TW200802576A - Method and apparatus for cleaning substrates - Google Patents

Method and apparatus for cleaning substrates

Info

Publication number
TW200802576A
TW200802576A TW096109903A TW96109903A TW200802576A TW 200802576 A TW200802576 A TW 200802576A TW 096109903 A TW096109903 A TW 096109903A TW 96109903 A TW96109903 A TW 96109903A TW 200802576 A TW200802576 A TW 200802576A
Authority
TW
Taiwan
Prior art keywords
substrate
drying
chuck
opened top
low cover
Prior art date
Application number
TW096109903A
Other languages
English (en)
Other versions
TWI378502B (en
Inventor
Keun-Young Park
Kyo-Woog Koo
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060052665A external-priority patent/KR100715984B1/ko
Priority claimed from KR1020060055358A external-priority patent/KR100776281B1/ko
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW200802576A publication Critical patent/TW200802576A/zh
Application granted granted Critical
Publication of TWI378502B publication Critical patent/TWI378502B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
TW096109903A 2006-06-12 2007-03-22 Method and apparatus for cleaning substrates TWI378502B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060052665A KR100715984B1 (ko) 2006-06-12 2006-06-12 기판 처리 장치 및 방법
KR1020060055358A KR100776281B1 (ko) 2006-06-20 2006-06-20 기판 처리 장치

Publications (2)

Publication Number Publication Date
TW200802576A true TW200802576A (en) 2008-01-01
TWI378502B TWI378502B (en) 2012-12-01

Family

ID=38820645

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109903A TWI378502B (en) 2006-06-12 2007-03-22 Method and apparatus for cleaning substrates

Country Status (3)

Country Link
US (1) US8267103B2 (zh)
JP (1) JP2007335868A (zh)
TW (1) TWI378502B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489542B (zh) * 2010-03-31 2015-06-21 Screen Holdings Co Ltd 基板處理裝置及基板處理方法
TWI728593B (zh) * 2018-12-13 2021-05-21 南韓商杰宜斯科技有限公司 用於去除異物的基質處理裝置

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100809594B1 (ko) * 2006-09-12 2008-03-04 세메스 주식회사 척킹부재 및 이를 포함하는 스핀헤드
KR101205460B1 (ko) 2008-06-05 2012-11-29 도쿄엘렉트론가부시키가이샤 액처리 장치 및 액처리 방법
JP5497607B2 (ja) * 2010-10-01 2014-05-21 ファインマシーンカタオカ株式会社 カプセル型の洗浄機
JP5782279B2 (ja) * 2011-01-20 2015-09-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US9242279B2 (en) * 2011-05-24 2016-01-26 Tokyo Electron Limited Liquid processing apparatus and liquid processing method
CN103177934B (zh) * 2011-12-26 2016-06-15 北京七星华创电子股份有限公司 薄片盘状物清洗甩干器
KR101512560B1 (ko) 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 기판처리장치
TWI484549B (zh) * 2013-02-08 2015-05-11 Sj High Technology Company 用於清潔半導體設備的零件之濕式清潔方法
KR102057220B1 (ko) 2013-02-19 2020-01-22 삼성전자주식회사 약액 공급기, 약액 공급기를 구비하는 기판 처리 장치 및 이를 이용한 기판의 처리방법
US10062586B2 (en) * 2013-07-26 2018-08-28 Tokyo Electron Limited Chemical fluid processing apparatus and chemical fluid processing method
US9968970B2 (en) * 2015-12-04 2018-05-15 Lam Research Ag Spin chuck with in situ cleaning capability
JP6672023B2 (ja) * 2016-03-08 2020-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102226084B1 (ko) 2017-02-06 2021-03-09 플레이너 세미컨덕터, 인크. 나노미터 미만 수준 광-기반 기판 세정 메커니즘
WO2018144446A1 (en) 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Sub-nanometer-level substrate cleaning mechanism
JP6804325B2 (ja) 2017-02-09 2020-12-23 東京エレクトロン株式会社 液処理装置
KR20210157574A (ko) * 2020-06-22 2021-12-29 주식회사 제우스 기판처리장치

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JPS5596945A (en) 1979-01-17 1980-07-23 Matsushita Electric Ind Co Ltd Developing method
JPS5723937A (en) 1980-07-17 1982-02-08 Matsushita Electric Ind Co Ltd Photographic etching method
JP2860545B2 (ja) 1987-08-27 1999-02-24 キヤノン株式会社 自動ホワイト・バランス補正装置
JPH03131026A (ja) 1989-10-17 1991-06-04 Seiko Epson Corp 洗浄装置
US5571560A (en) * 1994-01-12 1996-11-05 Lin; Burn J. Proximity-dispensing high-throughput low-consumption resist coating device
DE19781654B4 (de) * 1996-03-15 2007-03-29 Kabushiki Kaisha Toshiba, Kawasaki System zur Rückgewinnung von Metall von einer aus einem Harz und einem Metall bestehenden Leiterplatte und Verfahren zur Rückgewinnung von Metall von einer Leiterplatte mit einem Harz und einem Metall als Bestandteile
JP3774951B2 (ja) 1996-09-26 2006-05-17 神鋼電機株式会社 ウェーハ洗浄装置
JP2891951B2 (ja) 1996-12-06 1999-05-17 鹿児島日本電気株式会社 フォトレジスト現像装置
TW559927B (en) 2001-05-30 2003-11-01 Yamaha Corp Substrate processing method and apparatus
JP2003037095A (ja) 2001-07-25 2003-02-07 Sony Corp 基板処理装置および基板処理方法
US6869234B2 (en) * 2002-03-28 2005-03-22 Dainippon Screen Mfg. Co., Ltd. Developing apparatus and developing method
US20040082251A1 (en) * 2002-10-29 2004-04-29 Applied Materials, Inc. Apparatus for adjustable gas distribution for semiconductor substrate processing
US20060033678A1 (en) * 2004-01-26 2006-02-16 Applied Materials, Inc. Integrated electroless deposition system
US7323080B2 (en) * 2004-05-04 2008-01-29 Semes Co., Ltd. Apparatus for treating substrate
JP4446875B2 (ja) * 2004-06-14 2010-04-07 大日本スクリーン製造株式会社 基板処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489542B (zh) * 2010-03-31 2015-06-21 Screen Holdings Co Ltd 基板處理裝置及基板處理方法
TWI728593B (zh) * 2018-12-13 2021-05-21 南韓商杰宜斯科技有限公司 用於去除異物的基質處理裝置

Also Published As

Publication number Publication date
TWI378502B (en) 2012-12-01
JP2007335868A (ja) 2007-12-27
US20070283983A1 (en) 2007-12-13
US8267103B2 (en) 2012-09-18

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