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Application filed by Advanced Semiconductor EngfiledCriticalAdvanced Semiconductor Eng
Priority to TW095100040ApriorityCriticalpatent/TW200727430A/zh
Publication of TW200727430ApublicationCriticalpatent/TW200727430A/zh
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/11—Manufacturing methods
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(AREA)
TW095100040A2006-01-022006-01-02Bumping process and etching apparatus
TW200727430A
(en)