200807668 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種捲帶斗、 ，特別係有關 ▼式封裝構造 於一種可插接之捲帶式封裝構造。 【先前技術】200807668 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a reel hopper, and more particularly to a package type package structure constructed in a pluggable tape and reel type package. [Prior Art]
習知的捲帶式封裝構造主I 要可區分為捲帶承載封 裝構造（Tape Carrier Package tThe conventional tape and reel package structure main I can be divided into a tape carrier package structure (Tape Carrier Package t
g ’ TCP)與薄膜覆晶封裝構 造（Chip-On-FUm package，c〇F)，皆是以捲帶傳輸 (reei-t〇-reel)—可撓性電路基板的方式進行半導體封 裝作業。一般而言，捲帶式封梦播、& _ 7 ^構造可封裝的晶片係 為顯示器驅動晶片，其係具有离 男同腳數之輸出與輸入 端，並分別排列於可撓性電路基板之兩側。 如第1圖所示，一種捲帶式封裝構造1〇〇係為薄膜 覆晶封裝型態，其包含一可撓性電路基板i i 0、一晶 片1 2 0以及一封膠體1 3 〇。該可撓性電路基板i丨〇係 具有一第一表面111與一第二表面112，其中該第一表 面ill上形成有複數個引腳113。該些引腳ιι；3之内端 係可供該晶片1 2 〇之電極端1 2 2 (即凸塊）接合，該些引 腳1 1 3之外端係往該基板1 1 0之兩側延伸並區分為複 數個輸入外接指114以及複數個輸出外接指115。在該 二輸入外接指114與該些輸出外接指115之上形成有 ’專的電錢錫1 1 7，該基板1 1 〇之兩側分別可藉由a C F 連接或焊接方式連接至印刷電路板與顯示器面板。通 常該基板1 1 〇係具有一防銲層1 1 6，其係局部覆蓋該些 5 200807668 引腳11 3。該晶片1 2 0之電極端1 2 2係設】 之主動面121。該封膠體130係形成於 該晶片120之間。因此，習知的捲帶式 用方式是在該基板1 1 〇兩端進行異方性 connection)或焊接，可封裝輸出與輸入 之驅動晶片。 【發明内容】 本發明之主要目的係在於提供一種 式封裝構造’能擴大捲帶式封裝構造之 插接電子元件，易於更換、整修與擴充 本發明之次一目的係在於提供一種 式封裝構造，以低成本提供金手指在捲 本發明之另一目的係在於提供一種 式封裝構造，可使排列在捲帶同一側邊 密集化。 本發明之再一目的係在於提供一種 ^ / 式封裝構造，能以 TCP/COF製程機台 片，並且具有可插接功能以達到模組化 效。 本發明的目的及解決其技術問題是 方案來實現的。依據本發明，一種可插 裝構造主要包含一可撓性電路基板、一 膠體。該可撓性電路基板係具有一第一 表面，其中該第一表面上形成有複數個 L於該晶片1 2 0 該基板11 0與 封裝構造的應 導電連接（ACF 端分散在兩側 可插接之捲帶 應用範圍到可 〇 可插接之捲帶 帶上。 可插接之捲帶 之金手指更加 可插接之捲帶 封農記憶體晶 與散熱佳的功 採用以下技術 接之捲帶式封 晶片以及一封 表面與一第二 引腳。該晶片 6 200807668 係具有複數個電極端，該晶片係設置於該基板之該第 一表面上，並使該些電極端係電性連接至對應之引腳 之内端。該封膠體係形成於該基板與該晶片之間。其 中，該些引腳之外端係排列在該基板之同一側緣並電 鍵形成有複數個金手指。 本發明的目的及解決其技術問題還可採用以下技 術措施進一步實現。 在前述的捲帶式封裝構造中，該些金手指係包含有 一電鐘銅層與一錄金表面層。 在前述的捲帶式封裝構造中，該鎳金表面層係完全 包覆該電鍍銅層之上表面與側面，以不顯露該電鍍銅 層。 在前述的捲帶式封裝構造中，該些金手指係為單排 側邊排列。 在前述的可插接之捲帶式封裝構造中，該些金手指 係為雙排交錯排列或是多排交錯排列。 在前述的捲帶式封裝構造中·，該些金手指係為多排 斜向排列。 在前述的捲帶式封裝構造中，每一引腳之外端係形 成有至少兩金手指。 在前述的捲帶式封裝構造中，該基板係具有一防銲 層，該些金手指之電鍍高度係高於該防銲層。 在前述的捲帶式封裝構造中，另包含有一補強板， 其係貼設於該基板之第二表面。 7 200807668 在前述的捲帶式封裝構造中’該晶片係為DDR3記 憶體晶片或是記憶體時脈超過400Mhz的高頻晶片。 在前述的捲帶式封裝構造中，該基板係為Tcp/c〇F 薄膜，且該晶片之該些電極端係為凸塊，以覆晶接合 至該基板。 在前述的捲帶式封裝構造中，該些金手指係可為六角 形或八角形。 在前述的捲帶式封裝構造中，該封膠體係為底部填充 膠，並使該晶片之背面為顯露。 【實施方式】 在本發明之第一具體實施例中，揭示一種可插接之 捲帶式封裝構造。第2圖係為該捲帶式封裝構造之截 面示意圖’第3圖係為該捲帶式封裝構造之底面透視 示意圖。 請參閱第2圖’—種可插接之捲帶式封裝構造2〇〇 主要包含一可撓性電路基板21〇、一晶片22〇以及一 封膠體230。該可撓性電路基板21〇係具有一第—表 面211與一第二表面2U，其中該第一表面2ΐι上形成 有複數個引腳213，每—引腳213具有一内端214(或 可稱為内引腳）與一外端215(或可稱為外引腳卜其 中吻特別參閱第3圖，該些引腳2丨3之外端2丨5係 、排列在該基板21〇之同一側緣217並電鍍形成有複數 個金手指240(如第2圖所示）。在本實施例中，該些金 手指2 4 0係為單排側邊排列。 8 200807668 該晶片2 2 0係具有複數個電極端2 2 1，且該晶片2 2 0 係設置於該基板2 1 0之該第一表面2 1 1上，以使該些 電極端2 2 1係電性連接至對應之引腳2 1 3之内端2 1 4。 較佳地，該晶片220係可為DDR3記憶體晶片或是其它 南頻晶片’其s己憶體時脈可以是4 0 0 M h z或以上。利 用覆晶接合與捲帶之早層線路設計，不會有電路徑長 導致訊號延遲的問題’能對此提供低成本之高頻電傳 導路徑。在本實施例中，該基板210係可為TCP/C0F 薄膜，且該晶片2 2 0之該些電極端2 2丨係為凸塊，例 如金凸塊（Au bump)，以覆晶接合至該基板21〇之引腳 内端214，故能沿用既有的C〇f製程機台進行封褒。 該封膠體230則是形成於該基板21〇與該晶片22〇 之間，提供適當的封裝保護以防止電性短路、塵埃污 染與應力集中。在本實施例中，該封膠體23〇係為底部 填充膠（underfill material)，並使該晶片22〇之背面為顯露， 有助於晶片向之散熱。在不同實施例中，該封膠體23〇 Z可 為異方性導電膠膜（ACF)、非導電.（Ncp)等等。 請再參閱第2圖’較佳地’該些金手指24〇係包含 有一電鍍銅層241與一鎳金表面層242，以降低金= 指之成本。尤佳地，該鎳金表面f 242係完全 電鍍銅層241之上表面與側面，以不顯露該電鑛銅： 241，以避免該電鍍銅層241的銹化。此外，該基^ 210係具有—防銲層216在該第一表面211，以^二 些引腳213之中間區段。較佳地，胃些金手指 9 200807668 電鍍高度可高於該防銲層2 1 6，以姆士糾从你垃 Μ增加對外插接之電 接觸機率。 200另包含有一補強板 質。