TW200741019A - Copper alloy having excellent hot workability and its production method - Google Patents

Copper alloy having excellent hot workability and its production method

Info

Publication number
TW200741019A
TW200741019A TW096108678A TW96108678A TW200741019A TW 200741019 A TW200741019 A TW 200741019A TW 096108678 A TW096108678 A TW 096108678A TW 96108678 A TW96108678 A TW 96108678A TW 200741019 A TW200741019 A TW 200741019A
Authority
TW
Taiwan
Prior art keywords
copper alloy
precipitate
hot workability
excellent hot
alloy
Prior art date
Application number
TW096108678A
Other languages
English (en)
Other versions
TWI351439B (zh
Inventor
Masatoshi Eto
Satoru Endou
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006100338A external-priority patent/JP4937628B2/ja
Priority claimed from JP2006233750A external-priority patent/JP2008056974A/ja
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of TW200741019A publication Critical patent/TW200741019A/zh
Application granted granted Critical
Publication of TWI351439B publication Critical patent/TWI351439B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/40Electric properties
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C2202/00Physical properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
TW096108678A 2006-03-31 2007-03-14 Copper alloy having excellent hot workability and its production method TW200741019A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006100338A JP4937628B2 (ja) 2006-03-31 2006-03-31 熱間加工性に優れた銅合金
JP2006233750A JP2008056974A (ja) 2006-08-30 2006-08-30 熱間加工性に優れた銅合金

Publications (2)

Publication Number Publication Date
TW200741019A true TW200741019A (en) 2007-11-01
TWI351439B TWI351439B (zh) 2011-11-01

Family

ID=38804499

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108678A TW200741019A (en) 2006-03-31 2007-03-14 Copper alloy having excellent hot workability and its production method

Country Status (2)

Country Link
KR (1) KR100885825B1 (zh)
TW (1) TW200741019A (zh)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0718356A (ja) * 1993-07-01 1995-01-20 Mitsubishi Electric Corp 電子機器用銅合金、その製造方法およびicリードフレーム
JP3379380B2 (ja) 1997-04-23 2003-02-24 日立電線株式会社 高強度・高導電性銅合金
JP2004307905A (ja) * 2003-04-03 2004-11-04 Sumitomo Metal Ind Ltd Cu合金およびその製造方法

Also Published As

Publication number Publication date
KR100885825B1 (ko) 2009-02-26
TWI351439B (zh) 2011-11-01
KR20070098646A (ko) 2007-10-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees