comparative Example 3 [25] (Β)-2 [75] 80 49750 (18 μm) ◎ (Α)-2 (C)-l X Comparative Example 4 (Β)-2 77 31900 ◎ [ 25] Ρ5] (17.5 μm) (Α)-2 (C)-l X Comparative Example 5 Ρ5] (Β)-2 [75] 75 19900 (17 μm) ◎ (Α)-2 (C), l X Comparative Example 6 [25] (Β)-2 [75] 73 11900 (15.5 micron) 〇(Α)-2 (Ql X Comparative Example 7 [25] (Β>2 Ρ5] 71 7700 (14.5 μm) X In Table 1, (Α)·1, (A)-2, ( A)-3, (B)-l, (B)-2, (B)-3, 19 200808890 (C)-l are each as follows. (A)-1: Copolymer represented by the following chemical formula (new Nakamura Chemical Co., Ltd.: trade name TKO series). Composition ratio (mole ratio) x: y = 8:2, glass transition temperature (Tg) = 63 ° C, mass average molecular weight (Mw) = 250000. [Chemical Formula 3]

(A)-2 ··下述化學式所表示之共聚物（新中村化學社製：商 品名TKO系列）。組成比（莫耳比）x:y = 9:l、玻璃轉移溫度 (Tg) = 7t：、質量平均分子量（Mw) = 90000。 20 200808890 [化學式4](A)-2 · The copolymer represented by the following chemical formula (manufactured by Shin-Nakamura Chemical Co., Ltd.: trade name TKO series). Composition ratio (mole ratio) x: y = 9: l, glass transition temperature (Tg) = 7t: mass average molecular weight (Mw) = 90000. 20 200808890 [Chemical Formula 4]

(B)-l :盖烷醇(B)-l: captanol

OHOH

(B)-2 ··葱品醇 (B) -3 :乙酸曱氧基丁酯 (C) -l :含有ZnO之玻璃透明釉 又，使用如上述表1所調製的糊漿 試驗、分散性評價。結果如表1所示。 <塗佈試驗> 使用塗佈機’在基板上（高應變點ί! 塗佈實施例 1〜8及比較例 1〜7所調製 著，在600°C焙燒30分鐘（12°C /分鐘的 觸針式表面粗糙度計測定膜厚度。 表1中，能夠形成1 〇微米的膜之啦 為1 0微米以上之物評價為X。 組成物，進行塗佈 L璃 PD200)，各自 的糊漿組成物。接 升溫條件）後，使用 評價為〇，膜厚度 21 200808890 <分散性試驗> 將在表1所調製得到的糊漿組成物保管在密閉容器 (保管温度23 °C )後的時候，確認有無玻璃粉沈降。有無玻 璃粉沈降係目視判斷當使用抹刀刮搔容器的底面時，在抹 刀的前端是否有玻璃粉末附著來判斷。(B)-2 · Onion alcohol (B) -3 : decyl butyl acetate (C) -l : Glass transparent glaze containing ZnO Further, using the paste test prepared according to Table 1 above, dispersibility Evaluation. The results are shown in Table 1. <Coating test> Using a coater' on a substrate (high strain point ί! was coated with Examples 1 to 8 and Comparative Examples 1 to 7 and baked at 600 ° C for 30 minutes (12 ° C / The film thickness was measured by a minute stylus type surface roughness meter. In Table 1, a film having a thickness of 10 μm or more was evaluated as X. The composition was coated with L glass PD200), and each of them was coated. The paste composition was subjected to the evaluation of the temperature, and the evaluation was 〇, film thickness 21 200808890 <dispersibility test> The paste composition prepared in Table 1 was stored in a closed container (storage temperature 23 ° C) After that, confirm the presence or absence of glass frit sedimentation. Whether or not the glass frit is deposited is visually judged when the bottom surface of the container is scraped with a spatula, and whether or not glass powder adheres to the front end of the squeegee is judged.

