TW200730786A - Plate heat pipe, and manufacturing method and packing unit thereof - Google Patents

Plate heat pipe, and manufacturing method and packing unit thereof

Info

Publication number
TW200730786A
TW200730786A TW095104918A TW95104918A TW200730786A TW 200730786 A TW200730786 A TW 200730786A TW 095104918 A TW095104918 A TW 095104918A TW 95104918 A TW95104918 A TW 95104918A TW 200730786 A TW200730786 A TW 200730786A
Authority
TW
Taiwan
Prior art keywords
casing
working area
jointing
heat pipe
plate heat
Prior art date
Application number
TW095104918A
Other languages
Chinese (zh)
Other versions
TWI266854B (en
Inventor
xiu-wei Yang
Pei-Pei Chen
Wen-Hua Yu
zhi-hua Wu
zhao-xiang Zheng
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW95104918A priority Critical patent/TWI266854B/en
Application granted granted Critical
Publication of TWI266854B publication Critical patent/TWI266854B/en
Publication of TW200730786A publication Critical patent/TW200730786A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Buffer Packaging (AREA)

Abstract

This invention relates to a plate heat pipe, comprising a packaging unit and a binding material. The packaging unit comprises a first casing and a second casing matching up with the first casing. The first casing comprises a working area, a first jointing portion surrounding the working area, and a blocking portion risingly located between the working area and the first jointing portion. The second casing covers over the first casing, and has a case covering portion intervally located on the working area and a second jointing portion located on the first jointing portion. The binding material is located between the first and the second jointing portions. When the first casing and the second casing are compressed together, the blocking portion can prevent the binding material from entering the working area.
TW95104918A 2006-02-14 2006-02-14 Plate heat pipe, and manufacturing method and packing unit thereof TWI266854B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95104918A TWI266854B (en) 2006-02-14 2006-02-14 Plate heat pipe, and manufacturing method and packing unit thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95104918A TWI266854B (en) 2006-02-14 2006-02-14 Plate heat pipe, and manufacturing method and packing unit thereof

Publications (2)

Publication Number Publication Date
TWI266854B TWI266854B (en) 2006-11-21
TW200730786A true TW200730786A (en) 2007-08-16

Family

ID=38191693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95104918A TWI266854B (en) 2006-02-14 2006-02-14 Plate heat pipe, and manufacturing method and packing unit thereof

Country Status (1)

Country Link
TW (1) TWI266854B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105764300A (en) * 2014-12-19 2016-07-13 富葵精密组件(深圳)有限公司 Temperature-uniforming plate and manufacturing method thereof
TWI588438B (en) * 2014-06-06 2017-06-21 超眾科技股份有限公司 Sealing method of heat conducting plate and structures thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103712497A (en) * 2012-10-09 2014-04-09 元镫金属股份有限公司 Thinned guide plate pipe
TWI710742B (en) * 2019-11-22 2020-11-21 邁萪科技股份有限公司 Vapor chamber

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI588438B (en) * 2014-06-06 2017-06-21 超眾科技股份有限公司 Sealing method of heat conducting plate and structures thereof
CN105764300A (en) * 2014-12-19 2016-07-13 富葵精密组件(深圳)有限公司 Temperature-uniforming plate and manufacturing method thereof
TWI553288B (en) * 2014-12-19 2016-10-11 臻鼎科技股份有限公司 Vapor chamber and method for manufacturing same

Also Published As

Publication number Publication date
TWI266854B (en) 2006-11-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees