200805817 九、發明說明： 【發明所屬之技術領域】 ，本發明為一種轉接卡的技術領域，尤其指一種小型快閃記 - 憶卡所使用的轉接卡結構。 【先前技術】 隨著電子產品的不斷地推陳出新，所配合使用的各式快閃 式記憶卡也出現了數種不同的規格，例如c〇mpact Flash(CF)200805817 IX. Description of the Invention: [Technical Field] The present invention relates to the technical field of a riser card, and more particularly to a riser card structure used in a compact flash memory card. [Prior Art] With the continuous development of electronic products, various flash memory cards used together have appeared in several different specifications, such as c〇mpact Flash (CF).
Card、Smart Media Card(SMC 卡）、多媒體卡 Multi MediaCard, Smart Media Card (SMC card), multimedia card Multi Media
Card(MMC)、數位卡 Secure Digital Card(SD 卡）、Mem〇ry StickCard (MMC), digital card Secure Digital Card (SD card), Mem〇ry Stick
CanKMS卡）等。在部份產品要求體積更小的需求下，部份讀 瞻 取規格相同但尺寸更小的記憶卡產品也同時出現，例如 SD卡、MMCP1US卡…等。為了方便電腦的順利讀取資料，即有 配合使用的轉接卡出現，例如mini SD卡轉SD卡的轉接卡， 可將mini SD插置其中，再插置於邠規格的讀卡機中，即可 順利讀取資料。 傳統的轉接卡結構通常為二片式，再配^ —電性轉接件設置 其中，利用高週波熔接技術將上下兩片接合處熔化接合在一 5 200805817 -m • 起，即可形成一轉接卡的結構。缺點是接合效果較差，記憶卡 多次插置其中使用後，容易於接合處賴而損壞，讓產品的使 用壽命縮短。 【發明内容】 本㈣之主要目的是提供—種生產良率高絲構更為牢 • 固的轉接卡結構’主要是將補於最後射出細過程中分佈於 • 主要構件之間的接合處，使各構件緊緊地結合在-起，增加牢 丨而姻此方式生產的轉接卡良率高’並能有效降低生產 成本。CanKMS card) and so on. In some products requiring a smaller volume, some memory cards with the same specifications but smaller sizes are also available, such as SD card, MMCP1US card, etc. In order to facilitate the smooth reading of the computer, the adapter card used together, such as the mini SD card to the SD card adapter card, can be inserted into the mini SD, and then inserted into the 邠 specification card reader , you can read the data smoothly. The conventional riser card structure is usually two-piece, and is equipped with an electrical adapter. The high-frequency welding technology is used to melt and join the upper and lower joints to a 5 200805817 -m • to form a The structure of the riser card. The disadvantage is that the bonding effect is poor, and the memory card is easily inserted into the device for damage, which is easy to damage the joint and shorten the service life of the product. SUMMARY OF THE INVENTION The main purpose of the present (4) is to provide a high-yield, high-strength, more rigid and rigid adapter card structure that is mainly used to fill the joint between the main components during the final shot-out process. The components are tightly combined to increase the yield and the yield of the adapter card produced in this way is high, and the production cost can be effectively reduced.
為達上述之目的，為本發明之轉接卡結構是由一基殼、一 電性轉接件、—壓板及分佈於各構件接合處的包襲所構成， 為電f生轉接件是設置於基殼—側’其上之數雜接觸部是裸露 '另側邊的彈性接腳則隱藏於内部，該壓板則設置基殼 ^部，而包覆層暇以原料射出成型於壓板、基殼與電性轉接 :的接合處，但仍使電性接觸部仍裸露出來，而所形成的結構 基殼與壓板之間則為中空狀，並設有-開口與外界相通。 μ楚了解袖叙詳减程及技術内容，本 式及詳細之解說，以求審查委員清楚了 解本發明之精神所在·· 6 200805817 【實施方式】 構=二二圖所示，分別為本發明主要構件之分解圖及結 _，本發侧之轉接卡的概包括有： 一基殼1 ; 2ΓΓ彳轉Γ2，設胁級—側，飾财數電性接觸部 ’另一側邊延伸出數彈性接腳22，電性接 之彈性接腳22之間設有金屬線23與之相連； 十應 一:壓板3 ’蓋合於前述基殼頂部，使内部呈中空狀，並保留 fl 31與外界相通，該壓板3遮蔽了前述電性轉接件2部 Γ 數彈性接腳22隱藏於内部，而數電性接觸部21裸 i各出來； 包覆層4 ’是以原料成型於壓板3、基殼！與電性轉接件2 的接合處顯（如第三_句，但縣將前述空_封閉。 、為達到上述轉接卡之結構及形狀，為本發明採用—種不同 ^傳統方式的雜方法’但並科此關健使用此種方法才 此衣le本發明之轉接卡結構。請參考第四圖所示，為本發明之 封裝方法的流程圖，其步驟為： 步驟81、將-電性轉接件放置縣殼内，並使其電性接 裸露出來； 〇 /驟82將壓板设置於基殼頂部，但並未將前述電性轉接 7 200805817 件之電性接觸部遮蔽； 步驟83、將一輔助插片插入壓板與基殼之間的空間内，並與 前電性接觸部之彈性接腳相接觸； v驟84、以射出成型方式形成一包覆層於基殼、壓板及電性 - 轉接件的接合區域，形成一記憶卡的標準形狀；以及 _ 步驟85、將輔助插片退出該壓板與基殼之間的空間，並取出 _ 該轉接卡成品。 其中該包覆層成型的區域包括基殼與壓板接合處的周圍、電性 轉接件之電性接觸部周圍、以及電性轉接件與基殼、壓板的接 合處。 .為使審4委員更清楚了解本㈣運作方式，本實施將以 mm SD卡轉換為SD卡所使用的轉接卡來辅助解說，但並不 • 目此關本發0趙缺胁聽記針_接切構，任何運 財發明之技術所完成哺接卡結構，皆為本發明之範缚。 -首先就主要構件之基本結構及形狀作一說明，如第一圖所 不’該基殼1與壓板3形狀為事先射出成型。該基殼i的周圍 三侧邊設突起的框體U、12、13，僅一側無此結構，該處即 為日後miniSD卡插入的入口。基殼1於内部於槪框體12 的位置是供該電性轉接件2設置，而接近框槽12的位置則固 8 200805817For the above purpose, the riser card structure of the present invention is composed of a base case, an electrical adapter, a pressure plate and an attack distributed at the joint of each member, and the electrical transfer adapter is The plurality of contact portions disposed on the base shell-side are bare. The elastic legs on the other side are hidden inside, and the pressure plate is provided with a base shell, and the cladding layer is formed by injection molding on the pressure plate. The joint between the base shell and the electrical adapter: but still exposes the electrical contact portion, and the formed structural base shell and the pressure plate are hollow, and are provided with an opening communicating with the outside. μ Chu understands the sleeve reduction and technical content, this and the detailed explanation, in order to seek the clear understanding of the spirit of the present invention. 6 200805817 [Embodiment] The structure = 22 shows, respectively Exploded view of the main components and the knot _, the adapter card of the present side includes: a base shell 1; 2 ΓΓ彳 turn Γ 2, set the threat level - side, decorative financial electrical contact 'other side extension A plurality of elastic pins 22 are disposed, and a metal wire 23 is connected between the elastic connecting pins 22; the ten is one: the pressing plate 3' is covered on the top of the base shell to make the interior hollow, and retains fl 31, communicating with the outside, the pressure plate 3 shields the electrical adapter 2, the number of elastic pins 22 are hidden inside, and the electrical contact portions 21 are naked; the cladding layer 4' is formed by the raw material Pressure plate 3, base shell! The joint with the electrical adapter 2 is displayed (such as the third sentence, but the county will be the above-mentioned empty_closed. In order to achieve the structure and shape of the above-mentioned adapter card, the present invention adopts a different kind of traditional method. The method of the present invention is to use the method of the present invention. The method of the present invention is as follows: - The electrical adapter is placed in the county casing and exposed to the bare metal; 〇/Step 82 sets the pressure plate on the top of the base casing, but does not shield the electrical contact portion of the electrical transmission 7 200805817 Step 83, inserting an auxiliary insert into the space between the pressure plate and the base shell, and contacting the elastic pin of the front electrical contact portion; v, step 84, forming