TW200801432A - Heat pipe - Google Patents

Heat pipe

Info

Publication number
TW200801432A
TW200801432A TW95119596A TW95119596A TW200801432A TW 200801432 A TW200801432 A TW 200801432A TW 95119596 A TW95119596 A TW 95119596A TW 95119596 A TW95119596 A TW 95119596A TW 200801432 A TW200801432 A TW 200801432A
Authority
TW
Taiwan
Prior art keywords
section
tube
heat pipe
wick structure
heat
Prior art date
Application number
TW95119596A
Other languages
Chinese (zh)
Other versions
TWI275768B (en
Inventor
Chuen-Shu Hou
Chao-Nien Tung
Tay-Jian Liu
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95119596A priority Critical patent/TWI275768B/en
Application granted granted Critical
Publication of TWI275768B publication Critical patent/TWI275768B/en
Publication of TW200801432A publication Critical patent/TW200801432A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat pipe includes a tube forming a sealed container therein, a wick structure provided in inner walls of the tube and a working fluid filled in the container. The tube includes a first section, a second section and a third section. The first and second sections are metal tubes and the second section is a nonmetal tube. A cost of the heat pipe can be saved because the second section is a nonmetal tube. Effective pore rate of the wick structure is enhanced and water-containing ability of the wick structure is greatly improved. Heat dissipation efficiency of the heat pipeis accordingly improved.
TW95119596A 2006-06-02 2006-06-02 Heat pipe TWI275768B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95119596A TWI275768B (en) 2006-06-02 2006-06-02 Heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95119596A TWI275768B (en) 2006-06-02 2006-06-02 Heat pipe

Publications (2)

Publication Number Publication Date
TWI275768B TWI275768B (en) 2007-03-11
TW200801432A true TW200801432A (en) 2008-01-01

Family

ID=38646045

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95119596A TWI275768B (en) 2006-06-02 2006-06-02 Heat pipe

Country Status (1)

Country Link
TW (1) TWI275768B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7129577B1 (en) * 2022-02-24 2022-09-01 古河電気工業株式会社 heat transfer device

Also Published As

Publication number Publication date
TWI275768B (en) 2007-03-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees