TW200801489A - Paste status inspection device of electronic parts - Google Patents
Paste status inspection device of electronic partsInfo
- Publication number
- TW200801489A TW200801489A TW96116290A TW96116290A TW200801489A TW 200801489 A TW200801489 A TW 200801489A TW 96116290 A TW96116290 A TW 96116290A TW 96116290 A TW96116290 A TW 96116290A TW 200801489 A TW200801489 A TW 200801489A
- Authority
- TW
- Taiwan
- Prior art keywords
- tcp
- image
- pcb
- inspected
- leads
- Prior art date
Links
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Liquid Crystal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
A flexible TCP 20 having a plurality of TCP leads is electrically connected with a PCB 30 having PCB leads corresponding to the TCP leads through an ACF 40. When a paste status of the TCP 20 and the PCB 30 is inspected, on the basis of an image of the TCP 20 which is acquired from an electrical signal obtained by irradiating a parallel light towards the TCP 20 from a slant upper part of the TCP 20, and by carrying out a photoelectric conversion of a reflected light reflected by the TCP 20 by means of a solid state image sensing device 15, a pattern of an image (inspected image) of the acquired TCP 20 is compared with a pattern of an image (reference image) of a reference normal TCP 20, and thereby the paste status of the TCP 20 and the PCB 30 is inspected.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006147581A JP2007317972A (en) | 2006-05-29 | 2006-05-29 | Paste status inspection device of electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200801489A true TW200801489A (en) | 2008-01-01 |
Family
ID=38851556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96116290A TW200801489A (en) | 2006-05-29 | 2007-05-08 | Paste status inspection device of electronic parts |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007317972A (en) |
| TW (1) | TW200801489A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102590219A (en) * | 2012-02-10 | 2012-07-18 | 东莞市冠佳电子设备有限公司 | Comprehensive PCB (printed circuit board) inspection device |
| TWI835085B (en) * | 2022-03-04 | 2024-03-11 | 梭特科技股份有限公司 | Method for detecting defect between wafer or die and substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011142184A (en) * | 2010-01-06 | 2011-07-21 | Hitachi High-Technologies Corp | Acf presence detector |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6326508A (en) * | 1986-07-19 | 1988-02-04 | Fujitsu Ltd | Inspection device for packaging component |
| JPH0810800B2 (en) * | 1988-03-17 | 1996-01-31 | 富士通株式会社 | Part lead inspection and attitude recognition method |
| JPH07248211A (en) * | 1994-03-09 | 1995-09-26 | Toyota Central Res & Dev Lab Inc | Apparatus for detecting surface state |
| JPH11352074A (en) * | 1998-06-05 | 1999-12-24 | Matsushita Electric Ind Co Ltd | Inspection of connection part |
| JP2001021333A (en) * | 1999-07-08 | 2001-01-26 | Seiko Epson Corp | Method for inspecting attachment quality of anisotropic conductive sheet and its device |
| JP2001264019A (en) * | 2000-03-22 | 2001-09-26 | Olympus Optical Co Ltd | Device for appearance inspection of printed circuit board |
-
2006
- 2006-05-29 JP JP2006147581A patent/JP2007317972A/en active Pending
-
2007
- 2007-05-08 TW TW96116290A patent/TW200801489A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102590219A (en) * | 2012-02-10 | 2012-07-18 | 东莞市冠佳电子设备有限公司 | Comprehensive PCB (printed circuit board) inspection device |
| TWI835085B (en) * | 2022-03-04 | 2024-03-11 | 梭特科技股份有限公司 | Method for detecting defect between wafer or die and substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007317972A (en) | 2007-12-06 |
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