TW200739577A - Electrocast, stamper, manufacturing method of base - Google Patents
Electrocast, stamper, manufacturing method of baseInfo
- Publication number
- TW200739577A TW200739577A TW095140582A TW95140582A TW200739577A TW 200739577 A TW200739577 A TW 200739577A TW 095140582 A TW095140582 A TW 095140582A TW 95140582 A TW95140582 A TW 95140582A TW 200739577 A TW200739577 A TW 200739577A
- Authority
- TW
- Taiwan
- Prior art keywords
- plated film
- less
- electrocast
- stamper
- electrocasting
- Prior art date
Links
Landscapes
- Manufacturing Optical Record Carriers (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
To provide an electrocast and a stamper excellent in durability and less deformation. A conductor film 16 is formed by sputtering on a fine pattern formed on a glass original plate 15, and a plated film 17 is made of nickel by electrocasting. When forming this plated film 17, the electrocasting conditions (for example, electric current density) are adjusted for the nickel crystals composing the plated film 17 so that the crystallite size of a largest one regarded as a single crystal is 50 nm or smaller, the average particle diameter is 170 μm or less in the crystal growth direction (thickness direction), and that in the direction perpendicularly crossing the crystal growth direction (plane direction) is 10 μm or less.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005367007A JP2007172712A (en) | 2005-12-20 | 2005-12-20 | Electrocast, stamper, manufacturing method of base |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200739577A true TW200739577A (en) | 2007-10-16 |
Family
ID=38299078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095140582A TW200739577A (en) | 2005-12-20 | 2006-11-02 | Electrocast, stamper, manufacturing method of base |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2007172712A (en) |
TW (1) | TW200739577A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110724978A (en) * | 2018-07-17 | 2020-01-24 | 精工电子有限公司 | Electroformed component and timepiece |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5665169B2 (en) * | 2010-03-19 | 2015-02-04 | 学校法人早稲田大学 | Mold manufacturing method and mold formed by the method |
JP2011194721A (en) * | 2010-03-19 | 2011-10-06 | Waseda Univ | Mold manufacturing apparatus |
-
2005
- 2005-12-20 JP JP2005367007A patent/JP2007172712A/en not_active Withdrawn
-
2006
- 2006-11-02 TW TW095140582A patent/TW200739577A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110724978A (en) * | 2018-07-17 | 2020-01-24 | 精工电子有限公司 | Electroformed component and timepiece |
Also Published As
Publication number | Publication date |
---|---|
JP2007172712A (en) | 2007-07-05 |
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