TW200746399A - NAND type non-volatile memory and manufacturing method and operstion method thereof - Google Patents

NAND type non-volatile memory and manufacturing method and operstion method thereof

Info

Publication number
TW200746399A
TW200746399A TW095120523A TW95120523A TW200746399A TW 200746399 A TW200746399 A TW 200746399A TW 095120523 A TW095120523 A TW 095120523A TW 95120523 A TW95120523 A TW 95120523A TW 200746399 A TW200746399 A TW 200746399A
Authority
TW
Taiwan
Prior art keywords
memory
memory units
disposed
type non
nand type
Prior art date
Application number
TW095120523A
Other languages
Chinese (zh)
Other versions
TWI302741B (en
Inventor
Chao-Wei Kuo
Chih-Ming Chao
Hann-Ping Hwang
Houng-Chi Wei
Saysamone Pittikoun
Original Assignee
Powerchip Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powerchip Semiconductor Corp filed Critical Powerchip Semiconductor Corp
Priority to TW95120523A priority Critical patent/TWI302741B/en
Publication of TW200746399A publication Critical patent/TW200746399A/en
Application granted granted Critical
Publication of TWI302741B publication Critical patent/TWI302741B/en

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  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)

Abstract

A NAND type non-volatile memory having a plurality of memory unit rows is provided. Each of the memory unit rows includes a source region, a drain region, a plurality of memory units, a plurality of pass gates, a first select transistor and a second select transistor. The source region and the drain region are disposed in the substrate. Memory units are disposed between the source region and the drain region on the substrate. Each of memory units has a memory cell and a transistor. The memory cell and the transistor are arranged with parallel connection. The pass gates are disposed between two adjacent memory units on the substrate to connect memory units in series. The first and the second select transistor are disposed on the sidewall of the outermost two memory units and adjacent to the source region and the drain region respectively.
TW95120523A 2006-06-09 2006-06-09 Nand type non-volatile memory and manufacturing method and operstion method thereof TWI302741B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95120523A TWI302741B (en) 2006-06-09 2006-06-09 Nand type non-volatile memory and manufacturing method and operstion method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95120523A TWI302741B (en) 2006-06-09 2006-06-09 Nand type non-volatile memory and manufacturing method and operstion method thereof

Publications (2)

Publication Number Publication Date
TW200746399A true TW200746399A (en) 2007-12-16
TWI302741B TWI302741B (en) 2008-11-01

Family

ID=45070552

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95120523A TWI302741B (en) 2006-06-09 2006-06-09 Nand type non-volatile memory and manufacturing method and operstion method thereof

Country Status (1)

Country Link
TW (1) TWI302741B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651835B (en) 2017-03-31 2019-02-21 力晶科技股份有限公司 Non-volatile memory structure and methods for preventing stylized interference

Also Published As

Publication number Publication date
TWI302741B (en) 2008-11-01

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