TW200732167A - Structured thermal transfer article - Google Patents

Structured thermal transfer article

Info

Publication number
TW200732167A
TW200732167A TW095140978A TW95140978A TW200732167A TW 200732167 A TW200732167 A TW 200732167A TW 095140978 A TW095140978 A TW 095140978A TW 95140978 A TW95140978 A TW 95140978A TW 200732167 A TW200732167 A TW 200732167A
Authority
TW
Taiwan
Prior art keywords
thermal transfer
transfer article
metal
structured thermal
structured
Prior art date
Application number
TW095140978A
Other languages
English (en)
Chinese (zh)
Inventor
Phillip Eric Tuma
Gary Marven Palmgren
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200732167A publication Critical patent/TW200732167A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW095140978A 2005-11-07 2006-11-06 Structured thermal transfer article TW200732167A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/268,139 US7360581B2 (en) 2005-11-07 2005-11-07 Structured thermal transfer article

Publications (1)

Publication Number Publication Date
TW200732167A true TW200732167A (en) 2007-09-01

Family

ID=38002567

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140978A TW200732167A (en) 2005-11-07 2006-11-06 Structured thermal transfer article

Country Status (7)

Country Link
US (2) US7360581B2 (enExample)
EP (1) EP1946032A4 (enExample)
JP (1) JP2009515362A (enExample)
KR (1) KR20080074140A (enExample)
CN (1) CN101305256B (enExample)
TW (1) TW200732167A (enExample)
WO (1) WO2007055895A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11504863B2 (en) 2019-11-07 2022-11-22 Delta Electronics, Inc. Heat dissipation device and robot using same

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7695808B2 (en) * 2005-11-07 2010-04-13 3M Innovative Properties Company Thermal transfer coating
EP1826931B1 (en) 2006-02-27 2018-12-19 Samsung Electronics Co., Ltd. Method and system for protecting broadcast service/content in a mobile broadcast system, and method for generating short term key message therefor
KR100975386B1 (ko) * 2006-02-27 2010-08-11 삼성전자주식회사 휴대 방송 시스템에서 방송 서비스/컨텐츠 보호 방법과 시스템 및 이를 위한 단기 키 메시지의 생성 방법
AU2007221497B2 (en) * 2006-03-03 2012-06-14 Micro Delta T Ab Porous layer
US8356658B2 (en) * 2006-07-27 2013-01-22 General Electric Company Heat transfer enhancing system and method for fabricating heat transfer device
US7694719B2 (en) * 2007-01-04 2010-04-13 International Business Machines Corporation Patterned metal thermal interface
WO2008131105A1 (en) * 2007-04-17 2008-10-30 University Of Virginia Patent Foundation Heat-managing composite structures
US7907410B2 (en) * 2007-11-08 2011-03-15 International Business Machines Corporation Universal patterned metal thermal interface
US20090176148A1 (en) * 2008-01-04 2009-07-09 3M Innovative Properties Company Thermal management of electrochemical cells
US20090269521A1 (en) * 2008-04-24 2009-10-29 3M Innovative Properties Company Porous structured thermal transfer article
