TW200734279A - Method for machining a brittle material - Google Patents

Method for machining a brittle material

Info

Publication number
TW200734279A
TW200734279A TW095108811A TW95108811A TW200734279A TW 200734279 A TW200734279 A TW 200734279A TW 095108811 A TW095108811 A TW 095108811A TW 95108811 A TW95108811 A TW 95108811A TW 200734279 A TW200734279 A TW 200734279A
Authority
TW
Taiwan
Prior art keywords
brittle material
machining
light beam
brittle
providing
Prior art date
Application number
TW095108811A
Other languages
Chinese (zh)
Other versions
TWI330170B (en
Inventor
Jen-Guei Jung
Meng-Yu Wu
En-Rou Shiau
Original Assignee
Univ Nat Cheng Kung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Cheng Kung filed Critical Univ Nat Cheng Kung
Priority to TW95108811A priority Critical patent/TWI330170B/en
Publication of TW200734279A publication Critical patent/TW200734279A/en
Application granted granted Critical
Publication of TWI330170B publication Critical patent/TWI330170B/en

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to a method for machining a brittle material, comprising the following steps: (a) providing a brittle material; (b) providing a light beam; and (c) focusing the light beam on the interior of the brittle material, and adjusting the focal spot of the light beam according to the thickness of the brittle material so as to machine the brittle material. Whereby the machining speed is raise and the crack, bulge and scorch along the cutting line are constrained. In addition, the method of the present invention is a simple, flexible, fast, and clean technology in the micromachining and cutting of brittle materials which are used in optics, optoelectronic, and microfluidic devices.
TW95108811A 2006-03-15 2006-03-15 Method for machining a brittle material TWI330170B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95108811A TWI330170B (en) 2006-03-15 2006-03-15 Method for machining a brittle material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95108811A TWI330170B (en) 2006-03-15 2006-03-15 Method for machining a brittle material

Publications (2)

Publication Number Publication Date
TW200734279A true TW200734279A (en) 2007-09-16
TWI330170B TWI330170B (en) 2010-09-11

Family

ID=45074543

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95108811A TWI330170B (en) 2006-03-15 2006-03-15 Method for machining a brittle material

Country Status (1)

Country Link
TW (1) TWI330170B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110039665A (en) * 2019-05-14 2019-07-23 湖南大学 A kind of device of the tough crisp removal of dynamic monitoring ceramic material Ultra-precision Turning

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110039665A (en) * 2019-05-14 2019-07-23 湖南大学 A kind of device of the tough crisp removal of dynamic monitoring ceramic material Ultra-precision Turning
CN110039665B (en) * 2019-05-14 2020-12-04 湖南大学 Device for dynamically monitoring removal of ultra-precision machining toughness and brittleness of ceramic material

Also Published As

Publication number Publication date
TWI330170B (en) 2010-09-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees