TW200741024A - Substrate holding apparatus - Google Patents

Substrate holding apparatus

Info

Publication number
TW200741024A
TW200741024A TW096108679A TW96108679A TW200741024A TW 200741024 A TW200741024 A TW 200741024A TW 096108679 A TW096108679 A TW 096108679A TW 96108679 A TW96108679 A TW 96108679A TW 200741024 A TW200741024 A TW 200741024A
Authority
TW
Taiwan
Prior art keywords
holding apparatus
substrate holding
drive member
drive
film forming
Prior art date
Application number
TW096108679A
Other languages
Chinese (zh)
Inventor
Kouichi Nose
Koichi Sasagawa
Yasuhiro Koizumi
Yasukuni Iwasaki
Original Assignee
Shinmaywa Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinmaywa Ind Ltd filed Critical Shinmaywa Ind Ltd
Publication of TW200741024A publication Critical patent/TW200741024A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

A substrate holding apparatus (10) is provided to be used for a vacuum film forming tank (1). The substrate holding apparatus is provided with a drive source (14) arranged outside the vacuum film forming tank (1); a drive member (13) which is attached to the drive source (14) and airtightly and slidably arranged on the vacuum film forming tank (1); and a substrate holder (11) which is attached to the drive member (13) and has substantially circular outer circumference in plain view and a flat plate shape in side plain view. The drive source (14) reciprocates the drive member (13) by transmitting drive force to the drive member (13) and swings the substrate holder (11) in the thickness direction without rotating the holder.
TW096108679A 2006-03-27 2007-03-14 Substrate holding apparatus TW200741024A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006085695A JP2007262445A (en) 2006-03-27 2006-03-27 Base material holding device

Publications (1)

Publication Number Publication Date
TW200741024A true TW200741024A (en) 2007-11-01

Family

ID=38541021

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108679A TW200741024A (en) 2006-03-27 2007-03-14 Substrate holding apparatus

Country Status (3)

Country Link
JP (1) JP2007262445A (en)
TW (1) TW200741024A (en)
WO (1) WO2007111097A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7134009B2 (en) * 2018-07-31 2022-09-09 東京エレクトロン株式会社 Film forming apparatus and film forming method
CN111041445B (en) * 2019-12-26 2024-07-12 北京大学深圳研究院 Multidirectional rotating device for physical vapor deposition of surface coating of threaded part

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270568A (en) * 1985-09-25 1987-04-01 Hitachi Ltd Sputtering method
JPH01168551U (en) * 1988-05-16 1989-11-28
JPH05295540A (en) * 1992-04-21 1993-11-09 Shimadzu Corp Vacuum film forming device
JPH0925574A (en) * 1995-07-07 1997-01-28 Nissin Electric Co Ltd Base body holder
JP3623292B2 (en) * 1995-11-21 2005-02-23 株式会社アルバック Substrate tilt revolution device for vacuum deposition

Also Published As

Publication number Publication date
JP2007262445A (en) 2007-10-11
WO2007111097A1 (en) 2007-10-04

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