TW200744796A - Polishing pad, a polishing apparatus, and a process for using the polishing pad - Google Patents

Polishing pad, a polishing apparatus, and a process for using the polishing pad

Info

Publication number
TW200744796A
TW200744796A TW096108789A TW96108789A TW200744796A TW 200744796 A TW200744796 A TW 200744796A TW 096108789 A TW096108789 A TW 096108789A TW 96108789 A TW96108789 A TW 96108789A TW 200744796 A TW200744796 A TW 200744796A
Authority
TW
Taiwan
Prior art keywords
polishing
pad
polishing pad
layer
opening
Prior art date
Application number
TW096108789A
Other languages
English (en)
Chinese (zh)
Inventor
Brian E Bottema
Stephen F Abraham
Alex P Pamatat
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of TW200744796A publication Critical patent/TW200744796A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW096108789A 2006-03-27 2007-03-14 Polishing pad, a polishing apparatus, and a process for using the polishing pad TW200744796A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/390,292 US7179151B1 (en) 2006-03-27 2006-03-27 Polishing pad, a polishing apparatus, and a process for using the polishing pad

Publications (1)

Publication Number Publication Date
TW200744796A true TW200744796A (en) 2007-12-16

Family

ID=37744898

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108789A TW200744796A (en) 2006-03-27 2007-03-14 Polishing pad, a polishing apparatus, and a process for using the polishing pad

Country Status (6)

Country Link
US (1) US7179151B1 (https=)
JP (1) JP2009531192A (https=)
KR (1) KR20080100277A (https=)
CN (1) CN101400479B (https=)
TW (1) TW200744796A (https=)
WO (1) WO2007120982A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9868185B2 (en) 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7520797B2 (en) * 2005-09-06 2009-04-21 Freescale Semiconductor, Inc. Platen endpoint window with pressure relief
US7534162B2 (en) * 2005-09-06 2009-05-19 Freescale Semiconductor, Inc. Grooved platen with channels or pathway to ambient air
US7497763B2 (en) * 2006-03-27 2009-03-03 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
DE102010011470B9 (de) * 2010-03-09 2016-09-29 Nagel Maschinen- Und Werkzeugfabrik Gmbh Verfahren und Vorrichtung zur messungsunterstützten Feinbearbeitung von Werkstückoberflächen sowie Messsystem
JP5526911B2 (ja) * 2010-03-25 2014-06-18 東レ株式会社 研磨パッド
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
JP2014113644A (ja) * 2012-12-06 2014-06-26 Toyo Tire & Rubber Co Ltd 研磨パッド
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
US11072050B2 (en) * 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
KR101890331B1 (ko) * 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
CN109202693B (zh) * 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法
JP7041638B2 (ja) * 2019-01-10 2022-03-24 株式会社荏原製作所 研磨装置
US20220226956A1 (en) * 2021-01-15 2022-07-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacture of polishing pads having two or more endpoint detection windows
US20220305613A1 (en) * 2021-03-26 2022-09-29 Applied Materials, Inc. Controlled profile polishing platen
KR20240025694A (ko) * 2021-07-06 2024-02-27 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 음향 윈도우를 포함하는 연마 패드

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US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5461007A (en) 1994-06-02 1995-10-24 Motorola, Inc. Process for polishing and analyzing a layer over a patterned semiconductor substrate
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6323046B1 (en) * 1998-08-25 2001-11-27 Micron Technology, Inc. Method and apparatus for endpointing a chemical-mechanical planarization process
US6280289B1 (en) * 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
JP2001062703A (ja) * 1999-08-27 2001-03-13 Asahi Chem Ind Co Ltd 多孔性樹脂窓付き研磨パッド
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
JP2001110762A (ja) * 1999-10-04 2001-04-20 Asahi Kasei Corp 研磨パッド
JP3826728B2 (ja) * 2001-04-25 2006-09-27 Ｊｓｒ株式会社 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
US6599765B1 (en) 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
US6937915B1 (en) * 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
CN1302522C (zh) * 2002-05-15 2007-02-28 旺宏电子股份有限公司 一种化学机械抛光装置的终点侦测系统
JP3988611B2 (ja) * 2002-10-09 2007-10-10 Ｊｓｒ株式会社 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US7132033B2 (en) * 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9868185B2 (en) 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
TWI632986B (zh) * 2015-11-03 2018-08-21 Cabot Microelectronics Corporation 具有基礎層及附著於其上之窗之拋光墊

Also Published As

Publication number Publication date
CN101400479B (zh) 2010-12-15
CN101400479A (zh) 2009-04-01
KR20080100277A (ko) 2008-11-14
WO2007120982A3 (en) 2008-10-02
JP2009531192A (ja) 2009-09-03
WO2007120982A2 (en) 2007-10-25
US7179151B1 (en) 2007-02-20

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