TW200746285A - Device and method for wet treating plate-like substrates - Google Patents
Device and method for wet treating plate-like substratesInfo
- Publication number
- TW200746285A TW200746285A TW096114014A TW96114014A TW200746285A TW 200746285 A TW200746285 A TW 200746285A TW 096114014 A TW096114014 A TW 096114014A TW 96114014 A TW96114014 A TW 96114014A TW 200746285 A TW200746285 A TW 200746285A
- Authority
- TW
- Taiwan
- Prior art keywords
- plate
- substrates
- silicon
- article
- treating plate
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 title 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- 239000007788 liquid Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT7842006 | 2006-05-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200746285A true TW200746285A (en) | 2007-12-16 |
TWI373800B TWI373800B (en) | 2012-10-01 |
Family
ID=38110318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096114014A TWI373800B (en) | 2006-05-05 | 2007-04-20 | Device and method for wet treating plate-like substrates |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090235952A1 (zh) |
EP (1) | EP2018659A1 (zh) |
JP (1) | JP2009536450A (zh) |
KR (1) | KR20090029693A (zh) |
CN (1) | CN101438383A (zh) |
TW (1) | TWI373800B (zh) |
WO (1) | WO2007128659A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI574335B (zh) * | 2011-09-22 | 2017-03-11 | Ev集團E塔那有限公司 | 處理基板表面之裝置及方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5151343B2 (ja) | 2006-12-13 | 2013-02-27 | パナソニック株式会社 | 非水電解質二次電池用負極とその製造方法およびそれを用いた非水電解質二次電池 |
US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
WO2018076152A1 (en) * | 2016-10-25 | 2018-05-03 | Acm Research (Shanghai) Inc. | Apparatus and method for cleaning semiconductor wafers |
KR101918236B1 (ko) * | 2017-05-23 | 2018-11-14 | 주식회사 듀라소닉 | 미세 패턴 세정장치 |
US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4401131A (en) * | 1981-05-15 | 1983-08-30 | Gca Corporation | Apparatus for cleaning semiconductor wafers |
JP3088118B2 (ja) * | 1991-04-01 | 2000-09-18 | 株式会社日立製作所 | 板状物処理装置および板状物処理方法ならびに半導体装置の製造方法 |
US20020066464A1 (en) * | 1997-05-09 | 2002-06-06 | Semitool, Inc. | Processing a workpiece using ozone and sonic energy |
US6314974B1 (en) * | 1999-06-28 | 2001-11-13 | Fairchild Semiconductor Corporation | Potted transducer array with matching network in a multiple pass configuration |
TW499329B (en) * | 1999-09-17 | 2002-08-21 | Product System Inc | Chemically inert megasonic transducer system |
US6927176B2 (en) * | 2000-06-26 | 2005-08-09 | Applied Materials, Inc. | Cleaning method and solution for cleaning a wafer in a single wafer process |
US7456113B2 (en) * | 2000-06-26 | 2008-11-25 | Applied Materials, Inc. | Cleaning method and solution for cleaning a wafer in a single wafer process |
US20020062839A1 (en) * | 2000-06-26 | 2002-05-30 | Steven Verhaverbeke | Method and apparatus for frontside and backside wet processing of a wafer |
JP2002289568A (ja) * | 2001-03-23 | 2002-10-04 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置およびそれに用いる超音波振動エレメント |
TWI224531B (en) * | 2001-09-11 | 2004-12-01 | Ebara Corp | Substrate processing apparatus and method |
US6843855B2 (en) * | 2002-03-12 | 2005-01-18 | Applied Materials, Inc. | Methods for drying wafer |
WO2004112093A2 (en) * | 2003-06-06 | 2004-12-23 | P.C.T. Systems, Inc. | Method and apparatus to process substrates with megasonic energy |
ATE418790T1 (de) * | 2003-06-24 | 2009-01-15 | Sez Ag | Einrichtung und verfahren zur nassbehandlung von scheibenartigen substraten |
-
2007
- 2007-04-18 US US12/299,647 patent/US20090235952A1/en not_active Abandoned
- 2007-04-18 EP EP07728230A patent/EP2018659A1/en not_active Withdrawn
- 2007-04-18 JP JP2009508300A patent/JP2009536450A/ja active Pending
- 2007-04-18 WO PCT/EP2007/053768 patent/WO2007128659A1/en active Application Filing
- 2007-04-18 CN CNA2007800162979A patent/CN101438383A/zh active Pending
- 2007-04-18 KR KR1020087027147A patent/KR20090029693A/ko not_active Application Discontinuation
- 2007-04-20 TW TW096114014A patent/TWI373800B/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI574335B (zh) * | 2011-09-22 | 2017-03-11 | Ev集團E塔那有限公司 | 處理基板表面之裝置及方法 |
US9960058B2 (en) | 2011-09-22 | 2018-05-01 | Ev Group E. Thallner Gmbh | Device and method for treating substrate surfaces |
Also Published As
Publication number | Publication date |
---|---|
EP2018659A1 (en) | 2009-01-28 |
TWI373800B (en) | 2012-10-01 |
JP2009536450A (ja) | 2009-10-08 |
CN101438383A (zh) | 2009-05-20 |
US20090235952A1 (en) | 2009-09-24 |
WO2007128659A1 (en) | 2007-11-15 |
KR20090029693A (ko) | 2009-03-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |