TW200741939A - Substrate placing stand and substrate treatment apparatus - Google Patents

Substrate placing stand and substrate treatment apparatus

Info

Publication number
TW200741939A
TW200741939A TW096108977A TW96108977A TW200741939A TW 200741939 A TW200741939 A TW 200741939A TW 096108977 A TW096108977 A TW 096108977A TW 96108977 A TW96108977 A TW 96108977A TW 200741939 A TW200741939 A TW 200741939A
Authority
TW
Taiwan
Prior art keywords
substrate
placing stand
main body
stand main
pin
Prior art date
Application number
TW096108977A
Other languages
Chinese (zh)
Other versions
TWI434363B (en
Inventor
Joichi Ushioda
Takeshi Ito
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200741939A publication Critical patent/TW200741939A/en
Application granted granted Critical
Publication of TWI434363B publication Critical patent/TWI434363B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

To provide a substrate placing stand hardly causing a damage to a placing stand main body due to up-and-down pins. The substrate placing stand 4 for placing a substrate in substrate treatment is provided with the placing stand main body 4a and the up-and-down pins 30 which are inserted vertically with respect to the placing stand main body 4a, are disposed freely vertically movably so as to project and withdraw with respect to the surface of the placing stand main body 4a and moves vertically the substrate while supporting the substrate with top ends of the pins. Each of the up-and-down pins 30 can take a withdrawal position into which the pin withdraws and a support position at which the pin supports the substrate G by being projected from the placing stand main body 4a and, in the support position, the pin has a breaking part 35 which breaks when a force in the lateral direction having a prescribed extent less than such a force as to deform the up-and-down pin 30 is applied on the surface position of the placing stand main body 4a or on the upper side position thereof.
TW096108977A 2006-03-16 2007-03-15 A substrate stage and a substrate processing device TWI434363B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006073288 2006-03-16
JP2007008862A JP5219377B2 (en) 2006-03-16 2007-01-18 Substrate mounting table and substrate processing apparatus

Publications (2)

Publication Number Publication Date
TW200741939A true TW200741939A (en) 2007-11-01
TWI434363B TWI434363B (en) 2014-04-11

Family

ID=38679435

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108977A TWI434363B (en) 2006-03-16 2007-03-15 A substrate stage and a substrate processing device

Country Status (3)

Country Link
JP (1) JP5219377B2 (en)
KR (1) KR100854802B1 (en)
TW (1) TWI434363B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576956B (en) * 2014-01-20 2017-04-01 Ａｓｍｌ荷蘭公司 Substrate holder, support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
CN110473759A (en) * 2018-05-10 2019-11-19 东京毅力科创株式会社 Mounting table and plasma processing apparatus
TWI800573B (en) * 2017-12-21 2023-05-01 日商東京威力科創股份有限公司 Substrate support member, substrate processing device, and substrate transfer device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4482535B2 (en) * 2006-03-24 2010-06-16 日本碍子株式会社 Heating device
KR102411747B1 (en) * 2013-10-30 2022-06-22 가부시키가이샤 니콘 Substrate-holding apparatus, exposure apparatus, and device manufacturing method
CN103811332B (en) * 2014-02-14 2016-05-25 北京京东方显示技术有限公司 A kind of lower electrode base station and dry etching equipment of dry etching equipment
KR101738986B1 (en) * 2015-12-07 2017-05-24 주식회사 디엠에스 Substrate Processing Apparatus including Lift pin assembly
JP6592394B2 (en) * 2016-04-21 2019-10-16 東京エレクトロン株式会社 Maintenance method of plasma processing apparatus
KR102030471B1 (en) 2017-07-25 2019-10-14 세메스 주식회사 Lift pin unit and Unit for supporting substrate
US10784142B2 (en) 2018-01-09 2020-09-22 Varian Semiconductor Equipment Associates, Inc. Lift pin system for wafer handling
KR20210054112A (en) * 2019-11-04 2021-05-13 삼성디스플레이 주식회사 Deposition apparatus and method of processing substrate using the same
JP2024014096A (en) 2022-07-21 2024-02-01 東京エレクトロン株式会社 Board support structure and substrate processing apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4490524B2 (en) * 1999-08-10 2010-06-30 キヤノンアネルバ株式会社 Electrostatic adsorption stage and substrate processing apparatus
JP2002093890A (en) * 2000-09-19 2002-03-29 Olympus Optical Co Ltd Lift pin and stage device
KR20040031289A (en) * 2002-10-04 2004-04-13 삼성전자주식회사 Wafer lifting device of semiconductor manufacturing equipment
JP4594020B2 (en) * 2004-07-29 2010-12-08 京セラ株式会社 Pin elevator and plate chuck device using the same
KR20060130966A (en) * 2005-06-14 2006-12-20 삼성전자주식회사 A lift pin

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576956B (en) * 2014-01-20 2017-04-01 Ａｓｍｌ荷蘭公司 Substrate holder, support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
TWI800573B (en) * 2017-12-21 2023-05-01 日商東京威力科創股份有限公司 Substrate support member, substrate processing device, and substrate transfer device
CN110473759A (en) * 2018-05-10 2019-11-19 东京毅力科创株式会社 Mounting table and plasma processing apparatus
CN110473759B (en) * 2018-05-10 2024-04-16 东京毅力科创株式会社 Stage and plasma processing apparatus

Also Published As

Publication number Publication date
JP5219377B2 (en) 2013-06-26
JP2007277702A (en) 2007-10-25
TWI434363B (en) 2014-04-11
KR100854802B1 (en) 2008-08-27
KR20070094503A (en) 2007-09-20

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