TW200730863A - Radiation-sensitive resin composition, interlayer insulation film, microlens and formation method thereof - Google Patents

Radiation-sensitive resin composition, interlayer insulation film, microlens and formation method thereof

Info

Publication number
TW200730863A
TW200730863A TW095136721A TW95136721A TW200730863A TW 200730863 A TW200730863 A TW 200730863A TW 095136721 A TW095136721 A TW 095136721A TW 95136721 A TW95136721 A TW 95136721A TW 200730863 A TW200730863 A TW 200730863A
Authority
TW
Taiwan
Prior art keywords
radiation
resin composition
insulation film
interlayer insulation
sensitive resin
Prior art date
Application number
TW095136721A
Other languages
Chinese (zh)
Other versions
TWI410667B (en
Inventor
Eiji Yoneda
Kenichi Hamada
Hiroshi Shiho
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200730863A publication Critical patent/TW200730863A/en
Application granted granted Critical
Publication of TWI410667B publication Critical patent/TWI410667B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The present invention relates to a radiation-sensitive resin composition containing an unsaturated carboxylic acid; an unsaturated carboxylic acid anhydride; (methyl) copolymers of acrylamide, acyl, hydroxyl, oxygen-heterocyclic, butane; 1,2-dimolybdenum 2-azido nitrogen compounds, and a heat-sensitive acid generating compound. There was no safety issue in said composition, since they are excellent in sensitivity, resolution. Moreover, it has the advantage of providing good preservation and storage stability of the solution. It also includes sound imaging effects, and you can even apply more than optimal imaging time in the Imaging steps to form a good pattern shape. This invention can produce the interlayer insulation film and micro-lens.
TW095136721A 2005-10-03 2006-10-03 Sensing linear resin composition, interlayer insulating film and method for forming the same, microlens and method for forming the same TWI410667B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005289472A JP4677871B2 (en) 2005-10-03 2005-10-03 Radiation sensitive resin composition and formation of interlayer insulating film and microlens

Publications (2)

Publication Number Publication Date
TW200730863A true TW200730863A (en) 2007-08-16
TWI410667B TWI410667B (en) 2013-10-01

Family

ID=38028777

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136721A TWI410667B (en) 2005-10-03 2006-10-03 Sensing linear resin composition, interlayer insulating film and method for forming the same, microlens and method for forming the same

Country Status (4)

Country Link
JP (1) JP4677871B2 (en)
KR (1) KR101289163B1 (en)
CN (1) CN101154041B (en)
TW (1) TWI410667B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5003375B2 (en) * 2007-09-20 2012-08-15 Ｊｓｒ株式会社 Radiation-sensitive resin composition, interlayer insulating film and microlens, and production method thereof
JP5003376B2 (en) * 2007-09-20 2012-08-15 Ｊｓｒ株式会社 Radiation-sensitive resin composition, interlayer insulating film and microlens, and production method thereof
JP5105073B2 (en) * 2008-03-24 2012-12-19 Ｊｓｒ株式会社 Radiation-sensitive resin composition, and method for producing interlayer insulating film and microlens
JP5279353B2 (en) * 2008-06-09 2013-09-04 東京応化工業株式会社 Photosensitive resin composition, photosensitive resin laminate, and pattern forming method
JP5476490B2 (en) * 2013-01-18 2014-04-23 東京応化工業株式会社 Photosensitive resin composition, photosensitive resin laminate, and pattern forming method
KR20170039560A (en) * 2015-10-01 2017-04-11 롬엔드하스전자재료코리아유한회사 Photosensitive resin composition and organic insulating film using same
JP6807226B2 (en) * 2016-12-09 2021-01-06 東京応化工業株式会社 Energy-sensitive compositions used to form flattening films or microlenses on a substrate, cured product manufacturing methods, cured products, microlens manufacturing methods, and CMOS image sensors.

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3650985B2 (en) * 1997-05-22 2005-05-25 Ｊｓｒ株式会社 Negative-type radiation-sensitive resin composition and pattern production method
JP3835120B2 (en) * 2000-05-22 2006-10-18 Ｊｓｒ株式会社 Radiation sensitive resin composition, interlayer insulating film and microlens
JP2001343743A (en) * 2000-05-31 2001-12-14 Jsr Corp Radiation sensitive resin composition and use of its cured body in element
JP3965868B2 (en) * 2000-06-12 2007-08-29 Ｊｓｒ株式会社 Interlayer insulation film and microlens
JP4524944B2 (en) * 2001-03-28 2010-08-18 Ｊｓｒ株式会社 Radiation sensitive resin composition, its use for forming interlayer insulating film and microlens, and interlayer insulating film and microlens
JP4631081B2 (en) * 2001-07-16 2011-02-16 ナガセケムテックス株式会社 Positive radiation sensitive resin composition
JP2003082042A (en) * 2001-09-07 2003-03-19 Jsr Corp Radiation-sensitive resin composition for barrier plate formation, barrier plate, and display device
JP2004029535A (en) * 2002-06-27 2004-01-29 Sumitomo Chem Co Ltd Radiation-sensitive resin composition
TW200415438A (en) * 2002-09-27 2004-08-16 Sumitomo Chemical Co Radiosensitive resin composition
JP2004139070A (en) * 2002-09-27 2004-05-13 Sumitomo Chem Co Ltd Radiation-sensitive resin composition
TWI281095B (en) * 2002-11-01 2007-05-11 Sumitomo Chemical Co Radiation sensitive resin composition
JP3733946B2 (en) 2002-11-19 2006-01-11 Ｊｓｒ株式会社 Radiation sensitive resin composition for forming interlayer insulating film and microlens
JP4493938B2 (en) * 2003-06-06 2010-06-30 東京応化工業株式会社 Positive resist composition and resist pattern forming method

Also Published As

Publication number Publication date
KR20070037688A (en) 2007-04-06
JP2007101763A (en) 2007-04-19
JP4677871B2 (en) 2011-04-27
CN101154041B (en) 2011-11-23
TWI410667B (en) 2013-10-01
KR101289163B1 (en) 2013-07-23
CN101154041A (en) 2008-04-02

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