1330170 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種加工硬脆材料之方法，詳言之，係關 於一種利用變焦技術輔助光束加工硬脆材料之方法。 • 【先前技術】 备 目前較成熟的切割或加工玻璃等硬脆材料的方法中，依 加工機制不同可區分為接觸式與非接觸式兩種。 % 接觸式的加工方式主要是使用比玻璃等硬脆材料硬度高 的材料（如金鋼石）製成刀具，在該硬脆材料上刻劃然後折 斷，雖然不需要多大的技術，然而這種方式不但效率低、 易傷手、浪費材料外，更不適合電子、微光學、光電與微 機電元件的切割，僅僅只能運用於對切割表面無嚴謹要求 者。現今光電、半導體廠常用於切割晶圓或硬脆材料的金 鋼石輪刀，其硬度比欲切割材料硬度還高，雖已具備商業 價值，但其切割表面也常會隨機出現裂紋，且用於特殊形 .&時則無法切割，諸如：圓形、半月形、圓弧形及曲線的 • 切割時’若該金鋼石輪刀之形狀改成切割刀具之點形狀 時’則又會出現裂紋或更嚴重的碎裂等。接觸式加工方式 ‘ t專利如中華民國專利公告第期581號、第461875號及第 503939號所不，近幾年來的創新與發展不大，都只在功能 上與便利性作局部的改善。 而非接觸式的切割方式主要使用高能光束當熱源，在極 ，内將光束聚焦在工作物表面，同時釋放出能量，此 能董將在工作物表面產生熱能，並經由熱傳導作用傳至工 109245.doc U3U170 作物内部’當熱量足夠時 化，再利用掃晦雷射光作物局部炫化或汽 狀，以相光％ 5移動1作平台來達到所需形 r义屬於軚新式的 …、接觸式的切割方法相 、 諕及德國專利第DE19735357A1所示。 以上兩種方式皆有其使用上的缺點 切割方式在進杆硒胪, 如接觸式的 時，“刀 材…如玻璃 '陶究或石夕晶片）切割 夺^刀置與切割速度必須調控到剛好，否則極容易產 一裂痕’在切割過程中所產生粉塵和碎屑容易污染 凡件丨其疋在電子產品或液晶面板等加工環境中是不被 允許的，在切割完成後，尚須處理㈣面之毛邊等問題， 故增加成本又費時。此外，金鋼石刀具會有磨損問題必需 經常要更換’其進口價袼相當昂貴。而非接觸式的切割方 式’如傳統雷射光刻，由於其透過熱加工方式來刻劃圓 形，在一些容易因高溫而變形的材料，其光刻品質較不穩 疋，在切割流道邊緣常會發生凸塊、飛濺或再凝固的現 象，且尚需注意是否產生燃燒情形，上述這些問題若不加 以克服，可能會影響後續元件接合品質，甚至導致元件失 效或產品損壞。 目刖有關玻璃專硬跪材料切割或類似的研究與技術如 下’美國PTG精密工業技術中心利用超冷卻氣流進行玻璃 之雷射切割，如中華民國專利公告458837號所示。另外， 邊銑削式雷射破裂銳削技術被提出，係將雷射聚焦於材料_ 邊緣兩側’並割劃出兩道凹槽裂紋，最後再將聚焦點設於 I09245.doc 離開材料表面’使雷射施加於任一凹槽裂紋處而產生張應 力的集中，進而使凹槽裂紋產生破裂連結，達成材料去除 之目的如中華民國專利公告第590837號所示。中華民國 專利第M24G445號則創作—種切割氣壓彈簧刀頭的機構， 利用-氣壓源之氣體壓力促使切刀輪機構之切刀輪相對壓 合並切割基材’以彈f所產生之彈簧預力吸收基板表面不 平之影響，可得到均—切割深度之t刀割裂痕。 中華民國專利第5261 11號則以雷射光束加熱材料表面的 切割線時不切穿材料，而—個或多個彈性波的波源對材料 表面產生作用’調整彈性波集中於切割路徑上的振幅與頻 率可切穿或半切穿材料。中華民國專利第52刪號則在脆 性材料上的一雷射微裂紋切割線界定出一工作物件，並對 該脆性材料外部周圍進行加熱，以熱量使基板與該工作物 件間的裂紋擴張，而使該工作物件從該微裂紋切割線中釋 出。中華民國專利第460422號則係在工件上產生對稱於切 割線之熱輻射點，此點於邊緣部分具有高輻射強度，並沿 切割線及/或工作件移動，而切割線之路徑接著予以冷 卻，其控制著掃描機之圓形切割及自由式切割，故產生彎 曲切割路線之彎曲V-或U-形強度分佈。中華民國專利第 490349號則在玻璃上肇生一雷射切割線的方法，包括將壓 痕器按壓在玻璃上而形成裂紋標記的方法。另外，中華民 國專利第507777號、第507778號及第500125號等皆為表述 一玻璃切割之裝置或結構。 圖la至圖lc分別顯示三種以習知切割方式切割玻璃後之 109245.doc 破壞形貌之俯視及側視示意圖》其中圖la所示為沿一光刻 伙道10邊緣兩側產生凸塊12現象，主要是由於已熔融材料 噴出後無法被有效帶走，故沿著該光刻流道1〇邊緣產生再 凝固堆積的結果。圖1 b所示為一光刻流道14邊緣產生微裂 、’文16，主要為雷射光刻過程，由於能量過度集中在光刻 處熱量無法有效釋出，造成加工區域與非加工區域間溫 度梯度過高，導致微熱裂與燒焦現象產生。圖卜所示為裂 紋擴展（Cracks Propagation)情形，當熱量持續增加無法有 效釋出時，一光刻流道18邊緣之裂紋2〇會向外擴展，終將 導致整片玻璃產生嚴重破裂。 圖2顯示習用在大氣中使用24W的功率與2〇〇 mm/sec速 度之C02雷射光刻2〇次，來光刻c〇ning Pyrex 7740玻璃基 板之俯視照片。圖3顯示利用表面量測儀（a_step)量測圖2 之玻璃基板之表面輪廓圖。從圖2可明顯觀察出，在沿光 刻流道30邊緣兩側，產生明顯裂紋（Crack)2i、凸塊 (Bulge)22及燒焦（Scorch)23現象《初步研判為雷射光刻過 程，由於能量過度集中在光刻處，熱量無法有效釋出，造 成加工區域與非加工區域間溫度梯度過高，導致該裂紋21 與该燒焦23現象。而該凸塊22的產生主要是由於已熔融材 料噴出後無法被有效帶走’故沿著該光刻流道3〇之邊緣產 生再凝固堆積的結果。如圖2所示，該凸塊22高達18.121 μηι，該凸塊22過高容易導致後續製程之困擾；另外在某 些情況下，甚至還會發生濺開的現象。 因此，有必要提供一種創新且具進步性的加工硬脆材料 109245.doc 1330170 知凸塊82經由α-step的量測結果為ι.012 μηι，與圖3之凸塊 22( 1 8.12 1 μπι)相比’可發現本實例之該凸塊82明顯變小。 實例2 圖10顯示本發明實例2光刻後之玻璃之立體照片圊。本 貫例使用之硬脆材料係為一種商用厚玻璃，其厚度為j 〇 mm ’且本實例中所使用之光束係為24瓦及速度2〇〇 mm/sec之C02雷射。在本實例中，係先利用該c〇2雷射在 該玻璃之下表面形成一預割痕，之後將該c〇2雷射之聚焦 點設定在該玻璃之上表面，並直接來回加工2〇次，接續再 將聚焦點设定在玻璃内部’依序往下變焦，每個循環皆來 回加工20次，直到切斷該玻璃為止。從圖中觀察並未發 現光刻區域產生燒焦或裂紋的現象，且在玻璃切穿處其切 割面相當平滑完整並無明顯毛邊產生。 惟上述實施例僅為說明本發明之原理及其功效，而非用 以限制本發明。因此，習於此技術之人士可在不違背本發 明之精神對上述實施例進行修改及變化。本發明之權利範 圍應如後述之申請專利範圍所列。 