TW200745264A - Screen printing resin composition - Google Patents

Screen printing resin composition

Info

Publication number
TW200745264A
TW200745264A TW096102701A TW96102701A TW200745264A TW 200745264 A TW200745264 A TW 200745264A TW 096102701 A TW096102701 A TW 096102701A TW 96102701 A TW96102701 A TW 96102701A TW 200745264 A TW200745264 A TW 200745264A
Authority
TW
Taiwan
Prior art keywords
group
integer
resin composition
screen printing
printing resin
Prior art date
Application number
TW096102701A
Other languages
Chinese (zh)
Other versions
TWI399407B (en
Inventor
Hideki Akiba
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200745264A publication Critical patent/TW200745264A/en
Application granted granted Critical
Publication of TWI399407B publication Critical patent/TWI399407B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

To provide a screen printing resin composition which has good screen printability, does not cause mesh fill-in, bleeding and deterioration of the defoamability, can obtain a uniform film thickness, and excels in continuous moldability. The screen printing resin composition comprises (A) 100 pts.mass alkoxysilyl group-containing polyamic acid resin represented by formula (1) [wherein X is a tetravalent organic group; Y is a divalent organic group; Z is a group represented by formula (1-1); R4 is a 1-3C alkyl group; R5 is a 1-3C alkyl group or an alkoxy group; a is an integer of 0-4: p is an integer of 1-300, q is an integer of 1-300; and r is an integer of 1-100], (B) 5-350 pts.mass spherical metal oxide fine particles having an average particle diameter of 0.05-10 μm, and (C) an organic solvent in an amount effective for dissolving the resin of the above (A) component as essential components.
TW96102701A 2006-01-24 2007-01-24 Resin composition for screen printing TWI399407B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006015007A JP4771071B2 (en) 2006-01-24 2006-01-24 Resin composition for screen printing

Publications (2)

Publication Number Publication Date
TW200745264A true TW200745264A (en) 2007-12-16
TWI399407B TWI399407B (en) 2013-06-21

Family

ID=38452429

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96102701A TWI399407B (en) 2006-01-24 2007-01-24 Resin composition for screen printing

Country Status (4)

Country Link
JP (1) JP4771071B2 (en)
KR (1) KR101269820B1 (en)
CN (1) CN101007899B (en)
TW (1) TWI399407B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732082B (en) * 2016-12-26 2021-07-01 日商東麗股份有限公司 Photosensitive resin composition

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101064816B1 (en) * 2009-04-03 2011-09-14 주식회사 두산 Polyamic acid solution, polyimide resin and flexible metal clad laminate using the same
JP5547456B2 (en) * 2009-11-10 2014-07-16 スリーエム イノベイティブ プロパティズ カンパニー One-pack type epoxy resin composition and bonding method using the same
JP5338846B2 (en) * 2011-04-25 2013-11-13 横浜ゴム株式会社 Solar cell collecting electrode forming method, solar cell and solar cell module
CN110408206B (en) * 2019-09-02 2022-05-17 无锡创彩光学材料有限公司 Polyamic acid resin composition, method for preparing the same, and film formed from the same
CN110757972B (en) * 2019-10-11 2021-07-20 扬州虹扬科技发展有限公司 Retreatment process for electronic device with unqualified printed characters

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3731229B2 (en) * 1995-10-20 2006-01-05 チッソ株式会社 Polyamide acid, polyimide film, liquid crystal alignment film using the same, and liquid crystal display element
JP3539633B2 (en) * 2001-01-24 2004-07-07 荒川化学工業株式会社 Alkoxy-containing silane-modified polyamic acid resin composition and polyimide-silica hybrid cured product
JP2003020337A (en) * 2001-07-06 2003-01-24 Nippon Unicar Co Ltd Bisnadimide-polysiloxane alternating copolymer or its derivative and epoxy resin composition for electronic material containing the same
JP2003113338A (en) * 2001-10-03 2003-04-18 Pi R & D Co Ltd Heat-resistant block copolyimide composition for screen printing use and composition of ink using the polyimide and method of forming coating film
JP4599821B2 (en) * 2002-10-09 2010-12-15 宇部興産株式会社 Ink and printed matter that can print fine patterns
JP4276423B2 (en) * 2002-11-13 2009-06-10 トヨタ自動車株式会社 Basic silica powder, method for producing the same, and resin composition
JP2005171208A (en) * 2003-12-15 2005-06-30 Toyota Motor Corp Filler and resin composition
CN1300251C (en) * 2004-03-25 2007-02-14 中国科学院化学研究所 Polyimide film and its prepn process and use

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732082B (en) * 2016-12-26 2021-07-01 日商東麗股份有限公司 Photosensitive resin composition

Also Published As

Publication number Publication date
CN101007899B (en) 2012-05-23
KR101269820B1 (en) 2013-05-30
JP4771071B2 (en) 2011-09-14
KR20070077780A (en) 2007-07-27
JP2007197505A (en) 2007-08-09
CN101007899A (en) 2007-08-01
TWI399407B (en) 2013-06-21

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