TW200731279A - On die thermal sensor of semiconductor memory device and method thereof - Google Patents

On die thermal sensor of semiconductor memory device and method thereof

Info

Publication number
TW200731279A
TW200731279A TW095136300A TW95136300A TW200731279A TW 200731279 A TW200731279 A TW 200731279A TW 095136300 A TW095136300 A TW 095136300A TW 95136300 A TW95136300 A TW 95136300A TW 200731279 A TW200731279 A TW 200731279A
Authority
TW
Taiwan
Prior art keywords
comparing
voltage
thermal sensor
memory device
semiconductor memory
Prior art date
Application number
TW095136300A
Other languages
English (en)
Other versions
TWI309834B (en
Inventor
Chun-Seok Jeong
Original Assignee
Hynix Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Publication of TW200731279A publication Critical patent/TW200731279A/zh
Application granted granted Critical
Publication of TWI309834B publication Critical patent/TWI309834B/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • G11C11/40626Temperature related aspects of refresh operations
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/14Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/147Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2211/00Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C2211/401Indexing scheme relating to cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C2211/406Refreshing of dynamic cells
    • G11C2211/4065Low level details of refresh operations

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Read Only Memory (AREA)
TW095136300A 2005-09-29 2006-09-29 On die thermal sensor of semiconductor memory device and method thereof TWI309834B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20050091666 2005-09-29
KR1020060051145A KR100772560B1 (ko) 2005-09-29 2006-06-07 반도체 메모리 소자의 온도 정보 출력 장치 및 방법

Publications (2)

Publication Number Publication Date
TW200731279A true TW200731279A (en) 2007-08-16
TWI309834B TWI309834B (en) 2009-05-11

Family

ID=38158775

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136300A TWI309834B (en) 2005-09-29 2006-09-29 On die thermal sensor of semiconductor memory device and method thereof

Country Status (2)

Country Link
KR (1) KR100772560B1 (zh)
TW (1) TWI309834B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100851989B1 (ko) * 2006-10-12 2008-08-13 주식회사 하이닉스반도체 반도체 메모리 장치의 온도정보 출력회로 및 방법
US7863965B2 (en) 2007-06-27 2011-01-04 Hynix Semiconductor Inc. Temperature sensor circuit and method for controlling the same
KR100899390B1 (ko) * 2007-06-27 2009-05-27 주식회사 하이닉스반도체 온도 센서 회로 및 그 제어 방법
KR100983700B1 (ko) 2008-04-18 2010-09-24 주식회사 하이닉스반도체 Rfid 장치
KR101003120B1 (ko) 2008-12-23 2010-12-22 주식회사 하이닉스반도체 반도체 집적회로의 디지털 온도 정보 생성 장치
KR101069678B1 (ko) 2009-06-16 2011-10-05 주식회사 하이닉스반도체 반도체 메모리 장치의 온도 감지 회로
KR101131561B1 (ko) * 2010-08-31 2012-04-04 주식회사 하이닉스반도체 반도체 메모리 장치의 전압 생성 회로
KR20180042014A (ko) 2016-10-17 2018-04-25 삼성전자주식회사 배관 구조체 및 배관 구조체를 포함하는 반도체 모듈 테스트 장치
KR101937263B1 (ko) * 2017-07-28 2019-04-09 현대오트론 주식회사 차량용 카메라를 위한 신호 처리 장치 및 그것의 동작 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950009922B1 (ko) * 1992-08-24 1995-09-01 현대중공업주식회사 감지장치의 신호 보정장치
KR19990048860A (ko) * 1997-12-11 1999-07-05 김영환 반도체 메모리 소자의 온도 감지 회로
KR100475736B1 (ko) * 2002-08-09 2005-03-10 삼성전자주식회사 고속 테스트에 적합한 편이온도 검출회로를 갖는온도감지기 및 편이온도 검출방법

Also Published As

Publication number Publication date
TWI309834B (en) 2009-05-11
KR20070036648A (ko) 2007-04-03
KR100772560B1 (ko) 2007-11-02

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