【圖式簡單說明】 圖1 a至圖1 c分別顯示三種以習知切割方式切割玻璃後之 破壞形貌之俯視及側視示意圖； 圖2顯示習用在大氣中使用24W的功率與2〇〇 mm/sec速 度之C〇2雷射光刻20次’來光刻Coning Pyrex 7740玻璃基 板之俯視照片； 圖3顯示利用表面量測儀（a_step)量測圖2之玻璃基板之 109245.doc 14 表面輪廓圖； 圖 4 _ -負示本發明加工硬脆材料 圖5海_ 万去之流程示意圖； •喝示本發明加工硬脆材料之方i ^ 意圖； 刊τ寸疋方法之第一實施例之不 意圖.員不本發明加工硬脆材料之方法之第二實施例之示 圖 7 _ 九 •示本發明加工硬脆材料之方法之第三實施例之示 思、圖； 一 8貝示本發明實例1光刻後之玻璃之俯視照片圖； …貝示本發明實例1光刻後之玻璃之 α-step表面輪腐 ;及 10顯示本發明實例2光刻後之玻璃之立體照片圖。 【主要元件符號說明】 A 預割痕 B 預割痕 10 光刻流道 12 凸塊 14 光刻流道 16 微裂紋 18 光刻流道 20 裂紋 21 裂紋 22 凸塊 23 燒焦 109245.doc • J5* 13301701330170 IX. Description of the Invention: [Technical Field] The present invention relates to a method for processing hard and brittle materials, and more particularly to a method for assisting beam processing of hard and brittle materials by using a zoom technique. • [Prior Art] Currently, more mature methods for cutting or processing hard and brittle materials such as glass can be distinguished between contact and non-contact depending on the processing mechanism. % Contact type processing method is mainly to use a material with a hardness higher than that of hard and brittle materials such as glass (such as diamond) to make a tool, and to cut and then break on the hard and brittle material, although this does not require much technology, The method is not only inefficient, easy to hurt, but also wastes materials, and is not suitable for cutting of electronic, micro-optical, optoelectronic and micro-electromechanical components, and can only be applied to those who do not have strict requirements on the cutting surface. Today's optoelectronics, semiconductor factories are often used to cut wafers or hard and brittle materials. The hardness of the diamond wheel cutter is higher than the hardness of the material to be cut. Although it has commercial value, the cutting surface is often randomly cracked and used for Special shapes. & can not be cut, such as: round, half moon, arc and curve • When cutting, if the shape of the diamond wheel cutter is changed to the shape of the cutting tool, then it will appear again Cracks or more severe cracks, etc. Contact processing methods ‘t patents, such as the Republic of China Patent Announcement No. 581, No. 461875 and No. 503939, have not been innovative and developed in recent years, and have only partially improved in terms of function and convenience. The non-contact cutting method mainly uses a high-energy beam as a heat source, and focuses the beam on the surface of the workpiece in the pole, and releases energy. This energy will generate heat energy on the surface of the workpiece and pass to the work through heat conduction. .doc U3U170 The interior of the crop 'when the heat is sufficient, then use the broom laser to partially smear or vaporize the light, and use the light to move the screen as the platform to achieve the desired shape. The cutting method phase is shown in German Patent No. DE19735357A1. Both of the above methods have the disadvantages of their use in the cutting method of the selenium in the rod, such as contact type, "knife material ... such as glass 'ceramics or Shi Xi wafers" cutting the knife and the cutting speed must be adjusted to