IL157123A0 - Microelectronic system with integral cyrocooler, and its fabrication and use - Google Patents

Microelectronic system with integral cyrocooler, and its fabrication and use

Info

Publication number
IL157123A0
IL157123A0 IL15712302A IL15712302A IL157123A0 IL 157123 A0 IL157123 A0 IL 157123A0 IL 15712302 A IL15712302 A IL 15712302A IL 15712302 A IL15712302 A IL 15712302A IL 157123 A0 IL157123 A0 IL 157123A0
Authority
IL
Israel
Prior art keywords
expansion
heat
exchanger
fluid
orifice
Prior art date
Application number
IL15712302A
Other languages
English (en)
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of IL157123A0 publication Critical patent/IL157123A0/xx

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C13/00—Details of vessels or of the filling or discharging of vessels
    • F17C13/005—Details of vessels or of the filling or discharging of vessels for medium-size and small storage vessels not under pressure
    • F17C13/006—Details of vessels or of the filling or discharging of vessels for medium-size and small storage vessels not under pressure for Dewar vessels or cryostats
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Medicines Containing Plant Substances (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
IL15712302A 2001-09-07 2002-08-29 Microelectronic system with integral cyrocooler, and its fabrication and use IL157123A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/952,513 US6621071B2 (en) 2001-09-07 2001-09-07 Microelectronic system with integral cryocooler, and its fabrication and use
PCT/US2002/027326 WO2003025476A2 (en) 2001-09-07 2002-08-29 Microelectronic system with integral cyrocooler, and its fabrication and use

Publications (1)

Publication Number Publication Date
IL157123A0 true IL157123A0 (en) 2004-02-08

Family

ID=25492978

Family Applications (2)

Application Number Title Priority Date Filing Date
IL15712302A IL157123A0 (en) 2001-09-07 2002-08-29 Microelectronic system with integral cyrocooler, and its fabrication and use
IL157123A IL157123A (en) 2001-09-07 2003-07-27 A microelectronic system with an integrated Ciro cooler, its manufacturing process and uses

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL157123A IL157123A (en) 2001-09-07 2003-07-27 A microelectronic system with an integrated Ciro cooler, its manufacturing process and uses

Country Status (6)

Country Link
US (2) US6621071B2 (de)
EP (1) EP1425798B1 (de)
AT (1) ATE434832T1 (de)
DE (1) DE60232731D1 (de)
IL (2) IL157123A0 (de)
WO (1) WO2003025476A2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8283723B2 (en) * 2005-02-11 2012-10-09 Alpha & Omega Semiconductor Limited MOS device with low injection diode
JP2006226743A (ja) * 2005-02-16 2006-08-31 Mitsubishi Electric Corp 加速度センサ
DE102005013227A1 (de) * 2005-03-18 2006-09-28 Infineon Technologies Fiber Optics Gmbh Optoelektronische Sende- und/oder Empfangsvorrichtung und optoelektronische Anordnung mit einer Mehrzahl derartiger optoelektronischer Sende- und/oder Empfangsvorrichtungen
US8353332B2 (en) 2010-10-13 2013-01-15 Reid Aarne H Integrated electronics cooling device
JP5773353B2 (ja) * 2011-02-15 2015-09-02 忠元 誠 熱交換器
WO2013043883A1 (en) 2011-09-20 2013-03-28 Lockheed Martin Corporation Extended travel flexure bearing and micro check valve
US8987893B1 (en) * 2011-10-18 2015-03-24 Marvell International Ltd. Heat dissipating interposers
US9784505B2 (en) * 2012-05-15 2017-10-10 Lockheed Martin Corporation System, apparatus, and method for micro-capillary heat exchanger
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
US9936579B2 (en) * 2013-02-01 2018-04-03 Apple Inc. Low profile packaging and assembly of a power conversion system in modular form
US9683766B1 (en) * 2013-07-12 2017-06-20 Lockheed Martin Corporation System and method for electronic de-clogging of microcoolers
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
FR3018352B1 (fr) * 2014-03-06 2016-04-01 Soc Fr Detecteurs Infrarouges Sofradir Dispositif de detection refroidi
US9999885B1 (en) 2014-05-30 2018-06-19 Lockheed Martin Corporation Integrated functional and fluidic circuits in Joule-Thompson microcoolers
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
US10065256B2 (en) 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
WO2017152045A1 (en) 2016-03-04 2017-09-08 Reid Aarne H Vacuum insulated articles with reflective material enhancement
US11262142B2 (en) 2016-04-26 2022-03-01 Northrop Grumman Systems Corporation Heat exchangers, weld configurations for heat exchangers and related systems and methods
EP3541722A4 (de) 2016-11-15 2020-07-08 Concept Group LLC Mehrlagenisolierte anordnungen
JP7202766B2 (ja) 2016-11-15 2023-01-12 コンセプト グループ エルエルシー 微小孔構造の絶縁体によって強化された真空絶縁物品
US10390455B2 (en) * 2017-03-27 2019-08-20 Raytheon Company Thermal isolation of cryo-cooled components from circuit boards or other structures
JP2020531764A (ja) 2017-08-25 2020-11-05 コンセプト グループ エルエルシー 複合的ジオメトリおよび複合的材料の断熱部品
US20210337650A1 (en) * 2018-08-24 2021-10-28 Radialis Medical, Inc. Liquid cooling system for precise temperature control of radiation detector for positron emission mammography
CN112880233B (zh) * 2021-01-07 2022-09-20 武汉高芯科技有限公司 一种超微型mems节流制冷红外探测器
CN113324344A (zh) * 2021-04-30 2021-08-31 武汉高德红外股份有限公司 一种节流制冷器