在表1中，在7天期間能夠抑制玻璃的沈降時評價為 ◎，在3天期間能夠抑制玻璃的沈降時評價為〇，在24 小時以内確認有玻璃的沈降時評價為X。 依照上述結果，藉由使用本發明的糊漿組成物，能夠 形成10微米的薄膜。又，玻璃粉的分散性亦良好。 【圖式簡單說明】 無 【主要元件符號說明】 無 22In Table 1, when the sedimentation of the glass was suppressed during the 7-day period, it was evaluated as ◎, and when the sedimentation of the glass was suppressed during the three-day period, it was evaluated as 〇, and when the sedimentation of the glass was confirmed within 24 hours, it was evaluated as X. According to the above results, a film of 10 μm can be formed by using the paste composition of the present invention. Moreover, the dispersibility of the glass frit is also good. [Simple description of the diagram] None [Key component symbol description] None 22

Claims (1)

200808890 十、申請專利範圍： 1 . 一種糊漿組成物，係用以形成電漿顯示器面板的介電 體層之糊漿組成物，含有：（A)黏合劑樹脂，其含有質量平 均分子量為150000〜300000、且玻璃轉移溫度為30°C〜1〇〇 °C的丙烯酸系聚合物；（B)溶劑，其含有單環單萜烯及其加 氫化合物中至少1種；以及（C)無機粉末。200808890 X. Patent application scope: 1. A paste composition, which is a paste composition for forming a dielectric layer of a plasma display panel, comprising: (A) a binder resin containing a mass average molecular weight of 150000~ 30000, an acrylic polymer having a glass transition temperature of 30 ° C to 1 ° C; (B) a solvent containing at least one of a monocyclic monoterpene and a hydrogenated compound thereof; and (C) an inorganic powder . 2 · 如申請專利範圍第1項所述之糊漿組成物，其中相對 於溶劑以外之1 〇〇質量份總固體成分，該丙烯酸系聚合物 的含量為5質量份〜40質量份。 3· 如申請專利範圍第1項所述之糊漿組成物，其中該丙 烯酸系聚合物係（al)具有羥基之聚合性單體與（a2)以下述 結構式所示的聚合性單體之共聚物， CH2 = CR-COOCnH2n + i [式中’ R係氫原子或碳數丨^的烷基、η係的整數]。 4·如申請專利範圍第3項所述之糊漿組成物，其中在該 丙婦酸系聚合物中之該（al)聚合性單體的含有率為1〇莫耳 %〜9〇莫耳％。 5 * •如甲請專利範圍第1項所述之糊漿組成物，其中該（B) '合劑含有葱品醇及盖烷醇中至少一者。 如申請專利範圍第1項所述之糊漿組成物，其中該（C) …、機氣末係未含有鉛之玻璃透明釉。 7 · _ 種電漿顯示器面板，係具備使用如申請專利範圍第 項中任一項之糊漿組成物所形成的介電體層。 23 200808890 七、指定代表圖： (一） 、本案指定代表圖為：無 (二） 、本代表圖之元件代表符號簡單說明：無 八、本案若有化學式時，請揭示最能顯示 發明特徵的化學式： 無The syrup composition according to claim 1, wherein the acrylic polymer is contained in an amount of 5 parts by mass to 40 parts by mass based on 1% by mass of the total solid content of the solvent. 3. The syrup composition according to claim 1, wherein the acrylic polymer is a polymerizable monomer having a hydroxyl group and (a2) a polymerizable monomer represented by the following structural formula: Copolymer, CH2 = CR-COOCnH2n + i [wherein R is a hydrogen atom or an alkyl group having a carbon number of 丨^, an integer of η system]. 4. The syrup composition according to claim 3, wherein the content of the (al) polymerizable monomer in the propylene glycol polymer is 1 〇 mol% to 9 〇 mol %. The paste composition of claim 1, wherein the (B) 'mixture comprises at least one of onion alcohol and captanol. The syrup composition according to claim 1, wherein the (C) ... and the end of the engine are glass transparent glazes which do not contain lead. A liquid crystal display panel comprising a dielectric layer formed using the paste composition according to any one of the claims. 23 200808890 VII. Designated representative map: (1) The representative representative of the case is: No (2), the representative symbol of the representative figure is a simple description: No. 8. If there is a chemical formula in this case, please reveal the best indication of the characteristics of the invention. Chemical formula: none 44
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