It’s just that it’s very easy to produce a crack. The dust and debris generated during the cutting process are easy to contaminate. It is not allowed in the processing environment such as electronic products or LCD panels. After the cutting is completed, it must be processed. (4) The problem of burrs on the surface, etc., so it is time-consuming to increase the cost. In addition, the diamond cutters must have frequent wear problems. The import price is quite expensive. The non-contact cutting method is like traditional laser lithography. It is characterized by hot processing to round the shape. In some materials that are easily deformed by high temperature, the lithography quality is less stable, and bumps, splashes or re-solidification often occur at the edge of the cutting channel. Pay attention to whether there is a burning situation. If these problems are not overcome, it may affect the joint quality of subsequent components, or even cause component failure or product damage. Hard crucible material cutting or similar research and technology is as follows: 'PTG Precision Industrial Technology Center of the United States uses ultra-cooling airflow for laser cutting of glass, as shown in the Republic of China Patent Bulletin No. 458837. In addition, edge milling laser burst sharpening technology It was proposed to focus the laser on both sides of the material _ edge and cut out two groove cracks, and finally set the focus point on I09245.doc to leave the surface of the material to apply the laser to any groove crack. The concentration of tensile stress is generated, and the groove crack is broken and connected. The purpose of material removal is as shown in the Republic of China Patent Notice No. 590837. The Republic of China Patent No. M24G445 is a mechanism for cutting a gas spring cutter head. Using the gas pressure of the air pressure source to urge the cutter wheel of the cutter wheel mechanism to press and cut the substrate together, the spring preload generated by the spring f absorbs the surface unevenness of the substrate, and the t-cutting crack of the uniform cutting depth can be obtained. The Republic of China Patent No. 5261 11 uses a laser beam to heat the cutting line on the surface of the material without cutting through the material, and one or more waves of elastic waves. Effect on the surface of the material 'Adjusting the amplitude and frequency of the elastic wave concentrated on the cutting path can cut through or cut through the material. The Republic of China patent No. 52 deletes a laser micro-crack cutting line on the brittle material to define a job. And heating the outer periphery of the brittle material to expand the crack between the substrate and the working object by heat, so that the working object is released from the microcrack cutting line. The Republic of China Patent No. 460422 is attached to the workpiece. Producing a thermal radiation point symmetric to the cutting line, which has a high radiation intensity at the edge portion and moves along the cutting line and/or the workpiece, and the path of the cutting line is then cooled, which controls the circular cutting of the scanner And free-form cutting, resulting in a curved V- or U-shaped intensity distribution of the curved cutting path. The Republic of China Patent No. 490349 produces a laser cutting line on the glass, including pressing the indenter on the glass. A method of forming a crack mark. In addition, the Republic of China Patent Nos. 507777, 507778, and 500125, etc., all describe a glass cutting device or structure. Figures la to lc respectively show three top and side views of the 109245.doc fracture morphology after cutting the glass by a conventional cutting method, wherein the la shows the bumps 12 along the sides of a lithography 10 edge. The phenomenon is mainly due to the fact that the molten material cannot be effectively carried away after being ejected, so that re-solidification accumulation occurs along the edge of the lithographic flow path. Figure 1b shows a microcrack at the edge of the lithography flow path 14, '16, mainly for laser lithography. The heat cannot be effectively released due to excessive energy concentration at the lithography, resulting in a process between the processed area and the non-processed area. The temperature gradient is too high, resulting in micro-thermal cracking and charring. Figure Bub shows the Cracks Propagation. When the heat is continuously increased and cannot be effectively released, the crack 2 at the edge of the lithography runner 18 will expand outward, which will eventually cause severe cracking of the entire glass. Figure 2 shows a top-down photograph of a photolithographic crux 7740 glass substrate using a 24 watt laser lithography at a power of 24 W and 2 〇〇 mm/sec speed in the atmosphere. Figure 3 shows a surface profile of the glass substrate of Figure 2 measured using a surface gauge (a_step). It can be clearly seen from Fig. 2 that, along the edges of the lithography flow path 30, significant cracks 2i, bumps 22, and scorch 23 phenomena are generated, which is initially determined as a laser lithography process. Since the energy is excessively concentrated at the photolithography, the heat cannot be effectively released, causing the temperature gradient between the processed region and the non-processed region to be too high, resulting in the phenomenon of the crack 21 and the burnt 23 . The bump 22 is mainly produced because the molten material cannot be effectively carried away after being ejected, so that re-solidified deposition occurs along the edge of the lithographic flow path 3. As shown in Fig. 2, the bump 22 is as high as 18.121 μηι, and the bump 22 is too high to cause troubles in subsequent processes; in some cases, even splashing may occur. Therefore, it is necessary to provide an innovative and progressive process hard and brittle material 109245.doc 1330170 The bump 82 is measured by α-step as ι.012 μηι, and the bump 22 of FIG. 3 (1 8.12 1 μπι The bump 82 of the present example is significantly smaller than that of the