該補強板250係貼 此外，該捲帶式封裝構造 250，可為硬質之金屬或塑膠材 以增加封裝產品之 設於該基板210之第二表面211 整體結構強度。The g''TCP) and the Chip-On-FUm package (c〇F) are semiconductor packaged in a reel-t〇-reel-flexible circuit substrate. In general, the tape-and-reel package, & _ 7 ^ structure packageable chip is a display drive chip, which has an output and an input end from the same number of men, and is respectively arranged on the flexible circuit substrate On both sides. As shown in Fig. 1, a tape-and-reel package structure 1 is a thin film flip-chip package comprising a flexible circuit substrate i i 0 , a wafer 1 20 and a gel 1 3 〇. The flexible circuit substrate has a first surface 111 and a second surface 112. The first surface ill is formed with a plurality of pins 113. The inner ends of the pins 1-3 are available for the electrode terminals 1 2 2 (i.e., bumps) of the wafer, and the outer ends of the pins 1 1 3 are connected to the substrate 1 1 0 The side extends and is divided into a plurality of input external fingers 114 and a plurality of output external fingers 115. On the two input external fingers 114 and the output external fingers 115, a special electric money tin 1 1 7 is formed, and the two sides of the substrate 1 1 can be connected to the printed circuit by a CF connection or soldering, respectively. Board and display panel. Typically, the substrate 1 1 has a solder mask layer 1 1 6 which partially covers the 5 200807668 pins 11 3 . The electrode end 1 2 2 of the wafer 120 is provided with an active surface 121. The encapsulant 130 is formed between the wafers 120. Therefore, the conventional tape-and-reel method uses an anisotropic connection or soldering at both ends of the substrate 1 1 , and can package the output and input driving wafers. SUMMARY OF THE INVENTION The main object of the present invention is to provide a package structure of the type that can expand the tape-and-reel package structure, which is easy to replace, refurbish and expand. The second object of the present invention is to provide a package structure. Providing a Gold Finger at a Low Cost Another object of the present invention is to provide a package structure in which the arrangement is dense on the same side of the web. Still another object of the present invention is to provide a ^ / package structure capable of being a TCP/COF process machine and having a pluggable function for modularization. The object of the present invention and solving the technical problems thereof are achieved by means of a solution. According to the present invention, a pluggable structure mainly comprises a flexible circuit substrate and a colloid. The flexible circuit substrate has a first surface, wherein the first surface is formed with a plurality of Ls on the wafer 1 0 0. The substrate 10 0 and the package structure should be electrically connected (the ACF end is dispersed on both sides of the package) The application of the tape to the tape can be inserted into the tape. The plug of the tape can be more pluggable, and the tape can be used to seal the agricultural memory and heat. The tape-sealed wafer and a surface and a second lead. The wafer 6 200807668 has a plurality of electrode ends disposed on the first surface of the substrate and electrically connecting the electrode ends To the inner end of the corresponding pin, the encapsulation system is formed between the substrate and the wafer, wherein the outer ends of the pins are arranged on the same side edge of the substrate and the plurality of gold fingers are formed by electric keys. The object of the present invention and solving the technical problems can be further achieved by the following technical measures. In the above tape and reel package structure, the gold finger series comprises an electric clock copper layer and a gold recording surface layer. Belt seal In the structure, the nickel gold surface layer completely covers the upper surface and the side surface of the electroplated copper layer so as not to expose the electroplated copper layer. In the tape and reel package structure described above, the gold fingers are a single row of sides. In the above-mentioned pluggable tape and reel package structure, the gold fingers are staggered in a double row or staggered in a plurality of rows. In the tape and reel package structure described above, the gold finger systems are The plurality of rows are arranged in an oblique direction. In the tape and reel package structure described above, at least two gold fingers are formed on the outer end of each pin. In the tape and reel package structure described above, the substrate has a solder resist layer. The gold finger plating height is higher than the solder resist layer. In the foregoing tape and reel package structure, a reinforcing plate is further disposed on the second surface of the substrate. 7 200807668 In the package structure, the wafer is a DDR3 memory chip or a high frequency wafer having a memory clock of more than 400 Mhz. In the tape and reel package structure described above, the substrate is a Tcp/c〇F film, and the wafer is The electrode ends are bumps to cover The crystal is bonded to the substrate. In the tape and reel package structure described above, the gold finger systems may be hexagonal or octagonal. In the tape and reel package structure described above, the encapsulation system is an underfill and allows The back surface of the wafer is exposed. [Embodiment] In a first embodiment of the present invention, a pluggable tape and reel package structure is disclosed. Fig. 2 is a cross-sectional view of the tape and reel package structure 3 is a schematic perspective view of the bottom of the tape-and-reel package structure. Please refer to FIG. 2, a pluggable tape and reel package structure 2, which mainly comprises a flexible circuit substrate 21〇, a wafer 22〇 And a glue body 230. The flexible circuit substrate 21 has a first surface 211 and a second surface 2U, wherein the first surface 2 is formed with a plurality of pins 213, each of which has a pin 213 The inner end 214 (or may be referred to as an inner pin) and an outer end 215 (or may be referred to as an outer pin, wherein the kiss is particularly referred to in FIG. 3, and the outer ends of the pins 2丨3 are arranged in a row, 2, 5, and arranged A plurality of gold fingers 2 are electroplated on the same side edge 217 of the substrate 21 40 (as shown in Figure 2). In this embodiment, the gold fingers 240 are arranged in a single row side. 8 200807668 The wafer 220 