1266854 $ 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種熱管及其製造方法與封裝單元， 特別是指一種平板式熱管及其製造方法與封裝單元。 【先前技術】 參閱圖1及圖2,習知平板式熱管丨包含一封裝單元n 、一錫膏13、一毛細結構12，以及一工作流體14。 該封裝單元η包括一第一殼體lu及一形狀與該第一 殼體111相配合的第二殼體112。該第一殼體lu具有一工 作區113，以及一圍繞於該工作區113外的第一接合部 。該第一接合部114具有一自其周緣延伸至該工作區ιΐ3的 第一槽道115及一嵌置於該第一槽道115内的充填管116。 該第二殼體112係覆蓋於該第一殼體111上，且具有一 間隔地位於該工作區113上的殼蓋部117及一位於該第一接 合部114上的第二接合部118。該第二接合部118具有一與 該第一槽道115配合並適合供嵌置該充填管116的第二槽道 119。 該錫T 13係被設置位於該第一接合部丨丨4與該第二接 合部118之間，被用以黏合該第一接合部丨14與該第二接合 部 118。 该毛細結構12與該工作流體14位於一由該第一殼體 111的工作區113與該第二殼體丨12的殼蓋部117共同界定 出的容室110内。 當組合该平板式熱管1時，首先塗佈含有助焊劑（flux 1266854 的锡膏13於該第-接合部114與該第二接合部ιΐ8，然 後將該毛細結構12放置於該卜殼體⑴的卫作區ιΐ3與 該第二殼體112的殼蓋部117間，再利用一治具 /、 ®合該第-㈣m與該第二殼體112，使該第一接：部 ^與該第二接合冑118藉由該錫f丨3而黏合。然後該平 板式熱管1會被放人-高溫爐（圖未示）中供烤後再冷卻 ，该锡膏η便可使該第一殼體⑴與該第二殼體ιΐ2氣密 =合’之後再經該充填管116充填社作流體14至該容室 110 内。 當壓合該第-殼體m與該第二殼體112時，部分錫客 u因受力壓擠容易進入該封裝單元u的容室中，^ 影響該毛細結構12與紅作流體14的性f與功用，而降 低該平板式熱管1的散熱能力。 尤其該錫膏13中的助焊劑是為了腐姓掉該等接合部 二、118上的氧化層（圖未示）及抑制錫本身氧化，以使 1反應（eutectlcreact_)能夠充分完成，如此才能確伴 威體111與該第二殼體112為氣密結合。故用以腐敍 的該助焊劑為酸性且流動性強，此渗入情況更容易购 毛細結構12與該工作流體14的性質與功用，更加降：:; 平板式熱管1的散熱能力。 —〃 【發明内容】 因此，本發明之目的，是在提供-種可達到散敎能力 較穩定功效之平板式熱管。 本發明之另一目的，是在摇祉 疋在k供一種可達到散熱能力較 1266854 穩定功效之平板式熱管的製造方法。 —本發明之又-目的’是在提供—種確保結合物不 入谷至中而影響毛細結構與工作流體的性晰 ^ At κ 貝與功用，以保 持政”、、Sb力的平板式熱管及其封裝單元。 本發明之再一目的，是在提供一 λ ^ ^ . 檀確保結合物不會進 入谷至中而影響毛細結構與卫作流體的性質與功用 持散熱能力之平板式熱管的製造方法及其封裝方法。” 本發明之更一目的，是在提供一 ' f入^ I & 八 達到兩殼體間的 检合效果較佳之平板式熱管及其封裝單元。 ::明之另一目的，是在提供一種可達到兩殼體間的 h效果較佳之平板式歸的製造方法及其封袭方法。 於是，本發明平板式熱管包含一封裝單元及一結合物 Ο 該封裝單元包括一第 弟双體及一形狀與該第一殼體相 配a的弟二殼體。該第一殼體且右 Ύ从广 工作區外的第二Π 一工作區、一圍繞於該 接口邛，以及一隆起地位於該工作區盥該 第-接合部間的擒止部。該第二殼體係覆蓋於該第一殼體 士，且具有-間隔地位於該工作區上的殼蓋部及一位於該 第一接合部上的第二接合部。 、該結合物位於該第一接合部與該第二接合部間並被用 以黏合该第一接合部與該第二接合部。 於是，树明平板式熱管的製造方法包含以下步驟·· ，（Α)提供一第一殼體及—形狀與該第一殼體相配合的 卜—nn具有—工作區、一圍繞於該工作區 1266854 外的第一接合部’以及一隆起地位於該工作區與該第一接 合部間的擋止部。該第二殼體具有一對應該工作區的殼蓋 部及一對應該第一接合部的第二接合部。 (B) 塗佈一結合物於該第一接合部與該第二接合部中 的至少一者上。 (C) 蓋合该第二殼體於該第一殼體上，以使該第二殼 體固定於該第一殼體上。 本發明之功效在於增加一隆起於該工作區與該第一接 合部間的擋止部，則當塗佈該結合物時，該擋止部可限制 該結合物塗佈的範圍，甚至當壓合該第一殼體與該第二殼 體時，該擋止部可防止該結合物進入該容室中，以確保該 毛細結構與工作流體的性質與功用不會因結合物而受到影 喜進而可保持该平板式熱管的散熱能力。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之三較佳實施例的詳細說明中，將可清 楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明内谷中’類似的元件是以相同的編號來表示。 $ 1 Θ 3及圖4，本發明平板式熱管的第一較佳實施例 包各一封裝單元2、一結合物5、一毛細結構3，以及〆工 作流體4。 辦5亥封裝單元2包括一第一殼體21及一形狀與該第一殼 體21相配合的第二殼體22。在本實施例中該第—殼體21 1266854 與該第二殼體22的材質為鋁與銅中的一種，但也可以為其 他具延展性且導熱性佳的材質。 … 該第-殼體21具有-工作區211、—圍繞於該工作區 211外並與該工作區211位於同—平面上的第—接合部 ’以及—隆起地位於該工㈣211與該第_接合部2 擋止部213。1266854 $ IX. Description of the Invention: [Technical Field] The present invention relates to a heat pipe, a manufacturing method thereof and a packaging unit, and more particularly to a flat plate heat pipe, a manufacturing method thereof and a packaging unit. [Prior Art] Referring to FIGS. 1 and 2, a conventional flat heat pipe 丨 includes a package unit n, a solder paste 13, a capillary structure 12, and a working fluid 14. The package unit η includes a first housing lu and a second housing 112 shaped to cooperate with the first housing 111. The first housing lu has a working area 113 and a first engaging portion surrounding the working area 113. The first joint portion 114 has a first channel 115 extending from the periphery thereof to the work area ι 3 and a filling tube 116 embedded in the first channel 115. The second housing 112 covers the first housing 111 and has a cover portion 117 spaced apart from the working area 113 and a second engaging portion 118 on the first joint portion 114. The second engaging portion 118 has a second channel 119 that cooperates with the first channel 115 and is adapted to receive the filling tube 116. The tin T 13 is disposed between the first joint portion 丨丨4 and the second joint portion 118 for bonding the first