TW200745774A - Exposure apparatus, pressure control method for the same, and device manufacturing method - Google Patents

Exposure apparatus, pressure control method for the same, and device manufacturing method

Info

Publication number
TW200745774A
TW200745774A TW096108630A TW96108630A TW200745774A TW 200745774 A TW200745774 A TW 200745774A TW 096108630 A TW096108630 A TW 096108630A TW 96108630 A TW96108630 A TW 96108630A TW 200745774 A TW200745774 A TW 200745774A
Authority
TW
Taiwan
Prior art keywords
pressure
space
exposure apparatus
same
pressure control
Prior art date
Application number
TW096108630A
Other languages
English (en)
Chinese (zh)
Inventor
Kouhei Imoto
Shigeyuki Uzawa
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200745774A publication Critical patent/TW200745774A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/18—Vacuum control means
    • H01J2237/188—Differential pressure

Landscapes

  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096108630A 2006-03-14 2007-03-13 Exposure apparatus, pressure control method for the same, and device manufacturing method TW200745774A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006069901A JP4378357B2 (ja) 2006-03-14 2006-03-14 露光装置及びその圧力制御方法並びにデバイス製造方法

Publications (1)

Publication Number Publication Date
TW200745774A true TW200745774A (en) 2007-12-16

Family

ID=38594682

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108630A TW200745774A (en) 2006-03-14 2007-03-13 Exposure apparatus, pressure control method for the same, and device manufacturing method

Country Status (4)

Country Link
US (1) US7525106B2 (https=)
JP (1) JP4378357B2 (https=)
KR (1) KR100880617B1 (https=)
TW (1) TW200745774A (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006044591A1 (de) * 2006-09-19 2008-04-03 Carl Zeiss Smt Ag Optische Anordnung, insbesondere Projektionsbelichtungsanlage für die EUV-Lithographie, sowie reflektives optisches Element mit verminderter Kontamination
JP4656115B2 (ja) 2007-09-27 2011-03-23 ソニー株式会社 撮像装置、画像信号処理回路、および画像信号処理方法、並びにコンピュータ・プログラム
JP2009294439A (ja) * 2008-06-05 2009-12-17 Toshiba Corp レジストパターン形成方法
NL2005741A (en) * 2009-12-23 2011-06-27 Asml Netherlands Bv Lithographic apparatus and method.
JP2012114140A (ja) * 2010-11-22 2012-06-14 Renesas Electronics Corp 露光方法および露光装置
NL2008186A (en) * 2011-03-14 2012-09-17 Asml Netherlands Bv Projection system, lithographic apparatus and device manufacturing method.
US9506478B2 (en) * 2012-01-13 2016-11-29 Edwards Limited Vacuum system
JP2015127837A (ja) * 2015-04-03 2015-07-09 ルネサスエレクトロニクス株式会社 露光方法および露光装置
JP6748461B2 (ja) * 2016-03-22 2020-09-02 キヤノン株式会社 インプリント装置、インプリント装置の動作方法および物品製造方法
US11979971B2 (en) * 2018-06-29 2024-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. EUV light source and apparatus for lithography
KR20210145153A (ko) 2019-04-01 2021-12-01 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 그와 관련된 방법
US11150564B1 (en) 2020-09-29 2021-10-19 Taiwan Semiconductor Manufacturing Co., Ltd. EUV wafer defect improvement and method of collecting nonconductive particles

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999010917A1 (en) 1997-08-26 1999-03-04 Nikon Corporation Aligner, exposure method, method of pressure adjustment of projection optical system, and method of assembling aligner
US7109483B2 (en) * 2000-11-17 2006-09-19 Ebara Corporation Method for inspecting substrate, substrate inspecting system and electron beam apparatus
US6855929B2 (en) * 2000-12-01 2005-02-15 Ebara Corporation Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former
US6859259B2 (en) 2002-08-15 2005-02-22 Asml Netherlands B.V. Lithographic projection apparatus and reflector assembly for use therein
JP2005057154A (ja) 2003-08-07 2005-03-03 Canon Inc 露光装置

Also Published As

Publication number Publication date
KR20070093886A (ko) 2007-09-19
JP2007250686A (ja) 2007-09-27
KR100880617B1 (ko) 2009-01-30
JP4378357B2 (ja) 2009-12-02
US7525106B2 (en) 2009-04-28
US20080073571A1 (en) 2008-03-27

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JP2007250686A5 (https=)