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US4392362A (en) 1979-03-23 1983-07-12 The Board Of Trustees Of The Leland Stanford Junior University Micro miniature refrigerators
JPS6025308B2 (ja) * 1980-09-16 1985-06-17 株式会社昭和製作所 二輪車等のフロントフオ−ク
FR2500610B1 (fr) * 1981-02-25 1986-05-02 Inst Francais Du Petrole Echangeur de chaleur a plaques perforees
US4386505A (en) 1981-05-01 1983-06-07 The Board Of Trustees Of The Leland Stanford Junior University Refrigerators
US4431050A (en) * 1981-10-16 1984-02-14 Avco Corporation Stacked-plate heat exchanger made of identical corrugated plates
US4489570A (en) 1982-12-01 1984-12-25 The Board Of Trustees Of The Leland Stanford Junior University Fast cooldown miniature refrigerators
JPS605548A (ja) * 1983-06-03 1985-01-12 Esutetsuku:Kk 集積回路及びその製造方法
JPH06101524B2 (ja) * 1985-09-18 1994-12-12 株式会社東芝 半導体素子用冷却体
US4682032A (en) * 1986-01-17 1987-07-21 Itek Corporation Joule-Thomson cryostat having a chemically-deposited infrared detector and method of manufacture
US5101894A (en) * 1989-07-05 1992-04-07 Alabama Cryogenic Engineering, Inc. Perforated plate heat exchanger and method of fabrication
US5787977A (en) * 1992-04-02 1998-08-04 Nippondenso Co., Ltd. Heat exchanger
US5596228A (en) * 1994-03-10 1997-01-21 Oec Medical Systems, Inc. Apparatus for cooling charge coupled device imaging systems
US5758505C1 (en) * 1995-10-12 2001-10-30 Cryogen Inc Precooling system for joule-thomson probe
US6151901A (en) * 1995-10-12 2000-11-28 Cryogen, Inc. Miniature mixed gas refrigeration system
US5590538A (en) * 1995-11-16 1997-01-07 Lockheed Missiles And Space Company, Inc. Stacked multistage Joule-Thomson cryostat
US6127203A (en) * 1996-08-30 2000-10-03 Drs Technologies, Inc. Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US6054676A (en) * 1998-02-09 2000-04-25 Kryotech, Inc. Method and apparatus for cooling an integrated circuit device
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US6592577B2 (en) * 1999-01-25 2003-07-15 Cryocath Technologies Inc. Cooling system
US6446712B1 (en) * 1999-02-23 2002-09-10 Long Manufacturing Ltd. Radial flow annular heat exchangers
EP1047294A1 (de) * 1999-04-23 2000-10-25 The Swatch Group Management Services AG Isoliertes metallisches Substrat für Leiterplatten
US6252221B1 (en) * 1999-06-21 2001-06-26 Agilent Technologies, Inc. Photo-conductive switch having an improved semiconductor structure
US20010030040A1 (en) * 1999-12-23 2001-10-18 Jia Hua Xiao Miniature cryogenic heat exchanger

Also Published As

Publication number Publication date
ATE434832T1 (de) 2009-07-15
WO2003025476A3 (en) 2004-02-05
IL157123A (en) 2010-05-31
US20030047685A1 (en) 2003-03-13
US6621071B2 (en) 2003-09-16
DE60232731D1 (de) 2009-08-06
US7178345B2 (en) 2007-02-20
WO2003025476A2 (en) 2003-03-27
US20060180752A1 (en) 2006-08-17
EP1425798B1 (de) 2009-06-24
EP1425798A2 (de) 2004-06-09

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