TW200727121A - Multi-element heat exchange assemblies and methods of fabrication for a cooling system - Google Patents

Multi-element heat exchange assemblies and methods of fabrication for a cooling system

Info

Publication number
TW200727121A
TW200727121A TW095143854A TW95143854A TW200727121A TW 200727121 A TW200727121 A TW 200727121A TW 095143854 A TW095143854 A TW 095143854A TW 95143854 A TW95143854 A TW 95143854A TW 200727121 A TW200727121 A TW 200727121A
Authority
TW
Taiwan
Prior art keywords
heat exchange
flow passages
outlet
coolant inlet
cooling system
Prior art date
Application number
TW095143854A
Other languages
English (en)
Inventor
Levi A Campbell
Madhusudan K Iyengar
Richard C Chu
Roger R Schmidt
Michael J Ellsworth Jr
Robert E Simons
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200727121A publication Critical patent/TW200727121A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/007—Auxiliary supports for elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW095143854A 2005-11-30 2006-11-27 Multi-element heat exchange assemblies and methods of fabrication for a cooling system TW200727121A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/290,757 US7272005B2 (en) 2005-11-30 2005-11-30 Multi-element heat exchange assemblies and methods of fabrication for a cooling system

Publications (1)

Publication Number Publication Date
TW200727121A true TW200727121A (en) 2007-07-16

Family

ID=38087218

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143854A TW200727121A (en) 2005-11-30 2006-11-27 Multi-element heat exchange assemblies and methods of fabrication for a cooling system

Country Status (3)

Country Link
US (1) US7272005B2 (zh)
CN (1) CN100531541C (zh)
TW (1) TW200727121A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417502B (zh) * 2011-06-15 2013-12-01 Inventec Corp 冷卻裝置

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7365973B2 (en) 2006-01-19 2008-04-29 American Power Conversion Corporation Cooling system and method
US8672732B2 (en) 2006-01-19 2014-03-18 Schneider Electric It Corporation Cooling system and method
WO2008024575A2 (en) * 2006-07-21 2008-02-28 The Curators Of The University Of Missouri A cryopreservation device and method
US8322155B2 (en) 2006-08-15 2012-12-04 American Power Conversion Corporation Method and apparatus for cooling
US8327656B2 (en) 2006-08-15 2012-12-11 American Power Conversion Corporation Method and apparatus for cooling
US9568206B2 (en) 2006-08-15 2017-02-14 Schneider Electric It Corporation Method and apparatus for cooling
KR100877574B1 (ko) * 2006-12-08 2009-01-08 한국원자력연구원 원자력 수소생산용 고온, 고압 및 내식성 공정 열교환기
US7681404B2 (en) 2006-12-18 2010-03-23 American Power Conversion Corporation Modular ice storage for uninterruptible chilled water
US8425287B2 (en) 2007-01-23 2013-04-23 Schneider Electric It Corporation In-row air containment and cooling system and method
ES2612328T3 (es) 2007-05-15 2017-05-16 Schneider Electric It Corporation Métodos y sistemas para gestionar potencia y enfriamiento de una instalación
US8082978B2 (en) * 2007-08-07 2011-12-27 Georgia Tech Research Corporation Fluid-to-fluid spot-to-spreader heat management devices and systems and methods of managing heat
TWM329810U (en) * 2007-08-31 2008-04-01 Yu-Nung Shen Heat dissipation device
US9157687B2 (en) * 2007-12-28 2015-10-13 Qcip Holdings, Llc Heat pipes incorporating microchannel heat exchangers
CA2882794C (en) 2008-02-15 2017-08-22 The Pnc Financial Services Group, Inc. Systems and methods for computer equipment management
WO2009134760A2 (en) * 2008-04-29 2009-11-05 Carrier Corporation Modular heat exchanger
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7961475B2 (en) 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7983040B2 (en) 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US8219362B2 (en) 2009-05-08 2012-07-10 American Power Conversion Corporation System and method for arranging equipment in a data center
WO2011093852A1 (en) * 2010-01-26 2011-08-04 Hewlett-Packard Development Company, L.P. Heat sink with multiple vapor chambers
US8522861B2 (en) * 2010-03-29 2013-09-03 Hamilton Sundstrand Space Systems International, Inc. Integral cold plate and structural member
US9310135B1 (en) * 2010-05-28 2016-04-12 Cool Energy, Inc. Configureable heat exchanger
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8688413B2 (en) 2010-12-30 2014-04-01 Christopher M. Healey System and method for sequential placement of cooling resources within data center layouts
US8804334B2 (en) * 2011-05-25 2014-08-12 International Business Machines Corporation Multi-rack, door-mounted heat exchanger
US9952103B2 (en) 2011-12-22 2018-04-24 Schneider Electric It Corporation Analysis of effect of transient events on temperature in a data center
EP2796025A4 (en) 2011-12-22 2016-06-29 Schneider Electric It Corp SYSTEM AND METHOD FOR PREDICTING TEMPERATURE VALUES IN AN ELECTRONIC SYSTEM
KR20140002347A (ko) * 2012-06-29 2014-01-08 삼성전기주식회사 냉각 장치
CN103841791A (zh) * 2012-11-21 2014-06-04 华为技术有限公司 换热装置及机柜
WO2014165088A1 (en) * 2013-03-12 2014-10-09 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Systems and methods of manufacturing microchannel arrays
CA2998860A1 (en) * 2015-09-21 2017-03-30 Lockheed Martin Corporation Unitary heat exchanger for circulating two coolant media for allowing two different cooling modes
US10371462B2 (en) 2015-09-21 2019-08-06 Lockheed Martin Corporation Integrated multi-chamber heat exchanger
US10527362B2 (en) 2015-09-21 2020-01-07 Lockheed Martin Corporation Integrated multi-chamber heat exchanger
CA3038059A1 (en) 2016-08-26 2018-03-01 Inertech Ip Llc Cooling systems and methods using single-phase fluid and a flat tube heat exchanger with counter-flow circuiting
US20180147800A1 (en) 2016-11-30 2018-05-31 The Boeing Company Configurable Cooling Assembly and Cooling Method
US10976120B2 (en) * 2017-10-13 2021-04-13 Hamilton Sundstrand Corporation Net shape moldable thermally conductive materials
US10681846B2 (en) 2018-04-19 2020-06-09 Google Llc Cooling electronic devices in a data center
US10645847B2 (en) 2018-04-20 2020-05-05 Google Llc Cooling electronic devices in a data center
US10225958B1 (en) * 2018-05-03 2019-03-05 Baidu Usa Llc Liquid cooling system for a data center
CN111406314B (zh) * 2018-06-27 2023-09-22 富士电机株式会社 冷却装置、半导体模块以及车辆
US10966352B2 (en) 2018-09-24 2021-03-30 Google Llc Cooling electronic devices in a data center
US10548239B1 (en) 2018-10-23 2020-01-28 Google Llc Cooling electronic devices in a data center
US10548240B1 (en) 2019-01-11 2020-01-28 Google Llc Cooling electronic devices in a data center
CN113994772B (zh) 2019-04-14 2023-05-16 捷控技术有限公司 基于直接接触流体的冷却模块
EP3726175B1 (de) 2019-04-17 2022-08-10 TechN GmbH Komponenten für ein fluidkühlsystem sowie fluidkühlsystem mit diesen komponenten
US11212943B2 (en) 2020-02-21 2021-12-28 Nvidia Corporation Universal pluggable datacenter cooling system
US20210278147A1 (en) * 2020-03-05 2021-09-09 Uchicago Argonne, Llc Additively Manufactured Modular Heat Exchanger Accommodating High Pressure, High Temperature and Corrosive Fluids
GB2586094B (en) * 2020-06-22 2022-06-15 Zhong Qingchang Rackless thermal-efficient modular power electronic system
WO2022047156A1 (en) * 2020-08-28 2022-03-03 Czero Inc. Carbon separation and removal from molten media
CN114158232A (zh) * 2020-09-08 2022-03-08 英业达科技有限公司 散热片与散热系统
US11963341B2 (en) 2020-09-15 2024-04-16 Jetcool Technologies Inc. High temperature electronic device thermal management system
US11211538B1 (en) 2020-12-23 2021-12-28 Joseph L. Pikulski Thermal management system for electrically-powered devices
US11641727B2 (en) * 2021-03-23 2023-05-02 Hewlett Packard Enterprise Development Lp Cooling system for an electronic circuit module
US11988471B2 (en) * 2021-03-27 2024-05-21 Massachusetts Institute Of Technology Devices and methods for fabrication of components of a multiscale porous high-temperature heat exchanger
US11765865B2 (en) * 2021-08-26 2023-09-19 Baidu Usa Llc Data center system for various electronic rack architectures
EP4181642A1 (en) * 2021-11-16 2023-05-17 JJ Cooling Innovation Sàrl Cooling system for electronic component racks
US20240114663A1 (en) * 2022-09-29 2024-04-04 Lear Corporation Cooling system and method of manufacturing a cooling system