present example. Example 2 Figure 10 shows a stereoscopic photograph of a glass after lithography of Example 2 of the present invention. The hard and brittle material used in this example is a commercial thick glass having a thickness of j 〇 mm ' and the beam used in this example is a 24 watt and a CO 2 laser at a speed of 2 〇〇 mm/sec. In this example, the c〇2 laser is first used to form a pre-cut on the lower surface of the glass, and then the focus point of the c〇2 laser is set on the upper surface of the glass, and directly processed back and forth 2 At this time, the focus is set inside the glass, and the zoom is sequentially performed. Each cycle is processed 20 times back and forth until the glass is cut. It is observed from the figure that the phenomenon of scorching or cracking in the lithographic area is not found, and the cut surface of the glass is relatively smooth and complete without significant burrs. However, the above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Therefore, those skilled in the art can make modifications and changes to the above embodiments without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 a to Fig. 1 c respectively show a top view and a side view of three kinds of fracture morphology after cutting glass by a conventional cutting method; Fig. 2 shows a conventional use of 24 W power and 2 大气 in the atmosphere. C〇2 laser lithography of mm/sec speed 20 times' to view the photo of the Coning Pyrex 7740 glass substrate; Figure 3 shows the surface of the glass substrate of Fig. 2 measured by a surface measuring instrument (a_step) 109245.doc 14 surface Figure 4 _ - negative showing the process of processing hard and brittle materials of the present invention Figure 5: _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ FIG. 7 is a schematic view showing a third embodiment of the method for processing a hard and brittle material according to the present invention. FIG. FIG. 1 is a top view photograph of the glass after photolithography; FIG. 1 shows the α-step surface round rox of the glass after photolithography of Example 1; and 10 shows a stereo photo of the glass after photolithography of Example 2 of the present invention. . [Main component symbol description] A Pre-cut B Pre-cut 10 Photolithography channel 12 Bump 14 Lithography flow path 16 Micro-crack 18 Lithography flow path 20 Crack 21 Crack 22 Bump 23 Charred 109245.doc • J5 * 1330170
30 光刻流道 50 硬脆材料 51 co2雷射產生器 52 co2雷射 53 反射鏡 54 聚焦透鏡 60 硬脆材料 61 co2雷射產生器 62 co2雷射 63 反射鏡 64 聚焦透鏡 81 光刻區域 82 凸塊 501 硬脆材料之第一 表面 502 硬脆材料之第二 表面 601 硬脆材料之第一 表面 602 硬脆材料之第二表面 109245.doc -16-30 lithography runner 50 hard and brittle material 51 co2 laser generator 52 co2 laser 53 mirror 54 focusing lens 60 hard and brittle material 61 co2 laser generator 62 co2 laser 63 mirror 64 focusing lens 81 lithography area 82 Bump 501 First surface 502 of hard and brittle material Second surface 601 of hard and brittle material First surface 602 of hard and brittle material Second surface of hard and brittle material 109245.doc -16-