TW200729239A - Insulation sheet for the conductive junction sheet, conductive junction sheet, manufacturing method of conductive junction sheet, and manufacturing method of electrical composite parts - Google Patents

Insulation sheet for the conductive junction sheet, conductive junction sheet, manufacturing method of conductive junction sheet, and manufacturing method of electrical composite parts

Info

Publication number
TW200729239A
TW200729239A TW095139273A TW95139273A TW200729239A TW 200729239 A TW200729239 A TW 200729239A TW 095139273 A TW095139273 A TW 095139273A TW 95139273 A TW95139273 A TW 95139273A TW 200729239 A TW200729239 A TW 200729239A
Authority
TW
Taiwan
Prior art keywords
sheet
conductive junction
manufacturing
junction sheet
conductive
Prior art date
Application number
TW095139273A
Other languages
Chinese (zh)
Other versions
TWI423269B (en
Inventor
Tomonori Shinoda
Osamu Yamazaki
Naoya Saiki
Masaaki Furudate
Yuji Kawamata
Takeshi Tashima
Masato Shimamura
Masako Watanabe
Masazumi Amagai
Original Assignee
Lintec Corp
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp, Senju Metal Industry Co filed Critical Lintec Corp
Publication of TW200729239A publication Critical patent/TW200729239A/en
Application granted granted Critical
Publication of TWI423269B publication Critical patent/TWI423269B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Insulating Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

This invention provides an insulation sheet for a conductive junction sheet characterized with an adhesive layer supporting at least one layer of conductive particles, a conductive junction sheet using the insulation sheet, and a manufacturing method of electrical composite parts using the conductive junction sheet. The insulation sheet for the conductive junction sheet, the conductive junction sheet, and the manufacturing method of electrical composite parts using the conductive junction sheets can fix the arranged conductive particles toughly for preventing from elimination thereof.
TW095139273A 2005-10-26 2006-10-25 Insulation sheet for the conductive junction sheet, conductive junction sheet, manufacturing method of conductive junction sheet, and manufacturing method of electrical composite parts TWI423269B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005311379A JP4970767B2 (en) 2005-10-26 2005-10-26 Insulating sheet for conductive bonding sheet, conductive bonding sheet, method for manufacturing conductive bonding sheet, and method for manufacturing electronic composite component

Publications (2)

Publication Number Publication Date
TW200729239A true TW200729239A (en) 2007-08-01
TWI423269B TWI423269B (en) 2014-01-11

Family

ID=37967660

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139273A TWI423269B (en) 2005-10-26 2006-10-25 Insulation sheet for the conductive junction sheet, conductive junction sheet, manufacturing method of conductive junction sheet, and manufacturing method of electrical composite parts

Country Status (3)

Country Link
JP (1) JP4970767B2 (en)
TW (1) TWI423269B (en)
WO (1) WO2007049548A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI507093B (en) * 2007-12-19 2015-11-01 Lam Res Corp A composite showerhead electrode assembly for a plasma processing apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5018399B2 (en) * 2007-10-26 2012-09-05 富士通株式会社 Circuit board manufacturing method
JP5104687B2 (en) * 2008-09-19 2012-12-19 日本電気株式会社 Bonding sheet, electronic circuit device, and manufacturing method
JP5631654B2 (en) * 2010-07-28 2014-11-26 デクセリアルズ株式会社 Manufacturing method and connection method of mounting body
JP5696852B2 (en) * 2011-10-26 2015-04-08 Tdk株式会社 Solder connection sheet and electronic component mounting method using the same
WO2015016207A1 (en) * 2013-07-31 2015-02-05 デクセリアルズ株式会社 Anisotropically conductive film and manufacturing method therefor
JP6382228B2 (en) * 2014-08-29 2018-08-29 古河電気工業株式会社 Conductive adhesive film
JP5935938B1 (en) * 2015-12-28 2016-06-15 千住金属工業株式会社 A conductive bonding sheet and a method for manufacturing the conductive bonding sheet.

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313840A (en) * 1992-10-30 1994-05-24 At&T Bell Laboratories Tactile shear sensor using anisotropically conductive material
JP3622792B2 (en) * 1994-11-25 2005-02-23 日立化成工業株式会社 Connection member and electrode connection structure and connection method using the connection member
JP4473661B2 (en) * 1995-02-07 2010-06-02 日立化成工業株式会社 Connecting member
JP4433564B2 (en) * 2000-05-17 2010-03-17 日立化成工業株式会社 Adhesive for circuit connection
JP4130747B2 (en) * 2002-03-28 2008-08-06 旭化成エレクトロニクス株式会社 Anisotropic conductive adhesive sheet and manufacturing method thereof
JP2004214461A (en) * 2003-01-06 2004-07-29 Sony Corp Bonding sheet and its manufacturing method, bonding structure and bonding method employing bonding sheet
JP4238124B2 (en) * 2003-01-07 2009-03-11 積水化学工業株式会社 Curable resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component assembly
JP4386161B2 (en) * 2003-03-14 2009-12-16 セイコーエプソン株式会社 Conductive film pattern and method for forming the same, wiring board, and electronic device
JP2004006417A (en) * 2003-08-22 2004-01-08 Hitachi Chem Co Ltd Connecting element and connection structure of electrode using this

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI507093B (en) * 2007-12-19 2015-11-01 Lam Res Corp A composite showerhead electrode assembly for a plasma processing apparatus

Also Published As

Publication number Publication date
WO2007049548A1 (en) 2007-05-03
TWI423269B (en) 2014-01-11
JP4970767B2 (en) 2012-07-11
JP2007122965A (en) 2007-05-17

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