TW200746326A - Method of forming bump, method of forming image sensor using the method, semiconductor chip and the sensor so formed - Google Patents

Method of forming bump, method of forming image sensor using the method, semiconductor chip and the sensor so formed

Info

Publication number
TW200746326A
TW200746326A TW095141273A TW95141273A TW200746326A TW 200746326 A TW200746326 A TW 200746326A TW 095141273 A TW095141273 A TW 095141273A TW 95141273 A TW95141273 A TW 95141273A TW 200746326 A TW200746326 A TW 200746326A
Authority
TW
Taiwan
Prior art keywords
forming
bump
sensor
semiconductor chip
image sensor
Prior art date
Application number
TW095141273A
Other languages
English (en)
Inventor
Jong-Wook Hong
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200746326A publication Critical patent/TW200746326A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
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    • H01L27/144—Devices controlled by radiation
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    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Wire Bonding (AREA)
TW095141273A 2005-11-08 2006-11-08 Method of forming bump, method of forming image sensor using the method, semiconductor chip and the sensor so formed TW200746326A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050106596A KR100695518B1 (ko) 2005-11-08 2005-11-08 범프의 형성 방법, 이를 이용한 이미지 센서의 제조 방법및 이에 의해 형성된 반도체 칩 및 이미지 센서

Publications (1)

Publication Number Publication Date
TW200746326A true TW200746326A (en) 2007-12-16

Family

ID=38004320

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141273A TW200746326A (en) 2005-11-08 2006-11-08 Method of forming bump, method of forming image sensor using the method, semiconductor chip and the sensor so formed

Country Status (4)

Country Link
US (1) US20070105360A1 (zh)
JP (1) JP2007134713A (zh)
KR (1) KR100695518B1 (zh)
TW (1) TW200746326A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100672995B1 (ko) * 2005-02-02 2007-01-24 삼성전자주식회사 이미지 센서의 제조 방법 및 그에 의해 형성된 이미지 센서

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3798569B2 (ja) * 1999-02-23 2006-07-19 ローム株式会社 半導体装置の製造方法
US6636313B2 (en) * 2002-01-12 2003-10-21 Taiwan Semiconductor Manufacturing Co. Ltd Method of measuring photoresist and bump misalignment
KR100552664B1 (ko) * 2002-10-12 2006-02-20 삼성전자주식회사 측벽에 의해 한정되는 잉크 챔버를 가진 일체형 잉크젯프린트헤드 및 그 제조방법
TW584936B (en) * 2003-03-20 2004-04-21 Advanced Semiconductor Eng Wafer bumping process
KR100593162B1 (ko) * 2004-03-22 2006-06-26 매그나칩 반도체 유한회사 이미지센서 및 그 제조방법
US7251884B2 (en) * 2004-04-26 2007-08-07 Formfactor, Inc. Method to build robust mechanical structures on substrate surfaces

Also Published As

Publication number Publication date
JP2007134713A (ja) 2007-05-31
KR100695518B1 (ko) 2007-03-14
US20070105360A1 (en) 2007-05-10

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