TW200745560A - Approach for fabricating cantilever probes for probe card assemblies - Google Patents

Approach for fabricating cantilever probes for probe card assemblies

Info

Publication number
TW200745560A
TW200745560A TW096104631A TW96104631A TW200745560A TW 200745560 A TW200745560 A TW 200745560A TW 096104631 A TW096104631 A TW 096104631A TW 96104631 A TW96104631 A TW 96104631A TW 200745560 A TW200745560 A TW 200745560A
Authority
TW
Taiwan
Prior art keywords
approach
posts
end portion
probe card
panel
Prior art date
Application number
TW096104631A
Other languages
Chinese (zh)
Inventor
Bahadir Tunaboylu
Horst Clauberg
Mark Cunningham
Senthil Theppakuttai
John Mcglory
Original Assignee
Sv Probe Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sv Probe Pte Ltd filed Critical Sv Probe Pte Ltd
Publication of TW200745560A publication Critical patent/TW200745560A/en

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

An approach for fabricating cantilever probes for a probe card assembly includes forming posts on conductive traces on a substrate. A beam panel having beam elements formed therein is aligned to the substrate so that the beam elements are in contact with the plurality of posts. Each beam element is in contact with a post at a portion of the beam element so that both a first end portion and a second end portion overhang the post element. Each beam element is also attached to the beam panel by the first end portion. The beam elements are bonded to the plurality of posts. The first end portion of each beam element is cut, for example using an electrode, laser ablation or by dicing, to release the beam element from the beam panel. The beam panel is then removed, leaving the beam elements attached to the posts.
TW096104631A 2006-02-08 2007-02-08 Approach for fabricating cantilever probes for probe card assemblies TW200745560A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77155406P 2006-02-08 2006-02-08

Publications (1)

Publication Number Publication Date
TW200745560A true TW200745560A (en) 2007-12-16

Family

ID=57914532

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104631A TW200745560A (en) 2006-02-08 2007-02-08 Approach for fabricating cantilever probes for probe card assemblies

Country Status (1)

Country Link
TW (1) TW200745560A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755919B (en) * 2020-11-03 2022-02-21 中華精測科技股份有限公司 Board-like connector, dual-ring bridge of board-like connector, and wafer testing assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755919B (en) * 2020-11-03 2022-02-21 中華精測科技股份有限公司 Board-like connector, dual-ring bridge of board-like connector, and wafer testing assembly

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