WO2008153342A3 - Probe substrate assembly - Google Patents

Probe substrate assembly Download PDF

Info

Publication number
WO2008153342A3
WO2008153342A3 PCT/KR2008/003316 KR2008003316W WO2008153342A3 WO 2008153342 A3 WO2008153342 A3 WO 2008153342A3 KR 2008003316 W KR2008003316 W KR 2008003316W WO 2008153342 A3 WO2008153342 A3 WO 2008153342A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe
substrate
probe substrate
contact hole
substrate assembly
Prior art date
Application number
PCT/KR2008/003316
Other languages
French (fr)
Other versions
WO2008153342A2 (en
Inventor
Jong Hyeon Chae
Original Assignee
M2N Inc
Jong Hyeon Chae
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M2N Inc, Jong Hyeon Chae filed Critical M2N Inc
Publication of WO2008153342A2 publication Critical patent/WO2008153342A2/en
Publication of WO2008153342A3 publication Critical patent/WO2008153342A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)

Abstract

The present invention relates to a probe card used in a semiconductor inspection apparatus, in particular, to a probe card including a probe substrate assembly capable of electrically connecting probes inserted into and connected to a probe substrate with a space transformer wholly and accurately. The present invention provides a probe substrate assembly, which a probe in contact with an inspection target is inserted into and connected to, including: a probe substrate through which plural contact holes vertically penetrate; a reinforcing substrate connected with the probe substrate and having an opening which includes plural contact hole arrays; and a probe alignment substrate connected with the reinforcing substrate and through which the plural contact holes vertically penetrate, wherein one end of the probe is inserted into the contact hole of the probe substrate, the opening of the reinforcing substrate and the contact hole of the probe alignment substrate in sequence.
PCT/KR2008/003316 2007-06-13 2008-06-13 Probe substrate assembly WO2008153342A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0058017 2007-06-13
KR1020070058017A KR20080109556A (en) 2007-06-13 2007-06-13 Probe substrate assembly

Publications (2)

Publication Number Publication Date
WO2008153342A2 WO2008153342A2 (en) 2008-12-18
WO2008153342A3 true WO2008153342A3 (en) 2009-02-26

Family

ID=40130323

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/003316 WO2008153342A2 (en) 2007-06-13 2008-06-13 Probe substrate assembly

Country Status (2)

Country Link
KR (1) KR20080109556A (en)
WO (1) WO2008153342A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6235785B2 (en) * 2013-03-18 2017-11-22 日本電子材料株式会社 Probe card guide plate and probe card guide plate manufacturing method
CN106710492A (en) * 2015-07-28 2017-05-24 句容骏成电子有限公司 Small PITCH display screen detection fixture
JP2017201321A (en) * 2017-06-29 2017-11-09 日本電子材料株式会社 Guide plate for probe card and method for manufacturing the guide plate
KR102068699B1 (en) * 2018-08-24 2020-01-21 주식회사 에스디에이 Manufacturing method of MEMS probe for inspecting semiconductor by using laser

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000035647A (en) * 1998-11-27 2000-06-26 오쿠보 마사오 Vertical probe card and the board used by it
KR20060058189A (en) * 2004-11-24 2006-05-29 세크론 주식회사 Structure, contact substrate and method for manufacturing probe
US7102367B2 (en) * 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000035647A (en) * 1998-11-27 2000-06-26 오쿠보 마사오 Vertical probe card and the board used by it
US7102367B2 (en) * 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
KR20060058189A (en) * 2004-11-24 2006-05-29 세크론 주식회사 Structure, contact substrate and method for manufacturing probe

Also Published As

Publication number Publication date
WO2008153342A2 (en) 2008-12-18
KR20080109556A (en) 2008-12-17

Similar Documents

Publication Publication Date Title
WO2010028136A3 (en) Probe block assembly
US9823272B2 (en) Wafer testing probe card
TW200706882A (en) Probe card assembly with a dielectric structure
WO2007008790A3 (en) Probe card assembly with an interchangeable probe insert
WO2009042946A3 (en) Reduced scrub contact element
TW200801527A (en) Probe, testing head having a plurality of probes, and circuit board tester having the testing head
WO2006113708A3 (en) Apparatus and method for managing thermally induced motion of a probe card assembly
CA2611148A1 (en) Methods and devices for controlling the impact of short circuit faults on co-planar electrochemical sensors
ATE557453T1 (en) COAXIAL PLUG
MY154288A (en) Electronics device test set and contact used therein
WO2008051773A3 (en) Probe card assembly with a mechanically decoupled wiring substrate
WO2010056343A8 (en) Fast open circuit detection for open power and ground pins
TW200739086A (en) Space transformer, manufacturing method of the space transformer and probe card having the space transformer
WO2008153342A3 (en) Probe substrate assembly
TW200702665A (en) Socket for inspection apparatus
WO2012173777A3 (en) Probe module with interleaved serpentine test contacts for electronic device testing
WO2010098558A3 (en) Probe block
TW200801526A (en) Multi-layered probes
WO2012006249A3 (en) Testing techniques for through-device vias
HK1175530A1 (en) Analysis appliance for analysis of a sample on a test element
AR079150A1 (en) DETECTION OF THE SOY EVENT AAD-12 416
TW200708745A (en) Connector for measuring electrical resistance, and apparatus and method for measuring electrical resistance of circuit board
TW200709316A (en) Substrate and testing method thereof
TW200801530A (en) Air bridge structures and method of making and using air bridge structures
WO2008042520A3 (en) Probe array wafer

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08766278

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08766278

Country of ref document: EP

Kind code of ref document: A2