TW200727760A - Circuit substrate and method of fabricating the same - Google Patents
Circuit substrate and method of fabricating the sameInfo
- Publication number
- TW200727760A TW200727760A TW095100422A TW95100422A TW200727760A TW 200727760 A TW200727760 A TW 200727760A TW 095100422 A TW095100422 A TW 095100422A TW 95100422 A TW95100422 A TW 95100422A TW 200727760 A TW200727760 A TW 200727760A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit
- dielectric layer
- circuit substrate
- fabricating
- same
- Prior art date
Links
Abstract
A circuit substrate comprising a dielectric layer, a first surface circuit, a second surface circuit and at least one conductive piece is provided. The dielectric layer has a first surface and a second surface. The first surface circuit is lodged in the first surface of the dielectric layer, and the outer surface of the first surface circuit is coplanar with the first surface. The second surface circuit is lodged in the second surface of the dielectric layer, and the outer surface of the second surface circuit is coplanar with the second surface. Besides, at least one conductive piece is arranged in the dielectric layer for electrically connecting the first surface circuit and the second surface circuit. Because the surface circuits are lodged in the upper side and the lower side of the dielectric layer respectively, therefore, the circuit substrate of the present invention has better planarity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95100422A TWI293547B (en) | 2006-01-05 | 2006-01-05 | Circuit substrate and method of fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95100422A TWI293547B (en) | 2006-01-05 | 2006-01-05 | Circuit substrate and method of fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200727760A true TW200727760A (en) | 2007-07-16 |
TWI293547B TWI293547B (en) | 2008-02-11 |
Family
ID=45067879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95100422A TWI293547B (en) | 2006-01-05 | 2006-01-05 | Circuit substrate and method of fabricating the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI293547B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8115104B2 (en) | 2008-06-11 | 2012-02-14 | Advanced Semiconductor Engineering, Inc. | Circuit board with buried conductive trace formed thereon and method for manufacturing the same |
US8450621B2 (en) | 2008-09-16 | 2013-05-28 | Unimicron Technology Corp. | Wiring board and process for fabricating the same |
TWI425898B (en) * | 2007-11-22 | 2014-02-01 | Unimicron Technology Corp | Method for fabricating wiring structure of circuit board |
-
2006
- 2006-01-05 TW TW95100422A patent/TWI293547B/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI425898B (en) * | 2007-11-22 | 2014-02-01 | Unimicron Technology Corp | Method for fabricating wiring structure of circuit board |
US8115104B2 (en) | 2008-06-11 | 2012-02-14 | Advanced Semiconductor Engineering, Inc. | Circuit board with buried conductive trace formed thereon and method for manufacturing the same |
TWI425896B (en) * | 2008-06-11 | 2014-02-01 | Advanced Semiconductor Eng | Circuit board with buried conductive trace formed thereon and method for manufacturing the same |
US8450621B2 (en) | 2008-09-16 | 2013-05-28 | Unimicron Technology Corp. | Wiring board and process for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
TWI293547B (en) | 2008-02-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200731898A (en) | Circuit board structure and method for fabricating the same | |
GB2488265A (en) | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | |
TW201003865A (en) | Substrate having semiconductor chip embedded therein and fabrication method thereof | |
GB2472953A (en) | Circuit module and method of manufacturing the same | |
WO2011084235A3 (en) | Glass core substrate for integrated circuit devices and methods of making the same | |
TW200726335A (en) | Substrate structure with capacitance component embedded therein and method for fabricating the same | |
WO2010145907A3 (en) | Methods and systems for fabrication of mems cmos devices | |
TW200701398A (en) | Interconnect structure for integrated circuits | |
WO2009057654A1 (en) | Part built-in wiring board, and manufacturing method for the part built-in wiring board | |
TW200717887A (en) | Thermoelectric device and method for fabricating the same and chip and electronic device | |
TW200731889A (en) | Method of fabricating substrate with embedded component therein | |
TW200703642A (en) | Semiconductor device having a lateral channel and contacts on opposing surfaces thereof | |
TW200731423A (en) | Circuit board with a semiconductor chip embedded therein | |
TW200639952A (en) | Surface roughing method for embedded semiconductor chip structure | |
TW200629998A (en) | Printed circuit board and forming method thereof | |
TW200833212A (en) | Circuit structure and process thereof | |
TW200944072A (en) | Method for manufacturing a substrate having embedded component therein | |
WO2009048154A1 (en) | Semiconductor device and method for designing the same | |
TW200610463A (en) | Circuit board and method of manufacturing the same | |
TW200739635A (en) | Embedded capacitors and methods for their fabrication and connection | |
TW200715470A (en) | Semiconductor structure and integrated circuit | |
WO2008155967A1 (en) | Board with built-in component and its manufacturing method | |
WO2009061789A3 (en) | Methods of forming magnetic vias to maximize inductance in integrated circuits and structures formed thereby | |
TW200737455A (en) | Method for fabricating a metal protecting layer on electrically connecting pad of circuit board | |
TW200715525A (en) | Semiconductor integrated circuit device and method for manufacturing same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MC4A | Revocation of granted patent |