has a plurality of electrode terminals 2 2 1 , and the wafer 2 2 0 is disposed on the first surface 21 1 of the substrate 2 10 such that the electrode ends 2 2 1 It is electrically connected to the inner end 2 1 4 of the corresponding pin 2 1 3 . Preferably, the wafer 220 can be a DDR3 memory chip or other south frequency wafer. The suffix clock can be 400 Hz or more. With the use of flip-chip bonding and the early layer design of the tape, there is no problem that the electrical path length leads to signal delay, which provides a low-cost high-frequency electrical path. In this embodiment, the substrate 210 can be a TCP/C0F film, and the electrode terminals 2 2 of the wafer 220 are bumps, such as gold bumps (Au bump), which are flip-chip bonded to The substrate 21 has a pin inner end 214, so that it can be sealed with an existing C〇f process machine. The encapsulant 230 is formed between the substrate 21 and the wafer 22, providing proper package protection against electrical shorts, dust contamination and stress concentration. In this embodiment, the encapsulant 23 is an underfill material, and the back surface of the wafer 22 is exposed to facilitate heat dissipation from the wafer. In various embodiments, the encapsulant 23 〇 Z can be an anisotropic conductive film (ACF), a non-conductive (Ncp), or the like. Referring to Figure 2, however, the gold fingers 24 are provided with an electroplated copper layer 241 and a nickel gold surface layer 242 to reduce the cost of the gold finger. More preferably, the nickel gold surface f 242 completely etches the upper surface and the side surface of the copper layer 241 so as not to reveal the electric copper: 241 to avoid rusting of the electroplated copper layer 241. In addition, the substrate 210 has a solder mask layer 216 on the first surface 211, and an intermediate portion of the two leads 213. Preferably, the golden finger of the stomach 9 200807668 can be higher than the solder resist layer 2 1 6 to increase the probability of electrical contact with the external plugging. 200 also contains a reinforcing plate. The reinforcing plate 250 is attached. In addition, the tape and reel package structure 250 may be a hard metal or plastic material to increase the overall structural strength of the second surface 211 of the package 210.
如第4圖心，上述之至少—捲帶式封裝構造200 可插接在一電路載板10之對應插槽u，具有易於更 換、整修與擴充之功效。另，如第4圖所示，採用直 立插接的方式有助於兩面散導熱。該電路載板1〇係可 為記憶體模組板、顯示卡之印刷電路板、主機板或可 攜式電子裝置之電路板。纟本實施例巾，該可插接裝 置1 0係為記憶體模組板或顯示卡之印刷電路板，並具 有可對外插接之金手指12，以組成一可擴充與更換;己 憶體谷f之§己憶體模組、顯示卡等電子带置。 此外，本發明不局限金手指在捲帶侧邊之排列型態。如 第5圖所示，第二實施例揭示另一種捲帶式封裝構造，主 要包含一可挽性電路基板310與一晶片32〇。該晶片320 係具有複數個電極端321，並接合至該基板31〇之複數個引 腳311之内端。該些引腳311之外端係往該基板31〇之同一 側緣312延伸之。並且，複數個金手指33丨與3 32係形成 於該些引腳3 11之外端，以達到捲帶式封裝構造可供插接 之功效。較佳地，金手指為雙排交錯排列，可區分為複 數個第一排金手指331以及複數個第二排金手指 10 200807668 332，可達到更密集的排列。在本實施射，該些金手指 331與332係可為六角形。 本毛明之第二實施例另揭示一捲帶式封裝構造，主要 元件係與第一實施例㈣，不再贅述。該捲帶式封裝 構造係具有複數個多排斜向排列之金手指。如第6圖所 示，該些金手指係分為複數個第一排金手指42丨、複數 個第二排金手指422以及複數個第三排金手指423。 該些第一排金手指421、第二排金手指422、第三排金 手& 423係電鍍形成於一可撓性電路基板之複數個引腳 4 1 0之外端，並以不同間距方式排列在該基板之同一側緣 430 ’以達到金手指之高密度排列。 本發明之第四實施例另揭示一捲帶式封裝構造，主要 π件係與第一實施例相同，不再贅述。該捲帶式封裝 構仏係具有複數個多排交錯排列之金手指。如第7圖所 示’每一弓丨腳5 1 0之外端係形成有至少兩金手指，分 別為第—金手指5 2 1與第二金手指5 2 2，以增加電性 接觸機率。在本實施例中，該些金手指5 2 1與5 2 2係 可為八角形。 