TW200745502A - Heat dissipation device for heat pipe - Google Patents
Heat dissipation device for heat pipeInfo
- Publication number
- TW200745502A TW200745502A TW095120637A TW95120637A TW200745502A TW 200745502 A TW200745502 A TW 200745502A TW 095120637 A TW095120637 A TW 095120637A TW 95120637 A TW95120637 A TW 95120637A TW 200745502 A TW200745502 A TW 200745502A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- enclosure
- heat pipe
- dissipation device
- heat dissipation
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation device for heat pipe includes a heat pipe loaded with a working fluid therein. The heat conduction conduit separately contacts with a CPU and an enclosure. The enclosure is made of a material with high heat conductivity. Thus, heat generated by the CPU is conducted to the heat pipe and then to the enclosure so that heat can come into contact with a large quantity of air to be dissipated to outside air rapidly, thereby greatly increasing the heat dissipation efficiency and avoiding a rapid increase in the internal temperature of enclosure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095120637A TW200745502A (en) | 2006-06-09 | 2006-06-09 | Heat dissipation device for heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095120637A TW200745502A (en) | 2006-06-09 | 2006-06-09 | Heat dissipation device for heat pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200745502A true TW200745502A (en) | 2007-12-16 |
TWI302596B TWI302596B (en) | 2008-11-01 |
Family
ID=45070514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095120637A TW200745502A (en) | 2006-06-09 | 2006-06-09 | Heat dissipation device for heat pipe |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200745502A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM441311U (en) * | 2012-06-08 | 2012-11-11 | Leng-Hong Zhang | Casing formed with heat sink combination |
-
2006
- 2006-06-09 TW TW095120637A patent/TW200745502A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI302596B (en) | 2008-11-01 |
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