TW200735149A - Solid electrolytic capacitor and method for manufacturing the same - Google Patents

Solid electrolytic capacitor and method for manufacturing the same

Info

Publication number
TW200735149A
TW200735149A TW095140435A TW95140435A TW200735149A TW 200735149 A TW200735149 A TW 200735149A TW 095140435 A TW095140435 A TW 095140435A TW 95140435 A TW95140435 A TW 95140435A TW 200735149 A TW200735149 A TW 200735149A
Authority
TW
Taiwan
Prior art keywords
solid electrolytic
electrolytic capacitor
lead frame
manufacturing
same
Prior art date
Application number
TW095140435A
Other languages
Chinese (zh)
Other versions
TWI425542B (en
Inventor
Eiji Komazawa
Hirokazu Murakoshi
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200735149A publication Critical patent/TW200735149A/en
Application granted granted Critical
Publication of TWI425542B publication Critical patent/TWI425542B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/022—Electrolytes; Absorbents
    • H01G9/025—Solid electrolytes
    • H01G9/028—Organic semiconducting electrolytes, e.g. TCNQ

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Abstract

Provided in the present invention is a capacitor element, specifically a solid electrolytic capacitor obtained by bonding a lead frame, which is only partially plated with a low melting point metal by partial taping on the lead frame, with a capacitor element. The solid electrolytic capacitor has excellent heat resistance, high completeness in resin sealing and high moisture resistance. Since the lead frame plated with the low melting point metal can be used, post-plating steps are not necessarily increased, furthermore, the solid electrolytic capacitor to which anodic bonding on a lamination layer is easily performed in resistance welding.
TW95140435A 2005-11-01 2006-11-01 Solid electrolytic capacitor and manufacturing method thereof TWI425542B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005318244 2005-11-01
JP2006237482 2006-09-01

Publications (2)

Publication Number Publication Date
TW200735149A true TW200735149A (en) 2007-09-16
TWI425542B TWI425542B (en) 2014-02-01

Family

ID=40079641

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95140435A TWI425542B (en) 2005-11-01 2006-11-01 Solid electrolytic capacitor and manufacturing method thereof

Country Status (3)

Country Link
JP (1) JP4953090B2 (en)
CN (1) CN101300652B (en)
TW (1) TWI425542B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103752970B (en) * 2013-12-24 2017-09-22 广州金升阳科技有限公司 A kind of welding method of lead frame
TWI556277B (en) * 2015-10-14 2016-11-01 鈺邦科技股份有限公司 Improved structure of winding-type capacitor element and winding-type solid electrolytic capacitor thereof
CN105810439A (en) * 2015-10-27 2016-07-27 钰邦电子（无锡）有限公司 Matrix arrangement type stack solid electrolytic capacitor packaging structure and manufacturing method thereof
TWI690958B (en) * 2018-09-19 2020-04-11 鈺冠科技股份有限公司 Pre-treatment equipment for capacitor element and rapid manufacturing method for capacitor element
WO2021205893A1 (en) * 2020-04-10 2021-10-14 株式会社村田製作所 Electrolytic capacitor and method for manufacturing electrolytic capacitor
CN115533235B (en) * 2022-11-24 2023-04-14 成都宏明电子股份有限公司 Welding method, tool, soldering lug and production method of large-terminal film capacitor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814947A (en) * 1988-02-17 1989-03-21 North American Philips Corporation Surface mounted electronic device with selectively solderable leads
JPH07147365A (en) * 1993-10-01 1995-06-06 Electroplating Eng Of Japan Co Method for preventing deformation of lead frame
EP1215691B1 (en) * 1999-05-28 2011-07-13 Murata Manufacturing Co., Ltd. Solid electrolytic capacitor and method of manufacture thereof
JP3922058B2 (en) * 2001-03-30 2007-05-30 松下電器産業株式会社 Circuit board manufacturing method
JP4609828B2 (en) * 2001-08-22 2011-01-12 株式会社村田製作所 Solid electrolytic capacitor and manufacturing method thereof
JP2004087713A (en) * 2002-08-26 2004-03-18 Japan Carlit Co Ltd:The Aluminum solid electrolytic capacitor

Also Published As

Publication number Publication date
JP4953090B2 (en) 2012-06-13
JPWO2007052652A1 (en) 2009-04-30
CN101300652B (en) 2011-09-07
CN101300652A (en) 2008-11-05
TWI425542B (en) 2014-02-01

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