TW200737641A - Mounting structure providing electrical surge protection - Google Patents

Mounting structure providing electrical surge protection

Info

Publication number
TW200737641A
TW200737641A TW095149295A TW95149295A TW200737641A TW 200737641 A TW200737641 A TW 200737641A TW 095149295 A TW095149295 A TW 095149295A TW 95149295 A TW95149295 A TW 95149295A TW 200737641 A TW200737641 A TW 200737641A
Authority
TW
Taiwan
Prior art keywords
mounting structure
electrical surge
surge protection
providing electrical
structure providing
Prior art date
Application number
TW095149295A
Other languages
English (en)
Other versions
TWI350041B (en
Inventor
Bilenko Yuriy
Gaska Remigijus
Shur Michael
Simin Grigory
Original Assignee
Sensor Electric Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensor Electric Technology filed Critical Sensor Electric Technology
Publication of TW200737641A publication Critical patent/TW200737641A/zh
Application granted granted Critical
Publication of TWI350041B publication Critical patent/TWI350041B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Power Conversion In General (AREA)
TW095149295A 2005-12-29 2006-12-27 Mounting structure providing electrical surge protection and associated circuit and circuit manufacturing method TWI350041B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75499205P 2005-12-29 2005-12-29
US11/465,241 US8030575B2 (en) 2005-12-29 2006-08-17 Mounting structure providing electrical surge protection

Publications (2)

Publication Number Publication Date
TW200737641A true TW200737641A (en) 2007-10-01
TWI350041B TWI350041B (en) 2011-10-01

Family

ID=38223194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149295A TWI350041B (en) 2005-12-29 2006-12-27 Mounting structure providing electrical surge protection and associated circuit and circuit manufacturing method

Country Status (6)

Country Link
US (1) US8030575B2 (zh)
EP (1) EP1974591A4 (zh)
JP (1) JP4902670B2 (zh)
KR (1) KR101115125B1 (zh)
TW (1) TWI350041B (zh)
WO (1) WO2007078349A2 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100926262B1 (ko) * 2009-06-09 2009-11-12 (주)동일캔바스엔지니어링 전기탈수기의 누설전류 차단장치
US8907322B2 (en) 2010-06-18 2014-12-09 Sensor Electronic Technology, Inc. Deep ultraviolet light emitting diode
US9806226B2 (en) 2010-06-18 2017-10-31 Sensor Electronic Technology, Inc. Deep ultraviolet light emitting diode
US8927959B2 (en) 2010-06-18 2015-01-06 Sensor Electronic Technology, Inc. Deep ultraviolet light emitting diode
KR102085897B1 (ko) 2013-06-10 2020-03-06 엘지이노텍 주식회사 발광 소자 및 발광 소자 패키지
US10126347B2 (en) * 2016-12-29 2018-11-13 Infineon Technologies Ag Passive bridge circuit with oxide windows as leakage sink

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BE545324A (zh) * 1955-02-18
US5345134A (en) * 1988-06-29 1994-09-06 Raytheon Company Saw device and method of manufacture
US5476714A (en) * 1988-11-18 1995-12-19 G & H Technology, Inc. Electrical overstress pulse protection
US5260848A (en) * 1990-07-27 1993-11-09 Electromer Corporation Foldback switching material and devices
GB9021222D0 (en) * 1990-09-28 1990-11-14 Raychem Ltd Circuit protection device
JPH0569902A (ja) * 1991-09-11 1993-03-23 Matsushita Electric Ind Co Ltd フイルム用パツク装置
US5278535A (en) * 1992-08-11 1994-01-11 G&H Technology, Inc. Electrical overstress pulse protection
FR2717308B1 (fr) * 1994-03-14 1996-07-26 Sgs Thomson Microelectronics Dispositif de protection contre des surtensions dans des circuits intégrés.
DE69528833T2 (de) * 1994-07-14 2003-08-28 Surgx Corp Verfahren zur herstellung von ein- und mehrschicht-schutzvorrichtungen gegen veränderliche spannung
JPH0898401A (ja) * 1994-09-21 1996-04-12 Nissin Electric Co Ltd サージ保護回路
KR100219080B1 (ko) * 1996-08-09 1999-09-01 김영환 반도체 장치의 패키지용 리드프레임 및 반도체 장치
US7301748B2 (en) * 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
JP3658597B2 (ja) * 1997-11-21 2005-06-08 エス・オー・シー株式会社 サージ保護装置
JP3633297B2 (ja) 1998-07-31 2005-03-30 松下電器産業株式会社 サージ保護装置及び方法
US6549114B2 (en) * 1998-08-20 2003-04-15 Littelfuse, Inc. Protection of electrical devices with voltage variable materials
JP2000208822A (ja) * 1999-01-11 2000-07-28 Matsushita Electronics Industry Corp 半導体発光装置
WO2001017320A1 (en) * 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US6486499B1 (en) 1999-12-22 2002-11-26 Lumileds Lighting U.S., Llc III-nitride light-emitting device with increased light generating capability
JP3686569B2 (ja) 2000-03-02 2005-08-24 シャープ株式会社 半導体発光装置及びそれを用いた表示装置
DE10392524B4 (de) * 2002-04-08 2008-08-07 OTC Littelfuse, Inc., Des Plaines Vorrichtungen mit spannungsvariablem Material zur direkten Anwendung
JP3509809B2 (ja) 2002-04-30 2004-03-22 住友電気工業株式会社 サブマウントおよび半導体装置
JP2004127988A (ja) * 2002-09-30 2004-04-22 Toyoda Gosei Co Ltd 白色発光装置
TW577184B (en) * 2002-12-26 2004-02-21 Epistar Corp Light emitting layer having voltage/resistance interdependent layer
US6981319B2 (en) * 2003-02-13 2006-01-03 Shrier Karen P Method of manufacturing devices to protect election components
TW587346B (en) 2003-03-28 2004-05-11 United Epitaxy Co Ltd Optoelectronic device made by semiconductor compound
US6876008B2 (en) * 2003-07-31 2005-04-05 Lumileds Lighting U.S., Llc Mount for semiconductor light emitting device
TWI223900B (en) * 2003-07-31 2004-11-11 United Epitaxy Co Ltd ESD protection configuration and method for light emitting diodes
US7296913B2 (en) * 2004-07-16 2007-11-20 Technology Assessment Group Light emitting diode replacement lamp
TWI239626B (en) 2004-01-13 2005-09-11 Concord Semiconductor Corp Structure of electrostatic discharge suppressor and method of stacking package with semiconductor devices
US7279724B2 (en) * 2004-02-25 2007-10-09 Philips Lumileds Lighting Company, Llc Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
US20050247944A1 (en) * 2004-05-05 2005-11-10 Haque Ashim S Semiconductor light emitting device with flexible substrate
TWI239666B (en) * 2004-09-16 2005-09-11 Chen-Lun Hsingchen LED package with diode protection circuit
JP4384019B2 (ja) * 2004-12-08 2009-12-16 住友電気工業株式会社 ヘッドランプ

Also Published As

Publication number Publication date
KR20080083333A (ko) 2008-09-17
US20070151755A1 (en) 2007-07-05
US8030575B2 (en) 2011-10-04
WO2007078349A2 (en) 2007-07-12
WO2007078349A3 (en) 2009-04-23
EP1974591A4 (en) 2014-01-15
TWI350041B (en) 2011-10-01
KR101115125B1 (ko) 2012-02-27
JP2009525713A (ja) 2009-07-09
EP1974591A2 (en) 2008-10-01
JP4902670B2 (ja) 2012-03-21

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