TW200739960A - Method of producing light emitting apparatus - Google Patents

Method of producing light emitting apparatus

Info

Publication number
TW200739960A
TW200739960A TW096102054A TW96102054A TW200739960A TW 200739960 A TW200739960 A TW 200739960A TW 096102054 A TW096102054 A TW 096102054A TW 96102054 A TW96102054 A TW 96102054A TW 200739960 A TW200739960 A TW 200739960A
Authority
TW
Taiwan
Prior art keywords
light emitting
fluorescent
substance
containing resin
emitting element
Prior art date
Application number
TW096102054A
Other languages
English (en)
Inventor
Yuichi Taguchi
Masahiro Sunohara
Hideaki Sakaguchi
Akinori Shiraishi
Naoyuki Koizumi
Murayama Kei
Higashi Mitsutoshi
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200739960A publication Critical patent/TW200739960A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
TW096102054A 2006-01-24 2007-01-19 Method of producing light emitting apparatus TW200739960A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006015449A JP4749870B2 (ja) 2006-01-24 2006-01-24 発光装置の製造方法

Publications (1)

Publication Number Publication Date
TW200739960A true TW200739960A (en) 2007-10-16

Family

ID=37897376

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102054A TW200739960A (en) 2006-01-24 2007-01-19 Method of producing light emitting apparatus

Country Status (5)

Country Link
US (1) US7708613B2 (zh)
EP (1) EP1811581A3 (zh)
JP (1) JP4749870B2 (zh)
KR (1) KR20070077777A (zh)
TW (1) TW200739960A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102334205A (zh) * 2008-12-23 2012-01-25 克里公司 晶片级白色发光二极管的颜色校正
TWI460893B (zh) * 2010-09-28 2014-11-11 Advanced Optoelectronic Tech 發光二極體封裝基板及發光二極體封裝結構之形成方法
TWI476946B (zh) * 2008-10-15 2015-03-11 Visera Technologies Co Ltd 發光二極體裝置及其製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080035942A1 (en) * 2006-08-08 2008-02-14 Lg Electronics Inc. Light emitting device package and method for manufacturing the same
JP2008205170A (ja) * 2007-02-20 2008-09-04 Nec Lighting Ltd 発光半導体デバイス
JP5137059B2 (ja) * 2007-06-20 2013-02-06 新光電気工業株式会社 電子部品用パッケージ及びその製造方法と電子部品装置
DE102007046348A1 (de) * 2007-09-27 2009-04-02 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement mit Glasabdeckung und Verfahren zu dessen Herstellung
KR101226777B1 (ko) * 2008-03-25 2013-01-25 가부시끼가이샤 도시바 발광 장치와, 그 제조 방법 및 장치
US20110266580A1 (en) * 2009-01-21 2011-11-03 Koninklijke Philips Electronics N.V. Light source comprising a light recycling device and corresponding light recycling device
US8154183B2 (en) * 2010-03-04 2012-04-10 General Electric Company Mitigating shorting risks in encapsulated organic light emitting devices (OLEDs)
CN101937965A (zh) * 2010-08-30 2011-01-05 深圳市易特照明有限公司 一种诱发白光led
KR102224848B1 (ko) 2014-10-06 2021-03-08 삼성전자주식회사 발광 소자 패키지 제조 방법
JP6394649B2 (ja) * 2016-06-30 2018-09-26 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29820384U1 (de) * 1998-11-06 1999-01-14 Opto System Gmbh Leucht- oder Anzeigeelement mit mischfarbigen, insbesondere weißem Licht
TW490863B (en) * 2001-02-12 2002-06-11 Arima Optoelectronics Corp Manufacturing method of LED with uniform color temperature
JP2002344029A (ja) * 2001-05-17 2002-11-29 Rohm Co Ltd 発光ダイオードの色調調整方法
JP2003110146A (ja) 2001-07-26 2003-04-11 Matsushita Electric Works Ltd 発光装置
JP4003866B2 (ja) * 2001-12-04 2007-11-07 シチズン電子株式会社 表面実装型発光ダイオード及びその製造方法
JP4280050B2 (ja) * 2002-10-07 2009-06-17 シチズン電子株式会社 白色発光装置
US7038370B2 (en) * 2003-03-17 2006-05-02 Lumileds Lighting, U.S., Llc Phosphor converted light emitting device
US7029935B2 (en) * 2003-09-09 2006-04-18 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
KR20070058380A (ko) * 2004-04-23 2007-06-08 라이트 프리스크립션즈 이노베이터즈, 엘엘씨 발광 다이오드를 위한 광학 매니폴드
JP2005340512A (ja) * 2004-05-27 2005-12-08 Fujikura Ltd 発光装置及び発光装置製造方法
US7842526B2 (en) * 2004-09-09 2010-11-30 Toyoda Gosei Co., Ltd. Light emitting device and method of producing same
JP2006135225A (ja) * 2004-11-09 2006-05-25 Toshiba Corp 発光装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI476946B (zh) * 2008-10-15 2015-03-11 Visera Technologies Co Ltd 發光二極體裝置及其製造方法
CN102334205A (zh) * 2008-12-23 2012-01-25 克里公司 晶片级白色发光二极管的颜色校正
CN102334205B (zh) * 2008-12-23 2015-06-17 克里公司 晶片级白色发光二极管的颜色校正
TWI460893B (zh) * 2010-09-28 2014-11-11 Advanced Optoelectronic Tech 發光二極體封裝基板及發光二極體封裝結構之形成方法

Also Published As

Publication number Publication date
JP2007201010A (ja) 2007-08-09
JP4749870B2 (ja) 2011-08-17
KR20070077777A (ko) 2007-07-27
US7708613B2 (en) 2010-05-04
EP1811581A3 (en) 2010-01-20
US20070173165A1 (en) 2007-07-26
EP1811581A2 (en) 2007-07-25

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