joint portion 丨14 and the second joint portion 118. The capillary structure 12 and the working fluid 14 are located in a chamber 110 defined by the working area 113 of the first housing 111 and the cover portion 117 of the second housing 12. When the flat heat pipe 1 is combined, first, a solder paste (flux 1266854) is applied to the first bonding portion 114 and the second bonding portion ι 8 , and then the capillary structure 12 is placed on the housing (1). Between the guard area ι 3 and the cover portion 117 of the second casing 112, a jig/, a combination of the first (fourth) m and the second casing 112 is used to make the first connection portion The second joint 胄118 is bonded by the tin f丨3. Then, the flat heat pipe 1 is placed in a high-temperature furnace (not shown) for baking and then cooled, and the solder paste η can make the first The housing (1) and the second housing ι 2 are airtightly sealed and then filled into the chamber 110 via the filling tube 116. When the first housing m and the second housing 112 are pressed together At the same time, part of the tin guest u easily enters into the chamber of the package unit u due to the force pressing, and affects the property f and function of the capillary structure 12 and the red fluid 14, thereby reducing the heat dissipation capability of the flat heat pipe 1. In particular, the flux in the solder paste 13 is used to oxidize the oxide layer (not shown) on the bonding portions 2, 118 and inhibit the oxidation of the tin itself to make 1 anti-oxidation. (eutectlcreact_) can be fully completed, so that the companion body 111 and the second casing 112 are hermetically bonded. Therefore, the flux used for rot is acidic and fluid, and the infiltration condition makes it easier to purchase the capillary structure. 12 and the nature and function of the working fluid 14 are further reduced::; heat dissipation capability of the flat heat pipe 1. - [Invention] Therefore, the object of the present invention is to provide a stable ability to achieve divergence Flat-plate heat pipe. Another object of the present invention is to manufacture a flat-plate heat pipe capable of achieving a heat-dissipating capacity of 1,268,854 in a k-bar. - The present invention is intended to provide It is ensured that the conjugate does not enter the valley and affects the properties of the capillary structure and the working fluid, and the flat heat pipe and its packaging unit for maintaining the political and Sb forces. A further object of the present invention is Providing a λ ^ ^ . Tan-making method and packaging method for a flat-plate heat pipe that ensures that the conjugate does not enter the valley to affect the properties of the capillary structure and the fluid and the heat dissipation capability of the utility." A further object of the present invention is to provide a flat heat pipe and a package unit thereof which have a better inspection effect between the two housings. The method for manufacturing a flat plate with better h effect between the two shells and the sealing method thereof. Thus, the flat heat pipe of the present invention comprises a package unit and a combination Ο the package unit includes a second brother and a shape a second housing that is matched with the first housing. The first housing and the right housing are located from a second working area outside the wide working area, surrounding the interface, and a raised area is located in the working area.擒 The stop between the first and the joint portions. The second housing covers the first housing and has a housing cover portion spaced apart from the working area and a second engagement portion on the first engagement portion. The conjugate is located between the first joint portion and the second joint portion and is used to bond the first joint portion and the second joint portion. Therefore, the manufacturing method of the slab-type flat heat pipe comprises the following steps: (Α) providing a first casing and a shape-matching with the first casing--the working area, and surrounding the work A first joint portion 'outside the region 1668584 and a stop portion between the work area and the first joint portion are raised. The second housing has a pair of housing portions that should be the working area and a pair of second engaging portions that should be the first engaging portions. (B) applying a bond to at least one of the first joint portion and the second joint portion. (C) closing the second housing on the first housing to fix the second housing to the first housing. The effect of the present invention is to increase a ridge between the working area and the first joint, and when the conjugate is applied, the stop can limit the range of coating of the conjugate even when pressed When the first housing and the second housing are combined, the blocking portion prevents the conjugate from entering the chamber to ensure that the properties and functions of the capillary structure and the working fluid are not affected by the combination. In turn, the heat dissipation capability of the flat heat pipe can be maintained. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of FIG. Before the present invention is described in detail, it is to be noted that in the following description, like elements are denoted by the same reference numerals. $1 Θ 3 and Fig. 4, a first preferred embodiment of the flat heat pipe of the present invention comprises a package unit 2, a conjugate 5, a capillary structure 3, and a working fluid 4. The 5H package unit 2 includes a first housing 21 and a second housing 22 shaped to cooperate with the first housing 21. In the present embodiment, the material of the first case 21 1266854 and the second case 22 is one of aluminum and copper, but it may be a material having ductility and good thermal conductivity. The first housing 21 has a working area 211, a first joint portion that surrounds the working area 211 and is located on the same plane as the working area 211, and a raised position is located at the work (four) 211 and the first Joint portion 2 stopper portion 213.
喊止部213具有-自該工作區211的周緣朝上延伸的 第一段217、-自該第-段217的末端轉折朝遠離該工作區 211方向延伸的第二段218，以及一自該第二段218的末端 轉折向下延伸的第三段219。 在本實施例中，該第一殼體21為模鑄_體成型，但也 可以用電鑄或其他加工方法將該播止冑213固定於該工作 區211與該第一接合部212間。 該第一接合部212具有一自其周緣延伸至該工作區2ιι 的第-槽道2U及-喪置於該第—槽道214内的充填管215 ，且該充填管215於封裝後經夾焊方式讓遠離該工作區2ΐι 的一端係構成一密封端（容後再述）。在本實施例中該第一 接合部212為一水平壁，但也可以是其他形狀。 該第二殼體22係覆蓋於該第一殼體21上，且具有一 間隔地位於該工作㊣211上的殼蓋部221及-位於該第一接 合部212上的第二接合部如。該殼蓋部22ι具有—尺寸大 於該工作區211的頂面223及一自該頂面223周圍向下延伸 且位於該擋止部213外的直立壁224。該第二接合部222具 有一與該第一槽道214配合並適合供嵌置該充填管215的 1266854 1 帛二槽道225。在本實施例中該第二接合部222為_水平壁 ，但也可以是與該第一接合部212相配合的其他形狀。 該結合物5位於該第一接合部212與該第二接合部222 間並被用以黏合該第一接合部212與該第二接合部。在 - 本貫施例中該結合物5是含有助焊劑的錫膏，但也可以是 • 不含助焊劑的錫絲或可使該第一接合部212與該第二接合 . 冑222㈣的膠或黏著劑。該助焊劑是為了腐料該等接 φ 口邛212 222上的氧化層（圖未示）及抑制錫本身氧化， 以使共晶反應能夠充分完成’如此才能確保該第一殼體幻 與遠弟一设體22為氣密結合。 但亦可使用無助焊劑的錫、絲，然後利用氣氛（ protective gas)去保護該等接合部212、222以防止氧化。 例如使用包含95 %氮氣與5 %氫氣的氣氛，則氮氣可作為 保護氣體，而氫氣則可和該等接合部212、222上的氧化物 進行還原反應以去除氧化物，故可取代助焊劑的功用。 春該毛細結構3與該工作流體4位於-由該第一殼體21 的工作區211與該第二殼體22的殼蓋部221共同界定出的 容室23内。在本實施例中該毛細結構3為―被該工作流體 • 4所/叉/間的金屬網’並包括複數相互連通的毛細孔31。但 4毛細、、、"構3也可以用其他方式形成，如該毛細結構3包 括複數直立的毛細管（圖未示），或該毛細結構3直接形成 於該工作區211或該殼蓋部221。 該毛細結構3可使液體發生毛細現象，所以當該毛細 、、’σ構3的°卩伤與一液體接觸時，該液體可經由該毛細妹 10 文简854 才3才产.jj.* 力方/'政至該毛細結構3的其它部份，且此擴散過程與重 3的+向，關。因此，該等毛細孔31的大小需依該毛細結構 、材質，及配合該毛細結構3所使用的工作流體4而定。 本A知例中该工作流體4為水，但也可以為諸如甲 •。