TW200729310A - Two-fluid jet module for cleaning substrate and cleaning device using thereof - Google Patents

Two-fluid jet module for cleaning substrate and cleaning device using thereof

Info

Publication number
TW200729310A
TW200729310A TW095133094A TW95133094A TW200729310A TW 200729310 A TW200729310 A TW 200729310A TW 095133094 A TW095133094 A TW 095133094A TW 95133094 A TW95133094 A TW 95133094A TW 200729310 A TW200729310 A TW 200729310A
Authority
TW
Taiwan
Prior art keywords
cleaning
fluid jet
jet module
receiving
substrate
Prior art date
Application number
TW095133094A
Other languages
English (en)
Other versions
TWI323913B (en
Inventor
Geun-Sik Yoon
Hee-Sung Chae
Original Assignee
K C Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K C Tech Co Ltd filed Critical K C Tech Co Ltd
Publication of TW200729310A publication Critical patent/TW200729310A/zh
Application granted granted Critical
Publication of TWI323913B publication Critical patent/TWI323913B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Nozzles (AREA)
TW095133094A 2005-12-29 2006-09-07 Two-fluid jet module for cleaning substrate and cleaning device using thereof TWI323913B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050133727A KR100728882B1 (ko) 2005-12-29 2005-12-29 기판세정용 이류체 분사모듈 및 이를 이용한 기판세정장치

Publications (2)

Publication Number Publication Date
TW200729310A true TW200729310A (en) 2007-08-01
TWI323913B TWI323913B (en) 2010-04-21

Family

ID=38212791

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133094A TWI323913B (en) 2005-12-29 2006-09-07 Two-fluid jet module for cleaning substrate and cleaning device using thereof

Country Status (3)

Country Link
KR (1) KR100728882B1 (zh)
CN (1) CN1990124A (zh)
TW (1) TWI323913B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101617347B1 (ko) * 2014-12-16 2016-05-02 주식회사 케이씨텍 블록형 버블젯 세정 노즐
US9810676B2 (en) * 2015-01-12 2017-11-07 Ecolab Usa Inc. Apparatus for, system for and methods of maintaining sensor accuracy
CN112775096B (zh) * 2019-11-11 2022-04-05 安徽汇久管业有限公司 一种不锈钢管件用超声波清洗设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003145064A (ja) * 2001-11-12 2003-05-20 Tokyo Electron Ltd ２流体ジェットノズル及び基板洗浄装置
JP2004344689A (ja) * 2003-05-19 2004-12-09 Ikeuchi:Kk ２流体ノズル
JP4464850B2 (ja) * 2004-03-09 2010-05-19 株式会社ルネサステクノロジ 基板洗浄用２流体ノズル及び基板洗浄装置

Also Published As

Publication number Publication date
TWI323913B (en) 2010-04-21
KR100728882B1 (ko) 2007-06-15
CN1990124A (zh) 2007-07-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees