TW200738388A - Device for cutting glass piece and method for the same - Google Patents

Device for cutting glass piece and method for the same

Info

Publication number
TW200738388A
TW200738388A TW095113068A TW95113068A TW200738388A TW 200738388 A TW200738388 A TW 200738388A TW 095113068 A TW095113068 A TW 095113068A TW 95113068 A TW95113068 A TW 95113068A TW 200738388 A TW200738388 A TW 200738388A
Authority
TW
Taiwan
Prior art keywords
laser beam
glass piece
cutting
upper reflector
same
Prior art date
Application number
TW095113068A
Other languages
Chinese (zh)
Other versions
TWI324544B (en
Inventor
Shr-Ju Huang
Ren-Yan Weng
Chin-Tzung Chang
Jiue-Liang Shiu
Jin-Rei Hsu
Jr-Ping Yin
Original Assignee
Chung Shan Inst Of Science
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chung Shan Inst Of Science filed Critical Chung Shan Inst Of Science
Priority to TW095113068A priority Critical patent/TW200738388A/en
Publication of TW200738388A publication Critical patent/TW200738388A/en
Application granted granted Critical
Publication of TWI324544B publication Critical patent/TWI324544B/zh

Links

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  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)

Abstract

This invention relates to a device for cutting a glass piece and a method for the same. The device comprises a lower reflector plate, an upper reflector plate and a laser beam. The laser beam is reflected from the upper reflector plate to the lower reflector so that the laser beam oscillates between the lower and upper reflector plates and forms a beam passage. A cross section of the beam passage forms a first symmetrical pattern, of which a symmetrical axis is a first characteristic axis. The method for cutting glass piece of this invention comprises emitting a laser beam so that the laser beam oscillates between the lower and upper reflector plates and then adjusting the direction of the first characteristic axis. Since the crack resulted by the thermal stress in the glass piece almost corresponds to the cutting path, cutting speed is increased.
TW095113068A 2006-04-12 2006-04-12 Device for cutting glass piece and method for the same TW200738388A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095113068A TW200738388A (en) 2006-04-12 2006-04-12 Device for cutting glass piece and method for the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095113068A TW200738388A (en) 2006-04-12 2006-04-12 Device for cutting glass piece and method for the same

Publications (2)

Publication Number Publication Date
TW200738388A true TW200738388A (en) 2007-10-16
TWI324544B TWI324544B (en) 2010-05-11

Family

ID=45074180

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113068A TW200738388A (en) 2006-04-12 2006-04-12 Device for cutting glass piece and method for the same

Country Status (1)

Country Link
TW (1) TW200738388A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101513692B (en) * 2008-02-21 2011-09-07 富士迈半导体精密工业（上海）有限公司 Method for cutting brittle materials by laser and device
US8497451B2 (en) 2007-12-24 2013-07-30 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Brittle nonmetallic workpiece and method and device for making same
TWI488703B (en) * 2011-11-25 2015-06-21 Mitsuboshi Diamond Ind Co Ltd Scribing method and scribing apparatus for substrate of brittle material

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8887529B2 (en) * 2010-10-29 2014-11-18 Corning Incorporated Method and apparatus for cutting glass ribbon
US9278878B2 (en) * 2011-02-23 2016-03-08 Corning Incorporated Methods and apparatus for scoring thin glass
US9422184B2 (en) * 2011-09-15 2016-08-23 Nippon Electric Glass Co., Ltd. Cutting method for glass sheet and glass sheet cutting apparatus
TW201338902A (en) * 2012-03-29 2013-10-01 Mitsuboshi Diamond Ind Co Ltd Laser processing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8497451B2 (en) 2007-12-24 2013-07-30 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Brittle nonmetallic workpiece and method and device for making same
CN101513692B (en) * 2008-02-21 2011-09-07 富士迈半导体精密工业（上海）有限公司 Method for cutting brittle materials by laser and device
TWI488703B (en) * 2011-11-25 2015-06-21 Mitsuboshi Diamond Ind Co Ltd Scribing method and scribing apparatus for substrate of brittle material

Also Published As

Publication number Publication date
TWI324544B (en) 2010-05-11

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