以上所述，僅是本發明的較佳實施例而已，並非對 本t月作任何形式上的限制，雖然本發明已以較佳實 她例揭路如上，然而並非用以限定本發明，任何熟悉 項技術者’在不脫離本發明之技術範圍内，所作的 任何簡單修改、等效性變化與修飾，均仍屬於本發明 的技術範圍内。 11 200807668 【圖式簡單說明】 第1圖：一種習知捲帶式封襄構造之截面示意圖。 第2圖··依據本發明之第一 ^ 具體實施例，一種可插接 h ^帶式#裝構造之截面示意圖 ★圖I據本發明之第一具體實施例，該捲帶式封 裝構造之底面透視示意圖。 第@ ·依據本發明之第一具體實施例，一種可插接As shown in Fig. 4, at least the tape-and-reel package structure 200 can be inserted into a corresponding slot u of the circuit carrier board 10 for easy replacement, refurbishment and expansion. In addition, as shown in Figure 4, the use of vertical plug-in helps to dissipate heat on both sides. The circuit board 1 can be a memory module board, a printed circuit board of a display card, a motherboard or a circuit board of a portable electronic device. In the embodiment of the present invention, the pluggable device 10 is a printed circuit board of a memory module board or a display card, and has a gold finger 12 that can be externally inserted to form an expandable and replaceable;谷f § has recalled the body module, display card and other electronic belt. Moreover, the present invention is not limited to the arrangement of the gold fingers on the side of the tape. As shown in Fig. 5, the second embodiment discloses another tape and reel package structure, which mainly includes a switchable circuit substrate 310 and a wafer 32A. The wafer 320 has a plurality of electrode terminals 321 and is bonded to the inner ends of the plurality of pins 311 of the substrate 31. The outer ends of the leads 311 extend toward the same side edge 312 of the substrate 31. Moreover, a plurality of gold fingers 33A and 3 32 are formed on the outer ends of the pins 3 11 to achieve the effect of the tape and tape package structure being plugged. Preferably, the gold fingers are staggered in a double row, and can be divided into a plurality of first row of gold fingers 331 and a plurality of second row of gold fingers 10 200807668 332 to achieve a denser arrangement. In the present embodiment, the gold fingers 331 and 332 may be hexagonal. The second embodiment of the present invention further discloses a tape and reel package structure, and the main components are the same as the first embodiment (4), and will not be described again. The tape and reel package structure has a plurality of rows of gold fingers arranged obliquely. As shown in Fig. 6, the gold fingers are divided into a plurality of first rows of gold fingers 42 丨, a plurality of second row gold fingers 422, and a plurality of third row gold fingers 423. The first row of gold fingers 421, the second row of gold fingers 422, and the third row of gold hands & 423 are plated on the outer ends of a plurality of pins 4 1 0 of a flexible circuit substrate, and at different intervals The manner is arranged on the same side edge 430' of the substrate to achieve high density arrangement of the gold fingers. The fourth embodiment of the present invention further discloses a tape-and-reel package structure, and the main π-pieces are the same as those of the first embodiment, and are not described again. The tape and reel package has a plurality of rows of staggered gold fingers. As shown in Fig. 7, at least two gold fingers are formed on the outer end of each of the arches, and the first gold finger 5 2 1 and the second gold finger 5 