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4858685A (en) * 1982-12-06 1989-08-22 Energigazdalkodasi Intezet Plate-type heat exchanger
FI79409C (fi) * 1987-07-13 1989-12-11 Pentti Raunio Foerfarande foer konstruering av en vaermevaexlare jaemte enligt foerfarandet konstruerad vaermevaexlare.
US5228515A (en) 1992-07-31 1993-07-20 Tran Hai H Modular, compact heat exchanger
US5655600A (en) * 1995-06-05 1997-08-12 Alliedsignal Inc. Composite plate pin or ribbon heat exchanger
JP4158225B2 (ja) * 1997-07-25 2008-10-01 株式会社デンソー 熱交換器および筐体冷却装置
JPH1194476A (ja) * 1997-09-25 1999-04-09 Konica Corp 熱交換器
US6675875B1 (en) 1999-08-06 2004-01-13 The Ohio State University Multi-layered micro-channel heat sink, devices and systems incorporating same
WO2001048432A1 (fr) * 1999-12-27 2001-07-05 Sumitomo Precision Products Co., Ltd. Echangeur thermique haute temperature a ailette plate
US6892802B2 (en) 2000-02-09 2005-05-17 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Crossflow micro heat exchanger
US6459581B1 (en) * 2000-12-19 2002-10-01 Harris Corporation Electronic device using evaporative micro-cooling and associated methods
US7004237B2 (en) * 2001-06-29 2006-02-28 Delaware Capital Formation, Inc. Shell and plate heat exchanger
SE520702C2 (sv) * 2001-12-18 2003-08-12 Alfa Laval Corp Ab Värmeväxlarplatta med minst två korrugeringsområden, plattpaket samt plattvärmeväxlare
US6840308B2 (en) * 2002-05-31 2005-01-11 General Electric Co. Heat sink assembly
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US7104312B2 (en) * 2002-11-01 2006-09-12 Cooligy, Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
CA2487459A1 (en) * 2004-11-09 2006-05-09 Venmar Ventilation Inc. Heat exchanger core with expanded metal spacer component
US7470405B2 (en) * 2005-01-25 2008-12-30 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Microchannel reactor with active oscillatory forcing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417502B (zh) * 2011-06-15 2013-12-01 Inventec Corp 冷卻裝置

Also Published As

Publication number Publication date
US20070121294A1 (en) 2007-05-31
CN1976570A (zh) 2007-06-06
US7272005B2 (en) 2007-09-18
CN100531541C (zh) 2009-08-19

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