TW200741834A - Systems and methods for drying a rotating substrate - Google Patents

Systems and methods for drying a rotating substrate

Info

Publication number
TW200741834A
TW200741834A TW096101976A TW96101976A TW200741834A TW 200741834 A TW200741834 A TW 200741834A TW 096101976 A TW096101976 A TW 096101976A TW 96101976 A TW96101976 A TW 96101976A TW 200741834 A TW200741834 A TW 200741834A
Authority
TW
Taiwan
Prior art keywords
dispenser
liquid
substrate
drying fluid
drying
Prior art date
Application number
TW096101976A
Other languages
Chinese (zh)
Other versions
TWI467640B (en
Inventor
Ismail Kashkoush
Han-Joo Lee
Zhi Lewis Liu
Original Assignee
Akrion Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akrion Technologies Inc filed Critical Akrion Technologies Inc
Publication of TW200741834A publication Critical patent/TW200741834A/en
Application granted granted Critical
Publication of TWI467640B publication Critical patent/TWI467640B/en

Links

Landscapes

  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A method of drying a surface of a substrate is provided. The method includes supporting and rotating a substrate; applying a liquid to the substrate surface at or near a rotational center point via a liquid dispenser (so that a film of the liquid is formed on the surface); applying a drying fluid to the substrate surface at a predetermined distance from the rotational center point via one or more drying fluid dispensers; and manipulating the drying fluid dispenser(s) so that the location at which the drying fluid is applied to the substrate is moved in a direction toward the rotational center point, while at the same time manipulating the liquid dispenser so that the location at which the liquid is applied to the substrate is moved in a direction outward from the rotational center point. The liquid dispenser and drying fluid dispenser(s) noted above can be located on and/or within an assembly. The assembly can include a first dispenser, a second dispenser, and a third dispenser. The first dispenser supplies liquid while the second and third dispensers supply drying fluid, where the second dispenser has a larger opening than the third dispenser. The second and third dispensers are positioned on the assembly next to one another and spaced from the first dispenser. Further, the second dispenser is located between the third dispenser and the first dispenser, such that the first dispenser is capable of linearly leading the second and third dispensers during movement.
TW96101976A 2006-01-18 2007-01-18 Systems and methods for drying a rotating substrate TWI467640B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75994806P 2006-01-18 2006-01-18
US83948706P 2006-08-23 2006-08-23

Publications (2)

Publication Number Publication Date
TW200741834A true TW200741834A (en) 2007-11-01
TWI467640B TWI467640B (en) 2015-01-01

Family

ID=52784738

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96101976A TWI467640B (en) 2006-01-18 2007-01-18 Systems and methods for drying a rotating substrate

Country Status (1)

Country Link
TW (1) TWI467640B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6938248B2 (en) * 2017-07-04 2021-09-22 東京エレクトロン株式会社 Substrate processing equipment, substrate processing method and storage medium

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4989345A (en) * 1989-12-18 1991-02-05 Gill Jr Gerald L Centrifugal spin dryer for semiconductor wafer
US6247479B1 (en) * 1997-05-27 2001-06-19 Tokyo Electron Limited Washing/drying process apparatus and washing/drying process method

Also Published As

Publication number Publication date
TWI467640B (en) 2015-01-01

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