TW200740343A - Optoelectronic module - Google Patents

Optoelectronic module

Info

Publication number
TW200740343A
TW200740343A TW096107495A TW96107495A TW200740343A TW 200740343 A TW200740343 A TW 200740343A TW 096107495 A TW096107495 A TW 096107495A TW 96107495 A TW96107495 A TW 96107495A TW 200740343 A TW200740343 A TW 200740343A
Authority
TW
Taiwan
Prior art keywords
terminal
optoelectronic module
optoelectronic component
carrier
optoelectronic
Prior art date
Application number
TW096107495A
Other languages
English (en)
Chinese (zh)
Inventor
Antonio Ceschel
Michele Tiso
Original Assignee
Patent Treuhand Ges Fuer Elek Sche Gluehlampen M B H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Patent Treuhand Ges Fuer Elek Sche Gluehlampen M B H filed Critical Patent Treuhand Ges Fuer Elek Sche Gluehlampen M B H
Publication of TW200740343A publication Critical patent/TW200740343A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
TW096107495A 2006-03-07 2007-03-05 Optoelectronic module TW200740343A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006010802A DE102006010802A1 (de) 2006-03-07 2006-03-07 Optoelektronisches Modul

Publications (1)

Publication Number Publication Date
TW200740343A true TW200740343A (en) 2007-10-16

Family

ID=38220286

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107495A TW200740343A (en) 2006-03-07 2007-03-05 Optoelectronic module

Country Status (3)

Country Link
DE (1) DE102006010802A1 (de)
TW (1) TW200740343A (de)
WO (1) WO2007101825A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012089275A1 (en) * 2010-12-30 2012-07-05 Option Wireless Limited Multi board module with implant
DE102018111554A1 (de) * 2018-05-15 2019-11-21 HELLA GmbH & Co. KGaA Leiterplattenaufbau zur Aufnahme wenigstens eines Halbleiterleuchtmittels

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02216891A (ja) * 1989-02-16 1990-08-29 Nec Corp 回路基板の接続方法
DE19748005A1 (de) * 1997-10-30 1999-05-20 Siemens Ag Anordnung zum Übertragen von elektrischen Signalen zwischen einem auf einer Trägerplatte thermisch isoliertem Modul und angrenzenden Nachbarmodulen
JP2004146540A (ja) * 2002-10-23 2004-05-20 Denso Corp 接続型回路基板ならびに製造方法

Also Published As

Publication number Publication date
DE102006010802A1 (de) 2007-09-13
WO2007101825A1 (de) 2007-09-13

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