2 2 are respectively increased to increase the probability of electrical contact. . In this embodiment, the gold fingers 5 2 1 and 5 2 2 may be octagonal. The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Although the invention has been described above by way of example, it is not intended to limit the invention, It is still within the technical scope of the present invention to make any simple modifications, equivalent changes and modifications made by the skilled artisan without departing from the technical scope of the present invention. 11 200807668 [Simple description of the drawing] Fig. 1 is a schematic cross-sectional view of a conventional tape and reel type sealing structure. 2 is a cross-sectional view of a pluggable h ^ tape type package structure according to a first embodiment of the present invention. FIG. 1 is a first embodiment of the present invention, the tape and reel package structure is A schematic perspective view of the bottom surface. In accordance with a first embodiment of the present invention, a pluggable
裝置可插接複數個捲帶式封裝構造之示意 圖。 第 第 5圖··依據本發m具體實施例，—種可插接 之捲帶式封裳構造之底面透視示意圖。 6圖：依據本發明之第三具體實施例，—種可插接 之捲π式封裝構造緣示其金手指多排斜向排 列之局部示意圖。 一種可插接 多排斜向排 第7圖：依據本發明之第四具體實施例， 之捲帶式封裝構造繪示其金手指 列之局部示意圖。 【主要元件符號說明】 12金手指 111第一表面 114輸入外接指 117電鍍錫 122電極端 10電路載板 11插槽 100捲帶式封裝構造 110可撓性電路基板 112第二表面 113引腳 115輪出外接指 116防銲層 晶 y mi 日日月 121主動面 12 200807668 130 200 210 212 215 220 240 250 310 3 12 331 410 423 510 530 封膠體 可插接之捲帶式封裝構造 可撓性電路基板 211 第一表面 第二表面 213 引腳 214 内端 外端 216 防鮮層 217 側緣 晶片 221 電極端 230 封膠體 金手指 241 電鍍銅層 242 鎳金表面層 補強板 可撓性電路基板 311 引腳 側緣 320 晶片 321 電極端 第一排金手指 332 第二排金手指 引腳 421 第一排金手指 422 第二排金手指 第三排金手指 430 侧緣 引腳 521 第一金手指 522 第二金手指 側緣 13The device can be plugged into a schematic diagram of a plurality of tape and reel package configurations. Fig. 5 is a perspective view showing the bottom surface of a pluggable tape-and-sleeve structure according to a specific embodiment of the present invention. 6 is a schematic view showing a partial arrangement of a gold-finger multi-row oblique arrangement according to a third embodiment of the present invention. A pluggable multi-row diagonal row. Fig. 7 is a partial schematic view showing a gold finger row according to a fourth embodiment of the present invention. [Main component symbol description] 12 gold finger 111 first surface 114 input external finger 117 electroplating tin 122 electrode end 10 circuit carrier 11 slot 100 tape package structure 110 flexible circuit substrate 112 second surface 113 pin 115 Roll-out external finger 116 solder mask layer crystal y mi Sun and moon 121 active surface 12 200807668 130 200 210 212 215 220 240 250 310 3 12 331 410 423 510 530 Sealant plug-in tape and reel package structure flexible circuit Substrate 211 First surface Second surface 213 Pin 214 Inner end External end 216 Fresh-keeping layer 217 Side edge wafer 221 Electrode end 230 Sealing gold finger 241 Electroplated copper layer 242 Nickel gold surface layer reinforcing plate Flexible circuit board 311 Foot side edge 320 wafer 321 electrode end first row of gold fingers 332 second row of gold finger pins 421 first row of gold fingers 422 second row of gold fingers third row of gold fingers 430 side edge pins 521 first gold fingers 522 Two gold finger side edges 13