或丙醇等等之類的其他材料。 置〇 ^封裝單兀2更包括一吸熱端24及一散熱端25，其位 亨^…、且"亥各至23内的壓力等於該工作流體4的餘和 :炙^使忒工作流體4處於液態與氣態共存的穩定平衡 您。 、 田忒吸熱端24受熱而升溫時，位於該吸熱端24之工 作流^ 4的穩定平衡態被破壞，使位於該吸熱端24的液態 =作机體4蒸發成氣態工作流體4。則該吸熱端24的蒸氣 壓大於該散熱端25的蒸氣壓，使該氣態工作流體4由該吸 熱端24往該散熱端25擴散。由於該散熱端25的溫度較低 ’使位於該散熱端25的氣態工作流體4凝結成液態工作流 脰4過畺的液恶工作流體4便經由該毛細結構3流回該吸 熱女而24 ’如此便完成—將熱量由該吸熱端24傳至該散熱端 2 5的導熱流程。 » 該導熱流程是因為該工作流體4的穩定平衡態被破壞 而產生所乂/、要§亥吸熱端24與該散熱端25間有溫差， 該導熱流程便會一直循環進行以傳導熱量。但不同的工作 流體4有不同的工作溫度’故當工作環境的溫度超出該工 作温度時，該導熱流程便無法進行。 在下文中參閱圖3、圖4及圖5並依據前述的構件來 11 1266854 說明本實施例平板式熱管的製造方法。The shouting portion 213 has a first segment 217 extending upward from the periphery of the working area 211, a second segment 218 extending from the end of the first segment 217 toward the working area 211, and a The end of the second section 218 is turned into a third section 219 that extends downward. In the present embodiment, the first housing 21 is formed by molding, but the tamping 213 may be fixed between the working area 211 and the first joint portion 212 by electroforming or other processing methods. The first joint portion 212 has a first channel 2U extending from the periphery thereof to the working area 2 ι and a filling tube 215 disposed in the first channel 214, and the filling tube 215 is clipped after being packaged. The welding method allows the end away from the working area 2 ΐ to form a sealed end (described later). In the present embodiment, the first joint portion 212 is a horizontal wall, but may have other shapes. The second housing 22 covers the first housing 21 and has a cover portion 221 spaced apart from the working portion 211 and a second engaging portion located on the first engaging portion 212. The cover portion 22i has a top surface 223 that is larger than the working area 211 and an upright wall 224 that extends downward from the top surface 223 and is located outside the stop portion 213. The second engaging portion 222 has a 1266854 1 second channel 225 that cooperates with the first channel 214 and is adapted to be embedded with the filling tube 215. In the present embodiment, the second joint portion 222 is a horizontal wall, but may be other shapes that match the first joint portion 212. The conjugate 5 is located between the first joint portion 212 and the second joint portion 222 and is used to bond the first joint portion 212 and the second joint portion. In the present embodiment, the bond 5 is a solder paste containing a flux, but may also be: a solder wire containing no flux or a bond between the first joint portion 212 and the second joint. 胄 222 (four) Or adhesive. The flux is used to oxidize the oxide layer on the φ port 212 222 (not shown) and to inhibit the oxidation of the tin itself, so that the eutectic reaction can be fully completed, so that the first shell is magical and far-reaching. The younger one is a gas-tight combination. However, tin or wire without flux can also be used, and then the joints 212, 222 are protected by a protective gas to prevent oxidation. For example, if an atmosphere containing 95% nitrogen and 5% hydrogen is used, nitrogen can be used as a shielding gas, and hydrogen can be reduced with the oxides on the joints 212, 222 to remove oxides, so that it can replace the flux. function. In spring, the capillary structure 3 is situated in the chamber 23 defined by the working area 211 of the first housing 21 and the cover portion 221 of the second housing 22. In the present embodiment, the capillary structure 3 is a "metal mesh" which is /crossed/interposed by the working fluid 4 and includes a plurality of capillary holes 31 which communicate with each other. However, the 4 capillary, , and 3 structures may be formed in other manners, such as the capillary structure 3 including a plurality of upstanding capillary tubes (not shown), or the capillary structure 3 is directly formed in the working area 211 or the cover portion. 