a coating layer on the base shell by injection molding , the pressure plate and the electrical - the joint area of the adapter forms a standard shape of the memory card; and _ step 85, the auxiliary insert is withdrawn from the space between the pressure plate and the base case, and the finished product of the adapter card is taken out. Wherein the region in which the cladding layer is formed includes a circumference where the base shell and the pressure plate are joined , around the electrical contact part of the electrical adapter, and the junction of the electrical adapter and the base shell and the pressure plate. In order to make the 4 members more clearly understand the operation mode of this (4), this implementation will be converted by mm SD card. The adapter card used for the SD card is used to assist in the explanation, but it is not the case that the purpose of this invention is that the invention is based on the technology of the invention. First, the basic structure and shape of the main components are explained. As shown in the first figure, the shape of the base shell 1 and the pressure plate 3 is previously injection molded. The three sides of the base shell i are provided with raised frames. The body U, 12, 13 has no such structure on one side, and this is the entrance for the insertion of the miniSD card in the future. The position of the base case 1 inside the frame 12 is provided for the electrical adapter 2, and is close to The position of the frame slot 12 is solid 8 200805817
疋著一彈性卡掣片5，用以固定插入後之mini SD卡的位置； 此處内部的形狀並非固定，是配合著電性轉接件的形狀，例如 部份廠商是將彈性卡掣片直接設置於電性轉接件2處，故此時 内部形狀即不同。該電性轉接件2用以作訊息的轉接，其一側 面°又有複數個電性接觸部21，另一側邊延伸出數彈性接腳 22，電性接觸部21與相對應之彈性接腳22之間設有金屬線 23與之相連。壓板3在組裝時是設置於基殼1頂部，故兩者 組錢之高騎為SD卡的鮮厚度，但其錢她，蓋合於 基殼1頂部時’並未遮蔽該電性連接件2之電性接觸部21。 由於本發日月是以射出成型方式使原料（即包覆層）成型於基殼i 與塵板3之周圍，在本實施财該基殼}的_頂部外型可較 鮮規糾、—點，並於顺的框體心i2、13側邊形成有斜 面士’而該顯3周圍至少二側邊也形成有斜面32，以增加 黏合時的牢圊姓。 ，"裝的流程配合圖式作一說明，如第五圖所示，首 將該電性連接件2設置於該基殼1處，並使其電性接觸 21朝上裸㈣來，麟騎妨㈣帛。 將該屋板3設置於从卜⑽ +如不’ 份區域，使數’其雖賴了電性接觸件2的部 知[域使數㈣生接腳22隱藏於 露出來，此為步驟82 徽接觸部21仍稞 。將轉置入模具内，如第七 9 200805817 圖所不’並彻模具内可伸縮_助挿片7賴板3絲殼2 之間，空㈣插人其中，並與内部之彈性接聊42相接觸。此 目的，為了在射出成型過程中，防止電性接觸件4不會因原料 注入¥的強大壓力而使之移動，此為步驟83的動作。之後以 :出成型的方式於基殼卜壓板3、電性轉接件2的周園及接 口處形成-包覆層4 ’最後成型的形狀即如第二圖所示，其中 该包覆層4成獅區域包括基殼丨與壓板3 _接合處的周 圍、壓板3末端與電性轉接件2之電性接觸部21周圍、以及 電性轉接件2與基殼i、壓板3的接合處。由於基殼！與壓板 3相接處為斜面設計’包覆層原料也與各構件相同，有助於黏 合後更加牢固，雖第二圖中以細線表示包覆層4的區域，但實 際上製成時並無法翻麟，_料已被接在―^。如此結 構即為-轉接卡形狀，本實關所提供的結構為部卡轉 SD卡的結構，也可為卡轉聽卡的結構。 以上所述者，僅為本創作之較佳實施例而已，並非用來限 定本創作實施例之難|。即凡依摘作申料概圍所作的均 等變化及修飾，皆為本創作之專利範圍所涵蓋。 【圖式簡單說明】 第一圖為本發明之結構未黏合固定前之基本構件的分解圖； 第二圖為本發明之轉接卡的立體圖； 200805817 第二圖為第二圖之AA面之剖示圖； 第四圖為本發明之製造方法喊織； 第五圖為本發明製造過程中之步驟圖，此時電性轉接卡已放置 於基殼内部； 第六圖為本發明製造過程中之步驟圖，此時壓板已放置於基殼 頂部； 第七圖為本發明製造過程中 壓板與基殼之間的空間内。步驟圖，此纣一辅助插片將插入 【主要元件符號說明】 1基殼 14斜面 U彈性接腳 32斜面 11、12、13 框A flexible card cymbal 5 is attached to fix the position of the inserted mini SD card; the internal shape is not fixed, and is matched with the shape of the electrical adapter. For example, some manufacturers use elastic card cymbals. It is directly disposed at the electrical adapter 2, so the internal shape is different at this time. The electrical adapter 2 is used for the communication of the message. One side of the side has a plurality of electrical contact portions 21, and the other side extends a plurality of elastic pins 22, and the electrical contact portion 21 corresponds to A metal wire 23 is connected between the elastic pins 22 to be connected thereto. The pressure plate 3 is disposed on the top of the base shell 1 when assembled, so the high riding of the two groups is the fresh thickness of the SD card, but the money is not covered by the electrical connector when the top of the base shell 1 is covered. 2 electrical contact portion 21. Since the raw material (ie, the coating layer) is formed around the base shell i and the dust plate 3 by the injection molding method, the top shape of the base shell of the present invention can be relatively corrected. Points, and a beveled surface is formed on the sides of the frame cores i2 and 13, and a bevel 32 is formed on at least two sides of the display 3 to increase the permanent name at the time of bonding. , the installation process is described in conjunction with the drawing. As shown in the fifth figure, the first electrical connector 2 is disposed at the base shell 1 and the electrical contact 21 is upwardly exposed (four). Riding (four) 帛. The roof panel 3 is placed in the area of the (10) + if not the portion, so that the number is determined by the portion of the electrical contact 2 [the domain makes the number (four) of the student pin 22 hidden, which is step 82 The emblem contact 21 is still awkward. Will be transposed into the mold, such as the seventh 9 200805817 figure does not 'and the inside of the mold can be stretched _ inserts 7 board 3 between the shell 2, empty (four) inserted in it, and with the internal flexibility 42 Contact. For this purpose, in order to prevent the electrical contact 4 from moving due to the strong pressure of the material to be injected into the injection molding process, this is the operation of the step 83. Then, the shape of the final shape of the cladding layer 4 is formed on the base plate and the interface of the base shell plate 3 and the electrical adapter 2, as shown in the second figure, wherein the coating layer is formed. 4 The lion area includes the periphery of the base shell and the pressure plate 3 _ joint, the end of the pressure plate 3 and the electrical contact portion 21 of the electrical adapter 2, and the electrical adapter 2 and the base shell i, the pressure plate 3 Joint. Thanks to the base shell! The interface with the pressure plate 3 is designed as a bevel. The material of the cladding layer is also the same as the components, which is more favorable for bonding. Although the area of the coating layer 4 is indicated by thin lines in the second figure, it is actually made. Unable to rumor, _ has been picked up in ―^. The structure is the shape of the adapter card, and the structure provided by the actual gateway is the structure of the card to the SD card, and can also be the structure of the card transfer card. The above description is only a preferred embodiment of the present invention and is not intended to limit the difficulty of the present embodiment. All changes and modifications made to the scope of the application are covered by the scope of the patent. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded view of the basic structure before the structure of the present invention is unbonded and fixed; the second figure is a perspective view of the riser card of the present invention; 200805817 The second figure is the AA face of the second figure The fourth figure is a manufacturing method of the present invention; the fifth figure is a step diagram in the manufacturing process of the present invention, in which the electrical adapter card has been placed inside the base case; In the process step diagram, the pressure plate has been placed on top of the base shell; the seventh figure is in the space between the pressure plate and the base shell in the manufacturing process of the present invention. Step diagram, this auxiliary insert will be inserted [Main component symbol description] 1 base shell 14 bevel U elastic pin 32 bevel 11, 12, 13 frame
2電性轉接件 電性接觸部 23金屬線 3壓板 31空間 4包覆層2electric adapter electrical contact 23 metal wire 3 pressure plate 31 space 4 cladding