200800822 九、發明說明： 【發明所屬之技術領域】 本發明係與玻璃基板技術領域有關，更詳而言之 是指一種玻璃基板減薄製程者。 【先前技術】 按’目前將玻璃基板厚度減薄之加工方式通常係 利用研磨設備將玻璃基板予以研磨（LAPPING)—段時 間後獲得所需之厚度。由於利用研磨設備研磨玻填基 板表面時，必須搭配磨料（如氧化鋁、碳化石夕），i分 鐘始可磨除約5〜40um之厚度，不僅頗為費時，且，利 用研磨方式將玻璃基板減薄之方式易產生玻璃翹曲及 研磨過程中產生粉塵對人體健康造成危害等問題，因 此’並非袁么之玻璃基板厚度減薄方式。 此外，如中華民國發明第89119841號「顯示用玻 璃基板的製造方法，及該方法所製得之顯示用玻璃基 板」發明專利案，其係利用化學藥劑浸蝕之方式去除 玻璃機板表面之還原不均質層，亦有減薄玻璃之效 果，不過，由於玻璃基板表面難免有表面缺陷（刮傷， 雜質..等）’此等表面缺㈣經化學藥船錢程序處理 後將更為擴大’顯然此發明專利案所揭技術仍有缺點。 200800822 【發明内容】 本發明之主要目的即在提供一種可解決前揭缺失 之玻璃基板減薄製程，其可將玻璃基板快速薄化而縮 短加工時間，俾解決習知研磨（lapping)方式所產生之 玻璃翹曲、研磨過程中產生粉塵對人體健康危害之問 題’且，其更可解決玻璃基板之表面缺陷（刮傷，雜質·· 等）經化學藥劑浸蝕程序處理而擴大之問題者。 緣是，為達成前述之目的，本發明係提供一種玻 璃基板減薄製程，至少包含有以下步驟勾初拋光程 序：將玻璃基板表面予以拋光，用以消除玻璃基板表 面之缺陷；b)浸蝕程序：將拋光後之玻璃基板利用含 氫氟酸之浸蝕劑浸蝕預定時間，用以除去玻璃基板預 定之厚度；C)再拋光程序：將浸蝕後之玻璃基板再予 以拋光’用以消除浸银後玻璃基板表面產生之缺陷。 【實施方式】 以下，茲舉本發明一較佳實施例，並配合圖式做 進一步之詳細說明如後： 如第一圖所示，本發明一較佳實施例之玻璃基板 減薄製程，其第一步驟係初拋光程序10 :係利用習知 拋光裝置之拋光墊與含氧化鈽粉之拋光液（圖中未示） 進行玻璃基板表面之拋光動作，用以可消除玻璃基板 表面之缺陷。 200800822 本發明之第二步驟係浸蝕程序20 :係將拋光後之 玻璃基板利用含氫氟酸之浸蝕劑浸蝕預定時間，其方 式係將該玻璃基板浸入浸姓劑中，用以可除去玻璃基 板預疋之厚度。該等浸韻劑係由5百分比以下之氳氟 酸、2百分比以下之鹽酸及水混合而成，而玻璃基板 之浸餃時間視欲除去多少厚度而定，只需以習知分厘 卡尺測量一次以浸钱劑浸姓預定時間後之玻璃基板厚 度’即可得知所需之浸蝕時間。 本發明之最後步驟係再拋光程序30 :係將浸蝕後 之玻璃基板表面再予以拋光，用以可消除浸蝕後玻璃 基板表面所產生之缺陷，如此一來，即可獲得吾人所 需厚度之玻璃基板。 此外，本發明之浸蝕方式亦可為直接將浸蝕劑喷 灑（SPRAY)於該玻璃基板表面、以浸鍅玻璃基板。 由上可知，本發明玻璃基板減薄製程利用化學藥 劑（浸钕劑）浸姓玻璃基板之方式，相較於習知研磨 (lapping)之方式更可快速減薄玻璃基板之厚度而縮 短加工時間，同時，可解決習知研磨（LAPPING)方式所 產生之玻璃翹曲、研磨過程中產生粉塵對人體健康危 吾之問題，且，初拋光及再拋光程序可避免玻璃基板 表面缺陷（刮傷，雜質，凹洞··等）經化學藥劑浸蝕程 序處理而擴大之問題。 當然’本發明浸蝕程序所使用之浸蝕劑其成分中 7 200800822 之氫氟酸及鹽酸之比例亦可調整，甚至加入其他化學 腐蝕藥劑，俾可改變或調整浸蝕劑之浸蝕強度者。 综上所陳，本發明所提供之玻璃基板減薄製程， 其可將玻璃基板快速薄化而縮短加工時間，俾解決習 知研磨方式所產生之玻璃翹曲、研磨過程中產生粉塵 對人體健康危害之問題，且，其更可解決玻璃基板之 表面缺(刮& ’雜質’凹洞··等）經化學藥劑浸敍程 序處理而擴大之問題者；緣是，本發明確實符合發明 專利之規定，爰依法提出申請。 【圖式簡單說明】 第一圖係本發明一較佳實施例之流程圖。 【主要元件符號說明】 初拋光程序10 浸蝕程序20 再拋光程序30200800822 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to the technical field of glass substrates, and more specifically to a glass substrate thinning process. [Prior Art] According to the current processing method of thinning the thickness of the glass substrate, the glass substrate is usually ground by a grinding apparatus (LAPPING) to obtain a desired thickness after a period of time. Since the surface of the glass substrate is ground by a grinding device, it is necessary to match the abrasive (such as alumina and carbon stone), and the thickness of about 5 to 40 um can be removed in i minutes, which is not only time consuming, but also the glass substrate is polished. The thinning method is prone to problems such as glass warpage and dust generated during the grinding process, which is harmful to human health. Therefore, it is not the way to reduce the thickness of the glass substrate. In addition, as for the invention patent of the method for producing a glass substrate for display and the glass substrate for display obtained by the method of the invention of the Republic of China, the method for removing the surface of the glass plate by means of chemical etching is not used. The homogeneous layer also has the effect of thinning the glass. However, since the surface of the glass substrate is inevitably surface defects (scratches, impurities, etc.), the surface defects (4) will be enlarged after being processed by the chemical medicine ship program. The technology disclosed in this invention patent still has drawbacks. 200800822 SUMMARY OF THE INVENTION The main object of the present invention is to provide a glass substrate thinning process which can solve the problem of the prior invention, which can quickly thin the glass substrate and shorten the processing time, and solve the problem of the conventional lapping method. The problem that the glass is warped and the dust is harmful to human health during the grinding process is further solved by the problem that the surface defects (scratches, impurities, etc.) of the glass substrate are enlarged by the chemical etching process. In order to achieve the foregoing objective, the present invention provides a glass substrate thinning process comprising at least the following steps: polishing the surface of the glass substrate to eliminate defects on the surface of the glass substrate; b) etching procedure : polishing the polished glass substrate with a hydrofluoric acid-containing etchant for a predetermined time to remove the predetermined thickness of the glass substrate; C) re-polishing procedure: polishing the etched glass substrate to eliminate silver immersion Defects on the surface of the glass substrate. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be further described in detail with reference to the following drawings: As shown in the first figure, a glass substrate thinning process according to a preferred embodiment of the present invention is The first step is an initial polishing process 10: the polishing operation of the surface of the glass substrate is performed by using a polishing pad of a conventional polishing device and a polishing liquid containing cerium oxide powder (not shown) to eliminate defects on the surface of the glass substrate. 200800822 The second step of the present invention is an etching process 20: etching the polished glass substrate with a hydrofluoric acid-containing etchant for a predetermined time by immersing the glass substrate in a immersion agent for removing the glass substrate. The thickness of the preview. The immersion agent is prepared by mixing less than 5% of hydrofluoric acid, less than 2% hydrochloric acid and water, and the time of dip- dicing of the glass substrate depends on how much thickness is to be removed, and only needs to be measured by a conventional caliper. The desired etching time can be known by immersing the glass substrate with a thickness of the glass substrate after a predetermined period of time. The final step of the present invention is a re-polishing process 30: polishing the surface of the etched glass substrate to eliminate defects caused by the surface of the etched glass substrate, so that the glass of the desired thickness can be obtained. Substrate. Further, in the etching method of the present invention, the etching agent may be directly sprayed (SPRAY) on the surface of the glass substrate to immerse the glass substrate. It can be seen from the above that the glass substrate thinning process of the present invention utilizes a chemical agent (dip agent) to dip the glass substrate, and the thickness of the glass substrate can be quickly reduced and the processing time can be shortened compared with the conventional lapping method. At the same time, it can solve the problem that the glass warpage caused by the LAPPING method and the dust generated during the grinding process are dangerous to human health, and the initial polishing and re-polishing process can avoid the surface defect of the glass substrate (scratch, Impurities, pits, etc.) are enlarged by the chemical etching process. Of course, the ratio of hydrofluoric acid and hydrochloric acid in the composition of the etchant used in the etching process of the present invention can be adjusted, and even other chemical corrosive agents can be added, and the etching strength of the etchant can be changed or adjusted. In summary, the glass substrate thinning process provided by the invention can shorten the processing time of the glass substrate and shorten the processing time, and solve the problem that the glass warpage caused by the conventional grinding method and the dust generated during the grinding process are good for human health. The problem of the hazard, and the problem that the surface of the glass substrate is lacking (scraping & 'impurity', etc.) is expanded by the chemical chemical immersion program; the invention is indeed in accordance with the invention patent The provisions of the law, 提出 apply in accordance with the law. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a flow chart of a preferred embodiment of the present invention. [Main component symbol description] Initial polishing program 10 Etching program 20 Re-polishing program 30