221. The capillary structure 3 can cause the liquid to be capillary, so that when the capillary, the 'sigma 3', is in contact with a liquid, the liquid can be produced via the capillary 10, only 854. Force side / 'political to the other part of the capillary structure 3, and this diffusion process and the + direction of the heavy 3, off. Therefore, the size of the capillary holes 31 depends on the capillary structure, the material, and the working fluid 4 used to match the capillary structure 3. In the case of the present invention, the working fluid 4 is water, but may also be, for example, a. Or other materials such as propanol and the like. The package unit 2 further includes a heat absorbing end 24 and a heat dissipating end 25, and the pressure in the range is equal to the remainder of the working fluid 4: 炙^ makes the working fluid 4 in a stable balance between liquid and gas coexistence. When the endothermic end 24 of the field is heated and heated, the stable equilibrium state of the working stream 4 at the endothermic end 24 is destroyed, and the liquid state at the endothermic end 24 is evaporated into the gaseous working fluid 4. Then, the vapor pressure of the heat absorbing end 24 is greater than the vapor pressure of the heat radiating end 25, so that the gaseous working fluid 4 is diffused from the heat absorbing end 24 toward the heat radiating end 25. Since the temperature of the heat radiating end 25 is lower, the liquid working fluid 4 located at the heat radiating end 25 is condensed into a liquid working fluid, and the liquid working fluid 4 flowing through the capillary structure 3 flows back to the heat absorbing female 24' This is done by transferring heat from the endothermic end 24 to the heat transfer process of the heat sink end 25. » The thermal conduction process is caused by the fact that the stable equilibrium state of the working fluid 4 is destroyed, and there is a temperature difference between the heat absorbing end 24 and the heat radiating end 25, and the heat transfer process is circulated to conduct heat. However, different working fluids 4 have different operating temperatures. Therefore, when the temperature of the working environment exceeds the working temperature, the thermal conduction process cannot be performed. The method of manufacturing the flat heat pipe of this embodiment will be described hereinafter with reference to Figs. 3, 4 and 5 and in accordance with the aforementioned member 11 1266854.
在步驟61中，提供該第一殼體21及第二殼體22，且 把該充填管215嵌置於該第一殼體21的第一槽道214内， 此刻，該充填管215的長度係大於該第一槽冑214的長度 ，使該充填管215的-端可穿過該擋止部213連通至該工 作區211而另一端係外露於該第一殼體21外。 A 在步驟62中，塗佈該結合物5於該第—接合部2i2盘 :第，接合部222令的至少-者上。在本實施例中該結： 物5是錫膏，且同時塗佈於 合部如上。土佈於…接合部212與該第二接 在步驟63中，於該第—殼體21的工作區2ιι形成一毛 =構3。在本實施例中該毛細結構3為金屬網。熟習該項 技藝者當知，步驟62盥步嵊0 /、步驟63的執行順序可依設計需求 而調整，ϋ不應受限於本實施例所揭露者。 在步驟64中，蓋合該第二殼體22於該第一殼體21上 =以-夹具Μ見圖8)來爽置該已蓋合的第二殼體22 與弟一殼體21以固定兩者間的位置，使該第二殼體22定 位於該第一殼體21上。 …本實施例的結合物5是錫膏，故在步驟65中，送入一 :溫爐_(圖未示）或以一熱風搶（圖未示）來加熱該已蓋 =弟一设體22與第一殼體2ι ’使該錫膏炼融以黏著於該 弟—接合部212與該第二接合部m。在加熱完成後，讓高 =的該第-、第二殼體21、22冷卻以抑該結合物5使兩 者間黏者較，使該容室23成為—僅有該充填管215可向 12 1266854 外界連通之空間。該高溫爐可為一回焊爐（圖未示）。熟習 4項技藝者當知，若該結合物5不含錫則跳過步驟65，逕 自執行步驟66。 右4第一接合部212與第二接合部222間未完全密合 、弋表《亥谷至23除充填管215外還有其他地方可向外界連 通可旎會導致該平板式熱管無法正常工作。故，本實施 例在步驟66巾，先利用茂漏測試來確認經前述封裝流程（指 步驟61〜65)後的該第—接合部212與該第二接合部如^ 否：合。若步驟66中判斷未完全密合，指錢漏情況發生 、s自、、、口束而不再對该平板式熱管作後續的製造流程，以 (免不良。口的產生。反之’若步驟66中判斷是密合時，始 執行步驟67來繼續後續製造流程。 在步驟67中，以一除氣充填機（圖未示）經該充填管 215充填一工作流體4至該容室23内。 在步驟68中’再以該除氣充填機經該充填管215來降 =容室23與充填管215内的壓力，以抽除該容室23内 =餘氣^，使當該容室23内的壓力等於該工作流體 飽和瘵氣壓。 在步驟69中，以_ &，卜曰十斗、+丄 夾知方式來封閉該充填管215外露 勺一端。該夾烊方式為用一夹 營215 &其 、 人口钺（圖未不）夾合該充填 2 ' …Ά用—剪斷機（圖未示）剪斷該充填管 :再用：焊縫機（圖未示）點谭該充填管215，使該充 填官215几全氣密’以完成平板式熱管的製造。 又，該第—殼體21的工作區211除可與該第一接合部 13 1266854 位於同平面上外，該工作區211也可不與該第一接合 部二部位於同一平面上’指該工作區2ιι之平面高或低於 δ亥弟-接合部212的平面’用以調整該容室23内的空間。 參閱圖6’本發明平板式熱管的第二較佳實施例中該第一殼 體21之卫作區211’的平面低於該第-接合部212,的平面， 以增加該容室23内的空間。 另外，當錫膏顆粒較大時，需使用管徑更大的針頭（ 圖未不）塗佈料，關膏容易溢流過多而進人該容室23 中。故參_ 7，本㈣平板式熱管之第三較佳實施例的第 接口 4 212 ϋ具有一沿其周緣延伸的凹槽，以於封 裝過程中容置較大顆粒或溢流過多的錫膏於其中，以防止 錫貧進入該容室23中。又，為增加該第一、第二接合部 212”、222”間的密合度，本實施例中該第二接合部222” 更具有一沿其周緣延伸的凹槽226及一容置於該凹槽226 内的密：環（。，)227。熟習該項嶋 228亦可設置於該第二接合部奶，，上，及該凹槽226亦可 設置於該第一接合部2〗μ ^ 露者。 ή 212上，並不應受限於本實施例所揭 歸納上述’本發明平板式熱管及其製造方法血封裝單 由增加一隆起於該工作區211、211，與該第一接： 212、212，、212，，間的播止部⑴，以於塗佈該結合物5時 ，利用該播止部213來限制該結合物5塗佈的範圍，甚至 :塵合與加熱該第一殼冑21、21，與該第二殼體& 猎由該撞止部2U阻播該結合物5進人該容室23中，以確 14In the step 61, the first housing 21 and the second housing 22 are provided, and the filling tube 215 is embedded in the first channel 214 of the first housing 21. At this moment, the length of the filling tube 215 The length of the first tank 214 is greater than the length of the first tank 214 so that the end of the filling tube 215 can communicate with the working area 211 and the other end is exposed outside the first casing 21. A In step 62, the conjugate 5 is applied to at least the upper portion of the first joint portion 2i2. In the present embodiment, the junction 5 is a solder paste and is simultaneously applied to the joint as above. The soil cloth is joined to the second portion in step 63, and a hairy structure 3 is formed in the working area 2 of the first casing 21. In the present embodiment, the capillary structure 3 is a metal mesh. Those skilled in the art will recognize that the order of execution of step 62/step 63 can be adjusted according to design requirements and should not be limited to those disclosed in this embodiment. In step 64, the second housing 22 is closed on the first housing 21, and the second housing 22 and the second housing 21 are closed. The position between the two is fixed such that the second housing 22 is positioned on the first housing 21. The conjugate 5 of the present embodiment is a solder paste. Therefore, in step 65, a heater _ (not shown) or a hot air (not shown) is used to heat the cover. 22 and the first casing 2 ι 'make the solder paste to adhere to the joint portion 212 and the second joint portion m. After the heating is completed, the first and second casings 21 and 22 of the high= are cooled to suppress the conjugate 5 from being viscous, so that the chamber 23 becomes—only the filling tube 215 can be 12 1266854 Space for external communication. The high temperature furnace can be a reflow furnace (not shown). It is known to those skilled in the art that if the combination 5 does not contain tin, step 65 is skipped and step 66 is performed. The right 4th joint portion 212 and the second joint portion 222 are not completely in close contact with each other, and there is a place other than the filling tube 215 except for the filling tube 215, which can be connected to the outside, which may cause the flat type heat pipe to fail to work normally. . Therefore, in the embodiment, in step 66, the leak test is used to confirm that the first joint portion 212 and the second joint portion after the packaging process (refer to steps 61 to 65) are combined. If the judgment in step 66 is not completely close, the money leakage situation occurs, the s self, the s, and the mouth bundle are no longer subjected to the subsequent manufacturing process of the flat heat pipe, so as to avoid the bad. The mouth is generated. When it is determined that the adhesion is 66, the process 67 is continued to continue the subsequent manufacturing process. In step 67, a working fluid 4 is filled into the chamber 23 via the filling tube 215 by a degassing filling machine (not shown). In step 68, the degassing filling machine is further used to reduce the pressure in the chamber 23 and the filling tube 215 through the filling tube 215 to evacuate the inside of the chamber 23 to the residual gas, so that the chamber is The pressure in 23 is equal to the saturation pressure of the working fluid. In step 69, one end of the outer opening of the filling tube 215 is closed by means of _ &, 曰 曰 、, + 丄 。 。. Camp 215 & its population, 钺 (not shown), the filling 2 ' ... Ά - shearing machine (not shown) cut the filling pipe: reuse: weld machine (not shown) point Tan The filling pipe 215 causes the filling member 215 to be completely airtight to complete the manufacture of the flat heat pipe. Further, the work of the first casing 21 The area 211 may be located on the same plane as the first joint portion 13 1266854, and the work area 211 may not be on the same plane as the first joint portion, which means that the plane of the work area 2 ιι is higher or lower than δ hai. The plane of the joint portion 212 is used to adjust the space in the chamber 23. Referring to Fig. 6', the plane of the guard area 211' of the first casing 21 in the second preferred embodiment of the flat heat pipe of the present invention. Lower than the plane of the first joint portion 212, to increase the space in the chamber 23. In addition, when the solder paste particles are large, it is necessary to use a needle having a larger diameter (not shown) to coat the material. The paste easily overflows too much into the chamber 23. Therefore, the third interface of the third preferred embodiment of the present invention has a groove extending along the periphery thereof for packaging. In the process, a larger particle or an excessively overflowing solder paste is accommodated therein to prevent tin from entering the chamber 23. Further, in order to increase the adhesion between the first and second joint portions 212", 222", In this embodiment, the second engaging portion 222 ′′ further has a recess 226 extending along a circumference thereof and a receiving portion The inside of the groove 226 is dense: the ring (.,) 227. The enthalpy 228 can also be disposed on the second joint portion of the milk, and the groove 226 can also be disposed at the first joint portion 2 μ ^ ή 212, ή 212, should not be limited by the embodiment of the present invention, the above-mentioned flat heat pipe and its manufacturing method blood packaging list by adding a ridge in the working area 211, 211, and the first connection : 212, 212, 212, between the broadcast portion (1), when the conjugate 5 is applied, the splicing portion 213 is used to limit the range of application of the conjugate 5, even: dusting and heating The first casings 21, 21, and the second casing & the hunting device 2U block the combination 5 from entering the chamber 23 to confirm
^266854 工作〜 ^人⑪谷室〜㈣響該毛細結構3盘 工作流體4的性暂盘工六、社 〃 設計可輔助容置較大顆粒或溢流過多的錫膏，^ ^的 接合部222，，更具有一凹槽226 以弟一 密封璟乃7 , 谷置於该凹槽226内的 名封％ 227,以確保該第—、第二接合部Μη 融後又不溢流，進而達到提高產品良率的功效， 故確實能達成本發明的目的。 淮以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明巾請:利 範圍及發明說明内容所作之簡單的等效變化與修飾，月皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體分解圖，說明習知平板式熱管； 圖2是-側視剖面圖，說明習知平板式熱管的組合情 圖3是-立體分解圖，說明本發明平板式熱管的第一 較佳實施例； 圖4是-側視剖面圖，說明該第—較佳實施例的組合 情形； 〇 圖5是-流程圖，說明該第—較佳實施例的製造方法 圖6是一側視剖面圖，說明本發明平板式熱管的第 較佳實施例； 15 1266854 圖7是一側視剖面圖，說明本發明平板式熱管的第三 較佳實施例；及 圖8是一示意圖，說明該第一較佳實施例的製造方法 中以一夾具來夾置已蓋合的一第二殼體與一第一殼體。 16 1266854^266854 Work ~ ^ Person 11 Valley Room ~ (four) ringing the capillary structure 3 disk working fluid 4 sex temporary work six, community design can assist in accommodating larger particles or overflowing excess solder paste, ^ ^ joint 222, further having a recess 226 to seal the seal 7 and the valley is placed in the recess 226 by the name % 227 to ensure that the first and second joints Μη melt and then do not overflow, and further The effect of improving the yield of the product is achieved, so that the object of the present invention can be achieved. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the practice of the present invention, that is, the simple equivalent change between the scope of the invention and the description of the invention. Modifications, months are still within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing a conventional flat heat pipe; FIG. 2 is a side cross-sectional view showing a combination of a conventional flat heat pipe and an exploded perspective view illustrating the present invention. A preferred embodiment of the flat heat pipe; Fig. 4 is a side cross-sectional view showing the combination of the first preferred embodiment; and Fig. 5 is a flow chart showing the manufacture of the first preferred embodiment Figure 6 is a side elevational view showing a preferred embodiment of the flat heat pipe of the present invention; 15 1266854 Figure 7 is a side cross-sectional view showing a third preferred embodiment of the flat heat pipe of the present invention; 8 is a schematic view showing the manufacturing method of the first preferred embodiment in which a second housing and a first housing that are closed are sandwiched by a clamp. 16 1266854
【主要元件符號說明】 1 ..........平板式熱管 11…… …封裝單元 110 ···· …容室 111 ···· …第一殼體 112 ···· …第二殼體 113 ··.· …工作區 114 ···· …第一接合部 115 ···. …第一槽道 116 ·_·· …充填管 117 ···· …殼蓋部 118 ···· …弟一接合部 119 ···· …第二槽道 12…… …毛細結構 13…… …錫膏 14…… …工作流體 2 ....... …封裝單元 21…… …第一殼體 21，…·· …第一殼體 211 …·· …工作區 211，… …工作區 212 ·… …第一接合部 212,… …第一接合部 212，，·· …第一接合部 213 .......擋止部 214 .......第一槽道 215……充填管 217 .......第一段 218 .......第二段 219 .......第三段 22 .........第二殼體 221 .......殼蓋部 222 .......第二接合部 222” ··…第二接合部 223 .......頂面 224 .......直立壁 225 .......第二槽道 226 .......凹槽 227 .......密封環 228 .......凹槽 23 .........容室 24 .........吸熱端 25 .........散熱端 3 ..........毛細結構 31.........毛細孔 4 ..........工作流體 5 ..........結合物 17 1266854 61〜6 9 ·…步驟 7 ..........夾具[Description of main component symbols] 1 .......... Flat heat pipe 11 ... ... package unit 110 ···· ... chamber 111 ····...first housing 112 ...··· Second housing 113 ···· ... working area 114 ····...first joint portion 115 ···....first channel 116 ·_·· ...fill tube 117 ····· cover cover portion 118 ···· ... a joint portion 119 ···· ...the second channel 12 ... ... capillary structure 13 ... ... solder paste 14 ... ... working fluid 2 ... ... ... package unit 21 ... First housing 21, ..... ... first housing 211 ... ... ... ... working area 211, ... working area 212 ... ... first joint portion 212, ... first joint portion 212, ... ...the first joint portion 213 . . . the stop portion 214 .... the first channel 215 ... the filling tube 217 .... the first segment 218 ..... .. second paragraph 219 .... third paragraph 22 ......... second housing 221 .... shell cover portion 222 .... Two joints 222" ..... second joint portion 223 .... top surface 224 .... upright wall 225 .... second channel 226 ..... .. groove 227 .......seal ring 228 ....... recess 23 ... ... chamber 24 ... ... endothermic end 25 ... ... heat sink end ... .......capillary structure 31.........capillary hole 4 ..... working fluid 5 .......... combination 17 1266854 61 ~6 9 ·...Step 7 .......... Fixture
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