TW200730786A - Plate heat pipe, and manufacturing method and packing unit thereof - Google Patents
Plate heat pipe, and manufacturing method and packing unit thereofInfo
- Publication number
- TW200730786A TW200730786A TW095104918A TW95104918A TW200730786A TW 200730786 A TW200730786 A TW 200730786A TW 095104918 A TW095104918 A TW 095104918A TW 95104918 A TW95104918 A TW 95104918A TW 200730786 A TW200730786 A TW 200730786A
- Authority
- TW
- Taiwan
- Prior art keywords
- casing
- working area
- jointing
- heat pipe
- plate heat
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Buffer Packaging (AREA)
Abstract
This invention relates to a plate heat pipe, comprising a packaging unit and a binding material. The packaging unit comprises a first casing and a second casing matching up with the first casing. The first casing comprises a working area, a first jointing portion surrounding the working area, and a blocking portion risingly located between the working area and the first jointing portion. The second casing covers over the first casing, and has a case covering portion intervally located on the working area and a second jointing portion located on the first jointing portion. The binding material is located between the first and the second jointing portions. When the first casing and the second casing are compressed together, the blocking portion can prevent the binding material from entering the working area.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95104918A TWI266854B (en) | 2006-02-14 | 2006-02-14 | Plate heat pipe, and manufacturing method and packing unit thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95104918A TWI266854B (en) | 2006-02-14 | 2006-02-14 | Plate heat pipe, and manufacturing method and packing unit thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI266854B TWI266854B (en) | 2006-11-21 |
TW200730786A true TW200730786A (en) | 2007-08-16 |
Family
ID=38191693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95104918A TWI266854B (en) | 2006-02-14 | 2006-02-14 | Plate heat pipe, and manufacturing method and packing unit thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI266854B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105764300A (en) * | 2014-12-19 | 2016-07-13 | 富葵精密组件(深圳)有限公司 | Temperature-uniforming plate and manufacturing method thereof |
TWI588438B (en) * | 2014-06-06 | 2017-06-21 | 超眾科技股份有限公司 | Sealing method of heat conducting plate and structures thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103712497A (en) * | 2012-10-09 | 2014-04-09 | 元镫金属股份有限公司 | Thinned guide plate pipe |
TWI710742B (en) * | 2019-11-22 | 2020-11-21 | 邁萪科技股份有限公司 | Vapor chamber |
-
2006
- 2006-02-14 TW TW95104918A patent/TWI266854B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI588438B (en) * | 2014-06-06 | 2017-06-21 | 超眾科技股份有限公司 | Sealing method of heat conducting plate and structures thereof |
CN105764300A (en) * | 2014-12-19 | 2016-07-13 | 富葵精密组件(深圳)有限公司 | Temperature-uniforming plate and manufacturing method thereof |
TWI553288B (en) * | 2014-12-19 | 2016-10-11 | 臻鼎科技股份有限公司 | Vapor chamber and method for manufacturing same |
Also Published As
Publication number | Publication date |
---|---|
TWI266854B (en) | 2006-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |