TW200735313A - Semiconductor device and manufacturing method thereof - Google Patents
Semiconductor device and manufacturing method thereofInfo
- Publication number
- TW200735313A TW200735313A TW095119552A TW95119552A TW200735313A TW 200735313 A TW200735313 A TW 200735313A TW 095119552 A TW095119552 A TW 095119552A TW 95119552 A TW95119552 A TW 95119552A TW 200735313 A TW200735313 A TW 200735313A
- Authority
- TW
- Taiwan
- Prior art keywords
- pad electrode
- semiconductor device
- plating layer
- passivation film
- covering
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/05001—Internal layers
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005174921A JP2006351766A (ja) | 2005-06-15 | 2005-06-15 | 半導体装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200735313A true TW200735313A (en) | 2007-09-16 |
Family
ID=37076003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095119552A TW200735313A (en) | 2005-06-15 | 2006-06-02 | Semiconductor device and manufacturing method thereof |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060289991A1 (zh) |
EP (1) | EP1737036A2 (zh) |
JP (1) | JP2006351766A (zh) |
KR (1) | KR20060131642A (zh) |
CN (1) | CN1881573A (zh) |
SG (1) | SG128597A1 (zh) |
TW (1) | TW200735313A (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7952200B2 (en) * | 2008-07-16 | 2011-05-31 | Infineon Technologies Ag | Semiconductor device including a copolymer layer |
US8455361B2 (en) * | 2010-01-07 | 2013-06-04 | Texas Instruments Incorporated | Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device |
KR101968929B1 (ko) * | 2012-09-11 | 2019-04-16 | 삼성디스플레이 주식회사 | 센서 기판, 이의 제조 방법 및 이를 포함하는 센싱 표시 패널 |
DE102012223904A1 (de) * | 2012-10-05 | 2014-04-10 | Continental Automotive Gmbh | Verfahren zum Herstellen eines elektronischen Hochstrom-Schaltkreises mittels Gasspritz-Technologie und Abdichten mit isolierendem Polymer |
JP6424610B2 (ja) * | 2014-04-23 | 2018-11-21 | ソニー株式会社 | 半導体装置、および製造方法 |
WO2019123826A1 (ja) * | 2017-12-19 | 2019-06-27 | Jx金属株式会社 | 半導体ウェハ、及びその製造方法 |
JP7332304B2 (ja) * | 2019-02-14 | 2023-08-23 | キオクシア株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003037129A (ja) * | 2001-07-25 | 2003-02-07 | Rohm Co Ltd | 半導体装置およびその製造方法 |
-
2005
- 2005-06-15 JP JP2005174921A patent/JP2006351766A/ja active Pending
-
2006
- 2006-06-02 TW TW095119552A patent/TW200735313A/zh unknown
- 2006-06-13 US US11/451,619 patent/US20060289991A1/en not_active Abandoned
- 2006-06-13 SG SG200603994A patent/SG128597A1/en unknown
- 2006-06-13 CN CNA2006100926710A patent/CN1881573A/zh active Pending
- 2006-06-14 EP EP06012324A patent/EP1737036A2/en not_active Withdrawn
- 2006-06-14 KR KR1020060053307A patent/KR20060131642A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US20060289991A1 (en) | 2006-12-28 |
CN1881573A (zh) | 2006-12-20 |
EP1737036A2 (en) | 2006-12-27 |
KR20060131642A (ko) | 2006-12-20 |
SG128597A1 (en) | 2007-01-30 |
JP2006351766A (ja) | 2006-12-28 |
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