US8579018B1 (en) 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
US8573289B1 (en) 2009-07-20 2013-11-05 Hrl Laboratories, Llc Micro-architected materials for heat exchanger applications
US8453717B1 (en) * 2009-07-20 2013-06-04 Hrl Laboratories, Llc Micro-architected materials for heat sink applications
US8323524B2 (en) 2009-10-01 2012-12-04 3M Innovative Properties Company Apparatus including hydrofluoroether with high temperature stability and uses thereof
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US8921702B1 (en) 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US8535559B2 (en) * 2010-03-26 2013-09-17 3M Innovative Properties Company Nitrogen-containing fluoroketones for high temperature heat transfer
US8857182B1 (en) 2010-05-19 2014-10-14 Hrl Laboratories, Llc Power generation through artificial transpiration
US8771330B1 (en) 2010-05-19 2014-07-08 Hrl Laboratories, Llc Personal artificial transpiration cooling system
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
DE102012016442A1 (de) * 2012-08-18 2014-02-20 Audi Ag Wärmetauscher
JP5862536B2 (ja) 2012-10-04 2016-02-16 信越化学工業株式会社 太陽電池モジュールの製造方法
JP5867356B2 (ja) 2012-10-04 2016-02-24 信越化学工業株式会社 太陽電池モジュールの製造方法
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
EP2874479B1 (en) * 2013-06-19 2018-08-08 Amogreentech Co., Ltd. Hybrid insulation sheet and electronic equipment comprising same
US20150022975A1 (en) * 2013-07-19 2015-01-22 General Electric Company Method and system for an immersion boiling heat sink
CN104955311A (zh) * 2014-03-27 2015-09-30 玉晶光电股份有限公司 散热装置及其制造方法
TWI573976B (zh) * 2014-03-27 2017-03-11 玉晶光電股份有限公司 散熱裝置及其製造方法
US10695872B2 (en) * 2015-03-11 2020-06-30 Lockheed Martin Corporation Heat spreaders fabricated from metal nanoparticles
ES2768779T3 (es) * 2015-11-09 2020-06-23 Franke Technology & Trademark Intercambiador de calor
CN105466268A (zh) * 2015-12-18 2016-04-06 华南理工大学 一种基于3d打印的多孔内凹强化传热结构及其制备方法
RU174676U1 (ru) * 2017-02-20 2017-10-25 Федеральное государственное бюджетное учреждение науки Институт физики твердого тела Российской академии наук (ИФТТ РАН) Теплопроводящая прокладка для охлаждения изделий электроники
US10493693B1 (en) * 2017-07-25 2019-12-03 National Technology & Engineering Solutions Of Sandia, Llc 3D-printed apparatus for efficient fluid-solid contact
WO2020158739A1 (ja) * 2019-01-30 2020-08-06 京セラ株式会社 放熱部材およびこれを備える電子装置
CN112625657B (zh) * 2019-09-24 2022-01-14 华为技术有限公司 导热体、导热材料和半导体器件的封装结构
US12058842B2 (en) * 2020-09-18 2024-08-06 Arris Enterprises Llc Method and system for small scale structures to improve thermal efficiency
TWD213820S (zh) * 2021-03-23 2021-09-01 芝奇國際實業股份有限公司 記憶體散熱片
US12704333B2 (en) * 2022-03-04 2026-08-11 Drexel University Amphiphilic minichannel surface structures to enhance heat transfer coefficient
TWI872652B (zh) * 2023-08-18 2025-02-11 佳必琪國際股份有限公司 散熱裝置

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US397450A (en) * 1889-02-05 Boiler-tube plug
US3384154A (en) * 1956-08-30 1968-05-21 Union Carbide Corp Heat exchange system
US3523577A (en) * 1956-08-30 1970-08-11 Union Carbide Corp Heat exchange system
US3587730A (en) * 1956-08-30 1971-06-28 Union Carbide Corp Heat exchange system with porous boiling layer
BE757262A (fr) * 1969-10-10 1971-04-08 Union Carbide Corp Couche metallique poreuse et procede pour la former
US3753757A (en) * 1970-05-15 1973-08-21 Union Carbide Corp Two step porous boiling surface formation
US3689346A (en) * 1970-09-29 1972-09-05 Rowland Dev Corp Method for producing retroreflective material
US3906604A (en) * 1974-02-01 1975-09-23 Hitachi Cable Method of forming heat transmissive wall surface
US4064914A (en) * 1974-05-08 1977-12-27 Union Carbide Corporation Porous metallic layer and formation
US3990862A (en) * 1975-01-31 1976-11-09 The Gates Rubber Company Liquid heat exchanger interface and method
US4129181A (en) * 1977-02-16 1978-12-12 Uop Inc. Heat transfer surface
US4162412A (en) * 1977-10-03 1979-07-24 Rca Corporation Microwave power limiter comprising a single-gate FET
US4381818A (en) * 1977-12-19 1983-05-03 International Business Machines Corporation Porous film heat transfer
US4182412A (en) 1978-01-09 1980-01-08 Uop Inc. Finned heat transfer tube with porous boiling surface and method for producing same
US4232056A (en) * 1979-04-16 1980-11-04 Union Carbide Corporation Thermospray method for production of aluminum porous boiling surfaces
JPS57164292A (en) 1981-03-31 1982-10-08 Mitsubishi Electric Corp Boiling heat transfer surface
US4354550A (en) * 1981-05-07 1982-10-19 The Trane Company Heat transfer surface for efficient boiling of liquid R-11 and its equivalents
US4663243A (en) * 1982-10-28 1987-05-05 Union Carbide Corporation Flame-sprayed ferrous alloy enhanced boiling surface
JPS61273253A (ja) 1985-05-30 1986-12-03 Mitsubishi Heavy Ind Ltd 熱交換器の伝熱部及びその製造法
US4890669A (en) * 1986-07-02 1990-01-02 Carrier Corporation Porous coating for enhanced tubes
CA1238428A (en) * 1987-08-21 1988-06-21 John J. Kost Thermally enhanced integrated circuit carrier package
US5045972A (en) * 1990-08-27 1991-09-03 The Standard Oil Company High thermal conductivity metal matrix composite
US5570502A (en) * 1991-04-08 1996-11-05 Aluminum Company Of America Fabricating metal matrix composites containing electrical insulators
WO1994010294A1 (en) 1992-10-23 1994-05-11 New York University Human monoclonal antibodies to human parvovirus and methods of making and using thereof
US5814392A (en) * 1994-03-23 1998-09-29 Board Of Regents, The University Of Texas System Boiling enhancement coating
EP0786506B1 (en) 1996-01-26 2003-04-23 General Electric Company Coated abrasives for abrasive tools
JPH1062096A (ja) 1996-08-19 1998-03-06 Kubota Corp 熱交換用部材
JP3617232B2 (ja) * 1997-02-06 2005-02-02 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ
JP3893681B2 (ja) * 1997-08-19 2007-03-14 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法
KR19990050184A (ko) 1997-12-16 1999-07-05 이구택 방식 및 방열성이 우수한 아연계 무기도료
US6196307B1 (en) 1998-06-17 2001-03-06 Intersil Americas Inc. High performance heat exchanger and method
US6468669B1 (en) * 1999-05-03 2002-10-22 General Electric Company Article having turbulation and method of providing turbulation on an article
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US20020023733A1 (en) * 1999-12-13 2002-02-28 Hall David R. High-pressure high-temperature polycrystalline diamond heat spreader
JP2002368168A (ja) * 2001-06-13 2002-12-20 Hitachi Ltd 半導体装置用複合部材、それを用いた絶縁型半導体装置、又は非絶縁型半導体装置
KR20030065686A (ko) * 2002-01-30 2003-08-09 삼성전기주식회사 히트 파이프 및 그 제조 방법
KR100624877B1 (ko) * 2002-07-08 2006-09-18 한국과학기술연구원 젖음성 향상을 위한 습표면 열교환기의 표면처리방법
CN2578768Y (zh) * 2002-11-19 2003-10-08 江苏中圣石化工程有限公司 高热通量换热器
JP2004300415A (ja) 2003-03-20 2004-10-28 Eco Cosmo:Kk 塗料及びその製造方法
CN1566850A (zh) * 2003-06-17 2005-01-19 乐金电子(天津)电器有限公司 用于空调机的热交换器件组装体
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device
US7109581B2 (en) * 2003-08-25 2006-09-19 Nanoconduction, Inc. System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
KR101120789B1 (ko) * 2003-09-26 2012-04-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 촉매, 활성화제, 지지 매체, 및 특히 물리증착을 이용하여지지 매체 상에 촉매 증착시 촉매 시스템 제조에 유용한관련 방법
US7353860B2 (en) * 2004-06-16 2008-04-08 Intel Corporation Heat dissipating device with enhanced boiling/condensation structure
CN100552364C (zh) * 2005-08-26 2009-10-21 富准精密工业(深圳)有限公司 烧结式热导管之制造方法
US7695808B2 (en) * 2005-11-07 2010-04-13 3M Innovative Properties Company Thermal transfer coating
US20090269521A1 (en) * 2008-04-24 2009-10-29 3M Innovative Properties Company Porous structured thermal transfer article

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11504863B2 (en) 2019-11-07 2022-11-22 Delta Electronics, Inc. Heat dissipation device and robot using same

Also Published As

Publication number Publication date
US20080148570A1 (en) 2008-06-26
EP1946032A1 (en) 2008-07-23
WO2007055895A1 (en) 2007-05-18
CN101305256B (zh) 2010-10-06
JP2009515362A (ja) 2009-04-09
EP1946032A4 (en) 2010-10-06
US20070102140A1 (en) 2007-05-10
US7360581B2 (en) 2008-04-22
CN101305256A (zh) 2008-11-12
KR20080074140A (ko) 2008-08-12

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