DE60232731D1 - Mikroelektronisches system mit integriertem kryostatischem kühler - Google Patents

Mikroelektronisches system mit integriertem kryostatischem kühler

Info

Publication number
DE60232731D1
DE60232731D1 DE60232731T DE60232731T DE60232731D1 DE 60232731 D1 DE60232731 D1 DE 60232731D1 DE 60232731 T DE60232731 T DE 60232731T DE 60232731 T DE60232731 T DE 60232731T DE 60232731 D1 DE60232731 D1 DE 60232731D1
Authority
DE
Germany
Prior art keywords
expansion
heat
exchanger
fluid
orifice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60232731T
Other languages
English (en)
Inventor
Larry D Sobel
Jeff G Capara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of DE60232731D1 publication Critical patent/DE60232731D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C13/00—Details of vessels or of the filling or discharging of vessels
    • F17C13/005—Details of vessels or of the filling or discharging of vessels for medium-size and small storage vessels not under pressure
    • F17C13/006—Details of vessels or of the filling or discharging of vessels for medium-size and small storage vessels not under pressure for Dewar vessels or cryostats
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE60232731T 2001-09-07 2002-08-29 Mikroelektronisches system mit integriertem kryostatischem kühler Expired - Lifetime DE60232731D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/952,513 US6621071B2 (en) 2001-09-07 2001-09-07 Microelectronic system with integral cryocooler, and its fabrication and use
PCT/US2002/027326 WO2003025476A2 (en) 2001-09-07 2002-08-29 Microelectronic system with integral cyrocooler, and its fabrication and use

Publications (1)

Publication Number Publication Date
DE60232731D1 true DE60232731D1 (de) 2009-08-06

Family

ID=25492978

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60232731T Expired - Lifetime DE60232731D1 (de) 2001-09-07 2002-08-29 Mikroelektronisches system mit integriertem kryostatischem kühler

Country Status (6)

Country Link
US (2) US6621071B2 (de)
EP (1) EP1425798B1 (de)
AT (1) ATE434832T1 (de)
DE (1) DE60232731D1 (de)
IL (2) IL157123A0 (de)
WO (1) WO2003025476A2 (de)

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US8283723B2 (en) * 2005-02-11 2012-10-09 Alpha & Omega Semiconductor Limited MOS device with low injection diode
JP2006226743A (ja) * 2005-02-16 2006-08-31 Mitsubishi Electric Corp 加速度センサ
DE102005013227A1 (de) * 2005-03-18 2006-09-28 Infineon Technologies Fiber Optics Gmbh Optoelektronische Sende- und/oder Empfangsvorrichtung und optoelektronische Anordnung mit einer Mehrzahl derartiger optoelektronischer Sende- und/oder Empfangsvorrichtungen
US8353332B2 (en) 2010-10-13 2013-01-15 Reid Aarne H Integrated electronics cooling device
JP5773353B2 (ja) * 2011-02-15 2015-09-02 忠元 誠 熱交換器
WO2013043883A1 (en) 2011-09-20 2013-03-28 Lockheed Martin Corporation Extended travel flexure bearing and micro check valve
US8987893B1 (en) * 2011-10-18 2015-03-24 Marvell International Ltd. Heat dissipating interposers
US9784505B2 (en) * 2012-05-15 2017-10-10 Lockheed Martin Corporation System, apparatus, and method for micro-capillary heat exchanger
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
US9936579B2 (en) * 2013-02-01 2018-04-03 Apple Inc. Low profile packaging and assembly of a power conversion system in modular form
US9683766B1 (en) * 2013-07-12 2017-06-20 Lockheed Martin Corporation System and method for electronic de-clogging of microcoolers
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
FR3018352B1 (fr) * 2014-03-06 2016-04-01 Soc Fr Detecteurs Infrarouges Sofradir Dispositif de detection refroidi
US9999885B1 (en) 2014-05-30 2018-06-19 Lockheed Martin Corporation Integrated functional and fluidic circuits in Joule-Thompson microcoolers
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
US10065256B2 (en) 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
WO2017152045A1 (en) 2016-03-04 2017-09-08 Reid Aarne H Vacuum insulated articles with reflective material enhancement
US11262142B2 (en) 2016-04-26 2022-03-01 Northrop Grumman Systems Corporation Heat exchangers, weld configurations for heat exchangers and related systems and methods
US11008153B2 (en) 2016-11-15 2021-05-18 Concept Group Llp Multiply-insulated assemblies
CA3043915A1 (en) 2016-11-15 2018-05-24 Concept Group Llc Enhanced vacuum-insulated articles with microporous insulation
US10390455B2 (en) * 2017-03-27 2019-08-20 Raytheon Company Thermal isolation of cryo-cooled components from circuit boards or other structures
US11320086B2 (en) 2017-08-25 2022-05-03 Concept Group Llc Multiple geometry and multiple material insulated components
EP3841405A4 (de) * 2018-08-24 2022-05-04 Radialis Medical, Inc. Flüssigkeitskühlsystem zur genauen temperaturregelung eines strahlungsdetektors für die positronenemissionsmammografie
CN112880233B (zh) * 2021-01-07 2022-09-20 武汉高芯科技有限公司 一种超微型mems节流制冷红外探测器
CN113324344A (zh) * 2021-04-30 2021-08-31 武汉高德红外股份有限公司 一种节流制冷器

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US4392362A (en) 1979-03-23 1983-07-12 The Board Of Trustees Of The Leland Stanford Junior University Micro miniature refrigerators
JPS6025308B2 (ja) * 1980-09-16 1985-06-17 株式会社昭和製作所 二輪車等のフロントフオ−ク
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US4386505A (en) 1981-05-01 1983-06-07 The Board Of Trustees Of The Leland Stanford Junior University Refrigerators
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US5590538A (en) * 1995-11-16 1997-01-07 Lockheed Missiles And Space Company, Inc. Stacked multistage Joule-Thomson cryostat
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US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
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US6446712B1 (en) * 1999-02-23 2002-09-10 Long Manufacturing Ltd. Radial flow annular heat exchangers
EP1047294A1 (de) * 1999-04-23 2000-10-25 The Swatch Group Management Services AG Isoliertes metallisches Substrat für Leiterplatten
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Also Published As

Publication number Publication date
IL157123A0 (en) 2004-02-08
WO2003025476A3 (en) 2004-02-05
US20030047685A1 (en) 2003-03-13
IL157123A (en) 2010-05-31
US7178345B2 (en) 2007-02-20
EP1425798A2 (de) 2004-06-09
US20060180752A1 (en) 2006-08-17
US6621071B2 (en) 2003-09-16
EP1425798B1 (de) 2009-06-24
ATE434832T1 (de) 2009-07-15
WO2003025476A2 (en) 2003-03-27

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